SURFACE ENGINEERING:SCIENCE AND

TECHNOLOGY II

Edited by:Ashok Kumar

Yip-Wah ChungJohn J. MooreGary L. Doll

Kyoshi YatsuiD.S. Misra

SURFACE ENGINEERING:SCIENCE AND

TECHNOLOGY II

Proceedings of a symposium sponsored bythe Surface Engineering Committee of

the Materials Processing & Manufacturing Division (MPMD) ofTMS (The Minerals, Metals & Materials Society).

Held during the TMS 2002 Annual Meeting inSeattle, Washington

February 17-21, 2002

Partial funding for this publication was provided for by the Seeley W. Mudd Fund

Edited by:Ashok Kumar

Yip-Wah ChungJohn J. MooreGary L. Doll

Kyoshi YatsuiD.S. Misra

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v

TABLE OF CONTENTS

Preface ......................................................................................................................................... ix

Nanomaterials

Modifying the Surface of Nanoparticles by Coating ................................................................ 3D.V. Szabó, S. Schlabach, B. Xuand D. Vollath

Formation of Photonic Nanocomposites by Surface Engineering OverInorganic Nanoparticles ............................................................................................................ 15

N. Kambe

Micro To Nano-Small Research For Fuels and Combustion ................................................. 25C.E. Bunker, J.R. Gord, T.R. Meyer,M.S. Brown, V.R. Katta, D.A. Zweifel,B.A. Harruff and Y-P. Sun

Formation of Gold Nanowires with MgO Surfaces ................................................................ 35A. Ueda, R.R. Mu, V.C. Saunders,T.C. Livingston, M.H. Wu and D.O. Henderson

Dense Deposition of Nanocomposites By a Compact YAG Laser ......................................... 43M. Senna and K. Hamada

Aqueous Chemical Growth of Advanced Nanostructured Metal OxidesThin Films .................................................................................................................................. 51

L. Vayssieres

Purification of Aluminum Nitride Nanosized Powder Synthesized byPulsed Wire Discharge .............................................................................................................. 61

C. Cho, Y. Kinemuchi, T. Suzuki,H. Suematsu, W. Jiang and K. Yatsui

Engineered Nanomaterial Hard Coatings on Metal and PolymerSubstrates ................................................................................................................................... 69

A. Singhal and G. Skandan

Synthesis of Nickel Ferrite Nanosized Powders by Pulsed Wire Discharge ......................... 79K. Ishizaka, Y. Kinemuchi, T. Suzuki,H. Suematsu, W. Jiang and K. Yatsui

Reinforced Epoxies Using Carbon Nanotubes ........................................................................ 89R.A. Bley, D. Beascoechea and R. Niedner

vi

Tunable Self-Assembly of Carbon Nanotubes on Silica Surface ........................................... 99Z.J. Zhang, B.Q. Wei and P.M. Ajayan

Issues in Surface Engineering

Laser Surface Modification of Electronic Properties in Wide Band GapMaterials ................................................................................................................................... 113

I.A. Salama, N.R. Quick and A. Kar

Preparation of TiFe Thin Films of Hydrogen Absorbing Alloy by IntensePulsed Ion-Beam Evaporation ................................................................................................ 125

T. Saikusa, T. Suzuki, H. Suematu,W. Jiang and K. Yatsui

Surface Modification of Austenitic Stainless Steels .............................................................. 133H. Ocken and R. Asay

Synthesis of Functional Materials using Pulsed Power Technology ................................... 143K. Yatsui, W. Jiang, H. Suematsu,T. Suzuki, Y. Kinemuchi and S.C. Yang

Surface Modification of P/M TiC Reinforced Iron Matrix Composites ............................. 153O.N. Dogan, D.E. Alman, J.A. Hawkand P. Danielson

Functionally Graded Materials Produced with High Power Lasers ................................... 163J.T. De Hosson and Y. Pei

Advances in Coating Technology

Nucleation and Growth of Cubic Boron Nitride Under DifferentSubstrate Bias .......................................................................................................................... 179

Q. Li, Y. Lifshitz, L.D. Marks, I. Belloand S.T. Lee

Role of Precursors on the Formation of CNX Deposited by PE-HF-CVD .......................... 189D. Dumitriu and A. Karami

Optimization of Thermoelectric Properties in Boron Carbide Thin FilmsPrepared by Ion-Beam Evaporation ...................................................................................... 199

H. Suematsu, I. Ruiz, K. Kobayashi,M. Takeda, D. Shimbo, T. Suzuki,W. Jiang and K. Yatsui

Developing a MoSi2+ SiC Oxidation Resistance Coating for MO,a Prototype Refractory Metal ................................................................................................. 207

E.C. Hixson, G.G.W. Mustoe, J.J. Moore,H.J. Kleebe, D.L. Olson and C. Suryanarayana

vii

The Influence of Particle Energy Distributions on the Microstructure andProperties of Reactively Sputtered Titanium Oxide and Titanium NitrideThin Films ................................................................................................................................ 217

C. Muratore, J.J. Moore and J.A. Rees

Effects of Bias-Enhanced Nucleation and Growth of Diamond Films onCopper and Transition-Metal Alloy Substrates .................................................................... 227

A. Kumar and A.K. Sikder

Epitaxial Nucleation of Diamond Polytypes on Silicon by Direct IonBeam Deposition ...................................................................................................................... 239

Q. Li, X.F. Duan, Y. Lifshitz, F.Y. Meng,N.G. Shang, I. Bello and S.T. Lee

Characterization of Materials

Development of Cermet Thin Films Coatings ....................................................................... 369B. Mishra, J. Zhou and F. Kustas

Relative Nanomechanical and Raman Studies of Diamond-Like CarbonThin Films ................................................................................................................................ 251

J. Goldsmith, E. Sutter, J. Moore,B. Mishra and M. Crowder

Fabrication and Characterization of Mechanical Properties of Ultra-Thin Silicon Microcantilevers ................................................................................................. 261

P.B. Zantye, A.K. Sikder, R.K. Sharmaand A. Kumar

Influence of Surface Roughness on Coercivity and MagneticInteractions in CoCrX (X=Pt,Pd,Ta,B) Thin Film Media .................................................... 273

M. Tarakci and S. Guruswamy

Mechanical Properties of Microstructural Evaluation of ChromiumContaining Hard Coatings on Fe-Mn-Al Alloy ..................................................................... 283

J-W. Lee and J.-G. Duh

Curvature Method as a Tool to Evaluate Shape Memory Effects forTiNiCu Thin Films ................................................................................................................... 293

Y. Fu, H. Du and S. Zhang

Observation of Surface-Related Phenomena During In-situNanoindentation in a Transmission Electron Microscope (TEM) ...................................... 305

A.M. Minor, E.T. Lilleodden, E.A. Stachand J.W. Morris

Comparison in Characteristics of Electroless Deposited and MagnetronSputtered Ni-P-W Coatings .................................................................................................... 315

F-B. Wu, Y.-Y. Tsai and J.-G. Duh

viii

Oxidation/Corrosion/Nitridation/Diffusion

Factors Controlling In-Plane Cracking of Thermal Barrier Coatings ............................... 327Z. Zhang, J. Kameda, A.H. Swanson,S. Sakurai and M. Sato

The Corrosion Behavior of PVD-Grown WC-(Ti1-xAlx) N FilmsMultilayers in 3.5%NaCl Solution ......................................................................................... 337

S.H. Ahn, J.H. Yoo, Y.S. Choi, J.G. Kimand J.G. Han

Ferritic Nitrocarburising in Fludised Bed ............................................................................. 347D.M. Fabijanic, P.D. Hodgson and G.L. Kelly

Surface Phenomena in Diffusion Limited Capillary Flow in a ReactivePorous Film .............................................................................................................................. 357

R. Asthana

Author Index .............................................................................................................................. 379

Subject Index ............................................................................................................................. 381

ix

PREFACE

The symposium titled “Surface Engineering: Science and Technology II” was organizedby Ashok Kumar, Y. W. Chung, John J. Moore, Gary L. Doll, D. S. Misra and Kiyoshi Yatsui, andheld in Seattle, Washington, during the TMS annual meeting, February 17-21, 2002. This volumeconsists of invited and contributed papers from national and internationals researchers represent-ing universities, federal laboratories and industries. Surface engineering covers a wide range ofsurface modification processes that are directed at the creation of tailor-made surface characteris-tic of materials. The objective of this symposium is to provide a multi-disciplinary discussion onsurface related phenomena by which materials performance may be enhanced through engineeredinterface and surface modification technologies.

The objective of this symposium is to provide a forum for multi-disciplinary discussions on phe-nomena where materials-performance may be enhanced through engineered surfaces and inter-faces. The materials science of hard and wear-resistant coatings, including nanostructured coat-ings, is a scientifically challenging problem with immediate technological applications in ma-chine and machining tools, magnetic recording and others manufacturing industries. This sympo-sium has served as a forum to review key aspects, discuss ongoing current research and speculateon future trends relating to the science, technology and applications of coatings, surface treat-ments and surface analysis for the enhanced performance of engineered components and devices.We wish to thank all the authors, particularly the invited speakers and referees, for their contribu-tions to the success of this symposium. We also acknowledge the University of South Alabama,the Northwestern University/Materials Research Center, Colorado School of Mines, The TimkenCompany, I. I. T. Bombay and Nagaoka University of Technology for the resources the organizersused to organize the symposium and complete this book. Special thanks are also extended to Mr.Steve Kendall from TMS for his assistance in editing this book.

Dr. Ashok Kumar Dr. Yip-Wah ChungDept. of Mechanical Engr. & Dept. of Materials Sci.& Engr.Center for Microelectronics Research Northwestern UniversityUniversity of South Florida Evanston, IL 60208Tampa, FL 33620 Tel: (847)491-3112, Fax: (847)491-7820

Dr. John J. Moore Dr. Gary L. DollAdvanced Coating & Surface Engr. Lab The Timken CompanyColorado School of Mines P.O. Box 6930Golden, CO 80401-1887 Canton, OH 44706

Dr. Kiyoshi Yatsui Dr. D. S. MisraExtreme Energy Density Research Institute Department of PhysicsNagaoka University of Technology I. I. T. BombayNagaoka, Niigata 940-2188, Japan Powai, Mumbai 400076, India

379

AUTHOR INDEX

AAhn, S.H., 337Ajayan, P.M., 99Alman, D.E., 153Asay, R., 133Asthana, R., 357

BBeascoechea, D., 89Bello, I., 179, 239Bley, R.A., 89Brown, M.S., 25Bunker, C.E., 25

CCho, C., 61Choi, Y.S., 337Crowder, M., 251

DDanielson, P., 153De Hosson, J.T., 163Dogan, O.N., 153Du, H., 293Duan, X.F., 239Duh, J.-G., 283, 315Dumitriu, D., 189

FFabijanic, D.M., 347Fu, Y., 293

GGoldsmith, J., 251Gord, J.R., 25Guruswamy, S., 273

HHamada, K., 43Han, J.G., 337Harruff, B.A., 25Hawk, J.A., 153Henderson, D.O., 35Hixson, E.C, 207Hodgson, P.D., 347

IIshizaka, K., 79

JJiang, W., 61, 79, 125, 143, 199

KKambe, N., 15Kameda, J., 327Kar, A., 113Karami, A., 189Katta, V.R., 25Kelly, G.L., 347Kim, J.G., 337Kinemuchi, Y., 61, 79, 143Kleebe, H.J., 207Kobayashi, K., 199Kumar, A., 227, 261

LLee, J-W., 283Lee, S.T., 179, 239Li, Q., 179, 239Lifshitz, Y., 179, 239Lilleodden, E.T., 305Livingston, T.C., 35

MMarks, L.D., 179Meng, F.Y., 239Meyer, T.R., 25Minor, A.M., 305Mishra, B., 251Moore, J., 207, 217, 251Morris, J.W., 305Mu, R.R., 35Muratore, C., 217Mustoe, G.G.W., 207

NNiedner, R., 89

OOcken, H., 133Olson, D.L., 207

380

PPei, Y., 163

QQuick, N.R., 113

RRees, J.A., 217Ruiz, I., 199

SSaikusa, T., 125Sakurai, S., 327Salama, I.A., 113Sato, M., 327Saunders, V.C., 35Schlabach, S., 3Senna, M., 43Shang, N.G., 239Sharma, R.K., 261Shimbo, D., 199Sikder, A.K., 227, 261Singhal, A., 67Skandan, G., 67Stach, E.A., 305Suematsu, H., 61, 79, 143, 199Suematu, H., 125Sun, Y-P., 25Suryanarayana, C., 207Sutter, E., 251Suzuki, T., 61, 79, 125, 143, 199Swanson, A.H., 327Szabó, D.V., 3

TTakeda, M., 199Tarakci, M., 273Tsai, Y.-Y., 315

UUeda, A., 35

VVayssieres, L., 51Vollath, D., 3

WWei, B.Q., 99Wu, F-B., 315Wu, M.H., 35

XXu, B., 3

YYang, S.C., 143Yatsui, K., 61, 79, 125, 143, 199Yoo, J.H., 337

ZZantye, P.B., 261Zhang, S., 293Zhang, Z., 327Zhang, Z.J., 99Zweifel, D.A., 25

381

SUBJECT INDEX

AAdhesion, 340Annealing

Annealing Temperature, 320-321Ni3P, 315, 319-322

AlN Content, 61-65, 67Alumindum Nitride (AlN), 61-65, 67

BBia-Enhance, 227, 228, 233Bode Plot, 342Boron Carbide, 199-205Boron Nitride, 179

CCarbon Nanotubes, 89, 94, 98

Multi Walled, 91, 94Single Walled, 90-91, 94

Capilary Flow, 357, 358, 360CFD, 25, 27, 28, 31Chemical Vapor Deposition (CVD), 52, 94,

227-230, 240, 251Chromizing

Chromization, 283-284Pack Chromizing, 284-285, 299, 291

CNx Films, 189, 190CoCr, 273, 274, 280, 281Coercivity, 273, 274, 278, 280, 281Combustion, 25Composite, 153, 154, 158, 160

Epoxy/Nanotube, 94-98Copper, 227Corrosion, 138, 139CPE, 344Cracking, 163Crystalline, 126Curvature Method, 295

DD.C. –Bias, 227Deposited Energy, 61, 65-67Diamond, 239-248, 251Diamond Films, 227-230, 233-235, 237, 238Diffusion, 357-359, 363, 367Droplet, 341

EEIS, 339-340ERDA, 190

FFe-Mn-Al Alloy, 284, 286, 289, 292

Fe-Mn-Al-C Alloy, 284Ferimagnetism, 79, 80, 86Fluid-Bed Reactor, 347, 347Four Point Bending, 329FT-IR, 189, 191, 193Fuels, 25

GGallium Arsenide, 113Galvanic Current Density, 342Gas Sensor, 79, 80, 84, 85Gold, 35, 36, 40, 41

HHard Coatings, 69HF-CVD, 189, 190, 283Hydrogen Absorbing Alloy, 126

IInductance, 61-67Intense Pulsed Ion-Beam Evaporation, 126Internal Stress, 181Ion-Beam Evaporation, 143-148, 151, 199-

205

KKaufman Ion Source, 240, 242

LLarge Area High Resolution Transmission

Electron Microscopy, 199, 200, 202Laser, 43, 44, 49, 163-176

MMagnetron Sputtering, 179, 180Mechanical Properties, 283MEMS, 25, 29, 261, 262, 306Metal Oxide, 51, 53, 56MgO, 35-39, 41Microcantilevers, 263, 264

382

MicrohardnessDegradation, 321Peak-Hardness, 320-321Precipitation, 315, 316, 320-322

Microstructures, 284, 285Microwave Plasma Process, 3-5, 12

Synthesis, 5Molybdenum, 207, 208MoSi2, 207, 208, 209, 211

NNanocoating, 43, 49Nanocomposites, 43, 44, 49, 51, 55, 58Nanoindentation, 76, 266, 267, 305, 306,

308, 310, 312Nanomaterial, 69Nanomechanical, 251-253Nanoparticles, 3-9, 12

Coated Nanoparticles, 5, 7-9Morphology, 7Properties, 9

Nanosize Powder, 79-87Nanotubes, 99-108Nanowire, 35, 40, 41NEMS, 29NiFe2O4, 79-87, 149, 150Nitrocarburising, 347, 348

OOxidation Resistant Coating, 207

PPlasma, 217-218, 223-225Plasma Enhanced-Hot Filament CVD, 189-

198Ammonia, 189-198Dimethylamine, 189, 190, 192-194Methane, 189-192Precursors, 189-198Trichloroethylene, 189, 190, 194-198

Plasma Spray, 327, 328Polymer, 3-5, 11, 12Polymerization, 93Porosity, 163, 340Porous Films, 357, 366Powder Metallurgy, 153

PropertiesDispersion Behavior, 9, 10High Frequency, 12, 13Magnetic, 11, 12Suspension Behavior, 10

Pulsed Wire Discharge (PWD), 61-63, 67,79-87, 143, 144, 149-151

RR.F. Sputtering

Magnetron Sputtering, 283-286Raman, 251-252, 257-258Residual Stress, 163, 327

SScratch Test, 283-285, 291

Critical Load, 283-285, 289-291Shape Memory, 293, 298SiC, 163-175Silica, 99, 104, 106, 107Silicon Carbide, 113, 207, 214Sputter-Deposition, 294Stabilized Chronium Process, 133, 134, 137Stainless Steel, 133-135Steel, 347-355Stress, 293, 298, 299Surface Roughness, 273, 274SWNT, 89-94, 97, 98

TTEM, 179, 180-184, 239-241, 305, 306,308-312Tests

Flexural Stress, 95-97Thermal Barrier Coatings, 163, 327Thermal Conductivity, 129Thermoelectric Properties, 199-205Thin Films, 51-54, 199-205, 251, 273

FT-IR, 189, 191, 193, 196-197Hardness, 189, 191-197

TiC, 153, 154, 158, 160, 161, 163-176TiFe (Titanium Iron), 125, 147-148TiNiCu Thin Films, 293, 294Titanium Nitride, 217-224Titanium Oxide, 217-223, 225Transparent Coating, 72

383

VVia Hole, 148

WWide Bandgap, 113, 123

XX-Ray Diffraction, 128XPS, 113, 116, 119, 120, 122

YYbaCuO, 145-147

ZZero Resistance Ammeter (ZRA), 340