status in the clean room device production until 12-06-12
DESCRIPTION
STATUS IN THE CLEAN ROOM Device production Until 12-06-12. LHCb – S nake design. 525 um thick! SS polished. SEM PICTURES. LHCb – Snake design. NA62 – Frame 2. Channels too deep. Oxide +Nitride. 2 devices glued from Jerome. 525 um thick! SS polished. 20475 and 20477 broken !. - PowerPoint PPT PresentationTRANSCRIPT
STATUS IN THE CLEAN ROOMDevice production
Until 12-06-12
CMP Litho+Etching #1(marks+crosses)
Litho+Etching #2 (channels)
Bonding Litho+Etching #3 (holes)
Dicing @ CERN
3961 14.05.12 23.05.12
3772 14.05.12 15.05.12
3850 14.05.12 15.05.12 23.05.12 29.05.12 29.05.12 30.05.12
3917 14.05.12 15.05.12 23.05.12 29.05.12 29.05.12 30.05.12
3776 14.05.12 15.05.12 15.05.12 16.05.12 23.05.12 23.05.12
20478 7.06.12 7.06.12 8.06.12
20476 No (BS not polished) 8.06.12 Ready for bonding12.06.12 Piranha
LHCb – Snake design
525 um thick! SS polished
LHCb – Snake designSEM PICTURES
NA62 – Frame 2Litho+Etching #1(marks+crosses)
Litho+Etching #2 (channels)
Bonding Litho+Etching #3 (holes)
Dicing @ CERN
3448 24.04.12 29.05.12 29.05.12 30.05.12 01.06.12 05.06.12
3625 24.04.12 29.05.12 01.06.12 04.06.12 Ready for dicing
3645 23.05.12
3446 23.05.12
3627 23.05.12
3624 23.05.12
20473 No 12.06.12 12.06.12 12.06.12(mask 1+ mask 3)
12.06.12 13.06.12
20474 No 12.06.12 Ready for bonding12.06.12 Piranha
Oxide +Nitride....
525 um thick! SS polished
20475 and 20477 broken!
2 devices glued from Jerome
Channels too deep
NA62 – Dual BananaLitho+Etching #1(marks+pool)
Litho+Etching #2 (manifolds+channels)
Litho+Etching #3 (channels)
Bonding Litho+Etching #4 (big pool)
Dicing @ CERN
044 02.03.12 15.03.12 16.03.12 11.05.12 14.05.12 16.06.12 16.06.12
045 05.03.12 29.05.12 30.05.12 01.06.12 07.06.12
046 05.03.12 29.05.12 30.05.12
Surface not clean….CMP cracks!!
DRY ETCHING with 601Starts to de-bond!!! SEM PICTURES
Pool 380 um OK!!
before after
Dirty on the backside..
NA62 – Dual Banana 044 SEM PICTURES
Channels:
Pool:
KOH inside channels: