stato alice e its upgrade · v. manzari riunione referee infn – roma, 26 maggio 2016 2 months:...
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StatoALICEeITSUpgrade
RiunioneRefereeINFN–Roma,26Maggio2016
OnePeVCollisions
ALICEfirstyearofRUN2inone
image
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Run2
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
• 2015 - Primo anno di Run2 • Dati raccolti relativi a collisioni PbPb e pp a 13 e 5 TeV • Obiettivi raggiunti in termini di statistica • Distorsioni nella TPC ad alto rate à nuova procedura di calibrazione, necessaria
anche per RUN3
• 2015 - Year-End Technical Stop • Numerosi interventi di manutenzione ordinaria e straordinaria • Upgrade dell’elettronica di readout della TPC (RCU2) à ~ raddoppio del rate di
presa dati
• 2016 – Secondo anno di Run2 • Ripartenza senza problemi
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LHC Schedule per il 2015
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
p-Pbrun~halfat8andhalfat5TeVTarget:1BillionMBeventsat5TeVand20nb-1(raretriggers)at8TeV
p-prunLuminosity:5Hz/µb(300kHz)atpile-up(μ)~1-2%likein2015Trigger:mixofMBandraretriggers(highmulZplicity,muon,Jet,γ,diffracZve)
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Produzione Scientifica
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
• Numerosi lavori pubblicati
• 151 ALICE pubblicazioni su arXiv, alcuni già relativi a dati di Run2 ed in particolare 2 alla presa dati HI di Dic ‘15
• Pubblicazioni di elevato impatto scientifico: oltre 90 citazioni in media (inSPIRE)
• Alcune centinaia di presentazioni all’anno in conferenze internazionali
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ALICE Today
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016 Muon spectrometer
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ALICE Upgrade
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
NewInnerTrackingSystem(ITS)• improvedpoinBngprecision• lessmaterial->thinnesttrackerattheLHC
TimeProjecBonChamber(TPC)• newGEMtechnologyforreadoutchambers
• conBnuousreadout• fasterreadoutelectronics
MUONARM• conBnuousreadoutelectronics
MuonForwardTracker(MFT)• newSitracker• ImprovedMUONpoinBngprecision
DataAcquisiBon(DAQ)/HighLevelTrigger(HLT)• newarchitecture• onlinetracking&datacompression
• 50kHzPbPbeventrateTOF,TRD,ZDC• Fasterreadout
NewTriggerDetectors(FIT)
NewCentralTriggerProcessor(CTP)
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Approvazione degli Upgrades
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
The approval process for the upgrades has been completed in 2015
All 5 TDRs and respective MoUs ITS, Readout Electronics and Trigger System, O2, TPC, MFT
have been approved by LHCC, UCG and RRB
Excellent cards to play poker
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Installazione Upgrades
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
2 months: opening Experiment + TPC/ITS/beampipe de-installation
10 months: TPC + other detectors upgrade + services modifications
8 months: reinstall TPC/ITS/MFT/FIT/beampipe + close Experiment
4 months: commissioning
J F M A M J L A S O N D J F M A M J L A S O N D2019 2020
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Sviluppo di Tecnologie per gli Upgrade
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
Nel contesto più generale delle discussioni sugli Upgrades di Fase 1 e Fase 2 degli esperimenti ad LHC è emerso chiaramente che gli upgrades di ALICE ad oggi rappresentano in molti campi la frontiera tecnologica dei rivelatori
ALPIDEchip
ITSmechanicsandIntegraZon
4GEMTPC
O2facility
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Leadership in Collaborazione
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
• Spokesperson: P. Giubellino (To) • Physics Coordinator: F. Antinori (Pd) • Conference Committee: chairman E. Vercellin (To) • Editorial Board: co-chair E. Scomparin (To) • Run Coordination: deputy G. Luparello (Ts)
• PWG co-Conveeners (2-year mandate): • Heavy Flavour: E. Bruna (To) • Light Flavour Spectra: F. Bellini (Bo) • Physics Performance: C. Zampolli (Bo) • Monte Carlo generators and Minimum Bias physics: E. Scapparone (Bo)
• Project Leader and Deputy: • ITS: V. Manzari (Ba) • SPD: V. Manzari (Ba) • SDD: F. Prino (To) • HMPID: G. De Cataldo (Ba) • TOF: A. Zichichi (Bo) • ZDC: N. De Marco (Al) • LHCinterface:G.De Cataldo (Ba)
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Elezione Spokesperson
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
Elezione Nuovo Spokesperson (inizio mandato 1 Gennaio 2017) 4 Candidati: F. Antinori, A. Baldisseri, T. Nayak and R. Snelling
Eletto: F. Antinori (Padova)
La Costituzione ALICE richiede una maggioranza pari ad almeno 2/3 degli aventi diritto al voto per assicurare un forte mandato allo spokesperson che risulta eletto.
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ITS Upgrade - Stato Generale
• Processo di approvazione completato
• Attività di R&D in fase di completamento ed è iniziata la fase di ingegnerizzazione dei prototipi
• Abbiamo cominciato ad utilizzare pesantemente i finanziamenti UCG
• Engineering Design Reviews
• Pixel Chip – 19 Ott 2015
• Modulo e Stave – 3-4 Mag 2016
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
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EDR – Pixel Chip
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
ReviewPanel:A.Marchioro(CERN),W.Mueller(GSI),X.Llopart(CERN)
16"
EDR:"pALPIDEF2"results"and"pALPIDEF3"design"A"Large"Ion"Collider"Experiment"
General"Assessment"“The"reviewers"were"impressed"by"the"amount"and"the"quality"of"informaTon"provided"by"the"design"team"for"the"review."The"design"team"has"clearly"worked"very"hard"and"thoroughly"for"this"project"and"was"orchestrated"very"competently"and"effecTvely"by"its"management"team."
The"Alice"ITS"project"aims"at"introducing"some"very"original"soluTons"in"the"area"of"pixelated"detectors"for"parTcle"physics,"in"parTcular"the"new"technology,"the"sensor"architecture,"the"extremely"low"power"frontFend"circuitry"and"the"mechanical"thinning"of"the"detector,"all"are"pioneering"significant"innovaTons.""
Unavoidably"innovaTons"cannot"be"decoupled"from"risks,"but"it"seems"to"these"reviewers"that"the"team"has"studied"in"detail"the"various"aspects"of"the"design"of"the"proposed"chip"and"has"used"extensively"simulaTon"tools"to"understand"its"behavior."Of"course"the"usage"of"simulaTon"tools"must"be"accompanied"by"and"the"results"digested"with"a"fair"amount"of"common"sense,"which"has"been"expressed"during"the"review."The"engineering"team"has"shown"to"have"worked"proacTvely"on"a"number"of"issues"that"were"raised"during"the"presentaTon."
It"is"also"fair"to"noTce"that"the"learning"in"a"new"and"very"promising"monolithic"technology"that"this"project"will"hopefully"bring"to"the"HEP"community"does"by"itself"partly"jusTfy"the"risk"taken"with"the"project."
Finally,"it"was"really"a"pleasure"to"see"the"enthusiasm"and"competence"of"the"overall"team"working"on"this"project.”"
EDR"(19"Oct"2015)"F""Review"panel:"A."Marchioro"(CERN),"W."Mueller"(GSI),"X."Llopart"(CERN)"
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Interconnessione Pixel Chip-FPC
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
SelecZveLaserSolderingLasersolderingmachine(Dr.MergenthalerGMBH
Chip%FPC%
Solder%balls%
Laser%
Chip
Coverlay Metal
Polyimide Metal
Coverlay
2 Layers, Vacuum deposition
20 µm 25 µm 75 µm 25 µm 20 µm 50 µm
200 µm
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Interconnessione Pixel Chip-FPC
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
SelecZveLaserSolderingAll main issues were solved • Quality of the metallization of FPC VIAs • Excessive warping of pixel chip • Assembly jigs out of tolerance
Nevertheless the result continue to be unsatisfactory => too often “cold” soldering or partial wetting of the pad
We investigated in detail (optical inspections, SEM, FIB and EDS analysis) the quality of the metallization of the interface pads, but everything seems according to specs
FIBinspecBon
Feb 2016 – Decision to abandon laser soldering and use conventional wire bonding
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Interconnessione Pixel Chip-FPC
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
Possibile spiegazione o meglio la nostra interpretazione dei risultati supportata da numerose discussioni con esperti del settore
Quando la sferetta di saldatura è fusa, il trasferimento di calore al chip è troppo veloce e di conseguenza la temperatura all’interfaccia si riduce molto rapidamente, tanto da non permettere la formazione dello strato intermetallico.
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Wire-bonding
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
10 µm 25 µm 75 µm 25 µm 10 µm 100 µm
500 µm
Chip%FPC%
Solder%balls%
Laser%
Chip
Coverlay Metal
Polyimide Metal
Coverlay
• Il chip è incollato con una colla non conduttiva al circuito stampato flessibile (FPC)
• Interconnessione elettrica è stabilita mediante la tecnica consolidata di wedge wire-bonding attraverso il via del FPC
Primi test a Gennaio con assemblaggi di chip singoli
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Wire-bonding
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
Test con pALPIDE-3 e FPC singolo chip • 5 assemblaggi con filo di Al da 25mm wedge
tool standard (45°) • 1 assemblaggio con filo di Al da 25mm e
wedge tool deep-access • Risultati: tutti funzionanti secondo specifiche
10 µm 25 µm 75 µm 25 µm 10 µm 100 µm
500 µm
Chip%FPC%
Solder%balls%
Laser%
Chip
Coverlay Metal
Polyimide Metal
Coverlay
Primi test a Gennaio con assemblaggi di chip singoli
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EDR – Modulo e Stave
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
ReviewPanel:DiegoAlvarezFeito(CERN),NicolaBacche_a(INFN),HeinzPernegger(CERN), WalterSondheim(LANL)
ALICE&ITS&Stave&Engineering&Design&Review&
May&384,&2016&
Introduction:+
The&Committee&wishes&to&congratulate&the&ITS&project&team&on&the&high&quality&of&the&material&presented,&which&demonstrated&the&exceptionally&good&progress&made&with&design&of&components&for&this&ambitious&upgrade.&Several&important&issues&have&been&addressed&and&were&presented:&from&ALPIDE&design&towards&the&production&version,&the&designs&of&FPCs,&mechanics&and&cooling&for&staves&and&the&overall&assembly&and&testing&of&HIC&and&staves&for&IB&and&OB.&Several&issues&have&been&identified&and&overcome&&(eg&connection&FPC&to&chip,&ALPIDE&functionality&in&the&system).&The&component&designs,&assembly&setups&and&initial&results&on&early&HIC&prototypes&and&staves&look&generally&convincing&and&there&are&strong&and&experienced&teams&involved.&It&is&clearly&understood&that&the&next&months&are&critical&to&obtain&decisive&test&results&on&more&prototypes&for&production&readiness,&but&the&Committee&did¬&identify&any&show8stoppers&at&this&point.&More&detailed&remarks&and&recommendations&follow.&&
Remarks/Recommendations:+
The&committee&would&like&to&thank&the&entire&ITS&team&for&the&excellent&presentations&being&available&ahead&of&the&review.&Initial&reviewer&questions&and&answers&by&the&ITS&team&are&attached&the&review&agenda.&
1.) General+&
a.) Full&slice&system&test:&The&gradual&construction&of&the&full&slice&system&test&including&all&electrical&and&relevant&mechanical&parts&is&important&to&qualify&the&designs&of&all&components&(from&chip/FPC&to&HIC&,&DC/DC,&RU&,&cables).&The&system&test&activities&shall&be&pursued&with&high&priority&so&that&further&results&are&available&until&the&PRR.&
b.) Redundancy:&On&the&outer&barrel&the&failure&of&e.g.&a&master&chip&may&lead&to&the&loss&of&6+1&chips&(half8HIC).&Additionally&the&replacement&of&a&HIC&on&a&half8stave&seems&very&difficult&to&impossible.&Based&on&an&analysis&of&possible&failure&modes,&it&may&be&prudent&to&investigate&possibilities&for&more&redundancy&even&at&the&expense&of&a&small&mass&penalty&in&the&outer&layers.&&
&&
2.) Readout+&+Electronics++
a.) Data&transmission/data&corruption&issues&(due&to&pickup&on&supply&voltages)&have&been&addressed&in&the&latest&ALPIDE&version.&Further&checks&are&needed&once&the&new&chip&is&back.&
b.) With&the&production&version&of&the&ALPIDE&being&available,&dedicated&noise&test&should&be&pursued&with&DC/DC&converters.&&
3.) HIC+assembly++
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Milestones Tracker - ALPIDE,IBstaves,OBstaves
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
ITSMaster_Plan_V2(Sep-15) 2015 2016 2017 2018 2019 2020
ALPIDEEDR(10/15)
ALPIDEPRR(7/16)
ALPIDEproduct.andtest(end7/17)
IBstaveEDR(3-4/5/16)
IBstavePRR(8/16)
IBFPCproducBonend(9/17)
IBspaceframe&coldplateprod.end(9/17)
IBstaveproducBonend(1/18)
IBassemblyend(3/18)
OBstaveEDR(3-4/5/16)
OBstavePRR(12/16)
OBFPCproducBonend(12/17)
OBspaceframe&coldplateprod.end(1/18)
OBHICproducBonend(4/18)
OBstaveproducBonend(7/18)
OBstaveassemblyend(10/18)
May2016
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Milestones Tracker - ROelectronics,mechanics&cooling, commissioning,installaZon
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
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ITSMaster_Plan_V2(Sep-15) 2015 2016 2017 2018 2019 2020
ROelectronicsEDR(12/16)
ROelectronicsPRR(12/17)
ROelectronicsprod.end(12/18)
DetectorbarrelEDR(7/16)
DetectorbarrelPRR(11/16)
Detectorbarrelprod.end(7/17)
Servicebarrel/cageEDR(9/16)
Servicebarrel/cagePRR(2/17)
Servicebarrel/cageprod.end(9/17)
CoolingplantEDR(7/16)
CoolingplantPRR(10/16)
Coolingplantready(9/18)
Commissioningsurfaceend(5/19)
InstallaBonduringLS2(7/20)
14monthsconBngency
May2016
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Nuovo Coordinatore Nazionale ITS Upgrade dal 1 Aprile 2016
Stefania Beolè (To)
V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016
Thank you !
24 V. Manzari Riunione Referee INFN – Roma, 26 Maggio 2016