spectrum integrity overview 2013

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Spectrum Integrity, Inc. Advanced Interconnect Solutions Overview and Introduction Printed Circuit Design January 2013 1

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Page 1: Spectrum Integrity Overview 2013

Spectrum Integrity, Inc. Advanced Interconnect Solutions

Overview and Introduction

Printed Circuit Design

January 2013

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Page 2: Spectrum Integrity Overview 2013

Overview

Who we are:

• An experienced team of Engineers providing custom solutions for Interconnect Applications from DC to 110GHz and beyond

• Our specialty is with High-Speed Digital, RF, and Millimeter-Wave signals

• Our main focus is in Circuit Design, PCB Design, Product Development, and Test

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Page 3: Spectrum Integrity Overview 2013

Design Capabilities

• Transmission Line Analysis and Design

• High Power RF and design for extreme environments

• Thermal Management

• 3D EM Modeling and Simulation

• Chip-on-board

• PCB Material Selection and Stackup Design

• RF Connector Transition Optimization and Design

• Burn-in and HTOL design. Both static and dynamic RF and High-Speed

• Re-engineering of existing designs to improve Signal Integrity and to make more manufacturable

• Component Engineering

• Microwave Circuit Design: Filters, Couplers, Dividers, LNAs, etc.

• Flex Circuit Design

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Page 4: Spectrum Integrity Overview 2013

PCBs for Ultra High-Speed Applications (40Gbps to 100Gbps and beyond)

Transmission Line Design and Optimization – we have many proven designs “cataloged” for re-use. Full EM field solvers are utilized for the most demanding applications.

Spurious modes detected in CPW

S21= -0.28 dB @ 40 GHz

CPW performance after suppression of spurious modes

Optimized CPW for a multilayer PCB

0.00 2.00 4.00 6.00 8.00 10.00Distance [mm]

0.10

1.00

10.00

100.00

1000.00

10000.00

Co

mp

lexM

ag

_E

Ansoft LLC HFSSDesign1XY Plot 3

m2

m1

Curve Info

ComplexMag_ESetup1 : LastAdaptiveFreq='20GHz' Phase='0deg'

Name X Y

m1 1.0000 3.4812

m2 3.0000 44.2367

Ultra high-speed Diff Pair

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Page 5: Spectrum Integrity Overview 2013

RF Connector Transition Design (an often overlooked feature by many)

Careful attention is given to ensure signals efficiently “launch” onto and off of planar structures. We have developed numerous designs that have proven performance.

A particular area of expertise is with Transition Design for Multilayer PCBs

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Page 6: Spectrum Integrity Overview 2013

Example of connector optimization

S11= -13.5 dB @ 28 GHz (max)

S21= -0.67 dB @ 40 GHz

Before Optimization

S11= -21 dB @ 28 GHz

S11= -19 dB @ 40 GHz (max)

S21= -0.58 dB @ 40 GHz

After Optimization

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Page 7: Spectrum Integrity Overview 2013

Advanced Routing Capabilities

We have developed numerous custom techniques that allow automated advanced routing for arbitrary geometries, such as tapered arcs, with full net intelligence, for optimum performance.

Photo at left shows 1.5 mil (38um) lines tapering smoothly to wider lines and filled micro vias.

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Page 8: Spectrum Integrity Overview 2013

Chip-on-board

System model of components, transmission lines and wire bonds

Overall loss S11, S22, S33, (dB)

We have completed many successful chip-on-board designs from 10GHz up to 50GHz and can make extensive use of modeling and simulation if needed.

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Page 9: Spectrum Integrity Overview 2013

Dynamic Burn-in for at-speed HTOL Design and development of dynamic burn-in boards is an area of particular expertise. We have produced successful HTOL designs for up to 50GHz in a 150C environment for 8,000 hours.

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Page 10: Spectrum Integrity Overview 2013

CAD Screenshots of PCB Examples

40GHz Characterization PCBs (12 to 16 layers) 50GHz Chip-on-board PCB (14 layers and 9 cavities for bare die)

28GHz Mixed-Signal PCB 10

Page 11: Spectrum Integrity Overview 2013

CAD Screenshots of PCB Examples

High Density design example. This PCB is 2.5” x 1.8”, 14 layers, 758 components, 10Gbps signals

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Page 12: Spectrum Integrity Overview 2013

Samples of Completed PCB Designs

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Page 13: Spectrum Integrity Overview 2013

Samples of Completed PCB Designs

Example designs with die cavities. Capable of +/- 1mil depth tolerance (photos from scrap boards)

Multichip Module (MCM) Designs

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Page 14: Spectrum Integrity Overview 2013

Eye diagram measured at 36GHz of an output signal path of a chip-on-board PCB. The path included wire bonds, transmission line, and an optimized transition for the RF connector. This particular PCB was for a 28GHz application but was measured at 36GHz to demonstrate margin of the design.

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Sample Test Data From SI Designs

Page 15: Spectrum Integrity Overview 2013

Sample Test Data From SI Designs

TDR plot of a transmission path of an RF Test Board

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Page 16: Spectrum Integrity Overview 2013

Sample Test Data From SI Designs

Before and after test results showing Insertion Loss improvement with a replacement design done by Spectrum. (Horizontal axis in GHz)

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Page 17: Spectrum Integrity Overview 2013

Sample Test Data From SI Designs

Return Loss measurement of a Through-Line using optimized connector transitions. (Horizontal axis in GHz)

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Page 18: Spectrum Integrity Overview 2013

Sample Test Data From SI Designs

Return Loss of a 5GHz RF Power Amplifier PCB

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Page 19: Spectrum Integrity Overview 2013

Industry Recognition

http://www.microwavejournal.com/blogs/1-rog-blog/post/17921-celebrating-rog-award-contest-winners-at-ims-2012

Spectrum named winner, at recent IMS show in Montreal, for Best Digital Application from Rogers Corporation design contest. Our design entry was for a 100Gbps application.

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Page 20: Spectrum Integrity Overview 2013

Thank You

For Sales: Robert Blomquist (805) 426-4267 [email protected] For Engineering: Michael Ingham (619) 755-7869 [email protected] http://www.spectrumintegrity.com/

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