smta october 2002elizabeth howard's curtain call dinner theater when: thurs. dec 5th, 2002...

OCTOBER 2002 LA/OC SMTA CHAPTER TRAINING PROGRAM

& Vern Solberg

Are Proud to Present

Design for Advanced IC Package Technology PCB Design Guidelines and

Assembly Process Development For Fine-Pitch QFP and BGA/CSP

Course Objectives This tutorial workshop has been developed to assist the PCB designer and assembly process specialists in adapting high pin count fine-pitch ICs, high-density ball grid array and fine-pitch chip-scale device families. All of these package technologies offer improved product performance and reduced product size, but circuit routing and assembly processing have become more complex. Technology advances, the growing complexity of electronic products and reduced time to market goals con-tinue to burden packaging and assembly specialists. Adapting these smaller and of-ten, higher l/O devices can be challenging. To reduce the delays that often occur during the development, the course leader will assist the designer and engineer to recognize PCB design related disciplines and limitations as well as implement proven methods that can help reduce manufacturing costs and improve assembly process yield.

Topics: · Applications Driving Package Miniaturization · Impact of Device and IC Packaging Standards · Industry Defined Solder Joint Requirements · How to Plan High Density Land Pattern Geometry · Adapting Higher Density PCB Circuit Routing · Planning for Efficient Assembly Processing

What You Will Learn: · New IC Package Innovations and Methodology · PCB Design and Land Pattern Development · Circuit Board Material Selection · Specifying PCB Surface Finish · Alternative HDI Fabrication Technologies · Assembly Process Requirements for QFP, BGA and CSP

DATE October 24th, 2002

TIME

8:30AM to 4:00PM

COST $160 for Members

$220 for Nonmembers

LOCATION Conexant

Newport Beach, CA

REGISTER ONLINE

http://www.smta.org/education/chapter_training/chapt

er_training.cfm

OR Contact Espi

via e-mail:

[email protected]

OCTOBER 2002

CHAPTER OFFICERS

President Riki Brown

Golden West Technology Fullerton, CA

TEL: (714) 738-3775 FAX: (714) 738-7727

E-mail: [email protected]

Vice- President of Chapter Training Atul Mehta

Jet Propulsion Laboratory Pasadena, CA

TEL: (818) 393-2962 FAX: (818) 393-5055


Vice-President of Chapter Education Scott Penin

APW Enclosures Irvine, CA

TEL: (949) 474-8998 FAX: (949) 474-1340


Vice-President of Membership Michelle Ogihara

Seika Machinery, Inc. 3528 Torrance Blvd., Suite 100

Torrance, CA TEL: (310) 540-7310


Secretary Kathy Palumbo

Production Analysis & Learning Services, LLC TEL: (949) 713-7229 FAX: (949) 713-7229


Treasurer Nat Longrose

Spec Elite, Inc. 2031 E. Cerritos Ave, Ste 7D

Anaheim, CA 92806 TEL: (714) 774-6500 FAX: (714) 774-6501


Vendor Advertisement Chairman Michelle Ogihara

Seika Machinery, Inc. 3528 Torrance Blvd., Suite 100

Torrance, CA TEL: (310) 540-7310


SPEAKER PROFILE

Vern Solberg C.E.O

Solberg Manufacturing Technology Vern Solberg has more than twenty-five years of experience in

the design and manufacturing of electronic products. Founder of

NuGrafix Group, the first design and engineering service com-

pany dedicated to SMT. He also served as Manager of Design

Engineering for eight years with SCI Systems, a multinational

assembly service company followed by six years as the Sr. Ap-

plications Engineer with Tessera, the developer of the uBGA

package technology. An independent consultant, his primary

activities are related to application engineering PCB design and

assembly process development, serving as a technical advisor to

a number of industry related programs focusing on product

"Design for Efficient Manufacturing".

Current Activities · Chairman/Secretary for IEC-TC91/WG2, International Stan- dards for SMT Assembly Processes · Editorial Advisory Board Member and Writer for "Surface Mount Technology Magazine" · Author of "Design Guidelines for Surface Mount and Fine- Pitch Technology" published by McGraw-Hill of New York

Contact Information Vern Solberg Solberg Manufacturing Technology Tel.:408-741-1231 or 414-963-1440 e-mail: [email protected]

LA/OC SMTA Chapter Presents Christmas Party 2002

Elizabeth Howard's Curtain Call Dinner Theater When: Thurs. Dec 5th, 2002

Time: 6:15 pm Social/Dinner Hour, 8 pm Curtain Call Menu: Salad, Soup and a choice of three entrees...Roast Chicken, Roast Loin of Beef or Honey Glazed Ham.

Lemon Chiffon or English Custard Pie for dessert. Please note there is a no host bar available.

Play: JOSEPH AND THE AMAZING TECHNICOLOR DREAMCOAT Reservations: Contact MaskTek (714) 557-3383

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PRESIDENT’s MESSAGE By: Riki Brown

SMTA international in Chicago is over now. The reports I received said it was a good show with excellent technical sessions. The attendance was down and the exhibitors were fewer this year with some of the bigger players missing altogether. With the pre-sent state of our economy that is to be expected. We were represented at the Chapter Officers Meetings and SMTA Luncheon by Scott Penin and Atul Mehta were we re-ceived three awards, second place for Chapter of the Year, Best Chapter Newsletter and New Chapter Web Site.

Well its that time of year again for elections for our chapter offices. We have Pres., Vice President, Secretary and Treasurer open for nominations. If you would like to be nominated for any of these positions please call me or any of the board members. Be-ing an officer is a little work and requires you to attend a board meeting once a month plus our chapter meeting or event. LA/Orange County has one of the best SMTA chapters in National. Our board is dedicated to the mission of SMTA and is an out-standing leadership team. If you would like to be part of this dynamic group we wel-come you. The rewards and benefits are great. The deadline for nominations is Oct. 31, 2002. You also will be helping plan the year for 2003.

We have our chapter training by Vern Solberg also coming up this month on OCT. 24. We need your support in attending this great and worth while training seminar Design for Advanced IC Package Technology PCB Design Guidelines and Assembly Process Development For Fine-Pitch QFP and BGA/CSP. Cost is only $160 for members and $220 for non-members but includes a one year membership in SMTA. Vern is a great speaker and very knowledgeable in his field. He was instrumental in developing the IPC 782 Guidelines for SMTA Design with IPC. He has also spoken at our chapter meetings several times. Please check out our web site at www.laocsmta.org for details and the link to the National web site for registration. It will be held at Conextant in Newport Beach.

We will have two more meetings after our chapter training in Nov. and Dec. to wrap up another year for our chapter. Our Nov. 21 meeting is on IR thermal Imaging at the Embassy Suites in Anaheim. On Dec 5 we will have a non-technical Christmas meet-ing at Elizabeth Howard’s Curtain Call Dinner Theater in Tustin where we will have a great dinner and social hour and front row seats to see the musical play “Joseph and the Amazing Technicolor Dreamcoat”. This should be a fun event and a great way to wrap up the year. You can bring your significant other for a great date night so mark your calendars. Tickets are limited for this so make your reservations early.

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SEPTEMBER MEETING REVIEW Written By: Atul Mehta

The LA/OC SMTA meeting for the month of September 2002 was held on September 19th at the Embassy Suites in Anaheim. The topic was “Rework through IR technology: A new look”. The presentation was given by Ian Horne, C.E.O. for Solder Connections Inc.

Use of area array packages such as BGA’s, CSP’s and Flip Chips have increased many folds in recent years. Although the assembly process has matured during the evolution, for many, however, the concept of quality repair remains an expensive nightmare. A more thorough understanding of the area array pack-age and the production parameters can reduce fears of BGA repair, guarantee process control, and greatly save in rework costs.

Basically three repair concerns remain paramount: 1. Removing the component off the board without causing damage to the substrate, the lands, and adja-

cent components during the process. 2. Re-soldering the components in a process controlled manner. 3. Inspecting the quality of the completed rework process.

The density and performance requirements which drove the development of fine pitch, externally leaded devices, such as high lead count Quad Flat Packs, TAB and TCP components, cause enough of a repair headache from a handling, hand soldering, and inspection standpoint. While the area array package does not present the same handling problems, the soldering process cannot be achieved with typical repair tools, and inspection can only be achieved with the substantial investment of X-ray equipment. If the esti-mates are correct regarding the expected use of such components, then something must happen to make area array package repair a viable, user-friendly, and cost effective option for millions of repair operators worldwide.

Although the current types of BGA’s come in over 50 different variations, all packages can be divided into 2 important categories: a eutectic solder ball, currently representing over 90% of all area array pack-ages produced, and a non-eutectic or high melt solder ball.

In a production process, solder paste is screen-printed on the PCB; the components are then placed and reflowed. The additional paste on the land of a eutectic ball package is required for its flux content but generally not for its solder content. The eutectic paste on the land is consumed in the eutectic ball at re-flow and has no significant benefit to the joint. More accurately, the use of solder paste on eutectic ball micro-BGA or CSP installations must be considered based on the careful analysis. Paste is always re-quired for the installation of CBGAs with non-eutectic balls, as the additional solder is needed on the pad to create a meniscus or fillet at the base of the non-eutectic ball. Paste would, however, minimize prob-lems of co-planarity between a non-planar BGA and/or PCB by assuring that all balls contact and properly solder to the lands. For such cases, solder paste is then recommended even for eutectic ball area array package repair.

Uniform heat distribution and transfer across the entire surface of the area array package and its land pat-tern on the PCB is critical. The heating process and thermal profile must attempt to cause the package to reach reflow and uniformly "drop" or lower itself to the lands as the balls melt and form an intermetallic bond with the lands.

Non-uniform heating will cause the package to unevenly drop or tilt towards the side or corner that has prematurely reached reflow. If the process is stopped at this point, the component will not lower it uni-formly, is insufficiently soldered, and will not be perfectly parallel to the PCB. If the process is allowed to continue until all balls have reached the proper temperature, then those reaching reflow prematurely are overheated by the time the process is finished. In addition, a critical consideration for the extremely small and lightweight CSP components is the airflow rate in the convection reflow ovens. While a minimum air flow rate is required to transfer the heat to the component and PCB, this rate must not allow these light

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components to be either blown away or to move, i.e. vibrate, during the reflow process. When the ex-tremely small eutectic balls are in a liquid state, any movement can cause the surface tension and "support" function of the balls to be disrupted resulting in the CSP dropping completely onto the board during reflow. Convection reflow machine manufacturers recognize this specific problem with the CSP and are altering their processes accordingly.

From an automated placement standpoint, area array packages are actually more "forgiving" than other surface mounted devices. Although the eutectic ball of a micro BGA or CSP is extremely small and close together, placement accuracy needs to be only 50%. This is due to nature's surface tension principle that liquid objects always try to form a perfect sphere, which has the smallest surface area. Because we are placing a spherical ball on to a round pad, the surface tension of both objects at reflow will pull towards each other trying to form one sphere.

This property of "self-alignment" not only compensates for potential flaws of automated pick and place machines or mis-alignment caused by vibration on the conveyor belt in the reflow oven, but also makes alignment in a repair application that much easier. High-priced placement and mirror image vision sys-tems are simply not necessary!

While the de-soldering process can be handled with the majority of hot air equipment available, it is the re-soldering process, which is most difficult to control. Because the operator is unable to visually inspect the solder joints after the repair, it is essential that the reflow technology used will guarantee a quality in-stallation. Success here depends once again on uniform heat distribution across the package and PCB land pattern without blowing or moving the CSP during reflow, and depends on an optimal thermal profile. A convective heat transfer in a repair situation involves blowing heated air through a nozzle, which has the precise or approximate shape of the component. Airflow dynamics, encompassing the effects of laminar flow, high and low pressure zones, and circulation rate, is a complicated science in and of itself. When combining these physical effects with those of heat absorption and distribution, it is clear that the con-struction of a hot air nozzle for localized area heating and, therefore, proper BGA repair is a difficult task at best. Any pressure fluctuations or problems with the compressed air source or pump required by hot air systems would radically decrease the performance of the machine and would go undetected by the opera-tor. The whole issue of balancing required air flow rate with heat transfer has not only been a problem in handling ultra-light CSP components by causing them to move and drop during reflow, but has also been a problem when using solder paste in a repair application as micro solder balls can be blown across the PCB.

In a production machine, an accurate thermal profile is the key to process control. The starting point for setting the production parameters is the actual board temperature. A convective repair machine that can store various profiles of the heating element and/or air flow temperature, can only be an approximate indi-cator as to the thermal situation on the board. Such features can in no way precisely document or control the actual reflow process and are often superfluous and misleading. A more accurate procedure is to moni-tor and document the actual board or component thermal profile by attaching a K-type thermocouple to the PCB during the reflow process. Only in this manner can a process controlled repair installation be guaranteed.

A viable repair alternative to the numerous convective heat transfer problems listed above is the use of medium wavelength infrared. The clear advantage for process controlled BGA installations can be seen in the following comparative test results. A thermal image test for uniform heat distribution across a surface reveals a comparison of 3 different hot air nozzles to the alternative of medium wavelength infrared. The superiority of infrared vs. hot air is a physical effect that cannot be denied.

The presentation was very thorough and provided insight into IR rework process followed by an actual demo of the equipment. The chapter wishes to thank Mr. Horne for an outstanding and educational pres-entation enjoyed by all.

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2003 SMTA LA/OC Source Guide Calling All Advertisers

Michelle Ogihara has been working diligently on recruiting Ad-vertisers for the 2003 SMTA LA/OC Source Guide, but in a brief in-terview she stated “We are still short of our goal. We need 11 more to reach our goal.” Michelle has put countless hours into supporting your chapter and could really use some of your wonderful support! So, open up your heart and give her call to find out how you can you help! Contact: Michelle Ogihara at 310-540-7310 ext.120, email: [email protected]

LA/OC SMTA Chapter Training & Vern Solberg

Are Proud to Present Design for Advanced IC Package Technology

PCB Design Guidelines and Assembly Process Development For Fine-Pitch QFP and BGA/CSP

Thursday October 24th, 2002 8:30am to 4:00pm

@ Conexant in Newport Beach, Ca. Cost:

$160 For SMTA Members $220 for Non-Members Register Online at:

http://www.smta.org/education/chapter_training/chapter_training.cfm

10

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LA/OC SMTA Chapter Presents

Christmas Party 2002 At

Elizabeth Howard's Curtain Call Dinner

Theater When: Thurs. Dec 5th, 2002

Time: 6:15 pm Social/Dinner Hour, 8 pm Curtain Call Menu: Salad, Soup and a choice of three entrees...Roast Chicken, Roast Loin of Beef or Honey

Glazed Ham. Lemon Chiffon or English Custard Pie for dessert. Please note there is a no host bar available.

Play: JOSEPH AND THE AMAZING TECHNICOLOR DREAMCOAT Reservations: Contact MaskTek (714) 557-3383

Elizabeth Howard's Curtain Call Dinner Theater provides a touch of Broadway in the heart of South-ern California. Featuring favorite musical comedy productions, and professional actors who provide

entertainment for the whole family. Accompanied by a delicious meal in an elegant setting. (714)838-1540, 690 El Camino Real, Tustin, CA 92780

http://www.CurtainCallTheater.com

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Contact Riki Brown

Call: (714) 738-3775 / Fax: (714) 738-7727 / E-Mail: [email protected]

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O m n i Tr a i n i n g C o r p

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⇒ Courses to the new IPC-A-620 Cable and Wire Harness Assemblies

⇒ ESD Training: Handbooks, Awareness Courses and Seminars

⇒ Dummy Components: Training PWB’s and Components

⇒ Printed and Digital Electronics Assembly Photographs ⇒ Workbooks & Handbooks (Spanish and Custom available) ⇒ Posters of Workmanship Criteria for the Classroom and Assembly Area ⇒ Training Videos, PowerPoint CD ROMs, and 35mm Slide Sets ⇒ Spanish Handbooks, Workbooks and Workmanship Standards ⇒ Inspection Tests in Printed and Digital Formats ⇒ Turnkey Training Development and Maintenance Programs ⇒ BGA Rework and Reballing Courses with Various Techniques & Equipment

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Ph: (909) 945-9495 ◊ Fax: (909) 945-9459

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