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SINGULUS
TECHNOLOGIES
February 2018
Innovate processing systems for high performance solar cell concepts
Torsten Eisert, Director Marketing & Sales
SINGULUS TECHNOLOGIES AG
February 2018 - 2 -
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History SINGULUS TECHNOLOGIES
Foundation
SINGULUS
TECHNOLOGIES
Ernst Leybold started his business in Cologne
Company building 1860
1966 1851 1860 1967 1995
LEYBOLD HERAEUS
Vacuum Technology, Metallurgy
and Coating
Unicorn Pharmacy was founded 1600 in Hanau
W.C. Heraeus took over business in 1851 and
started with platinum
18
51
Merger
LEYBOLD / BALZERS
1995
SINGULUS TECHNOLOGIES AG
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Headquarter Kahl am Main, Germany
Production Site
Fürstenfeldbruck (Munich), Germany
France
Sausheim
Latin America
Sao Paulo
China
Guangzhou
Asia Pacific
Singapore
Taiwan
Taipeih
Legend:
Subsidiaries/Sales & Services
Headquarter
Production Site Fürstenfeldbruck
Agents
SINGULUS TECHNOLOGIES
Subsidiaries & Agents Worldwide
China
Shanghai
Worldwide Connected, Close to the Markets,
Close to the Customer Base
Semiconductor:
Over 180
systems installed
Photovoltaic:
Over 6000 MW
production capacity
Optical Disc:
Over 8.550
systems sold
Medical Technology:
Market entry 2017
First order received
Consumer Goods:
New POLYCOATER
orders received
Japan
Tokyo
SINGULUS TECHNOLOGIES AG
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Process Overview SINGULUS TECHNOLOGIES
Thin Film Deposition
- Sputter deposition (DC, RF, MF, Bipolar, pulsed)
- Evaporation (thermal evaporation)
- CVD
- PECVD (ICP, µ-Wave) - AACVD (aerosol assisted CVD)
SURFACE ENGINEERING
- Embossing, imprint nano lithography
- Injection molding
- Functionalization
- Oxidation
- Plasma cleaning & etching
- Lacquering & bonding
Thermal Processing
- Rapid thermal processing
- Conditioning
- Annealing
Wet Chemical
- Cleaning/washing
- Etching/polishing
- Texturing
- Conditioning
- Chemical bath deposition
- Developing
THIN FILM
DEPOSITION
SURFACE
ENGINEERING
THERMAL
PROCESSING
WET
CHEMICAL
SINGULUS TECHNOLOGIES AG
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SINGULUS TECHNOLOGIES is Active in both:
Crystalline Solar & CIGS Thin Film Solar
• High cell & module efficiency
• Easy process
• Advanced technology
• Production split on different
locations (silicon, ingot, wafer,
cell, module)
Crystalline Solar
• Excellent stability
• Good low light performance
• Light soaking effect
• Reduced sensitivity to overheating
• Tolerance to shading & low intensity
CIGS Thin Film
SINGULUS TECHNOLOGIES AG
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Test
incoming
wafer
Cleaning and
Texturing
(Wet
Chemical)
A-Si:H
Frontside
Deposition
(PECVD)
A-Si:H
Backside
Deposition
(PECVD)
TCO Front &
Backside
Deposition
(PVD)
Testing and
Sorting
Metallization
(Screen
Printing &
Annealing)
Selected Key Process- and Equipment Steps at
the Heterjunction Solar Cells Process
▲ SILEX II CLEANTEX
Cleaning and Texturing
GENERIS PVD
TCO Front & Backside ▼
SINGULUS TECHNOLOGIES AG
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GENERIS PVD Inline Sputtering Equipment
ITO top down ITO bottom up
Gas separation
TMP
SINGULUS TECHNOLOGIES AG
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Typical System Requirements for GENERIS PVD
- Wafer size: c-Si 156 x 156 mm2
- Wafer thickness: 120 – 200µm
- Double side deposition of ITO Indium Tin Oxide using rotatable
cathodes
-Throughput: >2.500 w/h (gross) approx 100 MW)
-Throughput: >5.000 w/h (gross) approx 200 MW
- Layer characteristics:
- Layer thickness
- Frontside: 110 nm; uniformity: +/- 5%
- Backside: 110 nm; uniformity: +/- 5%
- Target lifetime: > 15 days
- Optional: Gas separation between ITO front/back
- Temperature on substrate during process: < 200° C
- Typical process pressure: 2 - 5 x 10-3mbar
- Vacuum base pressure : 1 x 10-6mbar
SINGULUS TECHNOLOGIES AG
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SILEX II Wet Processing System for
Heterojunction Solar Cells
SINGULUS TECHNOLOGIES AG
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Wet Chemical
SINGULUS - Innovations for New Technologies
Integration of common and advanced wet process applications
Product Information Wet Processing
Cleaning
Organic Cleaning
Metal Cleaning
Surface Conditioning
SC1/SC2
Megasonic
TMAH/H2O2
O3 Application
Etching
HF
P-Etch
BOE
HCl
KOH
Metal Etching PR
Strip
Rinse Cascade Overflow
Dump-Spray System
Combination Rinse
Lift
off
Dry Spin-Rinse Dryer
Hot/Cold Air, N2 Drying
Marangoni Dryer
Coating
SINGULUS TECHNOLOGIES AG
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New Product Development:
LINEX Inline Wet Process Equipment
Applications
• Final Clean
• SDE & alkaline texturing
• Acidic texturing & polishing
• Single side etching & PSG removal
SINGULUS TECHNOLOGIES AG
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5 Lanes 10 Lanes
LINEX
Throughput up to 8400 wph
Lanes 5 Lane & 10 lanes
Velocity 2,5 m / min
LINEX - Basic Approach
SINGULUS TECHNOLOGIES AG
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LINEX – Process Flow Comparison to Slurry
HF/HNO3/Additive Rinse Singozon Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer
Standard process flow
Slurry -Cut
HF/HNO3 Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer
DW-Cut
DW process flow
SINGULUS TECHNOLOGIES AG
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LINEX DW – Process Results
REM microscopy – DW Texture
Supplier A Supplier B Supplier C
DW multi material of different suppliers can be texturized with our solution
SINGULUS TECHNOLOGIES AG
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Advantage for enduser:
No Change on Existing Utility
HF/HNO3/Additive Rinse Singozon Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer
HF/HNO3 Rinse porSi Rinse HF/HCl Rinse Hot Air Dryer Slurry-Cut
DW-Cut
• No Ag particle treatment needed
• No change on the existing utility for isotropic etching
• Much less disposal to be treated compared to MCCE
SINGULUS TECHNOLOGIES AG
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Smart Solutions for High Tech Infrastructure
SINGULUS TECHNOLOGIES AG
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Si barrier layer &
Mo Back
Contact
>Sputtering
Scribing P1 > Laser
CdS or. alt. buffer
Deposition
>Buffer Layer
Deposition Interconnect and
Encapsulation >Lamination
Glass Washing
> Wet cleaning
Scribing P2 >Mechanical
>Laser
2
7 Scribing P3 >Mechanical
> Laser
CIS/CIGS
Substrate
Inspection
Precursor
> Sputtering
Front Contact
> Sputtering
3
InS &
iZnO
> Evaporation,
Sputtering Automation
5
1 6
6
SINGULUS TECHNOLOGIES Provides all Key
Production Steps for a CIGS Fab.
Selenezation/
Sulphurization
> CISARIS Oven
4
Selen Evaporation
> Thermal evaporation
SINGULUS TECHNOLOGIES AG
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Innovative Large Sputtering Systems for CIGS
Thin Film Modules
• Integrated power supply design
• No carrier return system necessary
• Fully vertical substrate transport
• Special designed carrier transport system
• Load and Unload of substrate from the same side of the machine
• Usage of rotatable cylindrical magnetrons for highest utilization of target material
• Temperature processing before and during deposition available
• Gas separation by dynamic slit valves and/or by individual lock chambers
SINGULUS TECHNOLOGIES AG
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SELENIUS Vacuum Evaporation System for
CIGS Thin Film Modules
• Inline evaporation tool with high throughput capability
• Optimized utilization of evaporation material through unique chamber design
• High deposition rate and repeatability
• Excellent flux uniformity
• Excellent temperature uniformity during process sequence
• Substrate Pre-Heating
• In-situ monitoring of flux and temperature
SINGULUS TECHNOLOGIES AG
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CISARIS Selenization - Innovative Production
Equipment for CIGS Manufacturing
• Rapid heating (up to ∼ 4 °C/s) of large substrates with metal precursor coating (CIG)
• Homogeneous gas distribution and low gas consumption Introduction of H2S & H2Se
gas at various stages Uniform heating of large substrates up to 550 °C
• Uniform cooling of the substrate to avoid glass warpage
• Excellent temperature control (mean variation < 5 °C) at all process stages
SINGULUS TECHNOLOGIES AG
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Deposition of Buffer Layer for CIGS Modules
• Standard reference process: highest efficiencies and low risk
• More than 150 process modules in production
• Minimized chemical consumption
• Single side deposition incl. protection against backside contamination
• Modular system (easy upgrade for higher throughput)
• Reproducible process results
• Automatic dosage and mixing system
• Deposition systems for cadmium-free buffer layers
SINGULUS TECHNOLOGIES AG
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Contact
SINGULUS TECHNOLOGIES AG
Hanauer Landstrasse 103
D-63796 Kahl/Main
Dr.-Ing. Stefan Rinck, President and CEO
Tel: +49-6188-440-109
[email protected] Markus Ehret, CFO
Tel: +49-6188-440-204 [email protected]
Maren Schuster, Head of Investor Relations
Tel: +49-6188-440-612
[email protected] Bernhard Krause, Communications Worldwide
Tel: +49-6181-9828020
Forward-Looking Statements
This presentation contains forward-looking statements
based on current expectations, assumptions and forecasts
of the executive board and on currently available
information. Various known and unknown risks,
unpredictable developments, changes in the economic and
political environment and other presently not yet
identifiable effects could result in the fact that the actual
future results, financial situation or the outlook for the
company differ from the estimates given here. We are not
obligated to update the forward-looking statements made in
this presentation unless there is a legal obligation.