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Simulation: Powerful tool for Microscale Materials Design and Investigation Dr. Xining Zang ME 138/ME238 Prof. Liwei Lin Professor, Dept. of Mechanical Engineering Co-Director, Berkeley Sensor and Actuator Center The University of California, Berkeley, CA94720 e-mail: [email protected] http://www.me.berkeley.edu/~lwlin

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  • Simulation: Powerful tool for Microscale Materials Design and Investigation

    Dr. Xining Zang ME 138/ME238

    Prof. Liwei Lin Professor, Dept. of Mechanical Engineering Co-Director,

    Berkeley Sensor and Actuator Center The University of California, Berkeley, CA94720

    e-mail: [email protected] http://www.me.berkeley.edu/~lwlin

  • Time Scale and Length Scale

  • Modeling and Simulation Modeling: describes the classical scientific method of formulating a simplified imitation of a real situation with preservation of its essential features In other words, a model describes a part of a real system by using a similar but simpler structure

    Simulation: putting numbers into the model and deriving the numerical end-results of letting the model run on a computer. A simulation can never be better than the model on which it relies.

  • Computational Materials Science

    Micro scale Meso scale Atomic scale Electron scale

    Experiments

    Materials Science Question

    Model System

    Simulation

    Result Analysis

    Theory

  • https://www.mgi.gov/subcommittee-materials-genome-initiative-smgi

  • Materials Genome Initiative

    https://mgi.nist.gov/

    The Materials Genome Initiative is amulti-agency initiative designed to create anew era of policy, resources, andinfrastructure that support U.S. institutionsin the effort to discover, manufacture, anddeploy advanced materials twice as fast, ata fraction of the cost.

    Advanced materials are essential toeconomic security and human well being,with applications in industries aimed ataddressing challenges in clean energy,national security, and human welfare, yet itcan take 20 or more years to move amaterial after initial discovery to themarket. Accelerating the pace of discoveryand deployment of advanced materialsystems will therefore be crucial toachieving global competitiveness in the21st century.

  • Materials Project Harnessing the power of supercomputingand state of the art electronic structuremethods, the Materials Project providesopen web-based access to computedinformation on known and predictedmaterials as well as powerful analysistools to inspire and design novelmaterials.

    Dr. Kristin Persson (LBNL) Prof. Gerbrand Ceder

  • Molecular Dynamics Key: Newton second law & Hamiltonian

    Sir William Rowan Hamilton (1805-1865 Ireland).

    Sir Isaac Newton (1643-1727 England)

  • Molecular Dynamics• Using the information gained from r, v and application

    of the forces:

    • Initial positions are advanced towards a lower energy state.

    • Through some time step delta t

    • New positions are obtained.

    • New velocities are obtained

    • REPEAT.

    • This is repeated as many times as is needed to obtained equilibrium.

  • MD for mechanical properties

    Young’s ModulusYoung’s Modulus

    Yield Strength Yield Strength

    Interface structure Interface structure

    Dislocation-interface interactionDislocation-interface interaction

  • An example: ultralow elastic modulus

    10μm

    GPanm

    10~20nm thickness, one order decrease)

  • Mechanical propertyNanocrystalline softening

    Has been limitedly studied in typical FCC metal Cu/Ti etcGrain boundary dominated sliding > dislocation strengthening 2D stress field

    Reverse Hall-PeigeNeed to be tested out

    Nature 391, 561-563 (5 February 1998) International Journal of Solids and StructuresVolume 49, Issue 26, 15 December 2012, Pages 3942-3952

  • Why atomistic simulation?

    A.Misra, M.J,Demkowicz,et,al JOM,2008 April

    from • Hall-petch

    to• Single dislocation• Nanocrystalline softening?

    thickness

  • Dislocation

  • outline

    Simulation process outline

    Calculation details

    Interface structure

    Dislocation-interface interaction

    Methodology

    Results and discussion

    Difficulties and questions

  • Simulation process outline

    interface construction

    relaxation [quenching MD]

    calculation certain properties

  • Interface structure

    interface

    Coherent ——transparent

    Semi-coherent——half-transparent

    Incoherent interface ——opaque

    examples

    Cu-Ni (Fcc-Fcc) {Medyanik 2009}{Rao 2000}

    Cu-Ag(Fcc-Fcc) {Hoagland 2002}Cu-Nb(Fcc-Bcc)

    {Wang, 2008} {Wang, 2008}

  • KS

    KS1

    KS2

    KSmin

    plane strain adjoining atom layer

    Incoherent Cu-Nb

    || , ||Cu Nb Cu Nb (111) (110) 110> 111>

    Kurdjumov–Sachs (KS)

  • Cu and Nb slabs translate

    minimize the energy

    Positions of Cu and Nb not relaxed

    perfect Cu and Nb

    M.J.Demkowicz, Jour.Necluar.Mater.372(2008)

    KS1

  • a strained monolayer

    3 Cu, 2 Nb 1 Nb

    homogeneous in-plane deformation

    KS2

    Requires– Direction of the monolayer rows A||1– The rows C || Nb– d(A) is chosen such that s(C)=s(Nb)– d(C) is chosen such that s(A)=s(Nb)

    M.J.Demkowicz, Jour.Necluar.Mater.372(2008)

    Results– 1 atoms less per 188 atoms– Energy per atom to create the artificial monolayer

    0.03eV/atom– The A row lies between the valley of NbAnd the C rows lies between the Nb

  • • Two-body Morse

    • EAM ,CuNb in CsCl, first-principle

    using VASP.

    Potential for the bi-layer atoms ( )( ) (1 )M Mr RCuNb M Mr D e D

    ' ( ) ( ) ( )

    1cut

    CuNb CuNb CuNb cut

    m

    cut CuNb

    r rcut

    r r r

    r drm r dr

    M.J.Demkowicz, Jour.Necluar.Mater.372(2008)

  • Cu-Nb J.wang, et,al, Acta 56(2008)3111

    Cu-Nb J.wang, et.al, Acta 56(2008)5685

    Cu-Nb Hoagland et.al, Philos.Mag, 2006

    Cu-Ni / Cu-Ag Hoagland et.al, Philos.Mag, 2002

    Cu-Nb S. Shao, et.al, Model.Sim.MSE 2010

    Details about the structure construction in papers

  • J.wang, et.al,Acta,2008

    region 1 ——region 2

    PBC:

    in the x and z directions.

    Cu:42 185.9530 A ;19 48.5677A;

    Nb: 23 185.9614 A ; 17 48.5958A;[112]Nba

    [110]2Cua

    [111]2Cua

    [112]2Cua

    KS1

    KS2

    u / x 0.04785 u / 0.09209z / x 0.02763w / 0.05317w z displacemnt gradient

    Cu inserting strained monolayer

    additional PBC displacemnt gradient

    u / x 0.4144 4e u / 0.4867 3z e

    / x 0.1441 4w e / 0.8811 4w z e

    Cu-Nb J.wang, et,al, Acta 56(2008)3111

  • X,z=18.6 nm y=4.86

    Cu-Nb J.wang, et,al, Acta 56(2008) 5685

    Cu-Nb Hoagland et.al, Philos.Mag, 2006

    Ksmin

    Relaxation:Translate in 3 directions, but rotation is not allowed Excess energy:(relative to their respective cohesive energy. )

  • Another way to construct the interfaceFixing bottom

    wide enough

    Cu-Nb S. Shao, et.al, Model.Sim.MSE 2010

    Two sets of Slip plane.10.5

    dislocations through interface

    Dislocation transmission

  • Interface-dislocation interaction

    Modulus interactionModulus interaction

    Size interactionSize interaction

    Chemical interactionChemical interaction

    “ ”ineraction“ ”ineraction

  • Modulus interaction

    modulus mismatch (Koehler barrier) introduce an image force

    Koehler stress to move a screw dislocation from a softer layer to a harder layer against its elastic image

    (a/2) screw dislocations are considered to be split into Shockley partials

    1 2( ) /kf E E h

    * 1 1 2

    2 1

    ( )4 ( )k

    bh

  • Size interactionvan der Merwe misfit dislocations /coherency stresscoherency stress in multilayers:

    lattice parameter misfit between the lamellae, elastic constants of the individual lamellae, volume fraction of the lamellae and wavelength of the multilayer system

    Misfit dislocations ——forest-type obstacles

    * ,

    0,

    d c

    c

    a ba

  • Chemical interactiongamma surface mismatch introduce a localized force on the gliding dislocations

    the negative elastic interaction energy between the Shockley partials

    the total energy of the stacking fault bounding the partials.

    The stress on the leading dislocation of the a pile-up

    the stacking fault energy

    el chE E E

    elE

    chE

    * 2 , , , ( )ich i i Cu Ni Cuwhereb b

    i

  • Calculation details

    relaxation

    defect visualizatin

    thermodynamic stress

    elastic constant

    strain related

    interface constructioninterface construction

    Relaxation[quenching MD]

    Relaxation[quenching MD]

    calculation certain properties

    calculation certain properties

  • {Wang, et.al, Acta (2008)5685}

    Interface dislocation displacement field: Barnett-Lothe solution.

    field is applied to both the movable and fixed region

    Dislocation line is parallel to Z axis

    Relaxation Quenching MD until the force on any atom

  • Lattice glide dislocation enters the interface

    disregistry analysis

    Pairs of atoms straddle the desired shear plane

    relaxed system

    atoms in the sheared systems

    The disregistry

    r r

    ij i jr r r

    d d d

    ij i jr r r

    d

    ij ijr r

  • {Shao, Modelling Simul. Mater.Sci.Eng.18(2010)} conjugate gradient procedure

    energy minimization

    parallel atomistic simulation code LAMMPS

    visualization of the defects: atomic excess energy, coordinate number;

    centro-symmetry parameter

    • centro-symmetry parameter:

    • Atomeye function to compute P

    • pairs of the opposite nearest neighbors

    2

    1,

    | |i ii

    P R R

    2

    1,

    2

    1,2

    | |

    2 | |

    i ii

    jj

    R Rc

    R

    i iR andR

  • Indentation lattice glide dislocation

    Indentation on Cu-Nb bi-layer

    [adsorption]

    Indentation on Nb-Cu bi-layer

    [transmission]

    • rigid spherical indenter with radius R = 40Å• quadratic repulsive force• center of the top surface

  • DB 1.45nm from the interface in Cu Array relaxed by energy minimization Shockley partials B D

    •The lead Shockley partials enter the interface leaving trailing Shockley in the Cu near original site of DB•If the Burgers changed into BD, the enters the interface instead•The observation that one of the partials enters the interface, irrespective of sign, denies the possibility that this response is caused by small residual stresses or coherency stresses local to the interface.

    B D

  • Results and Discussion

    Slip systems in Cu/Nb

    Core spreading of lattice glide dislocation within the interfaces

    Sheared interface attracts lattice glide dislocation Interface

    Interface shear strength

    Elastic interaction between a dislocation and interface