si h110 desktop system dvt reliability & environment test...

SI H110 Desktop System DVT

Reliability & Environment Test Report

Project Start: 08, 31, 2015

Project End: 10, 21, 2015

Project Leader: Yuki Zhou

Version 1.01

10, 21, 2015

SI H110 Desktop System DVT Reliability & Environment Test Report

Copyright 2015 PEGATRON Corporation PAGE 2 Ver. 1.01

No. Date Description Page Revision 1. 9,30,2015 First release 44 1.0

2. 10,21,2015 Second release 54 1.01



Released on 10,21,2015 Sampling quantity 8 Systems Product Version Rev1.00 BIOS Version 0100B For Other 020E

For System Resonance Check

Test Phase DVT Testing engineers Miss Yuki Zhou Reviewed by Mr. Skquer Li



System Test Configuration

No. M/B CPU RAM HDD SPS Chassis

1 H110-P1 Intel Sky lake I5-6600 3.3G

SMART 8G SH5641G8F

Seagate 1T ST1000LM014

Delta 90W ADP-90MD

SI


TEIKON 2G TMT425S6CFR6A


Delta 90W ADP-90MD

SI


A-DATA 4G ADDS1600W4G11

WD 320G WD3200LPCX

Delta 90W ADP-90MD

SI


SMART 4G SH564128F

Toshiba 500G MQ01ABF050

Delta 90W ADP-90MD

SI


TEIKON 4G TMT451S6BFR8A


Delta 90W ADP-90MD

SI


SMART 8G SH5641G8


Delta 90W ADP-90MD

SI


TEIKON 4G TMT451S6BFR8A


Delta 90W ADP-90MD

SI


A-DATA 4G ADDS1600W4G11


Delta 90W ADP-90MD

SI

System Test Items Configuration

No. Test Item Qty. Test

Day

System MB No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8 No.1

1 Line Voltage And Frequency Test 1 2 V

2 Operation Temperature Test 2 6 V V

3 Thermal Shock 1 3 V

4 Acoustic Test 1 1 V

5 Temperature & DC Margin Test 1 2 V

6 Power Consumption Test 1 1 V

7 Power On/Off Test 2 8 V V

8 Power Line Disturbance Test 1 1 V

9 Power Supply Inrush Current Test 1 1 V

10 Vibration Test 1 1 V

11 Shock Test 1 1 V

12 Drop Test 4 1 V V V V

13 System Resonance Check 1 1 V

14 Appearance Check 8 - V V V V V V V V

15 Kensington Lock Tensile Strength test 1 1 V

16 Pad Lock test 1 1 V

17 Thermal Measurement 1 2 V

All the testing items vs. testing systems will under testing sequence arranged



Test Summary

No. Test Items Specification Result Remark

1 Line Voltage and Frequency Test

Voltage range: 90V~132Vac, 180V~264Vac Frequency: 47Hz, 53Hz, 57Hz, 63Hz

Pass Pass

2 Temperature and Humidity Cycle Test

Temp OP Low limit: 0℃, Temp OP High limit:40 ℃/50%RH, Temp Non-OP Low limit: -40℃ Temp Non-OP High limit: 60 ℃/50%RH Humidity OP Low limit: 40 ℃/20%RH Humidity OP High limit: 40 ℃/85%RH Humidity Non-OP Low limit: 60 ℃/20%RH Humidity Non-OP High limit: 60℃/90%RH

Pass Pass

3 Thermal Shock Test Non-OP: -40℃~85℃, 1.5hr/cycle, 27 cycles Pass Pass

4 Acoustic Test sound pressure 30dBA at idle mode Pass Pass

5 Temperature and DC Margin Test

Temperature: -10℃, 0℃, 40℃, 60℃ Voltage: -10%~+10%

Pass Pass

6 Power Consumption Test

Use Max Speed CPU to measure the system running power total loading.

Pass Pass

7 Power on/off Test Auto on/off: off time 1 sec, 5 sec, 10 sec and 20 sec Cold/Warm boot: 50 cycles

Pass Pass

8 Power Line Disturbance Test

Condition 1:AC +/- 10%, 15% Condition 2: AC 0V, 6 cycles, 35% 30 cycles, 0V 30 cycles. Surge: 110V: 150V~80V, 230V: 290~160V

Pass Pass

9 Power Supply Inrush Current

110V/60Hz: 50 A; 230V/50Hz: 100A Pass Pass

10 Vibration Test OP random: 5~500Hz, 0.21Grms, 20 min/axis Non-OP Sine: 5~500Hz, 0.5G Non-OP random: 5~500Hz, 2.09Grms, 10 min/axis Package Random: 5~200Hz, 1.48Grms, 30 min, Z axis

Pass Pass

11 Shock Test Non-OP Half Sine: 91G, 2ms. Trapezoidal Shock : 30G, 605 cm/sec

Pass Pass

12 Packing Drop Test Test time: 1 corner ,3 edges and 6 surfaces, total 10 drops 0 ~ 20 lb(9.1kg) / 91 cm, 20 ~ 40 lb(18.2kg) / 76 cm 40 ~ 60 lb(27.2kg) / 61 c 60~100 lb(45.4kg) / 46cm

Pass Pass

13 System Resonance Check

Record the sound sweep frequency by microphone and transfer the record data to FFT V.S Time spectrum.

Pass Pass

14 Appearance Check Follow 15.3 test spec. check the appearance and I/O connector life test

Pass Pass

15 Kensington Lock Tensile Strength test

Straight Pull – 44 LBs minimum Right Angle Push – 44 LBs minimum

Pass Pass

16 Pad Lock Test Padlock hoop with a 1/4” or 6mm diameter lock installed Pass Pass

17 Thermal Measurement

Temperature: 35℃/50%, CPU stress, and 3Dmark test

program

Pass Pass



SYSTEM RELIABILITY & ENVIRONMENT TEST 7

1. LINE VOLTAGE AND FREQUENCY TEST 7

2. TEMPERATURE AND HUMIDITY CYCLE TEST 9

3. THERMAL SHOCK TEST 11

4. ACOUSTIC NOISE TEST 13

5. TEMPERATURE & DC MARGIN TEST 15

6. POWER CONSUMPTION TEST 17

7. POWER ON OFF TEST 20

8. POWER LINE DISTURBANCE TEST 23

9. POWER SUPPLY INRUSH CURRENT TEST 26

10. VIBRATION TEST 28

11. SHOCK TEST 31

12. DROP TEST 33

13. SYSTEM RESONANCE CHECK 38

14. APPEARANCE CHECK 40

15. KENSINGTON LOCK TENSILE STRENGTH TEST 42

16. PAD LOCK TEST 44

17. THERMAL MEASUREMENT 46

BUGS & LIMITATIONS 52



SYSTEM RELIABILITY & ENVIRONMENT TEST

1. Line Voltage and Frequency Test

1.1 Objective

Our products are developed to meet the needs of a variety of consumers. These products may be used domestically or in foreign countries where there is a variety of line voltage and frequency limits and combinations. It is therefore desirable to design products that can operate under any of these combinations either by selected taps on transformer primary winding, selected switches (i.e., special line voltage selector module), switching input designs or combinations of the above.

1.2 Testing Procedure

1. Turn on the AC source and set the output voltage and frequency to the values specified in condition of Table 1-1.

2. Turn on the system and perform the function test for a period of 1 hour at least. 3. Check the functions of the system and record it. 4. Repeat steps 2~3 for each set of voltage and frequency values specified in condition 1~16.

1.3 Testing Equipment

1. Chroma programmable AC source model 6520 2. Multimeter TES 2320 3. Other relevant equipment

1.4 Testing Software

PEGATRON QC Test Program under Microsoft Windows 8.1 operation system

1.5 Testing Location

PEGATRON Reliability & Environment Test Lab

1.6 Testing Specifications

Condition Voltage & Frequency Condition Voltage & Frequency

1 90V / 47Hz 9 180V / 47Hz

2 90V / 53Hz 10 180V / 53Hz

3 90V / 57Hz 11 180V / 57Hz

4 90V / 63Hz 12 180V / 63Hz

5 132V / 47Hz 13 264V / 47Hz

6 132V / 53Hz 14 264V / 53Hz

7 132V / 57Hz 15 264V / 57Hz

8 132V / 63Hz 16 264V / 63Hz

Note: The PSU standard voltage range is from 100V~120V, 200V~240V, specification is +/-10% Each test condition combines a voltage limit with a frequency limit.

Table 1-1



1.7 Testing Criteria

1. A minimum of 1 system must be tested. 2. All units must be pass 30 mines PEGATRON QC test program, without any error occurs. Of cause the

test system must be no damage or safety problem. 3. All the test system must follow specified system configuration. 4. Reference document: IEC-61000-4-11: 1994

1.8 Testing Result

Condition Voltage & Frequency Result

1 90V / 47Hz Pass

2 90V / 53Hz Pass

3 90V / 57Hz Pass

4 90V / 63Hz Pass

5 132V / 47Hz Pass

6 132V / 53Hz Pass

7 132V / 57Hz Pass

8 132V / 63Hz Pass

9 180V / 47Hz Pass

10 180V / 53Hz Pass

11 180V / 57Hz Pass

12 180V / 63Hz Pass

13 264V / 47Hz Pass

14 264V / 53Hz Pass

15 264V / 57Hz Pass

16 264V / 63Hz Pass



2. Temperature and Humidity Cycle Test

2.1 Objective

To meet the varied temperature and humidity requirements of different areas, because of products may be subjected at varied operation temperature condition. The product must be tested to verify its temperature and humidity endurance. Additionally, the PC products are shipped by various types of carriers and will experience a wild range or storage condition.


1. Turn on the system to do functional test and record the reference reading, then turn off the system. 2. Place the system inside the temperature/humidity chamber. 3. Program the chamber as the temperature/humidity profiles, which is a combination of operation and

non-operation temperature and humidity conditions. 4. Start running the chamber program. Execute the test software exerciser during the operating condition

region of the profile. Turn the system off during the non-operation (storage) condition. 5. Perform performance verifications. No failures are allowed during any of the test made.

6. The chamber temperature gradient should be 20℃/ hour and humidity gradient should be 10 %/ RH / hour, which would not cause the condensation.


1. Thermotron SM-32CTest Chamber Tester Chamber 2. PEGATRON Power On Off Tester


OP Temperature Condition: 3Dmark 2006 Test Program under Microsoft Windows 8.1 Operation system OP Humidity Condition: PEGATRON QC Test Program under Microsoft Windows 8.1 Operation system


PEGATRON Reliability & Environment Lab


Desktop System profile




1. A minimum of 2 systems must be test. (Please refer to the specified systems configuration). 2. During the temperature test all units must be pass system test, any function error can not be allowed. 3. All units during or after the testing should without any malfunction & check RTC (specification is 3

sec/day) and damage. 4. If anything fails should check with R&D, to confirm the solution. 5. Reference document IEC-60068-2-1(low temperature), IEC-60068-2-2(high temperature),MIL-STD-810,

Method501.3, 502.3,MIL-STD-202F, MIL-STD-883, IEC 60068-2-3, 30, 56, MIL-STD-810 Method 507.3(Humidity),

2.8 Testing Result

Step Temperature

(oC)

Relative Humidity(%) Power On/Off

Time (Hour: Minutes)

Result

No. 2 No. 4

1 25 20% OFF 00:30 Pass Pass 2 60 20% OFF 02:00 Pass Pass 3 60 20% OFF 10:00 Pass Pass 4 40 20% OFF 1:00 Pass Pass 5 40 50% ON 2:00 Pass Pass 6 40 50% ON 12:00 Pass Pass 7 60 50% OFF 0:45 Pass Pass 8 60 90% OFF 2:15 Pass Pass 9 60 90 OFF 20:00 Pass Pass 10 60 20% OFF 3:45 Pass Pass 11 40 20% OFF 1:00 Pass Pass 12 40 20% ON 2:00 Pass Pass 13 40 85% ON 3:15 Pass Pass 14 40 85% ON 20:00 Pass Pass 15 40 20% ON 3:15 Pass Pass 16 25 20% ON 0:45 Pass Pass 17 25 20% OFF 1:00 Pass Pass 18 -40 -- OFF 3:15 Pass Pass 19 -40 -- OFF 10:00 Pass Pass 20 0 -- OFF 2:00 Pass Pass 21 0 -- ON 2:00 Pass Pass 22 0 -- ON 6:00 Pass Pass 23 25 20% ON 1:00 Pass Pass 24 25 20% OFF 0:15 Pass Pass 25 25 20% OFF 2:00 Pass Pass



3. Thermal shock test

3.1 Objective

The purpose of thermal shock test is to accelerate the variation of temperature, in order to increase the temperature effect in a short time to find the potential defect of material.


Non-operation: 1. Place the system into a thermal shock chamber. 2. Moving the system to cold zone and decrease the temperature with specified temperature gradient:

20C /min. 3. Keep the system in low temperature limit in 0.75 hour. 4. Moving the system to the hot zone and increase the temperature with specified temperature

gradient: 20C /min. 5. Keep the system in high temperature limit in 0.75 hour. 6. Repeat steps 2 to 5, total 27 cycles. 7. Perform the function test should without any malfunction


THERMOTRON RA-32-CHV-25-25 Air-Air Thermal Shock chamber THERMOTRON F-16-CHMV Thermal Shock chamber


PEGATRON QC Test Program under Microsoft Windows 8.1


PEGATRON Reliability & Environment test Lab


Condition Low Temp. High Temp. Interval time Gradient Duration

Non-operation -40C 85 C 1.5 hr/cycle 20C /min 27 cycles




1. 3 units must be test. 2. The before test must be no function error, and mechanical malfunction cannot be allowed. 3. All units must be pass PEGATRON QC Test Program under Microsoft Windows 7, any function

error cannot be allowed. 4. Testing systems configuration should be equivalent to the specified System Basic Configuration

on the test specification. 5. Functional checks refer to Appendix 3. 6. Reference document IEC 60068-2-14(Na), MIL-STD-810, method 503.3(Thermal shock)

3.8 Testing Result

Condition Low

Temp. High

Temp. Interval

time Gradient Duration

Result

No.1

Non-operation -40C 85 C 1.5 hr/cycle 20C /min 27 cycles Pass



4. Acoustic Noise Test

4.1 Objective

To specify methods for measuring and reporting the acoustic noise emitted by the system. The test methods are intended for using by manufacturers and users concerned with measurement, designation and comparison of equipment noise emissions.


1. Place the system on the standard test table 2. Prepare the sound level meter by setting the following: 3. Place the sound level meter at the operator position. 4. Record the background noise level when the system is not operating 5. For the idle mode and operating mode, record the highest reading of the sound level meter 6. During the period under consideration as specified in ISO7779 (Acoustic Noise Standard) 7. Repeat step 6 for the bystander position. 8. Compare the test data with the data specified acceptable values to verify whether the system passes the

noise requirement or not.


Head Acoustics – SQ LAB III G.R.A.S. Free-field 0.5 inch microphone – type 40AE 1/2” Condenser Preamplifier (ICPR Compatible) –26CA


Window 8.1 operation system


Acoustic room of PEGATRON COMPUTER INC


The measurement to be performed is (according to ISO 7779) LpA sound pressure level in dBA, Operation Position specification is 30dBA

At sound pressure operating modes:

(a) IDLE mode: after system boot finished, wait 20 mines, start to measure (b) Max power mode: after system running Max power 80%, wait 10 mines and start to measure.

35cm

50cm

MIC

Table

System




1. A minimum of one system must be test. (Please refer to the systems configuration table). 2. Testing systems configuration: Fun control speed CPU, ODD, SPS, HDD, FDD, 3. Reference document ISO-7779:1999, ISO-3744: 1994,ISO-9296:1988

4.8 Testing Result

Sound Pressure Level

System No.5 Sound pressure

Specification Result Unit

Condition Sound Pressure Background

IDLE 24.2 15.5 30 Pass dBA

Max power 80% 34.6 15.5 39 Pass dBA



5. Temperature & DC Margin Test

5.1 Objective

The purpose of the DC Margin Test is to prove the impact of system stability, which the specification of supply voltage’s ranges in difference temperature condition.


1. To configure motherboard into temperature chamber.

2. Connect DC power supply to an appropriate AC power source. Set the proper output voltage in power supply then turn it off.

3. Turn the power supplies on and set supply voltages as specifications. Run the test program to check and monitor the functions of system. Before turn off the power each item should be cyclical checked at least.


Chroma Model 6510 DC Source TES 2320 Multi meter TAKAMISAWA OTC-2C-N Test Chamber PEGATRON DC Control Box


Pass mark Burning Test program under Microsoft Windows 8.1 Operation system




+/- 5%

No. Temp. 19V

1 40 oC 18.05V

2 40 oC 19.95V

1 60 oC 18.05V

2 60 oC 19.95V

1 0 oC 18.05V

2 0 oC 19.95V

1 -10 oC 18.05V

2 -10 oC 19.95V

Table 6-1

+/- 10%

No. Temp. 19V

1 40 oC 17.1V

2 40 oC 20.9V

1 60 oC 17.1V

2 60 oC 20.9V

1 0 oC 17.1V

2 0 oC 20.9V

1 -10 oC 17.1V

2 -10 oC 20.9V

Table 6-2




1. A minimum 1 motherboard must be test. (Please refer to the systems configuration table). 2. During DC margin test all units should pass PEGATRON QC diagnostic test which system should without

any malfunction. 3. If anything fail happen should specific real failure voltage condition. 4. Minimum testing systems configuration: highest speed CPU, Add on card, SPS, HDD, FDD, max. RAM

memory, & Post Card. 5. Reference document IEC 60068-2-1 (Low temperature), IEC60068-2-2 (High temperature), MIL-STD-

810 Method 501.3 (high temperature), MIL-STD-810 Method 502.3 (low temperature)

5.8 Testing Result

+/- 5%

No. Temp. 19V Result

1 40 oC 18.05V Pass

2 40 oC 19.95V Pass

1 60 oC 18.05V Pass

2 60 oC 19.95V Pass

1 0 oC 18.05V Pass

2 0 oC 19.95V Pass

1 -10 oC 18.05V Pass

2 -10 oC 19.95V Pass

+/- 10%

No. Temp. 19V Result

1 40 oC 17.1V Pass

2 40 oC 20.9V Pass

1 60 oC 17.1V Pass

2 60 oC 20.9V Pass

1 0 oC 17.1V Pass

2 0 oC 20.9V Pass

1 -10 oC 17.1V Pass

2 -10 oC 20.9V Pass



6. Power Consumption Test

6.1 Objective

The purpose of the power consumption test is to verify the capability of the products comply with EPA Energy Star standard.


1. The computer is connected to a live Gigabit Ethernet (IEEE 802.3) HUB. Another computer is also connected to HUB. Make sure the status is “connected” and LOM LED is light on.

2. Turn on the AC source and Power Meter, and then set the output voltage /frequency. Switch on the system and entering BIOS. Make sure all BIOS setup set to default (Factory) and then set

WOL (Wake on LAN) for enable. 3. Save BIOS and wait system into windows, and then wait 5 minutes and record the power value

15minute. (any 5 minute average) 4. After completing Idle measurements, place in sleep mode (S3), and record the power value15minute.

(any 5 minute average) 5. After completing sleep mode measurements, place in standby mode (off mode: S5), and record the

power value15minute. (any 5 minute average) 6. TEC (Desktop product categories): The following tables indicate the required TEC levels for the 5.0

Specification. Table 1 below lists TEC requirements for Version 5.0, while Table 1 gives weightings for each operational mode by product type. TEC will be determined using the formula below:

ETEC = (8760/1000) * (Poff * Toff + Psleep * Tsleep + Pidle * Tidle)

where all Px are power values in watts, all Tx are Time values in % of year, and the TEC ETEC is in units of kWh and represents annual energy consumption based on mode weightings in Table 1

Table 1: Operational Mode Weighting – Desktops and Notebooks

Desktop

Conventional Proxying

Toff 55% 40%

Tsleep 5% 30%

Tidel 40% 30%

Note: Proxying refers to a computer that maintains Full Network Connectivity as defined in Section 1 of this specification. For a system to qualify under the proxying weightings above, it must meet a non-proprietary proxying standard that has been approved by the EPA and the European Union as meeting the goals of ENERGY STAR. Such approval must be in place prior to submittal of product data for qualification. See Section 3.C, Qualifying Computers with Power Management Capabilities, for further information and testing requirements.


1. Chroma PROGRAMMABLE AC SOURCE MODEL 61604 2. YOKOGAWA WT210 DIGITAL POWER METER

6.4 Operation System

Microsoft Windows 8.1 operation system


PEGATRON Reliability and Environment Test Lab




Category A: All desktop computers that do not meet the definition of Category B, Category C, or Category D below will be considered under Category A for ENERGY STAR qualification.

Category B: To qualify under Category B, desktops must have: Equal to 2 Physical Cores; and Greater than or equal to 2 gigabytes (GB) of System Memory

Category C: To qualify under Category C, desktops must have: Greater than 2 Physical Cores in addition to the requirement above, models qualifying under Category C must be configured with a minimum of 1 of the following 2 characteristics: Greater than or equal to 2 gigabytes (GB) of System Memory; and/or a Discrete GPU

Category D: To qualify under Category D, desktops must have: Greater than or equal to 4 Physical Cores in addition to the requirement above, models qualifying under Category D must be configured with a minimum of 1 of the following 2 characteristics: Greater than or equal to 4 gigabytes (GB) of System Memory; and/or a Discrete GPU with a Frame Buffer Width greater than 128-bit.


1. All of the testing must be accorded with Energy Star Computer Categories for Idle Criteria.

2. Energy Efficiency Requirements

Category A: ≤ 148.0KW/h

Category B: ≤ 175.0KW/h

Category C: ≤ 209.0KW/h

Category D: ≤ 234.0KW/h 3. Reference document Version 5.0 ENERGY STAR Eligibility Criteria for Computer.

6.8 Testing Configuration

System Configuration

Mother Board H110-P1 Mouse MSU0923

PCB Ver. Rev. 1.00 Keyboard KU-1060

BIOS 0100B HDD Seagate 1T ST1000LM014

CPU Intel Sky lake I5-6400 2.7G

DIMM TEIKON 4G TMT451S6BFR8A

PSU DELTA ADP-90MD 90W Lan Driver Rev. 8.38.115.2015

Category Classification A



6.9 Testing Result

Category Classification : A

ETEC S5 S3 S0

76.7902 15.67 1.19 0.22

ETEC S5 S3 S0

71.8101 14.65 1.2 0.2

ETEC S5 S3 S0

83.0229 16.97 1.2 0.21

ETEC S5 S3 S0

15.37 1.33 0.3

Spec(Kw/

h)

Result

148 Pass

DESKTOP COMPUTER MEASUREMENT DATA

Japan: 100VAC / 50Hz

Calculated

Result

= ( 8760

/ 1000 ) * * 0.55 + * 0.05 + * 0.4


Japan: 100VAC / 60Hz

Calculated

Result

= ( 8760

/ 1000 ) * * 0.55 + * 0.05 + * 0.4


North America/Taiwan: 115VAC / 60Hz

Calculated

Result

= ( 8760

/ 1000 ) * * 0.55 + * 0.05 + * 0.4


Europe/Australia/New Zealand: 230VAC / 50Hz

Calculated

Result

= ( 8760

/ 1000 ) * * 0.55 + * 0.05 + * 0.4



7. Power On Off Test

7.1 Objective

The purpose of Power ON/Off test is to make sure the system has been keep in normal working mode, even after an abnormal break condition of the power line.


1. Manual system power on off test a) Repeat a cycle of turn on/off of the power switch with the finger 50 times. b) Then test the system must be re-turn on OK.

2. Warm boot power on off test a) Repeat a reboot cycle of the system 50 times. b) Then test the system must be re-turn on OK.

3. Auto system power on off test b) The power off time will set as 1 second, 5 seconds, 10 seconds, and 20 seconds, in each of setting to

run 24 hours system AC power on off test. c) Before and after the test all the system should under function test anything malfunction cannot be

allowed.


PEGATRON Power On Off Tester




1. Power on during time 1 minute. Power off time set at 1 second, 5 second, 10 second, 20 second

2. There must be no damages or safety problem before and after the function test. And no any system power on boot failure is founded.

24 hours 24 hours 24 hours 24 hours

Power on Power off Power on Power off Power on Power off Power on Power off

1 minute 1 second 1 minute 5 second 1 minute 10 second 1 minute 20 second

System boot System boot System boot System boot

Function test Function test Function test Function test




1. A minimum of 2 systems must be test. 2. There must be no damages or safety problem before and after the test & check RTC (specification is 3

sec/day), and no any system boot failure are founded. 3. Testing systems configuration: The max loading system with a fully operational configuration of SPS,

video controller, ODD, HDD, FDD, M.B, CPU, RAM, Post Card, K.B., Mouse. (Please refer to the system configuration table)

7.7 Testing Result

Power On / Off Manual System Power On/Off Test Remark

Test Times No.3 No.6

10 Times Pass Pass Pass





Power On / Off Warm Boot Power On/Off Test Remark

Test Times No.3 No.6






AC Power Power On/Off Auto System Power On/Off Test Result

Test Times Power On Power Off No.3 No.6

230V 50Hz

24 Hours 1 Minute 1 Second Pass Pass




110V 60Hz







8. Power Line Disturbance Test

8.1 Objective

The purpose of the power line disturbance test is to verify the stability of the products under evaluation when they are subjected to voltage fluctuations. The system is tested under the two test conditions specified below.


1. Set up the AC source output voltage and frequency to the values specified in condition of specification. 2. Turn on the power of system. 3. Check the functions of the system and record any error condition. 4. Change the test condition and repeat steps 1~3.


1. Programmable AC Source Chroma 6520 2. Multimeter TES 2320 3. Other relevant equipment






1. Condition 1 a. An under voltage of 10% below any of the nominal input AC voltages applied for 2 seconds,

repeated 10 times with a 10% duty cycle. b. An under voltage of 100% during one half cycle repeated 10 times with a 1% duty cycle. c. An over voltage of 15% above the any of the nominal AC voltage applied for one second,

repeated 10 times with a 10% duty cycle. 2. Condition 2

a. Complete AC line outage for 6 cycles. b. A 65% under voltage lasting for 30 cycles. c. A complete AC line outage for 30 cycles.

3. Surge Test: to verify the normal system boot at high voltage power ramp. 132V to 150V for 0.5 sec, back to 132V at 60 Hz 264V to 290V for 0.5 sec, back to 264V at 50 Hz

4. Sag Test: to verify the normal system boot at low voltage power ramp. 90V to 80V for 0.5 sec, back to 90V at 60 Hz 180V to 160V for 0.5 sec, back to 180V at 50 Hz




1. A minimum of 1 system must be test. (Please refer to the system configuration table). 2. For test condition 1, the system must operate normally. For test condition 2, the system shall sustain no

physical damage. 3. Minimum testing systems configuration: highest speed CPU, Add on card, SPS, HDD, FDD, max. RAM

memory. 4. Surge test: no loss of function or anything damage. 5. Sag test: no loss of function or anything damage.



8.8 Testing Result

110V/60Hz

Condition 1

AC Input 110V

99V 0V 126.5V

2000ms 9ms 1000ms

No.3 Pass Pass Pass

Condition 2

AC Input 110V

0V 71.5V 0V

6 cycles 30 cycles 30 cycles

No.3 Pass Pass Pass

Surge &

Sag

AC Input 110V

Power Surge Power Sag

132V-150V-132V 90V-80V-90V

No.3 Pass Pass

230V/50Hz

Condition 1

AC Input 230V

198V 0V 253V

2000ms 10ms 1000ms

No.3 Pass Pass Pass

Condition 2

AC Input 230V

0V 143V 0V

6 cycles 30 cycles 30 cycles

No.3 Pass Pass Pass

Surge &

Sag

AC Input 230V

Power Surge Power Sag

264V-290V-264V 180V-160V-180V

No.3 Pass Pass



9. Power Supply Inrush Current Test

9.1 Objective

The purpose of the power supply inrush current test is to verify input characteristic of the power supply under evaluation.


1. Measure the first boot start of inrush current and waveform at 230V/50Hz and 110V/60Hz AC line. 2. Measure the next boot start of inrush current and waveform at 230V/50Hz and 110V/60Hz AC line.


1. Programmable AC Source Chroma 6520 2. Multimeter TES 2320 3. Other relevant equipment


Microsoft Windows 8 Operation System




Test Inrush Current

Condition Cold Start Warm Start

110V 60Hz 230V 50Hz 110V 60Hz 230V 50Hz

Specification 50 Amp 100 Amp No Damage No Damage Testing current specification is depend on power unit


1. A minimum of 1 system must be test. (Please refer to the system configuration table). 2. a) Cold start: The inrush current shall be less then the rating of the specification for all conditions of

line voltage. b) Warm start: The all test systems must be no damage.

3. Minimum testing systems configuration: highest speed CPU, Add on card, SPS, HDD, FDD, max. RAM memory.



9.8 Testing Result

Test Condition

Inrush Current

Cold Start Warm Start

110V 60Hz 110V 60Hz

Specification 50 Amp No Damage

No.4 15.87 Pass

Test Result Pass Pass

Test Condition

Inrush Current

Cold Start Warm Start

230V 50Hz 230V 50Hz

Specification 100 Amp No Damage

No.4 28.73 Pass

Test Result Pass Pass



10. Vibration Test

10.1 Objective

The purpose of the vibration test is to determine mechanical weakness or performance degradation of an equipment or component when subjected to vibration and to use this information, in conjunction with the relevant specifications, to decide whether the equipment or component, herein after referred to as a specimen, is acceptable or not. It may be used in some cases to determine the structural integrity of specimens and study their dynamic behavior. Vibration testing may be performed anytime during the course of the test program. The accumulated effects of vibration induced stress may affect equipment performance under other environmental conditions, such as temperature, altitude, humidity, leakage or EMI/EMC. When it is desired to evaluate the cumulative effects of vibration and other environmental factors, a single test item should be exposed to all environmental conditions, which vibration testing generally performed first.


1. Inspect the system to establish operation pretest criteria and physical condition. 2. Verify the system's functionality. 3. Mount the velocity transducers of the accelerometer on the surface of the system main parts (usually

choose the HDD) and take a picture. Repeat steps 1~2. 4. Mount the system on the vibration equipment table. 5. Expose the system to the test level and duration as determined from the Specifications. 6. Inspect the system and compare it to pretest data and physical condition, if anything physical issue or

malfunction during testing should under recorded & reported. 7. Repeat steps 1~6 for each axis. 8. Document the following test results:

a) Prior test history of the system. b) Inspection and test procedures, including inspection requirements, test criteria instrumentation,

data requirements and failure criteria. c) List of all test equipment, including vibration generating and analysis equipment, mounting

arrangements and fixtures. d) Orientation of the system, including axes of applied vibration. e) Location of accelerometer used to control and measure vibration. f) Resonant frequencies, including those selected as applicable. g) Isolation characteristics, including sway amplitudes and transmissibility versus frequency. h) Applied test levels, duration and frequency ranges. i) Results of all performance measurements, including overall test results. j) Analysis of each failure and proposed corrective action. k) Analysis spectrum.


1. UD Vibration Testing System SA15-S452/ST 2. UD Signal Conditioner CAV-4 3. UD Accelerometer 10B10T (10 PC/h, 1~10KHz,1000g) 4. DP550Win Vibration Controller








Operating Random Mode a) Axis: X, Y, Z axes. b) Position: normal operation position. c) No fixture used: only prevent the unit from leaving the table during test.

Frequency Slope PSD

Hertz (dB/Oct.) (g2/Hz)

5 ~ 350 0 0.0001

350~500 -6 ..

500 .. 0.00005

=> Equivalent to 0.21 Grms, 20 min/axis. Non-Operating Sine Mode

a) Axis: X, Y and Z-axes. b) Fixture used (wooden or plastic): fasten the unit to the table. c) Identify resonance with accelerometers placed on sensitive parts (mother board, DIMM.) d) Then conduct a resonant dwell for 5 min at 4 resonance frequencies per axis.

Sweep Frequency Amplitude (0 to Peak) Sweep rate

5 ~ 500 0.5G 1oct/min

Then conduct a resonant dwell for 5 min at 4 resonance frequencies per axis.

Non Operating Random Mode a) Axis: X, Y and Z-axes. b) Fixture used (wooden or plastic): fasten the unit to the table. c) 10 min/axis

Frequency Slope Psd

Hertz (dB/Oct.) (g2/Hz)

5 ~ 100 0 0.015

100~137 -6 ..

137~350 0 0.008

350~500 -6 ..

500 .. 0.0039

=>Equivalent to 2.09 Grms

Package Random Mode a) Axis: Z axis b) Standard Full system package c) Test time 30 mins

Frequency Slop PSD

5 ~ 100 - 0.015 G*2/Hz

100 ~ 200 -6 dB/Oct -

200 - 0.038 G*2/Hz

=>Equivalent to 1.48 Grms




1. A minimum of 1 system must be test. (Please refer to the system configuration table). 2. During and after the vibration test all units must be pass diagnostic test.

Diagnostic: a) Functional check: The system will under run PEGATRON QC test program to test the HDD, ODD,

FDD and others. b) Visual inspection: The system will be thoroughly inspected inside and outside for any sign

of damage, looseness or loose of parts. 3. Reference document: IEC60068-2-6 (Sine wave), IEC60068-2-34, 35,36,37 (Random wave), MIL-STD-

810E, Method 514

10.8 Testing Result

Operating Random Mode Function Test Physical Check

No.1 No.1

X axis Pass Pass

Y axis Pass Pass

Z axis Pass Pass

Non-Operating Sine Mode Function Test Physical Check

No.1 No.1

X axis Pass Pass

Y axis Pass Pass

Z axis Pass Pass

Non-Operating Random Function Test Physical Check

Mode No.1 No.1

X axis Pass Pass

Y axis Pass Pass

Z axis Pass Pass

Package Random Function Test Physical Check

Mode No.1 No.1

Z axis Pass Pass



11. Shock Test

11.1 Objective

The shock test is performed to ensure that material can withstand the relatively infrequent, non-repetitive shocks or transient vibration encountered in handling, transportation and service environments. The purpose of shock test is to reveal mechanical weakness or degradation in performance and to use this information, in conjunction with relevant specification, to decide whether a specimen is acceptable or not. It may also be used, in some cases, to determine the structural integrity of specimens or as a mean of quality control. There are often advantages to applying shock and vibration tests before climatic tests, provided that this sequence represents realistic service condition. However, test experience shows that climate-sensitive defects often show up more clearly after the application of shock and vibration forces.


1. 6 face, 1 shock per face: each unit has to withstand the 6 shocks. 2. The system will be installed on shock table in such a way that the shock input is transmitted directly

to it. The system will be fixture using a predetermined torque value. 3. Place accelerometers on sensitive parts (HDD, DIMM.) in order to measure the response

acceleration.


L.A.B 886.2432 Mechanical AUTO SHOCK system


PEGATRON QC Test Program under Micro Soft Windows 8.1


PEGATRON Reliability and Environment Lab


1. Non Operating Half-Sine Wave Shock a) Pulse duration: < 3ms (typically 2 ms) b) G value: 91G

2. Trapezoidal Shock (Square Wave Shock)

a) Maximum faired acceleration: 30G b) Velocity change: 676 cm/s for 0 < weight < 9.1 kg

605 cm/s for 9.1< weight < 18.2 kg

3. A test fixture is required during system fixed on shock test table.




1. A minimum of 1 system must be test. 2. Test Criteria:

a) After non-operation half-sine wave shock wave test all units should pass the PEGATRON QC test program which system should without any functional and mechanical malfunction.

b) After trapezoidal shock test all units should pass PEGATRON QC test program which system should without any functional and mechanical malfunction.

c) The max response of the key parts acceleration must under 2 times of the table input faired acceleration at half sine shock test

d) The max response of the key parts acceleration must under 3 times of the table input faired acceleration at trapezoidal shock test

3. Diagnostic: a) Functional check: The system will undergo PEGATRONQC test program the HDD, ODD, FDD and

main board. b) Visual inspection: The system will be thoroughly inspected inside and outside for any sign of

damage, looseness or loose of parts. c) Shock response curve check: The key parts max response acceleration must under the test criteria.

4. Testing systems configuration: please refer to the systems configuration table. 5. Reference document: IEC60068-2-27, MIL-STD-810E, Method 516

11.8 Testing Result

Non-Operation Half-Sine Shock Test

Face Function Test Physical Check

No.7 No.7

Top Pass Pass

Bottom Pass Pass

Left Pass Pass

Right Pass Pass

Front Pass Pass

Rear Pass Pass

Trapezoidal Shock Test

Face Function Test Physical Check

No.7 No.7

Top Pass Pass

Bottom Pass Pass

Left Pass Pass

Right Pass Pass

Front Pass Pass

Rear Pass Pass



12. Drop Test

12.1 Objective

To verify the ability of packaging to protect a product and to verify whether the packaged product can under protected and with well operation function which after normal handling and transportation.


1. Turn on system to perform function test, then turn off the system, package the system and place it on the drop tester.

2. To perform a corner drop on the weakest corner of product. 3. To perform an edge drop with impact on the shortest edge radiating with first tested corner. 4. To perform a second edge drop with impact on the next shortest edge which radiating with first tested

corner. 5. To perform an edge drop with impact on the longest edge radiating from first tested corner. 6. To perform a flat drop with impact on the front side. 7. To perform a flat drop with impact on the rear side. 8. To perform a flat drop with impact on the right side. 9. To perform a flat drop with impact on the left side. 10. To perform a flat drop with impact on the bottom side. 11. To perform a flat drop with impact on the top side. 12. To inspect the packaged system mechanical structure, and to execute the function test.


L.A.B. ACCU-160 drop tester


PEGATRON QC Test program under Window 8.1 Operation System


PEGATRON Reliability & Environment test LAB.

12.6 Testing Specification

Single Package or Color Box

Package Weight Drop Height No. Drops

KG lb cm inch Times

0 ~ 9.1 0 ~ 20 91 36 10

9.2 ~ 18.2 > 20 ~ 40 76 30 10

18.3 ~ 27.2 > 40 ~ 60 61 24 10

27.3 ~ 45.4 > 60 ~ 100 46 18 10

10 Drops: 1 corner, 3 edges and 6 surfaces




1. A minimum of 1 system must be test. (Please refer to the systems configuration table). 2. The minimum system is base on to cover the multi sourcing of key components that can present

weakness regarding mechanical stress: Power supply, Heatsink, Fans, HDD, ODD, Add on cards. 3. During and after the vibration test all units must be pass diagnostic test.

Diagnostic: a) Functional check: The system will must be pass PEGATRON QC Test Program under Window 7

Operation System testing the HDD, ODD, FDD and main board. b) Visual inspection: The system must without any mechanical damage and package inside cushion

materials rupture are permitted.

Packaging Drop Test Bug Definition

Priority Product Sponge Carton/ Color Box

Stopper Function Fail

Appearance damaged or Reliability Issue Concern

Serious Damage and Broken

Serious Damage and Broken

High

Function OK Component escape but

can recover or no Reliability Issue Concern

Serious Damage Appearance check ok,

but the crack is less 10 % of length

Low Function OK

Assembly shift and no Reliability Issue Concern

No damage No damage

Stopper: The top priority issue will affect to product’s transportation confidence seriously. In before

the issue solved, the project should not moved to next project phase.

High: The issue is concerned of transportation package reliability, but no serious carton damaged

further discussion is necessary in before any marketing requirement.

Low: The issue is low risk for transportation package reliability but the issue is under controlled and

stands by for implemented schedule.

12.8 Testing Result

Package Weight: 10.754 KG

Condition Drop Height Function Check Physical Check Remark

Corner 76cm Pass Pass Pass

Short Edge 76cm Pass Pass Pass

Middle Edge 76cm Pass Pass Pass

Longer Edge 76cm Pass Pass Pass

Top Face 76cm Pass Pass Pass

Bottom Face 76cm Pass Pass Pass

Right Face 76cm Pass Pass Pass

Left Face 76cm Pass Pass Pass

Front Face 76cm Pass Pass Pass

Rear Face 76cm Pass Pass Pass



13. System Resonance Check

13.1 Objective

To establish that the system operation and performance are not affected or mechanical resonance by the speakers and sub-woofer running with the maximum volume that have intense bass (low frequency audio) output.


1. Turn on system in acoustic chamber. 2. System placement is according ISO 7779. 3. Turn on the audio output and adjust the volume to maximum. 4. Using Tone Generator test program to provide the 20Hz~1000Hz sweep frequency to audio

System output power to the speakers and sub-woofer. Frequency is defined as 0dBFS peaks. 5. Record the sound sweep frequency by microphone and transfer the record data to FFT V.S Time

spectrum. 6. Using FFT V.S Time spectrum to find out the frequency band of system resonance. 7. Perform the resonance frequency by Tone Generator Program on system. 8. Find out the resonance source of system by listening then stop system resonance frequency playing. 9. Attach the accelerator on the resonance source, repeat step 4~5 and transfer the accelerator record

data to FFT V.S Time spectrum. 10. Perform the resonance frequency and record 20 sec acceleration (G value) by accelerator.


Test Tone Generator Version 4.32 Head Acoustics


SQ Lab III with DIC61 Module Artemis 7.0 Accelerometer type: PCB352A25


PEGATRON Reliability and Environment Test Lab.


Ambient room conditions

Test Item Condition

FFT VS Time Spectrum from MIC Sound Sweep 20Hz~1000Hz/980Sec


No acceptable Chassis Buzzing or Resonance.

13.8 Testing Configuration

1. To follow system basic configuration (refer to basic configuration table) 2. Mother Board Rev.1.00 3. BIOS Rev: 0102E

13.9 Testing Result

Ambient room conditions / Frequency 20~1000Hz



Item Result

FFT VS Time Spectrum from MIC Pass

FFT VS Time Spectrum from Accelerator



14. Appearance Check

14.1 Objective

To decide the system can or can't meet the appearance requirement, when perform the environment test. This must be done before and after all of the structure review test which showed on this plan.

14.2 Testing Item summary

Check Item Contain

Internal Assemble Check Cable, device match, SPS match

Insertion check AC power connector, Flat cable,


1. Internal Assemble Check

Test item Specification Description Remark

Power Supply Cable arranges spec. SPS out let is meet cable fix spec.

ODD Cable arranges spec. ODD flat cable is meet cable fix spec.

HDD Cable arranges spec. HDD flat cable is meet cable fix spec.

FDD Cable arranges spec. FDD flat cable is meet cable fix spec.

Audio Cable Cable arranges spec. Audio flat cable is meet cable fix spec.

Motherboard Chassis design spec. Check fitness / match, interfere.

Memory DIMM slot spec. Pin 1 mark, position interfere, protect key, hook match.

2. Insertion Check, please refer appendix 2

Test item Specification Test system Physical Function Remark

PS/2 mouse 172 No.1

PS/2 keyboard 172 No.2

USB port 2000/6022 No.3

Print port 172 No.4

COM port 515 No.5

1394 port 2409 No.6

Game port 858 No.1

LAN port 1205 No.2

Audio port 2409 No.3

HDD connector 40 No.4

FDD connector 40 No.5

SATA connector 40 No.6

Power connector 40 No.1

CPU socket 40 No.2

PCI socket 40 No.3

PCI-E socket 40 No.4

* M/B rear side USB I/O do 2000 times insertion test, System front USB I/O do 6022 times.


1. All the check items is base on Design specification to check, all the result should under System designer double confirm to improve.



14.5 Testing Result

1. Internal Assemble Check

Test item Specification Description Result

Power Supply Cable arranges spec. SPS out let is meet cable fix spec. Pass

ODD Cable arranges spec. ODD flat cable is meet cable fix spec. Pass

HDD Cable arranges spec. HDD flat cable is meet cable fix spec. Pass

FDD Cable arranges spec. FDD flat cable is meet cable fix spec. Pass

Audio Cable Cable arranges spec. Audio flat cable is meet cable fix spec. Pass

Motherboard Chassis design spec. Check fitness / match, interfere. Pass

Memory DIMM slot spec. Pin 1 mark, position interfere, protect key, hook match.

Pass

2. Insertion Check

Test item Specification Test system Physical Function Result

USB port 6022/2000 No.8 Pass Pass Pass

LAN port 1205 No.8 Pass Pass Pass

Audio port 2409 No.8 Pass Pass Pass

HDD connector 40 No.8 Pass Pass Pass

SATA connector 40 No.8 Pass Pass Pass

Power connector 40 No.8 Pass Pass Pass

CPU socket 40 No.8 Pass Pass Pass

HDMI 234 No.8 Pass Pass Pass

D-sub 234 No.8 Pass Pass Pass

Power Switch 5000 No.8 Pass Pass Pass



15. Kensington Lock Tensile Strength test

15.1 Test Procedure

To set the Kensington cable locked with the system side and execute following test: 1. Straight Pull a. AIO should be fixtured on Instron table with lock slot positioned on a horizontal plane directly below the

load cell. b. Use new style Kensington Micro Saver lock model number 64068. The lock can be disassembled from

the cable by removing a locking ring. The lock body is placed in a steel plate to allow a true straight pull of the lock from the system.

c. The Instron load cell will apply up to 44 LBs, which is the minimum acceptable level of performance. d. Record maximum force obtained if system fails before load of 44 LBs is reached. 2. Right Angle Push a. AIO should be fixtured on Instron table with lock slot positioned perpendicular to the load. b. Use either the old Kensington old style lock or Micro Saver locks model number 64068 since the lock

cable exits the locks at a 90 degree angle. c. This test is to be performed in 4 different orientations (quadrants) to determine the worst possible case. d. The Instron load cell will apply up to 44 LBs, which is the minimum acceptable level of performance. e. Record maximum force obtained if system fails before load of 300 LBs is reached. 3. Twist Out – 25 LBs-in minimum a. System should be clamped with lock slot in horizontal plane b. Install new style Kensington Micro Saver lock model number 64068 into lock slot in locked condition. c. Insert a Kensington lock key into a 14mm deep socket such that it can be rotated by the 3/8 inch drive

torque wrench. The torque wrench must be capable of recording the maximum torque level achieved during a clockwise or counter-clockwise rotation of the key.

d. Rotate lock until lock or system slot fails and record maximum torque achieved. e. Red needle on torque wrench can record maximum torque achieved during rotation.


IMADA DPRSX-50TR digital force gauge


Pegatron QT Reliability & Environment Test Lab


The specification level for security lock slot tests are as follows: 1. Straight Pull – 44 LBs minimum

Use load cell capable of applying 50 LBs minimum Set force limits to max pull load of 44 LBs / stop Set pull displacement 5 inches / stop Filter 0.5 LBs Head Speed of 2 in/min

2. Right Angle Push – 44 LBs minimum

Use load cell capable of applying 50 LBs minimum. Set force limits to max push load of 44 LBs / stop Set push displacement 2 inch / stop Filter 0.5 LBs Head Speed at 0.5 in/min



3. Twist Out – 25 LBs-in minimum

Items Direction Specification Remark

Vertical Straight 44 LBs -

Horizontal

Up 44 LBs -

Down 44 LBs -

Right 44 LBs -

Left 44 LBs -

Twist Out - 25 LBs


1. Vertical direction: 44LBs. 2. Horizontal direction: 44 LBs (4direction). 3. 2 units must be test. FAIL = Lock breaks from system below spec level. PASS = No damage/breakage to system at spec level following straight pull, angle pull, or twist out test.

Minor cosmetic damage is acceptable, as long as system structure remains intact. Marginal PASS =Some system damage without lock removal. The lock must still secure the notebook

within the specified force limits. Results should be presented to Dell development core team for final disposition.

15.6 Testing Result

Items Direction Specification Result

No.2

Vertical Straight 44 LBs Pass

Horizontal

Up 44 LBs Pass

Down 44 LBs Pass

Right 44 LBs Pass

Left 44 LBs Pass

Twist Out - 25 LBs Pass



16. Pad Lock test

16.1 Test Procedure

The test of this section is intended to verify the applicable security measure will delay entry to the machine when attempted with simple tools


With a screw driver, try to open the cover and access to the motherboard with the applicable security solutions:

Padlock hoop with a 1/4” or 6mm diameter lock installed


Pegatron QT Reliability & Environment Test Lab


The chassis should resist entry foe at least 1 minute The access panel must be able to be easily removed after the screws holding the solenoid have been

removed If can open chassis without deformation or damage, it consider failure All of the security features must be able to be used simultaneously, and activated/deactivated independently of each other



16.5 Testing Result

Test item Test system Physical Function Remark

Pad Lock No.8 Pass Pass Pass



17. Thermal Measurement

17.1 Objective

The purpose of performing thermal profile test is to identify potential thermal problem of products. And it is to aid products in reliability assessment considering that semiconductor failure rates rise rapidly with increasing junction temperature. In case of systems cooling, patterns will vary with stacking choices, temperature/thermal mapping can aid in the development of optimum tacking arrangements.


2. Using black paint to paint the M/B surface, then use hairdryer blow 30 mines, check if the paint is dry, the power on the M/B, check the M/B function.

3. Put the system in 25℃ condition, run test program 30 mines, then use IR camera to take the M/B overall, NB, SB, and VRM thermal image

4. Base on the Thermal Image, select the test points and attaches thermocouples to the desired test points.

5. Put the system under normal condition, turn the system on to run test program and turn on the thermal meter to measure the actual temperature of the test points.

6. After two hours, check the system function and print out Thermal profile data. 7. Turn off the power of all equipment. 8. Put the same system into the chamber, turn on the temperature chamber, and set the temperature

to 35℃ 9. Turn the system on to run test programs and turn on the thermal recorder to measure the actual

temperature of the test points. 10. After two hours, check the system function and print out Thermal profile data. 11. Turn off the power of all equipment.


1. YOKOGAWA DR232-12 - 00 -1D / D2 HYBRID RECORDER (Recording accuracy 100 %) 2. Thermotron SM-32CTest Chamber Tester Chamber 3. K Type Thermocouple 4. OMEGA Smallest Thermocouple Connector 5. OPTEX Thermo-Hunter PT-3LF laser thermal meter


PwrThermalUtil_SkyLake_E3_WS_Processor_Rev0.95 3Dmark2006 System Test Program




The measurement is based on AC 220 V voltage condition.

The system is operated under the designated ambient temperature (typically 25℃, 35℃) for a period of two hours at least.

Normal condition: (Thermal measurement)

Temperature: 25℃ Relative humidity: 50%

Chamber condition: (Thermal measurement) Temperature: 35

℃ Relative humidity: 50%



17.7 Testing Points

1. Those points to be selected for measurement should include a. High power dissipating components (CPU, Clock gen. Cap...) b. The component, which MTBF affected. c. The component which specification is close to system specification. d. According pre-scan measurement choose high power dissipating component. e. To select 10 to 20 measure points is recommended. f. Linear regulators or switch regulators power MOSFET need to be measured at North Bridge, South

Bridge and DDR memory.


1. A minimum of 1 system must be tested. (Please refer to the systems configuration table). 2. There must be no function error. 3. No any selected component temperature is higher than the max. Specified components

specification. 4. The test result of all the selected point should meet specified system components thermal

specification. 5. The operation system power is fixed on AC 220 V voltage. 6. Minimum testing systems configuration: highest speed CPU, Add on card, SPS, HDD, FDD, max.

RAM memory. 7. The CPU internal junction temperature measurement should following vendor recommend

measurement method (the analog device is recommend for Intel CPU junction temperature measurement).



17.9 Testing Result

CPU Type: Sky lake I5-6600 3.3G 35℃ PTU 100% Test Result

Channel No. Step Channel Location Specification Measured data Result CH1 (TP1) 1 PL1 105.0 90.38 Pass

CH2 (TP2) 2 PCE3 82.7 77.30 Pass CH3 (TP3) 3 PL9 105.0 93.94 Pass CH4 (TP4) 4 PCE5 82.7 79.32 Pass CH5 (TP5) 5 PL12 105.0 90.37 Pass CH6 (TP6) 6 PU17 105.0 89.75 Pass CH7 (TP7) 7 PU18 105.0 95.04 Pass CH8 (TP8) 8 PU19 105.0 96.76 Pass CH9 (TP9) 9 VU1 70.0 63.86 Pass CH10 (TP10) 10 Memory1 80.0 60.85 Pass CH11 (TP11) 11 Memory2 80.0 59.55 Pass CH12 (TP12) 12 Memory3 80.0 62.38 Pass CH13 (TP13) 13 Memory4 80.0 58.42 Pass CH14 (TP14) 14 HDD 60.0 58.73 Pass CH15 (TP15) 15 Fan inlet1 -- 54.84 Pass CH16 (TP16) 16 Fan inlet2 -- 55.71 Pass

CH17 (TP17) 17 Fan inlet3 -- 51.66 Pass

CH18 (TP18) 18 Fan inlet4 -- 49.04 Pass

CH19 (TP19) 19 TOP SKIN 60.0 52.23 Pass

CH20 (TP20) 20 Bottom SKIN 60.0 54.31 Pass

CH21 (TP21) 21 AMB -- 35.18 --

CH22 (TP22) 22 CPU DTS -- -4 --



35℃ 3Dmark06 Test Result

Channel No. Step Channel Location Specification Measured data Result CH1 (TP1) 1 PL1 105.0 81.60 Pass

CH2 (TP2) 2 PCE3 82.7 70.93 Pass CH3 (TP3) 3 PL9 105.0 83.11 Pass CH4 (TP4) 4 PCE5 82.7 72.44 Pass CH5 (TP5) 5 PL12 105.0 82.39 Pass CH6 (TP6) 6 PU17 105.0 72.99 Pass CH7 (TP7) 7 PU18 105.0 76.56 Pass CH8 (TP8) 8 PU19 105.0 77.41 Pass CH9 (TP9) 9 VU1 70.0 58.46 Pass CH10 (TP10) 10 Memory1 80.0 67.86 Pass CH11 (TP11) 11 Memory2 80.0 66.43 Pass CH12 (TP12) 12 Memory3 80.0 66.79 Pass CH13 (TP13) 13 Memory4 80.0 65.68 Pass CH14 (TP14) 14 HDD 60.0 56.87 Pass CH15 (TP15) 15 Fan inlet1 -- 55.02 -- CH16 (TP16) 16 Fan inlet2 -- 54.69 --

CH17 (TP17) 17 Fan inlet3 -- 51.16 --

CH18 (TP18) 18 Fan inlet4 -- 48.19 --

CH19 (TP19) 19 TOP SKIN 60.0 50.87 Pass

CH20 (TP20) 20 Bottom SKIN 60.0 52.26 Pass

CH21 (TP21) 21 AMB -- 35.11 --

CH22 (TP22) 22 CPU DTS -- -16 --



1 2 3 4 5

6 7 8



9



BUGS & LIMITATIONS 1. BUGS

2. LIMITATIONS

3. SUGGESTIONS



APPENDIX: 1. PEGATRON QC Test Program under Microsoft Windows 8.1 operation system which Include

multi task feature for each testing task as below.

Test Driver Test Item Remark Hard disk driver Files copy & compare test Hard disk to hard disk

ODD Files copy & compare test ODD to hard disk

Memory Read/Write test

Floppy driver Files copy & compare test Floppy to Hard disk

VGA GDI demonstration & Mltithrd test

LAN Movie play from Server Server to system

USB device USB HDD, AI-Flash file copy& compare test

USB device to HDD

2. Insertion standard Test time = Guarantee Year x Use Time Frequency x Safety Factor

Test Item Use time frequency Guarantee

Year Safety Factor Test times

Day Week Month

PS/2 mouse 1 3 1.1 172

PS/2 keyboard 1 3 1.1 172

USB port(front) 5 3 1.1 6022

USB port(rear) 1 3 1.8 2000

Print port 1 3 1.1 172

COM port 3 3 1.1 515

1394 port 2 3 1.1 2409

Game port 5 3 1.1 858

LAN port 1 3 1.1 1205

Audio port 2 3 1.1 2409

HDD connector 1 3 1.1 40

FDD connector 1 3 1.1 40

SATA connector 1 3 1.1 40

Power connector 1 3 1.1 40

CPU socket 1 3 1.1 40

PCI socket 1 3 1.1 40

PCI-E socket 1 3 1.1 40

DIMM socket 1 3 1.1 40

DVI 1 3 1.5 234

HDMI 1 3 1.5 234

D-sub 1 3 1.5 234

Power Switch 4 3 1.14 5000

Remark: Power Switch use 0.4kgf, 5000 times, and 5Kgf, 10 times



3. No function error means cannot allow any device cause damage, fail or blue screen during test and after test. The functional check detail situation is as follow:

Test Component Test Criteria Hard disk device Copy & compare cannot occur error

Combo device Read / Write/Copy/Comp. data cannot occur error

Memory Cannot occur error message

Floppy device Format, copy & compare files from HDD cannot occur error

VGA Cannot occur noise, bad color on screen both for CRT & DVI ports

Time Cannot occur time delay or stop

Other Devices Cannot happen error or failure

si h110 desktop system dvt reliability & environment test...

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