shaping the cots assembly market

BOEING PROPRIETARY

BTEC12-07-008 Approved for Public Release, Distribution Unlimited, PM FCS 26 JAN 2007, case 07-027

[email protected] – (253) 773-0197, [email protected] – (253) 657-0809,

[email protected] – (253) 657-5663

Shaping the COTS Assembly Market to Support High End MilAero Applications

Lori E. BechtoldKimberly D. Meredith

James A. Robles

Saint Louis, Missouri - February 13-15, 2007

BOEING PROPRIETARY


Name: Lori E. BechtoldKey Technical Field: Phone number:Fax number: (253) 773-0299E-mail:

Biography:Lori Bechtold is a reliability engineer with 22 years experience with Boeing, spanning programs in military, commercial aviation and space applications. She currently supports the P-8A Poseidon program, addressing environmental issues of commercial off the shelf (COTS) electronics on a Navy platform. She has conducted research and development in Boeing’s Phantom Works group, in the application of COTS electronics to military and aerospace applications. Lori is the technical editor for the VMEbus International Trade Association (VITA) working group 51, developing a new industry specification for reliability prediction for COTS modules. She holds a B.S degree in mathematics from the Massachusetts Institute of Technology.

[email protected]

Reliability(253) 773-0197

BOEING PROPRIETARY


Name: Kimberly D. MeredithKey Technical Field: Electronic Systems PackagingPhone number: 253-657-0809Fax number: 253-657-0071E-mail: [email protected]

Biography: Kimberly Meredith is a thermal and structural designer and analyst in the field of Electronics packaging, and has ten years of experience in avionics related disciplines. Areas of expertise include hardware design for military avionics, test and analysis of prototype and production avionics, test and mechanical design of pulse detonation technologies, thermal and dynamic/vibration analysis, design of experiments, and environmental test and analysis. She recently has become involved in joint COTS electronics initiatives in Phantom Works and IntegratedDefense Systems, as well as participated in Boeing efforts with the VMEbus International Trade Association (VITA). She holds a M.S. degree in EngineeringScience and Mechanics from the University of Tennessee.

BOEING PROPRIETARY


Name: James A. RoblesKey Technical Field: Electronic Systems PackagingPhone number: 253-657-5663Fax number: 253-657-0090E-mail: [email protected]

Biography: Jim Robles is a Boeing Senior Technical Fellow. He has more than thirty years of experience in electronic packaging disciplines including, development of system architectures, hardware design for commercial and military ground and airborne avionics, equipment installation design, mechanical tolerance analysis, thermal and dynamic/vibration analysis, weights/mass properties analysis, design of experiments, and environmental test and analysis. He is a recognized expert on the application of COTS hardware on military platforms. Jim is the leader of the GEIA working group that developed EIA-933 Standard for Preparing a COTS Assembly Management Plan. He is also the Boeing Executive Focal for our External Technical Affiliation with VITA, developing standards for next generation COTS hardware assemblies for military/aerospace applications.


Shaping the COTS Market

• Rapid evolution in COTS market– Boeing has influence only in high end MilAero market

• In the last decade, high end MilAero market has been transformed by technological advances, and through Boeing influence on open architecture standards evolution– COTS assemblies now provide superior solution for all

design criteria

• In increasingly competitive commercial and military marketplace, COTS integration is essential to remain competitive and is key to future success


Agenda

• COTS Applicability• Customer Needs • The COTS Trade, Then and Now• Functional Density• Open Architecture Standard for Environments• Two-Level Maintenance• Future Combat Systems and COTS• Liquid Flow Through Cooling• Future Opportunities


COTS Applicability

Future

More of the same“office environment”

Future

More COTSVPX/REDI

Graphic courtesy of Mercury Computing

System Mission CriticalFunctional

DensityEnvironment

Sample Assembly Item

Insight into Assembly Item and Ability to

Influence

C-32 / C-40 No (VIP Aircraft)Low

(Commercial Aircraft)

Benign Ricoh Printer Lowest

AWACS 40/45 Dell Server

P-8A ATCA

F/A-18Custom and

VMEHighest

F-22Custom and

VMEHighest

FCS VPX and Redi High

Medium

YesHigh (fighter,

helicopter, ground vehicle)

Severe

Medium Medium


Critical skill to support our core competencies

• Commercial-Off-The-Shelf (COTS) Electronics; Provide broad and deep knowledge of, and contacts within, the commercial electronics industry. This includes technical, management, economic, and cultural awareness. Also have similar knowledge of all segments of the aerospace industry, including commercial, military, and space; as well as the avionics supply chain, including avionics original equipment manufacturers, system integrators, commercial and military operators, and regulatory agencies; and all geographic regions. (IDS, BCA, PW, EE Function)

• Related Critical Skills– Electrical Engineering– Materials, Processes and Physics– Systems Engineering– System/Design Safety– Test and Evaluation


High Functional Density, Severe Environment Military Platform Needs

• Minimize Total Ownership Cost (TOC)– Development Cost– Unit Recurring Flyaway (URF) Cost– Operation and Support (O&S) Cost

• High functional density to minimize weight and volume– Thermal density (watts/cm)

• Perform reliably in harsh environment • Compatibility with two-level maintenance for

– Reductions in life cycle cost– Reductions in logistic footprint

• Facilitate insertion of new technology and mitigation of component obsolescence– Thermal margin– Open system standards


The Challenge

Customer NeedsThe Challenge and the Opportunity

Functional

Densit

y

Power per Function

Thermal Density

Allowable Component Temperature

Functional

Densit

y

Power per Function

Thermal Density


Functional

Densit

y

Power per Function

Functional

Densit

y

Power per Function

Thermal Density


Thermal Density


Thermal ManagementContinuing Loss of Control of

the Electronics Industry

0

10

20

30

40

1980 1990 2000 2010

Piece parts -mil-spec % of

total

Equipment -military % oftotal avionics

Source: AvionicsMagazine, 01/01

Source:TACTech,’95

Per

cen

t

Processing Requirements AKA Functional Density

The Opportunity

References: www.vita.com and http://www.busandboard.com/archive-index.html

Open Architecture Standards &a Strong Industrial Base

Two-Level Maintenance

VITA 48 ERDI (Enhanced Ruggedized Design Implementation)

IBM Cell Processor Technology

•Enhanced thermal management and functional density•Two-level maintenance compatibility•Conduction and air cooling to 200 watts •LFT and spray cooling to 800 watts

•Moving target engagement

•Automatic target recognition


VITA 46 VPX•High speed serial interconnect switch fabric based architecture•Market driven selection of bus protocols•ESD protected connectorANSI/VITA 47-2005•Open architecture standard for environments


Two-Level Maintenance

Three-Level Maintenance Two-Plus-Level Maintenance Two-Level Maintenance

LRU R&R at the O-Levelo Requires ESD/Handling protection at the LRU interfaceo Requires fault isolation to the LRUo Requires sparing; much larger, heavier, and more expensive; LRU’s

LRU R&R at the O-Levelo Requires ESD/Handling protection at the LRU interfaceo Requires fault Isolation to the LRUo Requires sparing; much larger, heavier, and more expensive; LRU’s

LRM R&R at the O-Levelo Requires ESD/handling protection a at the module/card interfaceo Requires fault isolation to the LRMo Requires sparing; much smaller, lighter, and less expensive; LRM’s

R&R modules/cards at the I-Levelo I-Level Shop is expensive, vulnerable, and difficult to transport

I-Level Shop not required I-Level Shop not required

Card/module repair at the Depot Card/module R&R and repair at the Depot LRM repair at the Depot

-

Radar Processor

-F- 22 Requires Two-Level Maintenance

F- 22 Opportunity To Use COTS Based

Graphic courtesy of

CWCECVITA 48

VITA 46 (VPX) and VITA 48 (REDI) addressed and resolved ESD issue, making two-level maintenance practicable.

Radar Processor (RP)


The COTS Trade – Circa 1998

Option Affordability Survivability/Lethality Supportability

Development Cost

Design To Cost (DTC)

O&S Cost Weight Volume Performance (watts per

inch of pitch)

Integrity/ Reliability

Ease of Maintenance

Ease of Technology

Insertion

Liquid Flow Through

(LFT) Cooled Custom Design

Baseline Baseline Baseline Baseline Baseline 500 High Good High (100% thermal margin)

Air Flow Through Cooled Custom Design

No change from Baseline

No change from baseline

No change from baseline

1.5 times baseline + ECS effect

1.5 times baseline + ECS effect

333 Medium Good High (100% thermal margin)

Conduction Cooled Custom Design

No change from Baseline

High High 3.4 times baseline

3.4 times baseline

145 Low Good Extremely Poor

Conduction Cooled COTS

Lower Lower Higher Eight (8) times

Baseline

Eight (8) times

Baseline

63 Low Poor Extremely Poor


The COTS Trade - Circa 2006

VPX/REDI COTS Assemblies provide low total ownership cost, excellent weight, volume, performance, and good supportability.

PoorGoodMedium1006 x Baseline6 x BaselineHighHighConduction Cooled Custom

Medium (30% Thermal Margin)

GoodHigh2003 x Baseline3 x BaselineLowConduction Cooled COTS

Marginal

(Zero to 33% Thermal Margin)

Good500 to 800LowInternal Spray Cooled COTS

Medium

(16% to 67% Thermal Margin)

PoorHigh700 to 1000Baseline plus pump module

or external HRU

Baseline plus pump module

or external HRU

MediumDirect Spray Cooled COTS

Medium

(25% Thermal Margin)

GoodHighest750BaselineBaselineLow$15k

(typical)

LowLFT Cooled COTS

Marginal


Good500 to 800HighVery HighInternal Spray Cooled Custom

Medium



or external HRU


or external HRU

Very HighDirect Spray Cooled Custom

Marginal (Zero Thermal

Margin)

GoodHighest5001.2 X Baseline

1.2 X Baseline

High$35k

(typical)

HighLFT Cooled Custom

Ease of Technology

Insertion

Ease of Maintenance


Performance (Watts per

inch of pitch)

VolumeWeightO&S CostDesign To Cost (DTC)

Development Cost

SupportabilitySurvivability/LethalityAffordabilityOption

PoorGoodMedium1006 x Baseline6 x BaselineHighHighConduction Cooled Custom

Medium (30% Thermal Margin)

GoodHigh2003 x Baseline3 x BaselineLowConduction Cooled COTS

Marginal


Good500 to 800LowInternal Spray Cooled COTS

Medium



or external HRU


or external HRU

MediumDirect Spray Cooled COTS

Medium

(25% Thermal Margin)

GoodHighest750BaselineBaselineLow$15k

(typical)

LowLFT Cooled COTS

Marginal


Good500 to 800HighVery HighInternal Spray Cooled Custom

Medium



or external HRU


or external HRU

Very HighDirect Spray Cooled Custom

Marginal (Zero Thermal

Margin)

GoodHighest5001.2 X Baseline

1.2 X Baseline

High$35k

(typical)

HighLFT Cooled Custom

Ease of Technology

Insertion

Ease of Maintenance


Performance (Watts per

inch of pitch)

VolumeWeightO&S CostDesign To Cost (DTC)

Development Cost

SupportabilitySurvivability/LethalityAffordabilityOption


Cooling Capacity vs. Functional Density Requirements

• Key to survivability/lethality

• Trends have changed COTS vs. Custom advantages

• The Future– IBM BE Cell Processor – 600 watt 6U card with four nodes

Cooling Capability vs. Functional Density Requirements 1998 - 2008

0

100

200

300

400

500

600

700

800

1998 2000 2002 2004 2006 2008

Po

wer

(Watt

s)

COTS LFT

Functional Density Requirements

COTS Conduction

Custom Conduction

Custom LFT


Advances in Conduction Cooled COTS

F-22 CNI/EW Power Supply• Circa 1993 to 2000

• SEM-E

• ~ 40 watts

• Military Grade Temperature Components

• No “special” technology

IEEE 1101.2 VME Card• 2000 to 2005

• 6U

• Up to 90 watts

• ~ Industrial Grade Temperature Components

• Extra conduction paths

VITA 48 Module• Circa 2006

• 6U

• 200 watt capability


• Heat pipes, extra conduction paths

• Aluminum/Beryllium is being used in the F-22 CNI/EW power supply module.

• AlBe selected for CTE match to PWBmaterial, to minimize strain on solder jointsof large packages.

• Weight benefit of -0.065 pound per module.

• Cost upper of $400 per module.

• ~$6,200 per pound of weight saved.

• Health and process issues resolved.

Graphic courtesy of CWCEC

GRAPHICGRAPHICNOTNOT

AVAILABLEAVAILABLE

Current Custom Module• Circa 2006

• 6U

• 110 watt capability


• Annealed Pyrolytic Graphite Core• Large Wedge Clamps


Advances in LFT Cooling

• Aluminum/Beryllium was considered for use inCIP power supply module cores.

• AlBe was not required for CTE match.

• -0.065 pound of weigh saving would have cost$585 ($9400/pound saved).

• Cost not considered justified by the F-22Program.

• Aluminum cores.

F/A-22 CIP Power Supply• Circa 1993 to 2000

• SEM-E

• ~ 80 to 100 watts

• Military Grade Temperature Components

• Quick Disconnect (QD) Issues

Custom Design Processor• Circa 1996 to 2000

• SAM (6U-ish)

• 140 watts design / 300 watt capability

• Industrial Grade Temperature Components

• QD Issues Worked

VITA 48 Module• Circa 2006

• 6U

• 600 to 800 watt capability


• QD Issues Being Worked



ANSI / VITA 47-2005• In 1996, COTS not available to an

open standard for Mil/Aero application environments

• In 2005, an open standard approved for environmental, design and construction, safety, and quality requirements for COTS plug-in units intended for mobile applications

• Keeps the advantages of open systems

– Lower total ownership cost

– Obsolescence protection, backward compatibility

– Efficiency of common solutions across multiple applications


Future Combat Systems is using a VITA 46 COTS Solution

Backplane (BP) – ruggedized circuitry for intra-rack power and signal distribution; includes backplane interconnect, I/O connectors, backplane to I/O connector harness, and backplane cover

Backplane

6U 3UCircuit Cards – Per VITA 46• Functional Density• High speed serial interconnect with switch fabric matrix architecture• ESD protected connectorEnvironments – Per ANSI/VITA 47-2005• Open architecture standard


Future Combat Systems has committed to 2-Level Maintenance Utilizing VITA 48

Table 2. FCS Maintenance Levels Trade Study

VITA 48 Module with ESD protected connector and covers

Integrated Electronics Rack (IER) – the enclosure in which LRMs are installed; provides mechanical support, cooling and some measure of environmental protection to the LRMs; provides the physical interface to the platform; includes backplane interface

6U 3U

Line Replaceable Modules (LRM) – Per VITA 48• Covers for ESD protection also provide stiffening and greater EMCMeets the Army’s Needs • $4B operation and support (O&S) cost reduction for Integrated Computer System (ICS) alone• Greater than 50% reduction in logistics footprint• Corresponding benefits for other systems.


Commercial Cooling Trends/Innovations

All Electric Trend

• 787 Power Electronics Control System (PECS)•Circa 2004 • All Electric Airplane• Thermal loads unmanageable with air cooling•http://www.newairplane.com/

Currently Available Liquid Cooled Computing

• Apple Power Mac G65•“Mind-boggling leaps in processing power • http://www.apple.com/powermac/design.html

• Sony VGC-RA710G•“Liquid Flow Heat Pipe”•http://www.mynetbuys.com/pdetails.aspx?part=VGC-RA710G

Intel Liquid Cooling Research• Sunon Waturbo CPU radiator cooling

•http://www.xbitlabs.com/news/coolers/display/20060418123542.html

• Integrated pump-coldplate module•http://www.xbitlabs.com/articles/editorial/display/idf-s2006-3.html


Back Up Slides


Shaping the COTS Market

• Our needs can’t be levied as requirements on COTS - they must be advocated in the market to influence future products

• Continued advocacy results in practicable solutions using COTS

• COTS integration is a critical skill to support our core competencies

Future efforts will assure practicable COTS solutions to future integration challenges.


The Maintenance Level Trade - Circa 1998

NoChange

FromBaseline

NoChange

FromBaseline

Option

Affordability Lethality/Survivability Supportability

DTC O&S Costs Weight Volume PerformanceIntegrity/Reliability

Ease ofMaintenance

Three LevelMaintenance

Two Plus LevelMaintenance

Two LevelMaintenance W/

Protection

One LevelMaintenance

Poor

Poor

Better (?)

Two LevelMaintenance

W/ KISSBaseline

Ease ofUpgrade

Lower

Lower

BaselineBaselineBaselineBaselineBaselineBaselineBaseline

6%Lower

6%Lower

3%Lower

3%Lower

5%Higher

Lower

Lower

Higher

MuchHigher

Higher

NoChange

FromBaseline

TBD%Higher

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

NoChange

FromBaseline

• LRU Removal At The O-Level.

• Card Removal At The I-Level.

• Card Repair At The Depot.

• Environmentally Protected Enclosure.

• Rugged Interface Connectors.

• Thermal Interface Is Not ContaminationSensitive.

• Cards Do Not Provide Protection AgainstESD/Handling Damage.

• LRU Removal At The O-Level.

• Ship LRU (Failed Card And Good Cards)To The Depot.

• Card Repair At The Depot.

• Same Hardware As For Three LevelMaintenance.

• Card (Line Replaceable Module or LRM)

Removal At The O-Level.

• Card/LRM Repair At The Depot.

• Environmentally Protected Enclosure (Installed).

• AKA - Integrated Electronics Rack (IER)

• Rugged IER Interface Connectors.

• LRM’s Provide ESD/Handling Protection.

• LRM/IER Connector/Thermal Interface Is Relatively Fragile.

•Three Level and Two Plus Level maintenance rejected due to high cost

•Two Level w/Protection rejected due to weight and volume increase


Thermal Management Technologies

Active Transport Elements

Interfaces

LFT Cooling

Spray Cooling

Conduction Cooling

Passive Transport Elements

HRU

Global Solutions

Module Solutions

Liquid Metal Cooling Loop

Phase Change Fillers for

Liquid Loops

Custom and COTS Design Improvements

QDs

• Aluminum/Beryllium is being used in the F-22 CNI/EW power supply module.

• AlBe selected for CTE match to PWBmaterial, to minimize strain on solder jointsof large packages.

• Weight benefit of -0.065 pound per module.

• Cost upper of $400 per module.

• ~$6,200 per pound of weight saved.

• Health and process issues resolved.

Thermal Spreaders (Diamond,

etc.)

Heat Pipes

Custom and COTS Design Improvements

Vapor Chambers

Micro-Channels

Wedge Clamps

Heat Pipes

Wedge Clamps

Thermal Spreaders (Diamond,

etc.)

Refrigeration

Thermal Pads

Composite Chassis

Rarefied Air

PM

C/X

MC

Co

ve

r

PM

C/X

MC

Mo

du

le

Prim

ary

Sid

e C

ove

rw

ith E

jecto

rsW

ed

ge

Cla

mp

s

Co

mm

on

PC

BA

sse

mb

ly

Se

co

nd

ary

Sid

e C

ove

r

Thermoelectric

Spacecraft Radiator


Future Opportunities

High Power Microwave

• Directed Energy Weapons

• 7E7 More Electric Aircraft

• Increasing Avionics Functional Density


Commercial Cooling Trends/Innovations

All Electric Trends

• 787 Power Electronics Control System (PECS)•Circa 2004 • All Electric Airplane• Thermal loads unmanageable with air cooling•http://www.newairplane.com/

•DDG 1000 Multimission Destroyer• All electric drive with integrated power system•http://peos.crane.navy.mil/ddx/

Currently Available Liquid Cooled Computing

• Apple Power Mac G65•“Mind-boggling leaps in processing power • http://www.apple.com/powermac/design.html

• Sony VGC-RA710G•“Liquid Flow Heat Pipe”•http://www.mynetbuys.com/pdetails.aspx?part=VGC-RA710G

Silicon Carbide Microelectronic Devices• Operate at higher temperatures and radiation levels vs. Si and GaAs semiconductors• High thermal conductivity • http://www.cree.com/products/sic_sub_prop.asp

Microtechnology Advances• Carbon Nanotubes (Purdue)

•http://widget.ecn.purdue.edu/~CTRC/research/breakthroughs.htm#CNT

•MEMS Cooling pumps (Purdue, UW)•http://www.physorg.com/news75566064.html

• MEMS Synthetic jets (Georgia Tech research)• IBM Zurich Labs chip cooling channel design

•http://www.physorg.com/news81096760.html

Intel Liquid Cooling Research• Sunon Waturbo CPU radiator cooling

•http://www.xbitlabs.com/news/coolers/display/20060418123542.html

• Integrated pump-coldplate module•http://www.xbitlabs.com/articles/editorial/display/idf-s2006-3.html

shaping the cots assembly market

Business

cots trade

cots integration

cots market boeing

cots applicability future

military avionics

cots liquid flow

cots market rapid evolution

cots assembly management