seapol resume release 3.0.2

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Resume ver 3.0.2 December 24 2015 This resume aims to simply let reader know about me. It won’t contain the all and detailed information about my background and experience but latest. It only let reader know if my background and experience attracts your or not. If interesting me, please feel free to give me a phone call. Under any condition, please keep it as confidential and never leak out to others. Many thanks for your professional manners. Let market say how much you are worth of

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Resume ver 3.0.2

December 24

2015 This resume aims to simply let reader know about me. It won’t contain the

all and detailed information about my background and experience but

latest. It only let reader know if my background and experience attracts

your or not. If interesting me, please feel free to give me a phone call.

Under any condition, please keep it as confidential and never leak out to

others. Many thanks for your professional manners.

Let market say how much you are worth of

SEAPOL SHEN Page 1

SEAPOL SHEN

SHANGHAI, CHINA

+86 18516357355 ▪ [email protected]

Visit me @ cn.linkedin.com/pub/zhiqiang-shen/90/778/525/Edit

Personal basic info

Item Description

Name Shen Zhiqiang

Nick Name Seapol

Gender Male

Date of Birth Jan 17, 1985

Location Shanghai

Top Education Exp. Master

Graduate from The University of Melbourne, Australia

Work Experience Since 2009, major in telecomm, networking, Testing, Measuring and

instrumentations

Experienced Job title Calibration Engineer; Test development Engineer; Applications Engineer

Phone number +86 185-1635-7355

Email [email protected];

Foreword

Since 2009, I started my career from SMIT, an institute that offers customer service of measuring and

calibration. Telecommunications Calibration engineer is my first job. During 2 years at SIMT, I gradually

became an engineer from a graduate student and also practice my theory and knowledge from university.

From the first job, I learnt to master the experience of measuring and calibration on telecommunication

instruments like RF test, Optical communications test and network test etc.

SEAPOL SHEN Page 2

In Aug, 2011, I joined in Tellabs, an American owned company that provides network solution to customer

over the world. My project is to develop test solution for smart router 8100/8600 that is developed in Espoo,

Finland and manufactured in Penang, Malaysia. So I often travelled to these sites to meet with R&D PTR and

implement projects to MFG. The reason I went away from SIMT is company culture conflict – I’m much ready

to work in such work environment that no too much office political issue, flexible working time, fair chance

to promotion and personalization etc. Tellabs is a good company for that but facing with finance issue. In

Final, I left Tellabs after my 2.5 years’ service due to layoff.

In May 5th, 2014, I joined in Agilent, a top 1 in its industry of instrumentations and begun my new journey on

this company and up to now.

In Nov 1st, 2014, Agilent Technologies split out its Electronic Measuring Group to Keysight Technologies.

Thus, I’m now serving at Keysight Technologies, focus on In-Circuit Testing Production Application.

Considering about my background and experience, I prefer to the future company should be

1. Wholly Foreign-Owned Enterprises (American/European) is a plus

2. Telecommunication or electronic Developing background (High technology developing company

rather than manufacturer)

3. Good Strategy and prospection

4. Flexible working time and environment

5. Fair and encouraging promotion policy

6. Professional career planning and HR policy including work overtime and leaves

7. Sufficient training chance abroad is a plus

8. Large size (e.g. 500 above) is a plus

9. Prefer to business travel abroad

10. Reject to the 3rd party contract position

Keyword

Telecommunications; Boundary Scan; Electronic; Programming C\C#; IT skills; RF; Testing; ICT; Design for

Test; Semiconducting; Instrumentations

Skills

Master and experienced programming skills including

o Low level procedure-oriented language: Language C

o Industrial software programming: NI Teststand, Agilent x1149, NI windowsCVI, Matlab, Goepel

Caswin 4.5.2

o Object-oriented language: Visual studio C#, .NET Framework 4.5.1

o Script language: Perl, Python, Windows Batch

o Framework: .NET framework 4.0

Master and experienced to develop scripts or tools by using C#, Perl and Python.

Well understand Intel Haswell, Broadwell and Skylake platform and structural functionalities.

Well understand and experience on Serial Bus Protocol like SPI, I2C and SMBus etc.

SEAPOL SHEN Page 3

Master and experienced hardware skills including

o Have knowledge of electronic engineering

o Able to PCBA schematic analysis and troubleshooting

o Familiar with Qualcomm SnapDragon 800 mobile platform

Master and experienced Industrial standards including

o IEEE 1149.1

o IEEE 1149.6

o IEEE 1149.8.1

o JEDEC JESD209-3

o JEDEC JESD84-B451

o JEDEC JESD84-B50-1

o JEDEC JESD79-3F

Master and experienced instruments including

o Agilent x1149 Boundary Scan Analyzer

o Agilent U2331 Digital Acquisition Device(DAQ)

o NI PXI Controller USB6501

o Goepel Boundary Scan Analyzer

o NI PXI cards like scope, matrix relay, switch

o Kepco Eload

o Agilent E4438C, E4440A, DMM, Counter, VSA 89600S

o RS communication analyzer, Anritsu Bluetooth analyzer

Work Experience Overview

Company Period Job Position

Keysight Technologies Inc.

(Split from Agilent, Nov 2015)

2014.5 to Now Applications Engineer

Tellabs Shanghai 2011.8 to 2014.2 Test Development Engineer

Shanghai Institute of

Measuring and Technology

(SIMT)

2009.5 to 2011.8 Calibration Engineer

Keysight (spin from Agilent, Nov 2014) Experience

SEAPOL SHEN Page 4

Applications Engineer ▪ May 5th 2014 - Now

Agilent Technologies, Inc. ▪ 19F LiTong Plaza, No.1350 North Si Chuan Road, Hongkou district,Shanghai

Primary responsibility for this customer facing role is to provide x1149 embedded test application expertise

to support pre-sales presentations, competitive evaluations and post-sale activities.

• Participate with technical marketing and R&D to develop new embedded test applications for customers.

• Independently develop embedded test on customer board designs, debug and deploy the test into

manufacturing. The development process may include design-for-test study, manage deliverables of third

party suppliers, and integrate multiple test hardware and software to become the embedded test solution,

create the user guide and train the customers to use the solution.

• Develop the field implementation plan for new embedded test applications. The field implementation plan

should include product knowledge transfer to other AEs and customers, translating critical product slides

and documents into local language.

• Uses in-depth technical, scientific and expert product knowledge to resolve embedded test application

issues escalated by customers. The resolution process may require direct interactions with customers or

supporting Field Service Engineers, Remote Engineers, and customer call center personnel responding to the

customer escalations.

Other responsibilities may include:

• Provide technical product and measurement consulting during presales engagements with customers.

• Interact with R&D marketing, sales, technical support, QA, manufacturing, product development, etc. as

well as external customers to ensure that products have necessary features, cost parameters, supportability

goals, reliability targets and release schedules.

• Crafting the product/process user documentation.

• Develop and deliver technical training to the Keysight technical support teams, such as field service and

remote service engineers

• Determines and develops approaches to assignments

WORK EXPERIENCES AT TELLABS

Main Role and Responsibilities: -Job Position: Global Testing Engineer (Engineer II)

-Take part in design and development of manufacturing test solutions for Tellabs 860x/86x0 products.

- Support Test solution verification and transition to CM and Repair&Return locations.

- Test Solution maintenance and improvement.

- Provide Test Solution sustaining and troubleshooting for CM and Repair&Return location

SEAPOL SHEN Page 5

- Detailed circuit design; schematic capture, hardware design/layout reviews, component selection,

device/module characterization, debug, and validation

- Be involved in product support, analyze field failures, manufacturing yield problems and perform corrective

action

-Achievement:

1. Outstanding employee in 2013

2. Engineer II Promotion

Experiences and knowledge 2 years’ experience in design for test (DFT) and Verification in worldwide renowned companies Boundary Scan test solution by using Goepel Cascon 4.5.2 and 4.2.1

Infrastructure test – check all IEEE1149.6 (BSCAN chips) IDcode and BSCAN chains Interconnection test – check interconnections between merged boards, pull-up and pull-down

resistor, sense specified nets by BS nets, and drive logic level on specified nets by BS nets.

Memory test – walk 0s and 1s on data bus by controlling signals Manually test – very similar with interconnection test such as LED test, matrix nets test, multiplex

device test etc.

Flash test – Program, Erase, Verify, IDcheck and Read to file on Flash and EEPROM Power Block and Functional module test

Experience in PXI 1044 tester including 6501 controller, switchers, DMM, Digitizer etc.

Participate with HW engineer to layout test board for solution Participate with mechanical engineer to finish in wiring and verification on fixture for solution Knowledge in state-of-art verification technologies such as formal methods, coverage, assertion

etc. Solid electric circuit knowledge and debugging experiences Experience with schematic capturing tools such as Expedition.

Unit Test in chassis Build solution for UUT board with several reference boards in chassis 860x/86x0 Inquire R&D change request by CQ system if necessary

Manually validate all PTS commands in specified chassis by Hyper Terminator. Build Teststand solution for unit test with specified version of mini-Application SW, boot code, and

Application SW.

NPI projects:

Summary

8609/8611 FP1.2 SBB2284V3 BSCAN solution development HMX2267 BSCAN solution development

LMP2242 BSCAN and unit test (8611 chassis) solution development 8602 FP1.0

Study Production Design from R&D

Make test strategy according to R&D PTR, offer test plan for each specified test item to R&D review

Develop test solution such as BST, PBLOCK, MODULE, UNIT tests for NPI projects

Build and wiring fixture with PXI tester and UUT Validate prototype test solution CPK analysis and improvement

Provide blackbox solution for Return and Repair Release test description/procedure/debug to Agile life cycle system in the end of solution

development

SEAPOL SHEN Page 6

Travel to CM and RR for NPI pilot onsite support – First Article Check Strong analytical ability and problem solving skills and be good at sustaining for customer

Familiar with R&D production lifecycle and process ECO and SCO in Agile Sustaining affairs including CM NPF and RR issue

Project1: Test solution development for NPI FP1.0 8602 Tellabs Smart Router

Period: 10/2013—02/2014

Project Role: Developer & Solution owner

Project Info:

The Tellabs 8602 router is an optimized cell site router for macro and small cell backhauling. It extends the

Tellabs Smart Router portfolio further down to the access network, enabling the operator to utilize IP/MPLS as

a unified technology down to the small cell sites. The Tellabs end-to-end solution for mobile backhaul includes

common control plane, traffic management and monitoring in a cost-efficient manner through the entire

network. (Ref: http://www.tellabs.com/products/8000/tlab8602sr.pdf)

The NPI test solution development project is taken by Finland GTE team and China GTE team. The Tellabs

8602 router contains sub-module of baseboard SBB2305/SBB2315 and sub-module of power board SPB2313.

According to test strategy, baseboard is required to go through the process of

ICT>>PBlock>>BST>>Module>>AssyAdd>>Unit>>Final test>>Packout and power board needs process of

ICT>>PBlock>>HI-POT>>Assy>>Packout

In the aspect of project tasks, I take responsibility of test solution development of PBlock>>BST>>Module for

SBB2305/SBB2315 baseboard. Solution development need a standard NI PXI tester including PXI chass is

1044, DMM4071, Scope5152, Switch2527/2566/2593, and RackIO USB6501 etc., a mechanical fixture

with pneumatic device to acquire electrical signal from UUT test point to VPC resource interface, and several

adapter board including LEDs inspection board, Clock signal buffer, and relay board etc.

I spent 2 months on solution modeling and fixture building

1. modeling solution in block diagram (6 weeks) 2. UUT test points assignment analysis (1 week)

3. measuring resources and instrument allocation (1 week) 4. negotiation with mechanical engineer about fixture building (2 weeks) 5. offer wiring list to fixture manufacture vendor (1 week)

6. Validate received fixture wiring and functionalities. (3 weeks) I spent 1 months on solution development, debug, validation, and reliability running

1. Develop and Verify specified test items by manual according to MTS-PTR (4 weeks)

i. PBlock test (Click here to see PBlock Test) ii. Boundary Scan test (Click here to see Boundary Scan Test) iii. Module test (Click here to see Module test)

2. Compiling and debug test script code e.g. NI Teststand sequences (1 week) 3. Analysis on the reason why those test item results are not within the limit (1 week)

SEAPOL SHEN Page 7

4. When confirm the root cause is not test solution, report to R&D to further investigate (1 week) 5. Reliable running and produce CPK statistic. (1 week)

Project2: Test solution development for FP1.2 8609/8611 Tellabs LMP2242 Period: 04/2013—10/2013

Project Role: Developer & Solution owner

Project Info:

LMP2242 is a line module with E1/T1 8 RJ45 port for Tellabs 8609/8611 Ethernet interface module. FP1.2

doesn’t belong to NPI project but Feature Package project. FP1.2 for LMP2242 adds main feature of hot-swap

support. In the aspect of test solution development, there is no need to develop new features on LMP2242 in

process of PCBA level test including PBlock and BST.

My test solution mainly focus on LMP2242 unit test in Tellabs 8611 smart router — previously LMP2242 unit

test in Tellabs 8607 smart router. See ref: http://www.tellabs.com/products/8000/tlab8611sr.pdf

R&D upgrade Tellabs smart router ESW with FP1.2 new features and I develop my test solution in the

environment of new ESW. For detailed information about unit test solution, see Software test in Unit level.

I spent 2 months on LMP2242 unit test solution, providing test items below:

1. 8611 system boot up done check

2. 8611 system ESW application check 3. 8611 system HW inventory check 4. 8611 system swap SCM priority from SCM1 to SCM2 5. LMP2242 UUT Identification check with GDMS manufacturing database

6. LMP2242 datapass test via E1/T1 loopback 7. LMP2242 oscillator clock measuring via PLD 8. LMP2242 CPU&PLD ID check

9. LMP2242 CPU&PLD temperature check 10. LMP2242 Alarm test via PLD 11. LMP2242 LOS signal functional test via PLD

12. LMP2242 CPU Power voltage measuring 13. LMP2242 IP configuration functional test 14. 8611 smart router protocols functional test

15. 8611 smart router robust synchronization test 16. Quality of Service Testing in Packet Networks

a) LSP ping functional test

b) LSP traceroute functional test c) Ethernet OAM functional test

My responsibilities:

1. Validate ESW for 8611 FP1.2

2. Convert test solution from 8607 to 8611 3. Develop test sequences for LMP2242 unit test in 8611 system 4. Regression ESW version in all module of unit test 8611 system

SEAPOL SHEN Page 8

5. Release and publish test solution in Agile and CM site

Project3: HMX2267 Boundary scan solution development Period: 08/2012—present

Project Role: Developer of HMX2267 Boundary scan solution

Project Info:

HMX2267 is 10G High speed Module for 8611 Edge network switch which offer interface between PHY and

XAUI by XFS. The boundary scan is a test solution for chips and interconnections. It utilize the chipset which

comply with IEEE 1149.6 and its boundary scan cell to drive a signal high or low and measure its result so as to

check if any open, short or connection errors on the UUT board. Moreover, boundary scan solution can also do

some test, verification, or programming EEPROM/FLASH/CPLD/FPGA/DDR RAM etc.

In addition, solid SW and HW knowledge is necessary as well. For example, to use the PXI rack, sometimes I

have to understand/writing/modify the RackController.dll by using C++ under the WindowsCVI environment.

And all test solution is used in NI teststand 4.5.

The coding task should include Boundary Scan test script programming and device library programming, dll

programming under windowsCVI, and teststand programming.

HMX2267 is a High speed module with a XFP interface. The mainly functionality is to transfer date from the

PHY side via XPF/SPF+ to the MAC side via SGMII. Below is specified test plan for each functionality check.

1. Boundary Scan infrastructure and interconnection test Boundary Scan solution for HMX2267 need to offer its basic HW functionality including components location

and direction correction, nets interconnection correction, pull-up and pull-down resistor presence etc. Test of

Infra and Interconnect can check error in the beginning of the test.

2. ADC9527 clock generating chip configuration by i2c bus ADC9527 is an analog device which is required to configure the access register via i2c bus, then it can

generate 155.52MHz and 156.25MHz CW frequency signal. Solution uses BSCAN nets to simulate i2c bus

time sequence so as to complete the job of ADC9527 register configurations.

3. PHY chips access by SMI interface PHY chips use SMI interface (MDC/MDIO bus) to access their internal register. PHY internal registers can

execute different types of loopback for test routing functionality. Besides rout ing, there are also some GPIO

resource on the PHY chip. Solution uses BSCAN nets to simulate SMI time sequence so as to test PHY routing

functionality via loopback and write/read data onto GPIO pins to extend other test like LED test and configuring

frequency division chip.

SEAPOL SHEN Page 9

4. UUT ID EEPROM write/read/verify

There is an ID EEPROM on the HMX2267 that records its manufacturing information. The EEPROM

Specification is provided and explained by R&D. Solution uses BSCAN nets to simulate i2c bus time sequence

so as to write/read/verify EEPROM bin file to/from device.

5. LEDs light on off tests LEDs are controlled by PHY chip GPIOs. As mentioned in section of PHY chip access, solution can write/read

data onto GPIOs via configuring PHY register. LEDs test is actually executed by GPIOs and check the

functionality via operator vision.

WORK EXPERIENCES AT SIMT

Main Role and Responsibilities: Telecommunication Calibration and Test Engineer

Responsibilities:

- Take part in design and development of calibration and test solutions for various kinds of telecommunication

instruments such as SDH/PDH/ATM Analyzer, VSA, VSG etc.

- Test Solution maintenance and improvement.

- Calibration Specification documentation.

Experiences and knowledge Have knowledge and 2 years work experience of calibration on telecommunication instruments and

devices especially for Agilent, RS, Anritsu, Tektronix, Fluke, Litepoint, and HP etc.

Experience and operating with RF and wireless communication instruments such as VSA, VSG, WLAN/WIFI/BLUETOOTH/GSM/EDGE/PHS/PDC/WCDMA/CDMA/IS95/CDMA2000/1XEVDO/HSPDA/WCDMA/TDSCDMA tester etc.

Experience and operating with Data communication device such as Ethernet, Frame Relay, ISDN, X.25, V.24, SDH/PDH/ATM analyzer etc.

Familiar with telecommunication calibration instruments such as oscilloscope, Spectrum Analyzer,

Universal Counter, Multifunctional Meter etc. Project on Litepoint IQFLEX, IQmax automatic calibration platform development which use its iqapi.dll to

produce a LABVIEW platform automatic test tool.

Manage and maintain calibration standard instruments and documentations in lab.

Projects: Project Name: IQFLEX WLAN TEST AUTOMATIC CALIBRATION PLATFORM

SEAPOL SHEN Page 10

Period: 12/2010—04/2011

Project Role: Project Owner

Project Info:

This is a calibration board for an IQFLEX WLAN tester manufactured by Litepoint ltd., co. Litepoint

Company provides me C++ API including iqapi.h etc. My mission is to utilize this API to generate my

project DLL which can be called by LABVIEW CLN. Instruments like Agilent E4438C, E4440A, and

34401A were used as Calibration Standard instrument for IQFLEX and they were controlled by GPIB

IEEE488.2. I used SCPI commands to give test sequences on IQFLEX calibration. The advantages of the

automatic calibration board are higher efficiency, lower cost and less mistakes. Higher efficiency means

that calibrating IQFLEX automatically need only one technician rather than two like before. Lower cost

because it decreased the period time of calibration. As for less mistake, we will not record the measuring

data onto the result list and the software can help us.

SW Environment: LabVIEW 2010, C++ dll

HW Environment: Agilent E4438C, E4440A, 34401A etc.

Responsibilities:

I take charge of the whole project and should take:

1.coding C++ iqfapi.dll with iqapi.h by Litepoint Corporation.

2. using LabVIEW to call my iqfapi.dll which contains IQFLEX functions for automatic board

3.coding other standard instrument such as E4438C, E4440A etc.

3.publishing a paper for the project

Achievements: A calibration board for an IQFLEX WLAN tester

Education

GPIB 488.2

Wifi IQFLEXE4438CVector Signal Generator

E4440ASpectrum Analyzer

34401ADMM

Universal Counter

IQFLEX

RF IN0

RF IN1

RF OUT

Audio out/in

10MHz Ref clock distributor

REF IN

REF OUT

SEAPOL SHEN Page 11

The University of Melbourne

12/25/2008 ▪ Master Degree

Master Degree of Telecommunications Engineering 1.5 years

Graduated with Honors in Telecommunications Engineering in 2009.

Overseas Studies Program:

This program is for electrical and electronic engineering graduates who wish to develop their knowledge and

skills base in optimal network design, network management and network security for modern

telecommunications networks.

Subjects

1.Network Design and Optimization

2.Internet Engineering

3.Wireless Communication Systems

4.Signaling and Network Management

5.Directed Studies

6.Mobile and Wireless Networks and Design

7.Multimedia Content Delivery

8.Broadband Access Networking and Design

9.Optical Networking and Design

10.Lightwave Systems

11.Advanced Communications Systems

12.Business of Telecommunications

Other Engineering electives

1.Sensor Networks and Applications

2.Cluster and Grid Computing

3.IT Project Management

4.RF Systems and Architecture

The University of Science&Technologies of Shanghai

12/25/2008 ▪ Bachelor Degree

Bachelor Degree of Measuring Technologies and Instrumentation Engineering 4 years

References

SEAPOL SHEN Page 12

Recommendation Letter of Seapol