BEST PERFORMANCE FOR BEST VALUEThe SE500 is capable of inspecting the most demanding assemblies with 80cm²/second inspection speed. Not just simpler and faster, SE500 also offers uncompromised measurement accuracy and repeatability even at such high speeds.

SE500 helps you achieve industry-leading volume accuracy, with its ability to inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with the growing demands of increasing line speeds.

As accurate volume measurement of each solder paste deposit plays a critical role, SE500 is designed to provide high quality solder joints in your SMT process in the most cost-effective way.

SE500 ™

SOLDER PASTE INSPECTION SYSTEMCP

CYBEROPTICS

PERFORMANCE

Best GR&R

Highest Speed

ATTRACTIVE COST OF OWNERSHIPA simplified yet robust design combined with calibration-free sensor technology makes SE500 a reliable, high-performance system while maintaining the most competitive cost of ownership in the industry.

PROCESS OPTIMIZATION CAPABILITYWith SE500 , you can optimize your screen printing process, fine-tune screen printer setup and monitor any process drifts. To enhance performance and provide more flexibility, SE500 is designed to support a blend of high speed and high resolution inspection modes within the same inspection program. Pattern of structured white light on PCB Quick Defect Detection

Integrated sensorassembly with no moving parts

Cross-section tools provide graphical profile of solder paste deposit

3-D image of solder paste deposit

CP

CP

CP

CP

CP

CP

CP

139cm(55 in)

490cm(19 in)

85cm(34 in)

134cm(53 in)

100cm(39 in)

www.cyberoptics.com

AmericasCyberOptics CorporationMinneapolis, Minnesota USATel: + 1 763 542 5000

Asia PacificCyberOptics SingaporeSingaporeTel: + 65 6744 3021

ChinaCyberOptics China Company, Ltd.ShanghaiTel: + 86 21 6468 8080

EuropeCyberOptics Ltd.United KingdomTel: + 44 (0) 1756 700 330

info@cyberopt ics .com

FRONT SIDE

Data subject to change without notice. Copyright © 2010 CyberOptics Corporation, Inc. All Rights Reserved. 8015887, Rev A 3/10

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CP

Panel Size Capacity (Min.)Panel Size Capacity (Max.)Dimensions (W x D x H)

650 kg (1,433 lbs.)WeightMaximum Panel WeightBoard Thickness (Min.)Board Thickness (Max.)Board Edge Clearance (Top)Board Edge Clearance (Bottom)Component Clearance (Top)Component Clearance (Bottom)Conveyor Speed RangeConveyor Adjustment

50 x 50 mm (2.0 x 2.0 in.) 510 x 510 mm (20.0 x 20.0 in.) 100 x 127 x 139 cm

3.0 kg (6.6 lbs) 0.3 mm (0.01 in.) 5.0 mm (0.2 in.) 2.5 mm (0.10 in.) 3.0 mm (0.12 in.) 20.1 mm (0.78 in.) 25.4 mm (1.0 in.) 150 – 450 mm/sec (5.9 – 17.7 in./sec) Automatic

Maximum Inspection AreaField-of-View (FOV) X and Y Pixel Size @ High ResolutionX and Y Pixel Size @ High Speed 30 µm (1.2 mils) Paste Height Range 50 – 500 µm (2 – 20 mils) Height ResolutionMaximum Board WarpMaximum Pad Size in FOVMeasurement TypesMachine Interface SMEMA, RS232 & Ethernet Power RequirementsCompressed Air Requirements

508 x 503 mm (20.0 x 19.5 in.) 32 x 32 mm (1.26 x 1.26 in.) 15 µm (0.6 mils)

0.2 µm (0.008 mils) < 2% of PCB diagonals or max. of 6.35mm (0.25 in.) total 15 x 15 mm ( 0.6 x 0.6 in.) Height, Area, Volume, Registration, Bridge Detection

100 – 130 / 220 – 240V, 50/60 Hz, 10 – 15 amps 5 Kgf/cm² (80 to 100 psi @ 4 cfm)

Inspection Speed @ 30umInspection Speed @ 15umLoad / Unload and Fiducial FindVolume RepeatabilityVolume Repeatability

< 10%, 6 σ

80.0 cm²/sec (12.3 in²/sec) 50.0 cm²/sec (7.6 in²/sec) 4 – 5 sec < 1%, 3 σ , on a Certification Target < 3%, 3 σ, on a Circuit Board

Gage R&R

SYSTEM SPECIFICATIONS

FUNCTIONAL SPECIFICATIONS

PERFORMANCE SPECIFICATIONS

SE500 CP

188cm(74 in)

92cm(36 in)

127cm (50 in)

*Adjustable86-104cm

(34-41 in)

* To achieve the lowest conveyor height measurement of 83 – 96 cm (33 – 38 in), a customized conversion kit is available. Contact CyberOptics for more information.