s+c_rs152_sensonor_stim210_gyro_module_sample

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

March 2014 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Sensonor STIM210 Gyro Module

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Sensonor Profile– STIM210 Specifications

3. Physical Analysis 15– Synthesis of the Physical Analysis– Physical Analysis Methodology– 3.1 Module 18

– Module View, Dimensions & Pin-out– Module Opening

– 3.2 Electronic Board 24– Top Side – Components Markings– Top Side – Components Identification– Bare Dies Connections– Bottom Side – Components Markings– Bottom Side – Components Identification

– 3.3 Digital ASIC 36– View, Dimensions & Marking– Delayering, Process Identification– Cross-Section

– 3.4 Mixed-Signal ASIC 48– View, Dimensions & Marking– Delayering, Process Identification– Cross-Section

– 3.5 MEMS Gyroscope 59– View, Dimensions & Marking– Bond Pads & Bond Pads Opening– MEMS Cap Removed– MEMS Sensing Area– MEMS Gyro Principle– MEMS Cross-Section: Structure– MEMS Cross-Section: Masses– MEMS Cross-Section: Electrode– MEMS Cross-Section: Buried Connections– MEMS Cross-Section: Getter

4. Manufacturing Process Flow 96– Global Overview– Digital ASIC Front-End Process & Wafer Fab Unit– Mixed-Signal ASIC Front-End Process & Wafer Fab Unit– MEMS Process Flow & Wafer Fab Unit– Module Assembly Process Flow & Assembly Unit

5. Cost Analysis 119– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– 5.1 Digital ASIC 124

– Front-End Cost– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.2 Mixed-Signal ASIC 129

– Front-End Cost– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.3 MEMS Gyroscope 134

– Front-End Cost– Front-End Cost per process steps– Probe Test & Dicing Cost

– Wafer Cost & Die Cost– 5.4 BOM Cost 143

– Electronic Board BOM Cost– Housing BOM Cost– Material Cost Breakdown

– 5.5 Module Assembly & Test Cost 149– Electronic Board Assembly Cost– Housing Assembly Cost– Final Test & Calibration Cost

– 5.6 Module Cost & Price 157– STIM210 Module Cost– STIM210 Module Estimated Price

Contact 161


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the STIM210 Multi-Axis Gyro Module supplied by Sensonor.

• MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in

term of reliability. They are now accepted in high-reliability environments, and are even starting to

replace FOGs and other technologies in tactical applications.

• With a bias instability of 0.5°/h and 10°/h bias error over the operating temperature range, the

Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is

available without export control (ITAR-free).

• The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit

microcontroller which provides flexibility in device configuration.

• The MEMS gyros are associated with ASIC dies and are mounted on a silicon plate directly

connected to the housing of the module, allowing to reduce the mechanical strain.

• The Sensonor gyroscope dies use a “butterfly” structure with two masses operating in an anti-phase

movement and asymmetric beams allowing them to bend both transversely and laterally.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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44.8mm

Global view of the STIM210 Gyro Module

38.6mm

21

.5m

m


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• The die marking includes:

SWA17C1

E0512X8PCL2

ASIC Die Marking


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• The die marking includes:

IMEGO

ASIC Die Marking


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Sensonor Gyro Process Synthesis


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

s+c_rs152_sensonor_stim210_gyro_module_sample

Documents

frontend cost frontend

manufacturing cost

cost studies

module cost price

module assembly test

structure mems crosssection

electrode mems crosssection

masses mems crosssection