san diego d-36 meeting minutes 02-18-13ipc.org/committee/minutes/d-36_m_1302.pdf · facilities have...

D-36 Subcommittee Meeting Held 18 February 2013San Diego Convention Center in San Diego, CA

Report of the Printed Board Process Capability, Quality, & Relative Reliability (PCQR2) Benchmark Test Standard & Database Subcommittee (D-36)

Gary Long, Intel Corporation, is the chair of this subcommittee. Michael (Mick) Miller, NSWC-Crane, is subcommittee vice-chair.

Minutes prepared by Dave Wolf from Conductor Analysis Technologies, Inc.

Project Background and StatusThis subcommittee is responsible for establishing and maintaining a family of process capability test panel designs and standards for use by the designers, purchasers, assemblers and manufacturers of printed boards.

SUBCOMMITTEE’S PROJECT ACTIVITY PRIOR TO THIS MEETING:Activities that have transpired since the 20 August 2012 meeting held in in Schaumburg, IL include:

1) Updates to the PCQR2 Database have been posted as testing and analysis of submitted test panel sets were completed; last update was on 19 February 2013.

2) Several minor updates of the PCQR2 Comparative Database software application have been sent to subscribers with the most recent being on 25 February 2013.

Summarized Results1) Members who signed the attendance roster at the meeting in San Diego, CA include:

a. Christopher Ryder AT&Sb. Mark Buechner BAE Systemsc. William Dieffenbacher BAE Systemsd. Tim Estes Conductor Analysis Technologies, Inc.e. Ron Rhodes Conductor Analysis Technologies, Inc.f. Dave Wolf Conductor Analysis Technologies, Inc.g. Jose Rios Endicott Interconnect Technologiesh. Benjamin Robertson General Electrici. Tim McKliget Holaday Circuitsj. Patrick O’Keefe Holaday Circuitsk. Mark Northrup IEC Electronics Corporationl. Nicholas Meeker Integrated Reliability Test Systemsm. Gary Long Intel Corporation n. Peter Menuez L-3 Communicationso. Beatriz Bennett Lockheed Martinp. Larry Foster Lockheed Martinq. John Potenza Lockheed Martinr. Gerry Partida Marcel Electronicss. Kelly Daniluk NASA Goddardt. Kathleen Nargi-Toth NCAB Groupu. Al Onderick National Instrumentsv. Ben Quarles Orbotechw. Lance Auer Raytheon Companyx. Gilbert Shelby Raytheon Companyy. Chris Mahanna Robinsan Laboratoryz. Alan Sanborn Teledyne Printed Circuit Technologyaa. James Monarchio TTM Technologiesbb. Michael Hill Viasystems Groupcc. Randy Reed Viasystems Groupdd. Lionel Fullwood WKK Distribution

San Diego D-36 Meeting Minutes_02-18-13.pages 1 of 2

2) Opening Comments and Administrative Items – Gary Long chaired the meeting. People attending the subcommittee meeting were asked to introduce themselves and sign the attendance roster. The proposed agenda (reference slide 2) for the meeting was reviewed.

3) PCQR2 Database Status (Reference presentation slides 3-8) – The total number of active database subscribers currently stands at thirteen (13). Within the last 36 months, 80 different printed board supplier facilities have submitted one or more test panel designs for testing. Since the activation of the database in the fall of 2001, 185 different printed board supplier facilities have submitted one or more sets of test panels for evaluation yielding a grand total of more than 585 sets of test panels evaluated.. There has been an average of 150 submissions recorded in the database over the rolling 36-month comparison period. By geographic region, the submissions over the last 36 months break down as follows: 50% from Greater China; 41% from North America; 5% from Asia/Pacific; and, 4% from Europe, Middle East & Africa (EMEA).

4) New Stacked Via Design (Reference presentation slides 9-11) – Gary Long reviewed the design elements for the IPC-HS-E standardized HDI, any layer, stacked via test panel design that Intel is using to benchmark the process capabilities and limitations of the printed board supplier facilities currently building any layer stacked via designs. The initial benchmark results from the first nine submittals showed the following:a. 0.3mm [12 mil] pitch BGA component capability is not ready for high volume manufacturing;b. 40um [1.6 mil] trace and space not too far from high volume manufacturing;c. 75um [3 mil] drilled vias have issues with reliability;d. Soldermask registration is much worse than expected; and,e. CAF results are very puzzling.

5) Cross-section Photo Technology (Reference presentation slides 12-14) – Chris Mahanna from Robison Laboratory informed the meeting attendees about a new cross-section image capture, photo stitching and delivery technology that his company is now using to show the results of the cross-sections. Robinson Labs performs all of the test panel X1 coupon cross-sections for the PCQR2 Database. Effective with analysis report ID Code M41 and beyond, “zoom.it” links (short “zoom.it” URL’s ) will be embedded in each analysis report in place of the actual photograph clusters. This will greatly reduce the report file size and allow much more user-friendly viewing of the cross-section photos. Two report examples, one from an IPC-6R-E design and the other from an IPC-24VH-E design, were viewed during the meeting.

STAFF ACTION REQUIRED:None at this time.

ACTION ITEMS ASSIGNED AT THIS MEETINGSpecific Action Items Date Due Member(s) Responsible

None at this time

San Diego D-36 Meeting Minutes_02-18-13.pages 2 of 2

D-‐36 Subcommi-ee(PCQR2 Database)

Chairman: Gary Long, Intel

Vice Chair: Mick Miller, NSWC Crane

February 18, 2013

Agenda• IntroducLons• Database status• IPC-‐10HS-‐E benchmark results • Other• Discussion

2

D-‐36 Subcommi-ee• Approved by IPC’s Technical AcLviLes ExecuLve CommiWee in the fall of 2000• Under D-‐30 Rigid Board CommiWee

• On-‐going objecLves• Maintain a family of process capability panel designs

• Maintain a database of printed board suppliers’ capabiliLes

• Maintain the IPC-‐9151 standard

3

By the Numbers• PCQR2 Database acLvated in fall of 2001• 585 sets of panels evaluated• 185 different supplier faciliLes have submiWed one or more sets of panels

• 27 different companies have subscribed• 13 acLve database subscribers today• Rolling 36-‐month comparison period• Average of 150 submissions • Average of 80 faciliLes parLcipaLng

4

Database Subscribers

5

• BAE Systems*• CML EurAsia• Dell Inc.• Enphase Energy• Exelis Inc. (former ITT Electronic Systems)*• General Electric Company• Honeywell InternaLonal Inc.*• IEC Electronics CorporaLon*• Intel CorporaLon• Lockheed MarLn CorporaLon*• NaLonal Instruments CorporaLon• Raytheon CorporaLon*• Sandia NaLonal Laboratories*

* Defense and Aerospace User Group (DAUG)

Supplier Facili>es – Last 36 Months

65

* Par5cipa5ng DAUG supplier facili5es

• Accuris – Kyungg-‐Do, Korea• Amphenol Printed Circuits – Nashua, NH*• AT&S – Leoben, Austria*• AT&S – Nanjangud, India• AT&S – Shanghai, China • BoardTek Electronics – Tao Yuan, Taiwan• Broadteam Electronics – Guangzhou, China• Broad Technology – Guangzhou, China• Champion Asia Electronics – Huizhou, China• CompuneLcs – Monroeville, PA• Corad Electronics Technology – Zhuhai, China• Cosmotronic – Irvine, CA*• Delton Technology – Guangzhou, China• Dongguan Somacis Graphic PCB – Dongguan, China• Dynamic and Proto Circuits – Stoney Creek, ON• DYnamic Electronics – Tao Yuan, Taiwan• Eagle Circuits – Dallas, TX• Elec & Eltek – Guangzhou, China• Elec & Eltek – Kai Ping, China• Electrotek – Oak Creek, WI • Ellington Electronics Technology – Zhongshan, China• EndicoW Interconnect Technologies – EndicoW, NY*• Fastprint Circuit Tech – Guangzhou, China• Foxconn Technology Group – HuaiAn, China• FTG Circuits – Chatsworth, CA*• FTG Circuits – Scarborough, ON* • Gainbase PCB – Shenzhen, China• GBM (Chuan Yi Computer) – Shenzhen, China• Global (Triangle) Circuits – Oakmont, PA • Gold Circuit Electronics – Chung Li, Taiwan • Gold Circuit Electronics – Suzhou, China

• Golden Shine Electronics – Weng Cheng, China• Gorilla Circuits – San Jose, CA*• Hannstar Precision Technology – Jiang Yin, China• Harbor Electronics – Santa Clara, CA• Holaday Circuits – Minnetonka, MN*• Integrated Test – Dallas, TX• KCA Electronics – Anaheim, CA*• Kwang Myung Circuit – Incheon, South Korea• Lenthor Engineering – Milpitas, CA*• Marcel Electronics InternaLonal – Orange, CA*• Meiko Electronics – Wuhan, China• Molex/Copper Flex Products – St. Paul, MN*• Multek (B3) – Zhuhai, China• Multek (B5) – Zhuhai, China • Nan Ya PCB – Tao Yuan, China • Olympic Country – Heshan, China• Onpress Printed Circuits – Heshan, China• Printed Circuits – Minneapolis, MN*• Real Time Focus Technology – Tao Yuan, Taiwan• Samsung Electro-‐Mechanics – Suwon, South Korea• Sanmina-‐SCI – San Jose, CA*• Sanmina-‐SCI – Singapore • Shennan Circuits (Longgang) – Shenzhen, China• Shennan Circuits (Nanshan) – Shenzhen, China*• Suntak MulLlayer PCB – Shenzhen, China• Synergie CAD – Carros, France• Techwise Circuits (Fogan TSF) – Qingyuan, China• Topsearch Printed Circuits – Shenzhen, China• Tripod Technology – Wuxi City, China• TTM Technologies – Santa Ana, CA*• TTM Technologies – Santa Clara, CA*

• TTM-‐Meadville Group (GME) – Guangzhou, China• TTM-‐Meadville Group (OPC) – Tai Po, Hong Kong• TTM-‐Meadville Group (SME) – Shanghai, China • Unicircuit – LiWleton, CO • Unimicron – Tao Yuan, Taiwan• Viasystems Group (Merix) – Forest Grove, OR*• Viasystems Group (Merix) – Huizhou, China• Viasystems Group (DDi Global) – Anaheim, CA*• Viasystems Group (DDi Global) – Cuyahoga Falls, OH*• Viasystems Group (DDi Global) – LiWleton, CO*• Viasystems Group (DDi Global) – Milpitas, CA*• Viasystems Group (DDi Global) – North Jackson, OH* Viasystems Group (DDi Global) – Sterling, VA*

• Viasystems Group (DDi Global) – Toronto, ON*• Westak – Forest Grove, OR • Westak – Sunnyvale, CA• Zhen Ding Technologies – Shenzhen, China

Database Submissions by Region

7

4%

50%

5%

41%North AmericaAsia/PacificGreater ChinaEurope, Middle East & Africa

Design Library

8

• Rigid board• Layers: 2, 4, 6, 10, 14 & 18• Panel size: 18 x 24 inches

• Via board• Layers: 14 & 24• Technologies: medium & high• LaminaLons: 2• Panel size: 18 x 24 inches

• High density interconnect (HDI)• Layers: 10; Type III microvia construcLon• Build-‐up 2+6+2; panel size 18 x 24 inches• Any layer stacked via 4+2+4; panel size 14 x 18 inches

IPC-‐10HS-‐E Stacked Via Design

9

IPC-‐10HS-‐E Panel Map

10

IPC-‐10HS-‐E Benchmark Results• Industry summary based on 9 submiWals• 0.3mm [12 mil] pitch capability is not ready for HVM

• 40um [1.6 mil] trace and space not too far from HVM

• 75um [3 mil] via issue with reliability• Soldermask registraLon much worse than expected

• CAF results very puzzling

11

Cross-‐sec>on Photo Technology

12

Printed Circuit Process Capability, Quality, and Relative Reliability

R

Submission Code: M42 Copyright © 1994−2013 Conductor Analysis Technologies, Inc., All Rights Reserved. February 18, 2013

Section Contents

Cross-Section Photos (X1 Coupon) View

Panel 3, Grind A ........................................................................................................................................................................................................................ zoom.it

Panel 3, Grind B ........................................................................................................................................................................................................................ zoom.it


Panel 4, Grind B ........................................................................................................................................................................................................................ zoom.it



Panel 12, Grind A ...................................................................................................................................................................................................................... zoom.it

Panel 12, Grind B ...................................................................................................................................................................................................................... zoom.it


Cross−section photos provided by Robisan Laboratory, Inc.: www.robisan.com

http://zoom.it/NhmS

http://zoom.it/GJqq

http://zoom.it/p8DA

http://zoom.it/gw8u

http://zoom.it/sVlm

http://zoom.it/GOYA

http://zoom.it/jxUg

http://zoom.it/Ayv4

http://zoom.it/Paf3

Printed Circuit Process Capability, Quality, and Relative Reliability

R

Submission Code: N2 Preliminary Copyright © 1994−2013 Conductor Analysis Technologies, Inc., All Rights Reserved. February 9, 2013

Section Contents

Cross-Section Photos (X1 Coupon) View







Cross−section photos provided by Robisan Laboratory, Inc.: www.robisan.com

http://zoom.it/jShD

http://zoom.it/DwLu

http://zoom.it/dfLD

http://zoom.it/8D4F

http://zoom.it/8D4F

http://zoom.it/7hJz

Discussion•Come visit us in PCQR2 Booth #1744

13

san diego d-36 meeting minutes 02-18-13ipc.org/committee/minutes/d-36_m_1302.pdf · facilities have...

Documents