samsung_analyst_day_lsi_6.pdf
DESCRIPTION
The sixth of seven slide decks from Samsung's Analyst Day 2013, this deck discusses Samsung's LSI unit, which makes chips for Samsung's Galaxy line and the iPhone, among other devices.TRANSCRIPT
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Samsung System LSI Business
NS (Stephen) Woo, Ph.D. President & GM of System LSI
Samsung Electronics
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Disclaimer
The materials in this report include forward -looking statements which can generally be identified by phrases such as Samsung
Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or
phrases of similar implications . Similarly, such statements that describe the company's business strategy, outlook, objectives,
plans, intentions or goals are also forward -looking statements. All such statements are subject to certain risks and uncertainties
that could cause actual results to differ materially from those in the presentation files above.
For us, particular uncertainties which could adversely or positively affect our future results include:
prices
IM (IT & Mobile communications), DS (Device Solutions)
results
These uncertainties may cause our actual results to be materially different from those expressed in this report.
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System Semiconductor Industry
Samsung System LSI : Now
Looking Forward
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Market of Mobile Device
2012 2013 2014(E) 2015(E)
0.3
0.5
0.5
0.5
0.6
0.6
0.7
0.7
* Source : Gartner, Strategy Analytics, 2013 3Q
Premium Mid + Low
(billion units)
0.8
1.0
1.2 1.3
Smartphone
9%
22%
* Source : Gartner, 2013 3Q
(billion units)
2012 2013 2014(E) 2015(E)
0.1
0.2
0.3
0.4
0.07
0.05
0.06
0.12
0.07
0.19
0.09
0.26
Premium Mid + Low
Tablet
25%
58%
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Computing Power
Com
putin
g/B
andw
idth
New applications require higher computing/bandwidth
Resolution
Single Camcording
1080p Video
Dual Camcording
Web browsing
Location Based Service
Voice Command
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Display Trend
Higher resolution
HD-class Display
FHD-class Display
WQHD (2,560x1,440)
HD (1,280x720)
UHD (3,840x2,160)
Re
solu
tio
n
2011 2013 2015(E)
FHD (1,920x1,080)
Display
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Camera Sensor Trend
Image quality enhancement is also improving
Face Detection
2009 2011 2013 2007 2015(E)
3Mp
8Mp
13Mp
Re
solu
tio
n
5Mp
16Mp
20Mp
Face Detection
Wide Dynamic Range
Image Stabilization
Camera Sensor
Wide Dynamic Range
Image stabilization
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System Semiconductor Industry
Samsung System LSI : Now
Looking Forward
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Three business areas
AP Connectivity
SOC
Image Sensor Display Driver IC Smart Card IC Power Management IC
LSI
Foundry
Foundry
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vt
Product Portfolio
WiFi/BT GPS
Smartphone
IoT
Powerful CPU/GPU
Low Power Camera Sensor
Pixel Leadership
Slim Solution
Low Power Consumption
High Density e-SE Module NFC
SIM
Full line up for next FHD
Lower Power solution
Fast Speed (New Architecture) T-con
eDRAM
Backlight control
Display Driver IC
T-Con
PMIC Power
Sequence Control
& I2C Interface
PMIC line: AP & OLED
High Efficiency
High Accuracy
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1. AP (Application Processor)
Focusing on high performance with low power consumption
Game changing technology :
big.LITTLE octa core
big LITTLE
CPU Leadership
Richer 3D graphics with
Energy efficiency
Powerful GPU
Advanced mobile process &
design methodologies
Low Power
Low High
Low High
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Computing Power
*DMIPS : Dhrystone Million Instructions Per Second
2009 2010 2011 2008
10,000
20,000
30,000
(DMIPS)
2012 2013
* Source : Samsung Electronics Co., Ltd., ARM
Cortex-A8 1.0GHz
ARM11 800MHz
Cortex-A9 Dual 1.2GHz
Cortex-A9 Quad 1.4GHz
Cortex-A15 2.xGHz
Cortex-A15 Octa 1.6GHz
Has been leading AP industry since 2009
Innovation in both Architecture & Silicon Technology
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Heterogeneous architecture for energy efficiency
big.LITTLE Architecture
Best of both worlds: high performance and low energy
1 2
3 4
1 2
3 4
big C-A15
LITTLE C-A7
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big.LITTLE Architecture
20% gain at performance and energy, respectively
+ 20%
Higher is Better
big.LITTLE Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
*Conventional : big CPU only
Performance
-15 ~ 20%
Lower is Better
big.LITTLE Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
Energy
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Advanced Silicon Process
Process Node
Vdd 90/65nm
Strained Si
45nm
ULK
32nm
1st Gen HK/MG
20nmm
1st Gate Last HK/MG
1.2V
1.1V
1.0V
0.9V 0.8V
0.7V
10nm
2nd Gen FinFET
14nm
1st Gen FinFET
*Vdd : Supplying voltage of drain
28nm
2nd Gen HK/MG
1.0V
2014(E) 2013 2012 2010 2006, 2009
Leadership in low-power, advanced silicon process
* Source : Samsung Electronics Co., Ltd.