samsung 3d v-nand 92-layer memory · 2019-09-23 · laboratory analysis by véronique le troadec...
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©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 1
22 Bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Samsung 3D V-NAND 92-Layer MemoryFifth generation 3D NAND memory chip reveals Samsung’s latest memory technology and fabrication methods.
SP19489 - MEMORY report by Belinda DubeLaboratory Analysis by Véronique LE TROADEC
September 2019 - Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Samsung
Market Analysis 12
o NAND Flash Market Revenue
o NAND Market Shipments
o Samsung NAND Flash RoadMap
Physical Analysis 16
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o 970 EVO Plus SSD Teardown
o Package
Package Views & Dimensions
o Memory Die
View, Dimensions & Marking
Cross-Section
Contacts and Metallization
o 3D NAND Patents
Physical Comparison (64 Layer Vs 92Layer V-NAND) 55
o Comparison Generation 5 92-layer and Generation 4 64-layer
Manufacturing Process Flow 60
o Global Overview
o Memory 3D 92 LayerFab Unit
o Memory 3D 92 Layer Process Flow
Cost Analysis 71
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Memory 3D 92 Layer
Memory Front-End Cost
Memory Front-End Cost per process steps
o Process Steps
o Component
Bonding Front-End Cost
Memory Wafer & Die Cost
Back-End : Final Test Cost
Memory 3D 92 Layer Component Cost
Estimated Price Analysis 88
Feedback 91
Company services 93
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Executive Summary
The new technology era has a huge impact on Non-Volatile Memory (NVM), demanding memories with faster speed
and higher storage capacity. Manufacturers have therefore channeled investment into the development of new NVMs
with more memory cells in a single chip.
Samsung continues to dominate the semiconductor industry, including the memory industry, as shown by the
magnificent $22 billion revenue in 2018 generated by its NAND memory business. Its manufacturing techniques change
from one generation to another to produce reliable memory chips with higher capacity.
This report presents a detailed technology study of the latest Samsung 3D Vertical-NAND memory made with 92-Layer
word lines. Thanks to high quality optical images and high-resolution scanning electron microscope (SEM) images, the
physical analysis shows details of die cross sections, including material identification. The report includes a detailed
process to better understand the major fabrication steps. It also includes a cost estimation of producing Samsung’s
new generation 3D NAND chips and the packaging cost.
Finally, this report features a comparison of Samsung’s previous NVM generation with the latest generation. This
identifies the different and similar features in the two generations, and compares the fabrication cost and the impact of
the added layers.
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 4
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Packaging
Package Cross Section©2019 by System Plus Consulting
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 5
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Logic Area : Transistor Technology
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 6
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Vertical NAND Cell
Vertical Cell structure –SEM©2019 by System Plus Consulting
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 7
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Charge Trap Flash
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 8
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
CTF NAND Cell
Cell structure WANOS Region –SEM©2019 by System Plus Consulting
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 9
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Cross Section- Staircase
©2019 by System Plus Consulting
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 10
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Cross Section- Metal Contacts
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 11
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
NAND Memory Circuit Diagram
Cross Section-SEM©2019 by System Plus Consulting
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 12
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Physical Analysis Comparison Gen 4 vs Gen 5
• The 5th generation V-NAND Dies are more dense than Gen4 dies.• Memory Array efficiency is higher for 5th generation dies. (NAND active area occupies less space on the die.)
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 13
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis o Synthesiso 970 EVO Plus TearDowno Packageo Memory Die
o Patent Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Gen 5- 92 layer NAND vs Gen 4- 64 layer NAND
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 14
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flowo Global Overviewo Driver Front-End Processo Memory Process
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
Bit Line Formation and Contact Formation
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 15
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Yieldso Driver Wafer & Die Costo Memory Wafer & Die
Costo Package Costo Final Costo Component Costo Cost per GB
Selling Price Analysis
Related Reports
About System Plus
Memory Wafer & Die Cost
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 16
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Yieldso Driver Wafer & Die Costo Memory Wafer & Die
Costo Package Costo Final Costo Component Costo Cost per GB
Selling Price Analysis
Related Reports
About System Plus
Component Cost
©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 17
Overview / Introduction
Company Profile
Market Analysis
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Related Reports
About System Plus
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMORY• NAND Service – Memory Research• Status of the Memory Industry 2019• Emerging Non-Volatile Memory 2018• MRAM Technology and Business 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMORY• Leading-edge 3D NAND Memory Comparison 2018• Toshiba Sandisk 64 Layers 3D NAND Memory
Related Reports
The new technology era has a huge
impact on Non-Volatile Memory (NVM),
demanding memories with faster speed
and higher storage capacity.
Manufacturers have therefore channeled
investment into the development of new
NVMs with more memory cells in a single
chip.
Samsung continues to dominate the
semiconductor industry, including the
memory industry, as shown by the
magnificent $22 billion revenue in 2018
generated by its NAND memory business.
Its manufacturing techniques change from
one generation to another to produce
reliable memory chips with higher
capacity.
This report presents a detailed technology
study of the latest Samsung 3D Vertical-
NAND memory made with 92-Layer word
lines. Thanks to high quality optical
images and high-resolution scanning
electron microscope (SEM) images, the
physical analysis shows details of die cross
sections, including material identification.
The report includes a detailed process to
better understand the major fabrication
steps. It also includes a cost estimation of
producing Samsung’s new generation 3D
NAND chips and the packaging cost.
Finally, this report features a comparison
of Samsung’s previous NVM generation
with the latest generation. This identifies
the different and similar features in the
two generations, and compares the
fabrication cost and the impact of the
added layers.
COMPLETE TEARDOWN WITH
• Detailed optical and SEM photos and
cross-sections
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply chain evaluation
• Manufacturing cost analysis
• Comparison of 92-layer with 64-layer
V-NAND
• Estimated sales price
Fifth generation 3D NAND memory chip reveals Samsung’s latest memorytechnology and fabrication methods.
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Title: Samsung 3D V-NAND 92-Layer Memory
Pages: 100
Date: September 2019
Format: PDF & Excel file
Price: EUR 3,990
Samsung 3D V-NAND 92-Layer Memory
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - MEMORY - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary
• Reverse Costing Methodology
Samsung Company Profile
Market Analysis
• NAND Flash Market Revenue
• NAND Market Shipments
• Samsung NAND Flash RoadMap
Physical Analysis
• Synthesis of the Physical Analysis
• Physical Analysis Methodology
• 970 EVO Plus SSD Teardown
• Package View and Dimensions
• Memory Die
View, dimensions & marking
Cross-section
Contacts and metallization
• 3D NAND Patents
Manufacturing Process Flow
• Overview
AUTHORS
• Fab Unit
• Process Flow
Cost Analysis
• Summary of the Cost Analysis
• Yields Explanation & Hypotheses
• Memory 3D 92-Layer
Memory front-end cost
Memory front-end cost per process steps
• Process Steps
• Component
Bonding front-end cost
Memory wafer & die cost
Back-end: Final test cost
Memory 3D 92-layer component cost
Selling Price
Comparison between Samsung 92-Layer and 64-Layer V-NAND
SAMSUNG 3D V-NAND 92-LAYER MEMORY
RELATED REPORTS
Leading-edge 3D NAND Memory Comparison 2018A deep technology analysis and cost comparison report on cutting edge 3D NAND memory chips from Toshiba/SanDisk, Samsung, SK Hynix and Intel/Micron.December 2018 - EUR 4,990*
Toshiba SanDisk 64 Layers 3D NAND MemoryThe latest 3D NAND Flash memory produced by Toshiba and SanDisk for the IPhone X.November 2018 - EUR 3,990*
NAND Service –Memory ResearchNAND market downturn continues into early 2019, with recovery expected in the second half.June 2019 - EUR 30,000*
Belinda Dube is working for SystemPlus Consulting as Analyst inSemiconductor Memories andIntegrated Circuits. She holds aMasters degree in Nano Scienceand Nanotechnologies from EcoleCentral Lyon and INSA Lyon.
Véronique Le Troadec has joinedSystem Plus Consulting as alaboratory engineer. Coming fromAtmel Nantes, she has extensiveknowledge in failure analysis ofcomponents and in deprocessing ofintegrated circuits.
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©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 18
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©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 19
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©2019 by System Plus Consulting | Samsung 3D V-NAND 92-Layer Memory | Sample 20
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Selling Price Analysis
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