ma k i n g i n n o v a t i o n   h a p p e n ,   t o g e t h e r

SAES  Packaging  service

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MEMS Packaging service descriptionFacility and operationsCapabilities and future prospective

Choose your type of service : Fast prototypingProcess developmentsPackaging foundry service

Add‐on servicesRGA (Residual Gas Analysis)Outgassing Leak rate measurements 

Conclusions

Agenda

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SAES Packaging Service description

MEMS discrete (die‐level) vacuum packaging Ceramic packaging Metal packaging

Getter integrationGetter film deposition and pattering

Sealing methodsAu/Sn eutecticGlass frit soldering

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Facilities and operations

Equipment Independent outgassing/forming gas systemHigh vacuum sealing furnace Independent heating systemsRapid thermal annealing

OperationsClass 100 clean room High ThroughputFlexible sealing recipes

TestingUltrasonic microscope bonding line integrity testLeak rate measurements

Temperature: up to 1100°CHeated plates, up to 450 x 450 mmFast ramping of plate • Ramp up at > 3.5°C/second • Ramp down at > 2°C/second100 steps per programUltimate Vacuum: ~ 7 x 10‐7mbarHigh pressure atmosphere: up to 3 bar (abs)

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Capabilities and future prospectiveCurrent achievements :

Final packaging pressure down to 10‐3 – 10‐4 mbar range with getter integrationHermeticity level < 10‐16 mbar l /sFast sealing processDie attach materials selections

Future available services :Die attachWire bonding

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Choose your type of service

SAES is offering : 

Fast prototypingProcess developmentsPackaging foundry service

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Fast prototyping

Need prototypes quickly?Here are the steps SAES follows:

Review packaging drawings and requirements Develop tools  Perform bonding trials on empty packages Perform bonding on first prototypes Complete tests and characterizations

In a reasonably short time we can make your first prototypes a thing of realityNeed more fast?  We can do that!We can provide effective and robust solutions 

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Process developments

Step by step process developmentDiscussion and definition of the project goalsMaterial selections and analysisGetter integrationPreliminary packaging experimentsRecipe definition and testingRecipe improvementsTests on repeatabilityCpK definition and key control parameters

Process installationTests and fine tuning

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Packaging foundry service

High throughput capability Competitive costsFast delivery

Packaging components provided by customer :Ceramic container with die attached and wire bonded MEMSAu plated Kovar lidAu‐Sn Bonding preform 

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Add‐on services

SAES also offers:

RGA (Residual Gas Analysis)Outgassing testsLeak rate measurements 

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RGA

MEMS samples with internal volume down to nano liter rangeAnalysis sensitivity 10‐6 cc mbarTotal pressure and gas compositionService capability :

Two samples per dayStandard lead time 4 weeksFast lead time : 1 week

Q Factor (measured) 3000

Q Factor (calculated) 3220

Gas Pressure (mbar) Composition

H2 7.92E-01 81.7%CH4 8.92E-02 9.2%H2O 9.70E-04 0.1%CO 5.53E-02 5.7%N2 1.55E-02 1.6%

C2H6 5.82E-03 0.6%C3H8 7.76E-03 0.8%CO2 1.94E-03 0.2%

Noble gases (He,Ar,etc...) 7.76E-04 0.1%

Total 9.70E-01 100.0%

Mean Viscosity (10-5 Pa s)

0.984

Sample 1

Without getter

Q Factor (measured) 500000

Q Factor (calculated) 1.40E+07

Gas Pressure (mbar) Composition

H2

CH4 3.92E-05 9.8%H2O 2.28E-05 5.7%CON2

C2H6 1.52E-05 3.8%C3H8 3.36E-05 8.4%CO2

Noble gases (He,Ar,etc...) 2.89E-04 72.3%

Total 4.00E-04 100.0%

Mean Viscosity (10-5 Pa s)

1.911

Sample 5

With getter

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Outgassing testsMaterial studies on outgassing propertiesMaterial vacuum compatibility assessmentsMaterial selections Material comparisons

Service capability :Max sample size of 1”Max temperature treatment is 800°C

Methods :Static outgassing

to measure the outgassing rate from metals, glasses, ceramics, and other materials which release a relatively low amount of gas

Dynamic outgassingis very useful to make measurements on plastics, foams and other materials which show a high amount of gas evolved and mainly outgas water vapor

0 20 40 60 80 100 120 140 160 180

0

50

100

150

200

250

300

350

400

450

Bonding: 370 °C x 5 min

330 °C x 12 min

400 °C x 60 min

200 °C x 60 min

Tem

pera

ture

(°C

)Time (min)

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Leak rate measurementsThe detection and measurement of very small leaks is a key factor for the assessment of device lifetime

The method is able to :establish whether the device is affected by a leak or not quantitatively measure the leak rate

Service capabilities : Sensitivity : the minimum detectable air leak rate is about 1x10‐16 mbar l/s. Whenever the leak rate is close to the system sensitivity an upper limit will be providedStandard lead time: 4 weeks Fast service lead time : 2 weeks

ExampleTests performed on inertial sensors The producer observed Q‐factor degradation with time for some devices

Pa·m3/s Torr·l/sUltra fine < 1.0E-13 1.0E-14 7.5E-14Super fine < 1.0E-10 1.0E-11 7.5E-11Extra fine < 1.0E-08 1.0E-09 7.5E-09

Fine < 1.0E-06 1.0E-07 7.5E-07Moderate < 1.0E-04 1.0E-05 7.5E-05

Gross > 1.0E-04 1.0E-05 7.5E-05

mbar·l/s

Air leak rate

Device AccelerometerInitial presure 0.01 mbarTarget pressure 0.1 mbarVolume 0.1 mm3

PaGe® surface 2 mm2

Internal surface outgassing is neglected

No getter With getterMeasured

air leak rate (mbar·l/s)< 3.0E-16 10 y >30 y6.6E-16 4.8 y >30 y2.0E-14 57 days 15 y7.5E-14 15 days 4.2 y

Time to exceed 10 x target pressure

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Conclusions

Competitive advantages of SAES’ MEMS die packaging service

High vacuum encapsulationGetter integration for long term stabilityFlexibilityFast responseCompetitive costsEngineering capabilities 

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