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ROYCE HIGH TEMPERATURE PERFORMANCE

EPOXY RESIN SYSTEMS

Royce International offers a number of epoxy resin systems derived from aromatic

amines. These compositions, which have a high glass transition temperature (Tg) oncuring, are suitable for formulating adhesives, potting compounds, filament windingsystems and making prepregs.

RoyOxy RAR 921

RoyOxy RAR 921 is the tetra-glycidyl derivative of methylene dianiline, also known asTGDDM (tetra-glycidyl diaminodiphenyl methane) having the following structure:

RoyOxy RAR 921 epoxy resin in combination with RoyOxy RAC 9910 epoxy curingagent is used to formulate prepregs mainly used in the aerospace industry. The curedprepreg has a Tg of 2400C.

RoyOxy RAR 921 can also be used with anhydride hardeners like Nadic methyl

anhydride (NMA), hexahydrophthalic anhydride (HHPA) and methyl tetrahydrophthalicanhydride (MTHPA) or with an aromatic amine hardener, diethyl toluene diamine(DETDA) for filament winding. A Tg up to 2350C is obtainable with the latter system.

RoyOxy RAR 922

RoyOxy RAR 922 epoxy resin is the tetra-glycidyl derivative of o,o-diethyl methylenedianiline represented by the formula:

Although this resin does not give quite as high a glass transition temperature as RoyOxyRAR 921, its lower viscosity of 9000-11000 cp at 250C is an advantage, especially in

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potting and encapsulating compounds. It is recommended with anhydride epoxy curingagents as well as with RoyOxy RAC 9915 epoxy curing agent in formulating castingresin systems for submersible and tooling applications and for high radiation resistant

components.

RoyOxy RAD 104

RoyOxy RAD 104 is diglycidyl aniline.

RoyOxy RAD 104 has a low viscosity of 100-200 cP and is used as a reactive diluentparticularly in those applications where a minimal sacrifice of heat deflection temperatureis called for. A blend of RoyOxy RAR 921 and RoyOxy RAD 104 epoxy diluent in theratio 75:25, cured with RoyOxy RAC 9923 epoxy curing agent (aromatic-aliphaticamine blend) gives a Tg as high as 1960C.

RoyOxy BMI11

RoyOxy BMI 11 is a bismaleimide resin usually cured with o,o-diallyl bisphenol-A. The

resin and curing agent have the structures below:

4,4-Bismaleimidodiphenylmethane

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oo-Diallyl Bisphenol A

The properties of this bismaleimide system are:

Outstanding heat resistance with a Tg as high as 3100C

Good toughnessVery high resistance to waterProcessability by hot melt

The main application of this resin system is in advanced composite structures mainly foraerospace. However, it can be used for structural adhesives and specialty coatings aswell.