ronald gd davis resume 7-7-15
TRANSCRIPT
Professional Experience:10/2009–Present
Vavni:
Cisco CRS-3 Optical Router – See page 3. Pass NEBS, Zone 4, Regulatory Compliance Canara UPS Battery cabinet, 5,500 lb Passed Zone 4 Seismic, ETL / Regulatory. Value engineering evaluation for Cisco APEX-10 Value engineering button (feel) study for Avid M-Wave Wireless Injection molded antenna enclosures, hermetic. Cisco Panini CPAK CPX Line Card test fixture with articulating arms.
1/2004 – 11/2009SGI / Rackable Systems:
Full Depth Severs, 1U, 2U,3U and 5U Chassis Half Depth Servers, four 1U, 2U, two 4U Cabinets, two 24U, 36U, 40U, 44U, 48U Cloudrack, 24U and 42U Data Center in a ISO 45” Container 6 Power Distribution Units Octane III Super Computer
6/2002 - 12/2004AMD:
First Quad Processor platform, Quartet 4U 2U Quad Processor Platform, Warthog
1/2002 - 3/2002Appro International - Cray : (Design Consultant)
2U 12 HDD Full Depth Chassis
8/2000 - 3/2001VA Linux Systems:
First dual processor AMD Athelon MP, 1U 4 HDD
3/1999 - 7/2000Acorn Product Development:
Dell 1U 1550 Server 1 Gateway 3U server Netgear 20U Router Force10 20U Optical Router Brightlink 20 Optical Router
1988 - 1999Trimble Navigation:
Seven Ruggedized GPS Products (Ag122, 4700.. ) 1 Patent on GPS base station fast initialization. Ruggedized cabling - high pull strengths, met demanding outdoor conditions. Standardized on
Santoprene jackets and overmolds for abrasion, chaffing, and chemical resistance in cabling.
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Ronald Davis Lead Product Designer
4779 Quadres Ct. E-Mail [email protected]
Fremont, Ca. 94538 Phone (510) 459-8795
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Professional Skills:
Pro/E CREO v2, solids, surfacing, sheet metal, detail, advanced assembly 22 Yrs Pro/Mechanica cantilever beam design Windchill / PDMLink. Expert at import and export from PDMLink ECAD / IDF / PCA layout Top Down Design Methodology Systems Development and Architecture Design for Manufacturing Designed for Regulatory, Compliance, EMC, NEBS, Etc.. Statistical Tolerance Analysis AutoCAD Microsoft Office Adobe Illustrator 6 Years US Navy with Honorable Discharge FCC General Class Ham Radio Certified, KK6AFE
My Linkedin Profile - Click HereMy Paper on Top Down Design
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Ronald Davis Lead Product Designer
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Ronald Davis Lead Product Designer
Anatom
y of a Full Rack System
D
esign
4779 Quadres Ct. E-Mail [email protected]
Fremont, Ca. 94538 Phone (510) 459-8795
Page 4 of 4 4/15/2023Page 3 of 3
As the Lead Architect I had the following responsibilities and objectives.
Responsibilities:
1. Create top down design approach to diakoptically break down the structure tois simplest elements.
2. Create a set of Datum’s to control Sub-Assembly Placement. 3. Reduce the size of Mid-Plain and revise the power connections for blind-mate
and low insertion forces. 4. Created ECAD IDF’s imports / exports for the control of connector position and
various other alignments. 5. Created new double insulated UL approved system bus bars which reduce the
cost of the previous bus bars by $14,000 per system.6. Redesign the Line card & Fabric card cages for better EMC function using tiger
teeth finger stock sandwich between sheet metal elements.7. Redesign the Fantray’s to use higher flow fans. Created UL approved double
insulated bus bars to connect to the fan controller. 8. Fixed NEBS compliance issue with system filter. Added a second filter so the
system stays operational without contaminated the system with a filter swap.9. Created naming conventions to aid in assembly of a number of components to
simplify assemble and reduce manufacturing costs. 10. Revised Cosmetics Plastic components for the new system requirements. 11. Used only native Pro/E parts and assemblies when possible to reduce the
memory required to load the assembly. 12. Responsible for maintaining a viable copy of the master models and drawing
within Windchill no Ghost parts and assemblies. 13. Identified mating force issue with the 10mm Radsok Power connectors.
Design Objectives:
1. Reduce the cost of the carrier class optical router, CRS-3. 2. Improve EMC shielding for 200G and 400G follow on Line Cards.3. Reduce complications at the base of the structure while improving stiffness.4. Improve Line Card Cage stiffness (reduce sag in the center of the card cage).5. Improve EMC capabilities for upcoming 200G / 400G Line Cards.6. Decrease assembly time / Reduce manufacturing cost.7. Lower the cost for 2 bus bar assemblies.8. Improve field serviceability of inlet filter.9. Revised the shipping container.
I was involved with all the DFx and changes which followed all phases of the project including EVT, MDVT testing. I was asked to stay an additional 6 months, as an individual contributor, after the final release of the product to handle any issues which cropped up after the final release to production.
4779 Quadres Ct. E-Mail [email protected]
Fremont, Ca. 94538 Phone (510) 459-8795