role of conventional silicon ics in flexible electronics

© 2013 American Semiconductor Inc. All Rights Reserved.

Role of Conventional Silicon ICs in Flexible Electronics

Authors: Douglas R. Hackler Sr., Richard L. Chaney, Dale G. Wilson


The Flexible problem is a Silicon Opportunity

Problem: No ICs = No Flexible Electronic Features Conventional ICs have the needed features, but are brittle and require assembly methods that are incompatible with printed manufacturing. Thin Film Transistors (TFT) cannot provide the needed performance or density.

Opportunity

Flexible electronics offers a whole new world in electronic product designs and markets. If we can apply semiconductor industry design and infrastructure, we can leverage and reuse silicon in new markets.

2


The Flexible problem is a Silicon Opportunity

The FleX™ technology presented today shows how standard CMOS foundry wafer processing

can be applied to flexible systems.

3


Flexible Electronic Products and Services Provider

4

Corporate Headquarters – Boise, ID

Engineering – Design, Process, Modeling

FleX™ Silicon-on-Polymer™ mfg and assembly

Test & Characterization Cleanroom

Sales, Marketing, Administration

Process engineering center – Santa Clara, CA

Manufacturing – pilot SoP operations

Small Business

Privately Held

Founded November, 2001

Product Lines

FleX – Silicon-on-Polymer

Design Services – Turnkey Design Solutions

2007 Supplier of the Year


Flexible CMOS (2009 - 2012)

Electrical Testing

Proof-of-Concept

Functional CMOS

Today (July 2013)

CS18/13

Functional Devices

Initial Production Volume Production

Process Qual

Functional CMOS

Production

Custom Process

Flexfet Process

Qualified Foundry Process

FleX Silicon-On-Polymer Foundry Roadmap

Process Qual

Production

FleX: Transparently Thin Functional CMOS

Burghartz “Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology,” IEEE 2009

Organic Thin Film Transistors

101

100

10-1

10-2

10-3

10-4

10-5

10-6

1 10 100

Tim

e d

elay

per

sta

ge (

s)

Orders of magnitude faster, at lower

voltage!

complementary circuits

n-channel circuits

p-channel circuits

PEALD ZnO TFTsElectron Devices, Feb. 2010

Supply Voltage (V) 10 10010.11.0E-12

1.0E-11

1.0E-10

1.0E-9

1.0E-8

1.0E-7

1.0E-6

1.0E-5

1.0E-4

1.0E-3

1.0E-2

1.0E-1

1.0E+00

1.0E+01

FleX CMOSFeb. 2011

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Relevant Markets and Opportunities

Printed ElectronicsLow Cost, R2R, Large Format

Antenna

Pressure Sensor

Strain Gauge

Flexible FleX ICsHigh Performance, High Density

Flexible Hybrid System (FHS)“Combination of flexible printed materials and flexible silicon-based ICs to create a new class of flexible electronics.”

ADCµCtrl

LNA

Data Bus

Automotive/Aerospace:ConformalStructural IntegrationSensorsFly-by-FeelRugged & Durable

Smart Cards:SIM/PIV/CIV IdentityFinanceContacted Contactless

Consumer:Tablets PhoneseReaderUltra-thinFlexible

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CS18 PMOS Top, NMOS BottomFull Thickness data in red; FleX data in blue

FleX Option for Jazz CS18/13

Jazz CS18-FleX is the industry’s first commercially available flexible CMOS foundry process

Characterization of CS18 in FleX is underway

First wafers show excellent mechanical properties

DC data pre- and post-FleX show no shift in transistor performance

RF FleX testing shows good initial results

Initial characterization data will provide a preliminary CS18-FleX PDK for prototyping

Rich [email protected]

Jazz CS18 postFleX™ processing

Mike [email protected]

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FleX Option for Jazz CS18/13

• Jazz CS18/CS13 (180/130nm) SOI CMOS – Partially depleted thin SOI process

– Floating body & body contacted devices

– 2fF/um2 MIM Capacitor

– Low and high value salicided poly resistors

– Four Al metal levels with 3um thick top metal

• Process Design Kits available for both Cadence and Silvaco based EDA flows

• Design libraries and reusable IP are in development

• Regular multi-project wafer (MPW) wafer lots provide low cost options for manufacturing test chips, prototypes and key IP building blocks

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FleX-IC Product Roadmap

9

Printed ElectronicsLow Cost, R2R, Large Format

Flexible Hybrid System“Combination of flexible printed materials and flexible silicon-based ICs to create a new class of flexible electronics.”

Antenna

Printed Sensor

Printed Sensor

ADCMCU

LNA

Data Bus

FleX-MCU™ 8-bit RISC, 1.2V core, 2.5V I/O, UART, I2C, SPISampling early Q4‘13

FleX-MCU™ With FleX-ADC and FleX-RFIC onboard

FleX-ADC™ 8-bit Analog-to-Digital Converter100k samples/s, I2C, 2.5V; Sampling late Q4‘13

FleX-RFIC™860-960MHz (UHF) IP-X™ TTO RFID64-bit UID, 0.1m–10m range, Sampling late Q4’13

FleX-LNA™ standalone Low Noise Amplifier

FleX-NVM™ Non-Volatile Memory

FleX-MCU™ adds NVM

In Process In Development Planning

FleX-ASIC custom ICs

FleX™ IC Product Roadmap

FleX ICsHigh Performance, High Density

Physically Flexible Silicon


FleX-MCU™ MicrocontrollerFirst Flexible High Performance Logic IC

FleX-MCU™ Microcontroller

WDT

Enhanced PIC 16F84A

(picL)

InstrROM

Instr/DataRAM

w/EDAC

A[7:0]

C[7:0]

RESET

XTALIN/CLK

Wishbone Bus

TIMER2

GPIOA

GPIOB

GPIOC

CLK/PWR ControlXTALOUT

ADC

TMS

TDI

TDO

TCK

TMR2I TMR2O ADCIN0

RTCSYNC_1PPS

TAP / DEBUG

Reg File

DAC

DACOUT0

Test ByPass

POR/BOD

Band-Gap & V-

regulator

8

8

M S

DMA

M

INTR

TBP_TO TPB_FR

SPA-1

SDA2 SCL2

ASIP(I2C / SPI / UART)

SS2 SCK2TXD2RXD2

TestBP(SPA)

TIMER1

TMRI TMRO

MChPWM

PWMnHPWMnL

3 3

Platform Peripherals

Customer Specific

CPU & Support

B[7:0]

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Future Peripherals

Product Overview

• Low-power general purpose microcontroller

>1.5M transistors

• FleX SoP process with 130nm CMOS

Product Features

TowerJazz 130nm SOI CMOS with FleX option

RISC microcontroller

ROM and SRAM

UART, I2C and SPI communication

Multiple programmable timers

Multiple GPIO ports for sensor data collection

Planned expansion to provide analog functionality

(ADC and DAC)

Status

Data Sheet available at www.americansemi.com

FleX-MCU available early Q4 2013

picL supported by AFRL

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Announced at

June 13, 2013


FleX-ADC™First Flexible Analog-to-Digital Converter

Features

• 8-bit Successive Approximation ADC

• 8 input channels and 100k samples/s

• Single, continuous, and scan modes

• 2-wire I2C communication

• 2.5V operation

• Manufactured in Jazz CS13 process

• Samples available Q4 2013

Benefits

FleX is flexible and conformable

FleX is 85% lighter than thinned die

FleX is 95% thinner than a 20-pin TSSOP package

FleX is 70% smaller in area than a 20-pin TSSOP package

Pitch is 42% tighter providing more I/O in the same space

8-b

it A

nal

og

Mu

x

A[0]A[1]A[2]A[3]A[4]A[5]A[6]A[7]

8-bitSAR ADC

I2CInterface

Control and Data Registers

Internal Oscillator

I2CCK

I2CDA

Power-OnReset Controller

New Product Announcement11


FleX-RFIC™First Wireless Communications IC

• IP-X™ tag-talks-only (TTO) protocol

• Programmable via 2-wire I2C interface

• 860-960MHz (UHF)

• 64-bit unique identification (UID) including 16-bit CRC

• 0.1m–10m read range; depending upon reader power

• 64kpbs or 256kpbs data rates

• Anti-collision protocol supports more than 45 tags/sec

• Manufactured in Jazz CS13 process

• Demonstration samples available Q4 2013

I2CInterface

Control and Data Registers

Internal Oscillator

I2CCK

I2CDA

Data Modulator

Power-On Reset

Antenna +

Antenna -



FleX-MCU™ Development Kit• Flexible development kit hardware includes:

– FleX-MCU on a flexible demonstration board

– Standard connectors for interfacing to PCs and prototyping boards

– Flexible, printed display and push-buttons

– Voltage regulators (conventional)

– Serial EEPROM (conventional)

• Software and Documentation

– C-compiler and assembler

– Product specifications

– User’s guide

– Data sheet

– Demonstration software

• Samples available Q4 2013

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American Semiconductor Inc., the American Semiconductor logo, FleX-IC, FleX-MCU, FleX-ADC, and FleX-RFIC are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners.

Thank You

American Semiconductor, Inc.3100 S. Vista Ave, Ste 230

Boise, ID 83705Tel: 208.336.2773

www.americansemi.com

role of conventional silicon ics in flexible electronics

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