rockwell profile
DESCRIPTION
Resume/Portfolio of Steve RockwellTRANSCRIPT
Motorola Confidential Proprietary 1
Steve Rockwell
RF / Microwave / mm-Wave Design Expertise mm-Wave design & applications (1 thru 100 GHz) Gigabit mm-Wave radio front end design & integration Actives & Passives characterization & modeling (on-wafer specialist) III-V MMIC design EM design tools
20+ years Experience Defense / Aerospace / Space / Commercial Telecommunications / Semiconductor Transistor > IC > Component > Front End > Sub-System > System
Excellence in Varied Roles: Independent Contributor Team Leader / Project Leader Engineering Manager / Program Manager
Steve K. Rockwell - Overview
Motorola Confidential Proprietary 2
Steve Rockwell
Key Accomplishments Demonstrated low cost 60GHz high multi-Gbps radio
systems and front ends by developing prototype implementations in progressively smaller package sizes from 2003 to 2008.
Proved feasibility of high speed download in a cell phone by integrating a 60GHz transceiver in a Motorola Q in 2008.
Led prototype development and systems analysis of 60 GHz backhaul link for Motorola Broadband product division. Completed detailed link availability and budget analysis and supported successful field testing.
Successfully completed JDA with Phiar Corp. demonstrating metal-insulator electronics in high speed millimeter-wave front end.
Motorola Confidential Proprietary 3
Steve Rockwell
Gigabit mm-Wave Radio Long Range for Backhaul & Networks Short Range for consumer & portable Link Budgets, Design & Analysis, Link
Availability, Prototyping
0.1
0.5
10
500
Tra
nsm
iss
ion
rat
e (
Mb
ps)
Range (meters)
1000802.15.3c /
ECMA / WirelessHD
10 100 1000 10 000 100 000
BlackberryGSM/TDMA
GPRS/EDGE
UMTS / HSDPA / 1xEVDO
ZigBee802.15.4
802.11bWiFi1
5
50
5000
802.16WiMax
100
802.11a/gWiFi
1
Bluetooth802.15.1
UWB / WiMedia
802.16e / 20WiMax
802.11nWiFi
NF
C
2009 Wireless Landscape
0.1
0.5
10
500
Tra
nsm
iss
ion
rat
e (
Mb
ps)
Range (meters)
1000802.15.3c /
ECMA / WirelessHD
10 100 1000 10 000 100 000
BlackberryGSM/TDMA
GPRS/EDGE
UMTS / HSDPA / 1xEVDO
ZigBee802.15.4
802.11bWiFi1
5
50
5000
802.16WiMax
100
802.11a/gWiFi
1
Bluetooth802.15.1
UWB / WiMedia
802.16e / 20WiMax
802.11nWiFi
NF
C
2009 Wireless Landscape
Motorola Confidential Proprietary 4
Steve Rockwell
Gigabit mm-Wave Radio – Handset Integration
60GHz TXCVR in a handset
Handset Architecture to Download Files to Onboard USB Memory
Motorola Confidential Proprietary 5
Steve Rockwell
Radio Systems Design / AnalysisMinimum Link Requirement for 5 Nines
V-Band vs. E-Band, Region K
120
130
140
150
160
170
180
190
200
210
220
230
240
250
260
270
280
290
300
500 1000 1500 2000 2500 3000
Range (m)
Lin
k B
ud
get
(dB
)
V-Band
E-Band
Motorola Confidential Proprietary 6
Steve Rockwell
RX required vs TX power @ Different Distances
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
-8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20 22 24 26
TX Power (dBm)
RX
Sen
sitv
ity
(dB
m)
RX @ 500m
RX @ 1000m
RX @ 1500m
RX @ 2000m
Radio Systems Design / Analysis
Main Signal Chain Component
Total Received Power at Antenna Duplexer B2B Filter LNA Filter B2B LNA Filter Filter LNA
Desired Power to Detector
Power (dBm) -50.0 -53.0 -55 -56.5 -42.5 -45.5 -47.5 -31.5 -33 -36 -20 -20 dBmGain (dB) -3 -2 -1.5 14 -3 -2 16 -1.5 -3 16
P1dB 99 99 99 10 99 10 10 99 100 10
Interfering Signal Chain Component
Power From TX to
Diplexer Duplexer B2B Filter LNA Filter B2B LNA Filter Filter LNA
Out of Band
Power to Detector
Power (dBm) 20.0 -5 -7 -32 -18 -33 -35 -19 -44 -59 -43 -43 dBmGain (dB) -25 -2 -25 14 -15 -2 16 -25 -15 16
Motorola Confidential Proprietary 7
Steve Rockwell
Auto Radar
Lane ChangeSupport
Lane Change Support
Lane ChangeSupport
Lane Change Support
AdaptiveCruiseControl
LaneDepartureWarning
Side Crash DetectionParking Support
Side Crash DetectionParking Support
Blind Spot DetectionBlind Spot Detection
Analysis tool to estimate target reflections, resolution, phase noise
effects, etc.
Motorola Confidential Proprietary 8
Steve Rockwell
MMIC Design 30 GHz LNA Design on UMS PH25
(.25um) PHEMT Project canceled before going to fab
8 Watt 3.5 GHz PA Design on Freescale High Voltage PHEMT Parts fabricated Early/soft breakdown caused high gate
leakage preventing full performance 60 GHz MIIM Detector
Modeled
Measured
Circuit Design
Bias Tee
60GHz FilterInput Match
Diode
Motorola Confidential Proprietary 9
Steve Rockwell
Foundry / IC Technology GAAS
MHEMT
INP
Imax GmMax
Fmin @
26ghz
Ga @
26ghz
Max Pwr Density @26ghz
Max PAE
@26ghzFOUNDRY PROCESS DEVICE mA/mm mS/mm Off On dB dB mW/mm %
BAE INP phemt No 0.10 ? Yes 0.8 13
HRL INP phemt No 0.10 3 Yes 250 600 700 950 5
OMMIC MHEMT phemt Yes 0.15 3 Yes 170 700 10 6
PSRL MHEMT phemt August 0.15 3 No
RAYTHEON GAAS phemt Yes 0.15 4 Yes 45 700 12 500
RAYTHEON MHEMT phemt Yes 0.18 4 Yes 130 185 660 790 8 3 1.1 10
TRIQUINT-TX GAAS phemt No 0.25 4 Yes 45 75 510 375 20 1.7 45
TRIQUINT-TX MHEMT phemt No 0.15 4 Yes 120 10 3 300 47
UMS GAAS phemt Yes 0.15 4 Yes 110 550 640 4 300
UMS GAAS phemt Yes 0.25 4 Yes 90 500 5 1.1 6 250
VELOCIUM (TRW) GAAS phemt Yes 0.1 4 Yes 120 250 700 650 7.5 500* 48*
VELOCIUM (TRW) INP phemt No 0.10 3 Yes 180 350 900 2.5
WIN MHEMT phemt Yes 0.15 6 Yes 120 700 650 11 6 1.2 9 300* 60*
XX Motorola Measurement of Samples* 10 ghz load pull
Backside Processes
Vbgd/VbceSamples
in Hand?
Gate Length(Emitter length)
Ft (ghz)
Fmax(ghz)
Wafer Size(in)
GaAs Foundry Review Summary Compiled in 2002 for 60 GHz front end designs
SiGe Foundry Review Summary Compiled in 2005 for mm-Wave GHz design
Technology
Frequency
Power
Efficiency
Noise Phase Noise
Passives
Integration1
Cost2
GaAs -pHEMT
Good Excellent Fair Good Fair Excellent Fair Fair
InP HEMT Excellent Fair Excellent Excellent Fair Excellent Fair Poor
Metamorphic HEMT
Excellent Good Excellent Excellent Fair Excellent Fair Fair
GaAs HBT Fair Excellent Good Poor Excellent Excellent Fair Fair
InP HBT Excellent Good Good Fair Excellent Excellent Fair Poor
SiGe HBT Fair Poor Poor Poor Good Poor Excellent Good
1 – Integration with other functions such as baseband, digital, passives, etc. 2 - Cost is volume driven and hence difficult to compare established processes with emerging ones.
Motorola Confidential Proprietary 10
Steve Rockwell
Passives & Packaging Design
Vialess CPW Probe Transition Silicon 5 metal layer stack
Integrated LCP on FR4
M ax O pe rating Fre q v s S ubstrate T h ickne ss E r= 2.9
0
50
100
150
200
250
300
350
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
S u b stra te T h ickn e ss (m ils)
Fre
qu
en
cy
(G
Hz
)
Er = 2 .9
Er = 2
Er = 1 .5
Motorola Confidential Proprietary 11
Steve Rockwell
Device Modeling & Characterization Led on-wafer device characterization in support of modeling
team at TI (1991-95) GaAs MESFET/HEMT/HBT
S-Parms up to 50GHZ Load / Source Pull
Lead Device Modeler for MMW projects at Mot Labs (2000-2005) Developed transmission line system approach for standard
BiCmos silicon Lead characterization and benchmarking of emerging
mHEMT/ InP / SiGe technologies
freq (1.000GHz to 60.00GHz)
Smea
s2(1
,1)
Smod
2(1,
1)
f req (1.000GHz to 60.00GHz)
Smea
s2(2
,2)
Smod
2(2,
2)
10 20 30 40 500 60
0
5
10
15
20
-5
25
freq, GHz
dB(S
mea
s2(2
,1))
dB(S
mod
2(2,
1))
10 20 30 40 500 60
-40
-35
-30
-45
-25
freq, GHz
dB(S
mea
s2(1
,2))
dB(S
mod
2(1,
2))
FET2 Modeled vs Measured
10 20 30 40 500 60
0.05
0.10
0.15
0.20
0.00
0.25
freq, GHz
FET2
_s11
dpFE
T2_s
12dp
FET2
_s21
dpFE
T2_s
22dp
10 20 30 40 500 60
0
50
100
150
-50
200
freq, GHz
phas
e(Sm
eas2
(2,1
))ph
ase(
Smod
2(2,
1))
Motorola Confidential Proprietary 12
Steve Rockwell
Silicon Technologies for mm-Wave
Z0 vs. R
0.0
20.0
40.0
60.0
80.0
100.0
120.0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
R=300
R=50
R=10
Silicon Substrate = 15 -cm
Top Metal Signal
Passivation
Dielectric Layers
3 to 10 um
Bottom Metal Ground
CPW MS
Silicon Substrate = 15 -cm
Top Metal Signal
Passivation
Dielectric Layers
3 to 10 um
Bottom Metal Ground
CPW MS
Progression of current distribution with increasing frequency
0.5 GHz 5.5 GHz 10 GHz 40 GHz 70 GHz
M5-Top Conductor
M1-Bottom Conductor
Motorola Confidential Proprietary 13
Steve Rockwell
Off Wafer SOLT
On Wafer LRM
On Wafer TRL
Off Wafer SOLT
On Wafer LRM
On Wafer TRL
Measurement Expertise VNA
Developed on-wafer LRM cal for silicon technologies
Load Pull Familiar with load and source pull
characterization up BERT
Digital bit error rate up to 10 Gbps ICCAP
Programming for characterization and modeling On-wafer Calibration De-embedding
Requirements Transmission Line System
Requirements
1. Well defined reference plane to extract accurate loss and phase information of test device.
1. Realizable impedances ranging from at least 25 ohms to 75 ohms, wider if possible.
2. Configured to match end use layout. These layouts should both minimize parasitic effects, and allow them to be accurately characterized.
2. Low loss.
3. Low loss to maximize system dynamic range and increase measurement accuracy.
3. Ease of implementation of scalable, layout based models.
4. Minimize number and size of calibration structures required.
4. Ease of interconnection to active and passive design elements.
5. Minimize post measurement data processing requirements. Single tier, in-situ calibration desired.
5. Minimize real estate cost to implement.
6. Maximize verifiability of calibration accuracy prior to data collection.
Motorola Confidential Proprietary 14
Steve Rockwell
EM Simulation
MIM Cap Model (Sonnet)
Marchand Balun (Sonnet)
CPW (HFSS)
Asymmetric Rat Race Coupler
(Sonnet)
Coupled lines in multi-stage MMIC design
(Sonnet)
Progression of current distribution with increasing frequency
0.5 GHz 5.5 GHz 10 GHz 40 GHz 70 GHz
M5-Top Conductor
M1-Bottom Conductor
Motorola Confidential Proprietary 15
Steve Rockwell
ADS Simulations & Libraries
Motorola Confidential Proprietary 16
Steve Rockwell
Team Leader / Project Leader Project Lead on Packaged MMIC design, assembly, and test
for space qualified flight deliverables Led team of technicians and engineers in assembly and test phase of
effort Responsible for performance reviews
Team leader on various research projects Led team meetings to set and define goals and track progress Represented team’s efforts to business units sponsoring or supporting
the research Responsible for performance reviews of technicians on project
Motorola Confidential Proprietary 17
Steve Rockwell
Engineering Management Lead technical researcher on several projects to
demonstrate Gbps wireless radios Defined/negotiated goals, objectives, schedule, and roles
with business units Made presentations and led status meetings with business
units Coordinated research/design efforts among several
engineers and technicians Have been responsible for supervising 3-5 technical
employees at various stages of career.
Motorola Confidential Proprietary 18
Steve Rockwell
Experience & Education Experience
Motorola Labs, mm-Wave & microwave design and applied research , 9 years
Motorola Government Business, space payloads, MMIC packaging and test, 4 years
Texas Instrument Defense and Electronics Division, GaAs MMIC, modeling, characterization, and components, 8 years
Academics BSEE from Arizona State University, 1986 Graduate courses at Southern Methodist University and
University of Texas at Dallas, 1988-89
Motorola Confidential Proprietary 19
Steve Rockwell
Affiliations & Conferences Professional Society Affiliations
IEEE since 1983 Served as student chapter secretary 1986 Serving as MTTS Representative in Phoenix Waves and Devices chapter from
2002 to 2007. Serving as Vice Chair of Waves and Devices chapter 2007-2008. Chapter Chair, IEEE Waves & Devices (2009 – present) Technical reviewer for technical papers for refereed journals for: “IEEE
Transactions on Microwave Theory and Techniques”; and “IEEE Microwave and Wireless Components Letters”;
Conferences Co-chair of Digest committee for International Microwave Symposium,
Phoenix, AZ, 2001 Session Chair, Non-linear Device Modeling, International Microwave
Symposium, Seattle, WA, 2002. Session Chair, Non-linear Device Modeling, International Microwave
Symposium, Philadelphia, PA 2003. Served on Technical and Vendor committees of CPMT/WAD annual
Devices and Packaging 1 day workshops at ASU from 2001 thru 2008
Motorola Confidential Proprietary 20
Steve Rockwell
Publications GaAs MESFETs fabricated on Si substrates using a SrTiO/sub 3/ buffer layer
Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W. IEEE Electron Device Letters , Volume: 23 Issue: 6 , June 2002 Page(s): 300 –302
An 8-Watt 3.5 GHz Power Amplifier with Tunable Matching Rockwell, Emrick, R.; Bosco, B.;Franson, S.; Miller, M.; Johnson, E.;Crowder, J. GaAs IC Symposium, 2002, October 20-23
Performance of GaAs on silicon power amplifier for wireless handset applications Escalera, N.; Emrick, R.; Franson, S.; Farber, B.; Garrison, G.; Holmes, J.; Rockwell, S.; Bosco, B. Microwave Symposium Digest, 2002 IEEE MTT-S International , 2002 Page(s): 1031 -1034 vol.2
RF Devices Implemented on GaAs on Si Substrates Using a SrTiO3 Buffer Layer Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W.;Ramdani, J.;Yu, Z.; Hilt, L.;Talin, A.;Edwards Jr, J.; Curless, J.; O’Steen, M. GaAs IC Symposium, 2001, October 21-24Page(s): 300 –302
MMIC Power Amplifier Output Combiner Network Considerations for S-Band Applications Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S. European Microwave Conference, 2001, September 24-28, London
A 60 GHz Transceiver with Multi-Gigabit Data Rate Capability Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S.; Holmes, JRadio and Wireless Conference, 2004 IEEE
On-Wafer Characterization De-embedding and Transmission Line Optimization on Silicon for Millimeter-wave Applications Bosco, B.; Rockwell, S.Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE
Characterization and Modeling of Metal/Double-Insulator/Metal Diodes for Millimeter Wave Wireless Receiver ApplicationsStephen Rockwell, Derrick Lim, Bruce A. Bosco, Jeffrey H. Baker, Blake Eliasson, Keith Forsyth, Michael CromarRadio Frequency integrated Circuits (RFIC) Symposium, 2007. Digest of Papers. 2007 IEEE
Gigabit Wireless Personal Area Networks: Motivation, Challenges and ImplementationStephen Rockwell, Bruce A. Bosco, Robert Lempkowski, Rudy Emrick, John Holmes Radio and Wireless Conference 2009