reduced halogen material technology - ibm www page · reduced halogen material technology. 2...
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Proprietary
Nov. 15th. 2011
(Halogen(Halogen--Free Laminates)Free Laminates)
Electronic Materials Business Unit
Reduced Halogen Material Technology
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1. Environmental Activities on Green Materials Today
2. Environmental Challenges on Green Technologies for Future
1) Future Direction on Electron Products - PWB Materials 2) New Technology Development on Green Materials
AgendaAgenda
1) Panasonic Environmental Strategy 2) Global Environmental Concerns, and Why Green? 3) Green Technologies for PWB Materials
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Global Environmental Concerns, Why Green?Global Environmental Concerns, Why Green?
1960 - 1980 ( Society )Pollution control
1981- 2000 ( Production Site )Manage the toxic substance at the production site (PRTR)
*Pollutant Release and Transfer Registers
2001- Current ( Products )The management of the toxic substance to contain to products
RoHS
Register discharge and the movement of the environmental pollution materials
REACH
Global Warming
CO2 Reduction
Energy Saving
Green IT
(15%out of global electricity generated )
0
10000
20000
30000
40000
50000
2006 2010 2015 2020 20250
10000
20000
30000
40000
50000
World
x9.4
x5.7
x3.2x1.6
Electric Consumption(BkWh)
(Source: Ministry of Economy, Trade and Industry)
(Source: IPCC)
No Pollution Society No Pollution Society Low Carbon Society Low Carbon Society
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RoHSRoHS moves Leadmoves Lead--Free & HalogenFree & Halogen--FreeFree
Pb
Mercury
Cadmium
HexavalentChromium
PBB
PBDE
PWB Assembly PWB Materials
Leaded Solder
Lead Free Solder
Rise of Melting Point
High Heat Resistance
Rise of Reflow Temp
・Higher Degradation Temp・Higher Tg
Lead-Free
Other Bromine Flame Retardants
Halogen-Free
ConventionalType
Non-Bromine Flame Retardants
・・・
RoHSRoHS
=
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Green Technologies for PWB MaterialsGreen Technologies for PWB Materials
Flame retardants are chemicals which are added to combustible materials to renderthem more resistant to ignition. They are designed to minimize the risk of a fire starting in case of contact with a small heat source such as a cigarette, candle or an electrical fault. If the flame retarded material or an adjacent material has ignited, the flame retardant will
slow down combustion and often prevent the fire from spreading to other items.
Flame retardantsprotect modern materials such as technical plastics, building insulation, circuit boards and cables from
igniting and from spreading a fire.
What is a Flame Retardant ?
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Halogen Free Technologies for PWB MaterialsHalogen Free Technologies for PWB Materials
What is a Halogen ?
Halogen Elements are a series of non-metal elementscomprising Fluorine, (F); Chlorine, (Cl); Bromine, (Br); Iodine, (I); and Astatine, (At).
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Definition – Halogen Free Laminates(Reduced Halogen Material)
・ Bromine (Br) content: 0.09wt% (900ppm) or less
・ Chlorine (Cl) content: 0.09wt% (900ppm) or less
・ Br & Cl contents: 0.15wt% (1500ppm) or less
By combustion flask type Ion Chromatography method
JPCA-ES-01-2003, IPC 4101B, IEE 61249-2-21<TEST-METHOD FOR HALOGEN-FREE MATERIALS>
Halogen Free Technologies for PWB Materials Halogen Free Technologies for PWB Materials
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Elemental Technology for Flame Retardants Elemental Technology for Flame Retardants
BrominatedFlame Retardant
PhosphorusFlame Retardant
Reaction in the gas phase:The radical gas phase combustion process is interrupted by the flame retardant, resulting in cooling of the system, reducing and eventually suppressing the supply of flammable gases.・Brominated Dioxin might be generated.
Reaction in the solid phase:The flame retardant builds up a char layer; shields the material against oxygen and provides a barrier against the flame.
(Surface)
ThermalDecomposition
Diffusionin the solid
Diffusion
Combustion
Oxygen
Plastic material
Mechanism of Combustion
●To apply reactive phosphorus raw material.
Reacted with epoxy resin ●No un-reacted additives
Epoxy resin Reactive phosphorus compound
No deterioration in cured epoxy characteristics
Phosphorus flame retardant is reacted withepoxy resin.
AdvantageElemental Technology ①
Elemental Technology②
NEWHigh Heat Resistance High Heat Resistance
((T288T288))Conventional
FR-4R-1566(W)
3 min 1 min
(IPC-TM 650)R-1577 (Meg2)
18 min
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0
100
200
300
400
500
600
700
800
900
Volu
me
Inde
x (2
000
= 1.
0)
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
Calendar Year
Panasonic History Only
Industry History
Volume Growth of HalogenVolume Growth of Halogen--Free LaminateFree LaminateGlobal Presence in Halogen Free Laminates Global Presence in Halogen Free Laminates
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Global Presence in HalogenGlobal Presence in Halogen--Free Laminates Free Laminates
HalogenHalogen--Free Laminate ManufacturersFree Laminate Manufacturers
Global 2010$1,241M
Global 2010$1,241M
(21.5%)
(17.9%)
(19.9%)
Others
[Source: PRISMARK]
$222M
$267M
$247M $135M
(10.9%)
$82M (6.6%)
$193M (15.6%)
$95M (7.6%)
In 2010In 2010
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PWB Materials Option for HalogenPWB Materials Option for Halogen--Free Free
RR--1566(W)1566(W)Typical ApplicationsEco Ideas for Products
Mobile Equipments Mobile Equipments
Through-hole Reliability
0.30㎜
1.6mm
20 - 25um
•Test Sample
Cycle - 65C (30min)⇔125C (30min)
Failu
re R
atio
(%)
Cycle Number
R-1566W Throwing power (Uniformity of plating thickness):80% or more
R-1755CHigh Reliable
FR-4
R-1766140Tg FR-4
•Test Result
Halogen-Free and Lead-Free AssemblyExcellent CAF PerformanceLow CTE (Z axis - 40ppm)
Automotives Automotives
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RR--1577 1577 Typical ApplicationsEco Ideas for Products
High Tg (170℃) and High Td (380 ℃)LOW CTE-Z (34ppm/ ℃)High Reliability – T288 (18min ) , T300 (5min )
Base Station Base Station
Server Server
T-288 (IPC-TM-650 TMA method)No blister time at 288℃
T-300 (IPC-TM-650 TMA method)
No blister time at 300℃
0
10
20
R-1577R-1566WConventional
HF FR-4
Conventional FR-4
0
10
20
R-1577R-1566WConventional
HF FR-4
Conventional FR-4
5
0 0
18
13
min min
PWB Materials Option for HalogenPWB Materials Option for Halogen--Free Free
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PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free
R-1577(MEGTRON2) is Halogen free material.It also has High Tg, High Td and low z-CTE for lead free soldering.It also has low Dk&Df for low power consumption.
94 V-0Bromine
1.2kN/m
45ppm/℃
280℃
>120 min
410℃
185℃
0.002
3.6
R-5775(MEGTRON6
)
30 min25 min20 min3 minIPCT288(with Cu foils)
3.84.14.44.62GHzDk
0.0060.0100.0160.0122GHzDf
94 V-0Bromine
1.5kN/m
44ppm/℃
265℃
350℃
173℃
R-1755V
94 V-0Halogen free
1.3kN/m
34ppm/℃
265℃
380℃
170℃
R-1577(MEGTRON2)
1.2kN/m1.8kN/mACu peel strength(Conventional
35um)
94 V-0Bromine
94 V-0Halogen freeULFlammability
35ppm/℃40ppm/℃TMAZ-CTE
280℃245℃-Heat resistance (1H)
360℃350℃TGATd
176℃148℃DSCTg
R-5725(MEGTRON4
)
R-1566Condition
Items
Sample thickness:0.75-0.8mm
Basic Properties
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PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free IST (Interconnect Stress Test)
>1,000
>1,000
>1,000
>1,000
>1,000
R-1755V
>1,000
>1,000
>1,000
>1,000
>1,000
R-5775(MEGTRON6)
>1,000
>1,000
>1,000
>1,000
>1,000
R-1577(MEGTRON2)
>1,000
>1,000
>1,000
>1,000
>1,000
R-5725(MEGTRON4)
467
(Mean)
972
(Mean)
582
(Mean)
878
(Mean)
>1,000
R-1566
5
4
3
2
1
No.
6
6
6
6
6
Number of Coupon
260℃
×6cycle
260℃
×3cycle
245℃
×6cycle
230℃
×6cycle
-
Reflow condition
■ Results
Treating condition : 25℃ 2min ⇔150℃ 3min, NG Judgment : Resistance changes >10%
Table. Number of Thermal cycles to occur failure (Times)
For sever conditions, Materials with High Tg, High Td and Low CTEare preferable.
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Copper type:VLP
35um 250um
-40
-35
-30
-25
-20
-15
-10
-5
0
0 1 2 3 4 5 6Frequency (GHz)
Tran
smis
sion
loss
(dB
/m)
MEGTRON6(R-5775)
MEGTRON4(R-5725)
HF-MEGTRON2(R-1577)
Conventional FR-4(R-1766T)
PCB construction
Transmission loss
R-1577(MEGTRON2) has low loss performance. It can transfer 1.5 times more amount of signal than R-1766 (Conventional FR-4).
PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free
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PWB Materials Option for HalogenPWB Materials Option for Halogen--FreeFree
■ IC Substrates
Power7 organic module
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IC Substrates Materials History for Halogen FreeIC Substrates Materials History for Halogen Free
Halogen Free
Halogen R-5715S
R-1515B
1999 ~
2005 ~
R-1515S
2007 ~
Evolve
CSP
Standard Ver.
High Elastic Modulus
R-5715E
High Elastic Modulus
R-1515H
2008 ~
R-1515B
R-1515S
R-1515H
CSP
High Elastic Modulus
+ Super High Tg
FC-Package(Build-Up PKG)
2004 ~
FC-Package(Build-Up PKG)
FC-Package(Build-Up PKG)
2009 ~+ Ultimate
Heat Resistance
R-1515A
Thick-Core200~800um
Thin-Core40~200um
Thick-Core200~800um
2007200520041999 2008 2010
EvolveEvolve
RR--1515W1515W
RR--1515E, L1515E, L
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Green Technologies for IC Substrate Materials Green Technologies for IC Substrate Materials
Unit R-1515S R-1515A R-1515W
Base resin - Epoxy Epoxy Epoxy
Flame retardant -Organic Resin&Metal-hydroxide
Organic Resin&Metal-hydroxide
Organic Resin&Metal-hydroxide
DMA ℃ 205 205 250TMA ℃ 180 180 22020℃ GPa 27 27 34-35
250℃ GPa 10 10 21CTE X ppm /℃ 12 12 10-9CTE Y ppm /℃ 12 12 10-9CTE Z ppm /℃ 30 30 ≦20CTE Z2 ppm /℃ 140 140 100Td weight loss 260℃ % 0.5 0.5 0.2Thermal condutivity DSC/Flash W/mk 0.7 0.7 0.7
TMA
Elastic Modulus
Item
Tg
Basic Properties
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Line up of IC Substrate Materials (All HalogenLine up of IC Substrate Materials (All Halogen--Free)Free)Applications Target IC-Packages Color Our Products
CPUGPUChip Set
MemoryDRAMSD CardSSD
DSP
High Elastic ModulusLow CTE x,y,zSuper Heat Resistance
+Ultimate Heat Resistance
+Super High-Tg+Super
High Elastic Modulus(@RT~250℃)
+Lower CTE x,y
High Elastic ModulusLow CTE x,y,zSuper Heat Resistance
FCFC--xGAxGA
CSPCSP+Super High-Tg+High Elastic Modulus
(@250℃)
Thick-Core800-100μm
Thin-Core200-40μm
R-1515SS
R-1515A A
R--1515WW
R-1515BB
R-1515HH
+Super Low CTE x,y(9ppm@R1515E, 7ppm@R1515L)
+Super High Elastic Modulus
R-1515EE/R-1515LL
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Halogen Free Technology Roadmap Halogen Free Technology Roadmap
2011 2012 2013 2014
Halogen Free, Lead Free Compatible (High Tg, High Td and Low CTE)and Low Energy Consumption (Low Dk and Low Df)
Mobile
Digital Appliance
NetworkEquipment
IC Pkg
:Developing:Under research
Halogen free Low Dk, Low Df Dk<3.8, Df<0.005
High elastic modulus & Low CTEx-yE>40GPa, CTE<5ppm Tg 270℃
High elastic modulus & Low CTEx-yE>50GPa, CTE<3ppm Tg 270℃
Low Dk(3.5), Df(0.005) and Low CTE x-y (=8ppm)
Heat dissipation materials (1.3-1.5W) Heat dissipation materials (3W)
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Thank you! Thank you!