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Quectel Cellular Engine
Module Secondary SMT
User Guide
Module_Secondary_SMT_User_Guide_V1.1
Module Secondary SMT User Guide
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Document Title Module Secondary SMT User Guide
Version 1.1
Date 2012-02-14
Status Released
Document Control ID Module_Secondary_SMT_User_Guide_V1.1
General Notes
Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products designed by Quectel. The information provided is
based upon requirements specifically provided for customers of Quectel. Quectel has not
undertaken any independent search for additional information, relevant to any information
that may be in the customer’s possession. Furthermore, system validation of this product
designed by Quectel within a larger electronic system remains the responsibility of the
customer or the customer’s system integrator. All specifications supplied herein are subject to
change.
Copyright
This document contains proprietary technical information of Quectel Co., Ltd. Copying of
this document, distribution to others, and communication of the contents thereof, are
forbidden without permission. Offenders are liable to the payment of damages. All rights are
reserved in the event of a patent grant or registration of a utility model or design. All
specification supplied herein are subject to change without notice at any time.
Copyright © Quectel Wireless Solutions Co., Ltd. 2012
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Contents
Contents ............................................................................................................................................ 3
Figure Index ...................................................................................................................................... 4
0. Revision history ............................................................................................................................ 5
1. Introduction ................................................................................................................................... 6
2. SMT overview ............................................................................................................................... 7
2.1. Package type ........................................................................................................................ 7
2.2. Packing type ........................................................................................................................ 7
2.3. Mounter requirements ......................................................................................................... 7
2.4. Soldering equipment requirements ...................................................................................... 7
3. SMT Manufacturing process ......................................................................................................... 8
3.1. Moisture-proof requirement ................................................................................................ 8
3.2. Solder paste printing ............................................................................................................ 9
3.3. Mounting Process .............................................................................................................. 10
3.3.1. Manual assembly ............................................................................................. 10
3.3.2. Automatic placement ....................................................................................... 11
3.3.3. Image analyzing .............................................................................................. 11
3.4. Reflow ............................................................................................................................... 12
4. Disassembly ................................................................................................................................ 13
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Figure Index
FIGURE 1 SMT FLOWCHART .............................................................................................................. 8
FIGURE 2: HUMIDITY INDICATOR .................................................................................................. 10
FIGURE 3: PASTE APPLICATION ........................................................................................................ 6
FIGURE 4: THICKNESS OF STENCIL ............................................................................................... 10
FIGURE 5: MANUAL ASSEMBLY ....................................................................................................... 7
FIGURE 6 IMAGE ANALYZING ......................................................................................................... 12
FIGURE 7: IMAGE ANALYZING ........................................................................................................ 12
FIGURE 8: TAKE OFF THE MODULE ............................................................................................... 13
FIGURE 9: SOLDER OF THE MODULE ............................................................................................ 14
FIGURE 10: SOLDER OF THE HOST BOARD .................................................................................. 14
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0. Revision history
Revision Date Author Description of change
1.0 2011-03-29 Tony PEI Initial
1.1 2011-12-16 Gavin HOU Modified Section 3.1 and 3.2.
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1. Introduction
This document describes the process of Quectel modules’ secondary SMT and disassembly. It is
intended for all Quectel modules made in SMD type.
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2. SMT overview
2.1. Package type
The modules are made in SMD type.
2.2. Packing type
Quectel provides the following packing methods:
Auto-tray
Tape reel
2.3. Mounter requirements
Component feeder:
Support Auto-tray feeder
Component alignment:
Support Laser, vision, Laser and vision mix-up alignment
Diameter of nozzle:
5.0mm--10.0mm
2.4. Soldering equipment requirements
Support Hot-air soldering
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3. SMT Manufacturing process
This chapter describes the whole manufacturing process of secondary SMT including solder paste
printing, mounting and reflow. The flowchart of the manufacturing process is shown in Figure 1.
Solder paste
printing
Mounting
Reflow
Cosmetic inspect
Figure 1 SMT flowchart
To avoid damage to the module when it was repeatedly heated, it is suggested that the module
should be mounted after the first panel has been reflowed. The following section describes the
manufacturing process of M10-TE-A SMT.
3.1. Moisture-proof requirement
M10 is sensitivity to moisture absorption. To prevent M10 from permanent damage during reflow
soldering, baking before reflow is required in following cases:
Humidity indicator card: At least one circular indicator is no longer blue.
The seal is opened and the module is exposed to excessive humidity.
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Figure 2 Humidity Indicator
M10 should be baked for 48 hours at temperature 125℃±5℃ in high-temperature containers. Care
should be taken that plastic tray is not heat resistant. M10 should be taken out before preheating,
otherwise, the tray maybe damaged by high-temperature heating.
3.2. Solder paste printing
The squeegee should push the paste on the surface of the stencil that makes the paste fill the
stencil openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to
produce a clean stencil surface on a single pass. For M10, M12, M72, M75, the thickness of
stencil marked in blue in the module should be 0.23mm shown as Figure 3. For L50 the thickness
of stencil marked in the module should be 0.20 mm .The hole of the stencil is lengthened outward
by 0.2 mm. For M95 the thickness of stencil marked in the module should be 0.20mm .For L10,
L10-C, L20, L30 and M80 should be 0.13mm. The hole of the stencil is lengthened outward by
0.1mm and moved outward by 0.1mm as shown by the yellow and blue arrow in Figure 3
respectively. Notice that the minimum distance between components is 0.2mm. The distance
between the edge of the blue area and the pad is 2mm, as is marked with red arrow.
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Figure 3: Paste application
Figure 4: Thickness of Stencil
3.3. Mounting Process
3.3.1. Manual assembly
Put 10 modules in the standard tray feeder and assemble it in the mounter.
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Figure 5: Manual assembly
3.3.2. Automatic placement
The operator should program the position of the tray as following parameters to let the mounter
complete the automatic placement.
• Layers
• The total rows and columns
•The coordinate of X/Y of the first and last position on the tray
3.3.3. Image analyzing
Program the dimensions of the actual components and components package type, then identify
accurate mounting through the camera image analyzing
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Figure 6: Image analyzing
3.4. Reflow
Refer to the recommended ramp-soak-spike reflow profile in the Figure 5.
Time(s)
50 100 150 200 250 300
50
100
150
200
250
160℃
200℃
217
0
70s~120s
40s~60s
Between 1~3℃/S
Preheat Heating Cooling℃
s
Liquids Temperature
Figure 7: Image analyzing
First pin
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4. Disassembly
Please use the SMD Rework Station to heat the pads of the module in the host board. The
temperature of the SMD Rework Station should be about 350℃ in order to release enough heat.
The wind speed should be adjusted according to actual situation.
When the host board being heated, the distance between the host board and the wind outlet should
be from 1cm to 3.5cm. Move the wind outlet along the edge of the module in uniform rotation.
When all of the solder is melting, take off the module along the diagonal direction with tweeters.
The time of the whole process should be no more than 250 seconds.
Figure 8: Take off the module
After disassembly, wait a moment until the module and the host board cool down. When the
module has been taken off, the solder must be smooth and no connected.
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Figure 9: Solder of the module
Figure 10: Solder of the host board
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Shanghai Quectel Wireless Solutions Co., Ltd.
Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China 200233
Tel: +86 21 5108 6236
Mail: [email protected]