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Page 1: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

Quartz Cr ystal Devices

Page 2: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

As a global leader in miniaturization and precision technology, we are poised to carve

out new product possibilities to create the next "best thing," in our efforts to earn the

admiration of our customers and to meet their growing expectations.

The combination of our creativity and technology in these efforts is reflected in the

Citizen group's dynamic new slogan: "Micro Human Tech"

The Citizen group has been improving upon the technology of miniaturization and precision since its inception as a manufacturer of watches. We are now a global leader in high-quality micro technology in the fields of production, processing and mounting. The prefix "Micro" thus represents the domain of our craftsmanship.

The Company was originally named Citizen to convey its aim of providing products that are familiar to, and loved by, the public-"citizens." We will continue to embody the spirit of this corporate principle by maintaining our focus on the needs and lifestyles of the public, with a keen eye to all of its expectations and hopes. The inclusion of the word "Human" represents our belief in 'precise craftsmanship, precisely applied' to the 'human' needs of the consumer.

Micro Human Tech

Micro

Human

Tech Through our superior technology in precision processing, instrumentation, energy conservation and production, we can offer designs and functions that are both refined and appealing. The abbreviated "Tech" represents the grounding of our business in craftsmanship based on reliable technology.

"Micro" our domain.

"Human" our focus.

"Technology" our foundation.

Page 3: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

2

32.768 kHz 1 MHz 3 MHz 10 MHz 30 MHz 50 MHz 100 MHz

Frequency range

*There may be unavailable frequency even if it is in the above frequency range. please inquire for availability of the specific frequency.

* : 3rd Overtone: Fundamental,

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Crystal Cut Mode of vibration Frequency range (kHz) Capacitance ratio (C0/C1)

AT

Thickness shearFundamental

3rd overtone

5th overtone7th overtone

Thickness shearFundamental

Flexural(Tuning fork)

Extensional

Face shear

DT

CT

SL

XY

BT

800~5,000 450~300 2,000~80,000 220

20,000~90,000 n2 x 250

n: Overtone order

40,000~150,000 70,000~210,000

3,000~30,000 650

16~150 425~800

600~3,000 400

100~500 400

150~850 350

180~700 400

TYPES OF CRYSTAL CUT

L1 C1

C0

R1 A quartz crystal unit in the main resonance frequency, may be expressed as an electrical equivalent circuit-a circuit ordinarily composed of a series circuit consisting of an inductance, capacitance and resistance, and a capacitance connected in parallel to the series circuit as shown in the drawing. Here, C0, which is commonly known as the shunt capacitance, comprises an inter-electrode static capacitance to which the inter-terminal stray capacitance is added. L1 and C1 are the equivalent constants of the quartz crystal unit viewed as an electrical and mechanical oscillation system. Since both constants are determined by such factors as the type of cut, cutting angle, dimensions of the crystal piece, and construction of the electrodes, and are thus reproducible, quartz crystal units, can be manufactured to high precisions. R1, which denotes oscillation loss, is governed by such conditions as the cutting, mounting, and dimensions of the quartz crystal.

L1 : Motional inductanceC1 : Motional capacitanceR1 : Motional (Series) resistanceC0 : Shunt capacitance

CRYSTAL UNIT EQUIVALENT CIRCUIT

The electrical equivalent circuit, composed of L1, C1, R1 and C0, all of which are correlated, may be expressed by the following equation.

f0 =

Shown below are some equations by which the performances of quartz crystal units are expressed.

Q = =

γ=

(Capacitance ratio)

2πf0L1

R1

1

12πf0C1R1

C0

C1

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CRYSTAL CUT AND FREQUENCY vs. TEMPERATURE CHARACTERISTICS

f ( )f

TEMP.(℃)

Fig. 3: Correlation between Crystal cutting angles and Frequency vs. temperature characteristics of AT-cut Crystal Units

f ( )f

TEMP.(℃)

To= ℃

Fig. 1: Correlation between Crystal cut and Frequencyvs. temperature characteristics

f ( )f

TEMP.(℃)

Fig. 2: Frequency vs. temperature characteristic of Tuning Fork Crystal Unit

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GLOSSARY

Item Description

Crystal unit equivalentcircuit

Load capacitance (CL)

Nominal frequency (f0)

Resonance frequency(fr)

Load resonance frequency (fL)

Resonance resistance (R1)

Load resonanceresistance (RL)

Motional inductance (L1)

Motional capacitance(C1)

Shunt capacitance (C0)

Capacitance ratio (C0/C1)

Overtone order

Unwanted response

Frequency tolerance(Δf/f0)

Operating temperature range

Storage temperature range

The electrical circuit which has the same impedance as the unit in the immediate neighborhood of resonance

The effective external capacitance associated with the crystal unit which determines the load resonance frequency (fL).

The frequency assigned by the specification of the crystal unit.

The lower of the two frequencies of the crystal unit alone, under specified conditions, at which the electrical impedance of the crystal unit is resistive.

One of the two frequencies of a crystal unit in association with a series or with a parallel load capacitance, under specified conditions, at which the electrical impedance of the combination is resistive. The frequency is the lower of the two frequencies when the load capacitance is in series.

The resistance of the crystal unit alone at the resonance frequency.

The resistance of the crystal unit in series with a stated external capacitance at the load resonance frequency.

The inductance in the motional (series) arm of the equivalent circuit.

The capacitance of the motional (series) arm of the equivalent circuit.

The static capacitance between the electrodes, together with stray capacitances of the mounting system.

The ratio of the shunt capacitance to the motional capacitance.

The numbers allotted to the successive overtones of a given mode of vibration from the integral numbers commencing with the fundamental as unity.

Frequency responses other than the main, or desired response, which the crystal elements have.

The permissible deviation from the nominal frequency at the reference temperature (usually 25°C).

The range of temperatures over which the crystal unit shall function.

The temperature range over which the standard characteristics of the crystal unit can be maintained when the crystal unit is not in operation.

Drive level, (Level of drive)

Insulation resistance

Q value

Frequency stability

Supply current

Duty

Output load

Rise time

Fall time

Start up time

Output enable function

Frequency adjustment range

Phase noise

Harmonic distortion

Allan variance fractional frequency fluctuation

The level of power or current in the crystal unit when in the operating state.

Resistance between leads, or between lead and case.

In a resonance circuit composed of an L, C and R, a quantity that represents the sharpness of a resonance curve-a curve that shows the relationship between the circuit current and power frequency.

Within operating temperature, operating voltage and output load range, deviation in actual frequency from nominal frequency.

The electric current to supply (VDD) pin with no output load when output is enabled.

The 1/2 cycle to 1 cycle ratio (as expressed in percentages) of an output waveform at the specified voltage level.

The load that can be connected to the oscillator.

The time interval required for the leading edge of a pulse wave form to change from specified L voltage level to specified H voltage level.

The time interval required for the trailing edge of a pulse wave form to decay from specified H voltage level to specified L voltage level.

The time interval between power on and supply voltage becomes the specified voltage until the output waveform becomes stable.

The function to change the output signal.When pins OE are at H level or open : Specified frequency is output. (Enable)When pins OE are at L level :Output has high impedance. (Disable)

Frequency adjustment (pulling) range of a crystal oscillator which enable to change the frequency with a variable component.

Unit of measurement of frequency sphere in short-term frequency stability of a crystal oscillator.

Non-linear distortion by occurrence of the needless spectral element in a higher harmonic wave of the requisite signal frequency.Each harmonic element is generally expressed in power ratio (dB) to output power of a requiring signal.

Objective evaluation is defined by time-domain in short-term frequency stability of a crystal oscillator

Item Description

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70KΩMax.

CM2012H

12.5pF

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

C0

32.768kHz

at 25℃

at 25℃

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.033±0.003ppm/℃2

1.0μW Max.

±3ppm Max.

1.3pF Typ.

CM2012H

Internal connection

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Shunt capacitance

Item Model Conditions

TUNING FORK CRYSTAL UNIT (SMD • Ceramic Package)

■ FEATURES

•Tuning fork crystal with ceramic packaged type.

•High-density SMD type Ultra-light weight with ultra-miniature packaging.

High-stability assured with tight vacuum sealing.

•Most appropriate for portable devices and mobile telecommunications devices.

■ STANDARD SPECIFICATIONS

3000pcs/reelRoHS compliant / Pb free

■ SOLDER PAD LAYOUT [mm]■ DIMENSION [mm]

Life-size

Do not design any patterns on shaded area.

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0.95pF Typ.

70KΩMax.

CM315D

1.5±0.1

1.3

0.1

3.2±0.1

(2.4)

1.8

C0.3

0.10.6

4-R0.15

0.9 Max.

1.41.1 1.1

1.9

Life-size

9.0pF, 12.5pF

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

C0

32.768kHz

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

CM315D

Internal connection

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Shunt capacitance

Item Model Conditions

TUNING FORK CRYSTAL UNIT (SMD • Ceramic Package)

■ FEATURES

7Tuning fork crystal with ceramic packaged type.

7High-density SMD type Ultra-light weight with ultra-miniature packaging. High-stability assured with tight vacuum sealing.

7Most appropriate for portable devices and mobile telecommunications devices.

■ STANDARD SPECIFICATIONS

3000pcs/reel

■ SOLDER PAD LAYOUT [mm]■ DIMENSION [mm]

∗ Do not design any patterns on shaded area.

RoHS compliant / Pb free

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1.30pF Typ.

50KΩMax.

CM315DL

1.5±0.1

1.3

0.1

3.2±0.1

(2.4) 1.8

C0.3

0.10.6

4-R0.15

0.9 Max.

1.41.1 1.1

1.9

Life-size

9.0pF, 12.5pF

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

C0

32.768kHz

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

0.5μW Max.

±3ppm Max.

CM315DL

Internal connection

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Shunt capacitance

Item Model Conditions

TUNING FORK CRYSTAL UNIT (SMD Ceramic Package)

■ FEATURES

Tuning fork crystal with ceramic packaged type.

High-density SMD type Ultra-light weight with ultra-miniature packaging. High-stability assured with tight vacuum sealing.

Most appropriate for portable devices and mobile telecommunications devices.

■ STANDARD SPECIFICATIONS

3000pcs/reel

■ SOLDER PAD LAYOUT [mm]■ DIMENSION [mm]

Do not design any patterns on shaded area.

RoHS compliant / Pb free

■ FEATURES

•Tuning fork crystal with ceramic packaged SMD type for low current consumption IC.

•Reduced motional resistance by 30% compared with existing models.

•Most appropriate for portable devices, mobile telecommunication devices and wearable devices.

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8

TUNING FORK CRYSTAL UNIT (SMD • Ceramic Package)

■ FEATURES

7Tuning fork crystal with ceramic packaged type High-density SMD type.

7Light weight with small and thin packaging High-stability assured with tight vacuum sealing.

7Most appropriate for portable devices, automotive applications and mobile telecommunication devices.

7Complete Pb free product.

9.0pF, 12.5pF

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

Q

C0

Item Model Conditions

32.768kHz

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

1.10pF Typ.

70KΩMax.

CM415

1.5±0.1

1.3

0.1

4.1±0.1

(3.3)

2.7

C0.3

0.10.6

4-R0.15

0.9 Max.

Life-size

■ STANDARD SPECIFICATIONS

See figure 2 in P4

53000 Typ.

CM415 3000pcs/reel

2.31.1 1.1

1.9

■ SOLDER PAD LAYOUT [mm]■ DIMENSION [mm]

∗ Do not design any patterns on shaded area.

Internal connection

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9

TUNING FORK CRYSTAL UNIT (SMD • Ceramic Package)

∗ Do not design any patterns on shaded area.

■ FEATURES

7Tuning fork crystal with ceramic packaged type.

7Small & thin packaging and light weight.

7Most appropriate for portable devices and mobile telecommunications devices.

7Complete Pb free product.

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

■ SOLDER PAD LAYOUT [mm]

■ STANDARD SPECIFICATIONS

CM519

See figure 2 in P4

1.35pF Typ.

57000 Typ.

9.0pF, 12.5pF

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

Q

C0

Item Model

32.768kHz

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

70KΩMax.

CM519

1.6

0.1

4.9±0.15

(3.95)

3.2

0.10.75

4-R0.15

1.8±0.15

1.0 Max.

2.91.3 1.3

2.2

Life-size

■ DIMENSION [mm]

Internal connection

3000pcs/reel

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

Conditions

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10

12.5pF

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

Q

C0

Item Model

32.768kHz 30kHz~100kHz Need to contact us for the available frequency in CM250C

Depend on frequency

±30ppm

1.35pF Typ. 0.8pF ~ 1.7pF Typ.

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

50KΩMax.

±5ppm Max.

CM200C CM250C

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

CM200C . CM250C 3000pcs/reel

See figure 2 in P4

∗ Do not connect to external with #2 and #3

TUNING FORK CRYSTAL UNITS (SMD • Plastic Package)

■ FEATURES

7Embeded with heat resistant cylinder type crystal bring highly stable characteristics.

7Automatic mounting and reflowable type.

7Most appropriate for clock source for portable and autmotive equipment with low power consumption.

3.7±0.1

2.4±0.1

7.9±0.1

5.5±0.5(1.25) (1.25)

0.5

#1 #2#1 #2

#4 #3#4 #3

0.5 (0.9)

1.3 1.34.2

1.9

1.9

1.3

Internal connection

Depend on frequency70000 Typ. 70000 ~ 100000 Typ.

■ STANDARD SPECIFICATIONS

Conditions

実物大

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11

TUNING FORK CRYSTAL UNIT (SMD • Jacket Type)

■ FEATURES

7High-density mounting SMD with jacket.

7Automatic mounting and reflowable type.

7Most appropriate for clock source for portable and other various equipment with low power consumption.

See figure 2 in P4

CMJ206 3000pcs/reel

■ DIMENSION [mm]

8.3±0.3

6.0

4.3 0.2Max0.2Max

(1.0)

2.54±0.3

0.85 2.0 1.3±0.3

2.3±0.3

φ0.260.5

2.2+0.2

-0.1

0.15

2.7Max

2.5

■ SOLDER PAD LAYOUT [mm]

3.4

2.5 1.55.2

2.54

1.0

12.5pF

■ STANDARD SPECIFICATIONS

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

Q

C0

32.768kHz

1.35pF Typ.

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

70000 Typ.

50KΩMax.

CMJ206

Life-size

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

ConditionsItemModel

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12

12.5pF

See figure 2 in P4

CMR200T 2000pcs/reel

TUNING FORK CRYSTAL UNITS (SMD • Cylinder Type)

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

Life-size

■ STANDARD SPECIFICATIONS

■ FEATURES

7Lead formed SMD type with embossed tape. Automatic mounting and reflowable type.

7Most appropriate for clock source for portable and other various equipment with low power consumption.

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

Q

C0

Item Model Conditions

32.768kHz

70000 Typ.

1.35pF Typ.

at 25˚C

at 25˚C

25℃±3℃

Need to specify your requirement

±20ppm

-40℃~+85℃

-55℃~+125℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

50KΩMax.

2.5

1.54

1.0

6.02.5

1.75

CMR200T CMR200T

ø1.

9±0.

1

2.54±

0.3

(1) 2.0±0.3

(1) 2.0±0.3

3.0±0.3

6.0  +0.1-0.2

CMR200T

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Quality Factor

Shunt capacitance

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TUNING FORK CRYSTAL UNITS (Cylinder Type)

CFS-206.CFS-145.CFV-206

■ DIMENSION [mm]

■ STANDARD SPECIFICATIONS

■ FEATURES

•Best suited for portable devices with low current consumption.•For a clock source in digital equipment.

Nominal Frequency

Frequency Tolerance

Load capacitance

Operating Temperature Range

Storage Temperature Range

Turnover Temperature

Temperature Coefficient

Motional (series) resistance

Level of drive

Aging (first year)

Shunt capacitance

f0

△ f/f0

CL

TOPR

TSTR

TM

β

R1

DL

△ f/f0

C0

ItemModel CFS-206 CFS-145 CFV-206 Conditions

32.768kHz 30kHz~100kHz Need to contact us for the available frequency in CFV-206

Depend on frequency

±30ppm

1.2pF Typ. 1.00pF Typ. 0.8~1.7pF Typ.

at 25℃

at 25℃

25℃±3℃

Need to specify your requirement

±20ppm

-20℃~+70℃

-40℃~+85℃

25℃±5℃

-0.034±0.006ppm/℃2

1μW Max.

±3ppm Max.

12.5pF

35KΩMax. 40KΩMax. 50KΩMax.

±5ppm Max.

8.0pF 12.5pF

0.26±0.05

0.7±0.2

1.9±0.1

6±0.2 6.1±0.2Max 1.5

0.45±0.08

0.2±0.05

4.3±0.35±0.1

Life-size

CFS-206, CFV-206 CFS-145

RoHS compliant / Pb free

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14

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

12.0MHz~54.0MHz(Fundamental)

12.0MHz≦f0<16.0MHz

Need to contact us for the available frequency

150 Ω Max.

16.0MHz≦f0<20.0MHz

120 Ω Max.

20.0MHz≦f0<30.0MHz

80 Ω Max.

30.0MHz≦f0<54.0MHz

50 Ω Max.

at 25˚C

-10℃~+60℃

at 25˚C

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

±30ppm

-40℃~+85℃

-55℃~+125℃

Refer to the following table

16.0pF, 18.0pF

5.0pF Max.

10μW(100μW Max.)

500MΩMin.

±5ppm Max.

■MOTIONAL (SERIES) RESISTANCE (R1)

■ STANDARD SPECIFICATIONS

CS325S

Life-size

■ FEATURES

7High-density SMD type.

7Reliable ceramic package and excellent environmental characteristics.

7Suitable for various applications such as communication devices, AV devices and other equipment.

7Complete Pb free product.

CS325S

AT-CUT CRYSTAL UNIT (SMD • Ceramic Package)

Nominal Frequency

Frequency Tolerance

Frequency Tolerance overOperating Temperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

Frequency Range

ESR

3000pcs/reel

3.2±0.1

#3

#2

#4

#1

#4

#1

#3

#2

2.5±0.1

1.0

0.65

0.6±0.1

1.2 0.9

1.31.01.3

1.1

1.1

0.8

Internal connection(Top View)

∗#2 and #4 is connected with cover.

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■ FEATURES

•Embeded with heat resistant cylinder type crystal bring highly stable characteristics.•Automatic mounting and reflowable type.

•Suitable for various applications such as communication devices, AV devices, and measuring instruments.

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

CM309E

4.000MHz~29.999MHz(Fundamental)

4.0MHz≦f0<5.5MHz

Fundamental Fundamental Fundamental Fundamental Fundamental Fundamental 3rd Overtone3rd Overtone

5.5MHz ≦ f0 < 6.0MHz 6.0MHz≦f0<10.0MHz 10.0MHz≦f0<12.0MHz 12.0MHz≦f0<16.0MHz 16.0MHz≦f0<30.0MHz 36.0MHz≦f0<64.0MHz30.0MHz≦f0<36.0MHz

Need to contact us for the available frequency30.000MHz~64.000MHz(3rd Overtone)

40ΩMax. 80ΩMax.100ΩMax.60ΩMax. 50ΩMax.80ΩMax.100ΩMax.150ΩMax.

at 25℃

-10℃~+60℃

See figure 3 in P4

at 25℃

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

below 5.5MHz:±50ppm

above 5.5MHz:±30ppm

-40℃~+85℃

-55℃~+125℃

Refer to the following table

16.0pF, 18.0pF

5.0pF Max.

100μW

500MΩMin.

±5ppm Max.

1.8 1.87.6

1.8

1.8

1.7

Internal connection

■ DIMENSION [mm]

CM309E

■ SOLDER PAD LAYOUT [mm]

∗ Do not connect to external with #2 and #3

Life-size

AT-CUT CRYSTAL UNIT (SMD • Plastic Package)

■MOTIONAL (SERIES) RESISTANCE (R1)

■ STANDARD SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Toleranceover OperatingTemperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

Frequency Range

Mode

R1

1000pcs/reelRoHS compliant

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15

■ FEATURES

7Embeded with heat resistant cylinder type crystal bring highly stable characteristics.

7Automatic mounting and reflowable type.

7Suitable for various applications such as communication devices, AV devices, automotive devices and measuring instruments.

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

CM309S

3.5MHz~34.0MHz(Fundamental)

3.5MHz≦f0<4.0MHz

Fundamental Fundamental Fundamental Fundamental Fundamental 3rd Overtone 3rd Overtone

4.0MHz≦ f0 < 6.0MHz 6.0MHz≦f0<10MHz 10MHz≦f0<27MHz 27MHz≦f0<36MHz 36MHz≦f0≦70MHz

Need to contact us for the available frequency27.0MHz~70.0MHz(3rd Overtone)

50ΩMax. 100ΩMax. 80ΩMax.50ΩMax.100ΩMax.150ΩMax.200ΩMax.

at 25˚C

-10℃~+60℃

See figure 3 in P4

at 25˚C

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

below 6.0MHz:±50ppm

above 6.0MHz:±30ppm

-40℃~+85℃

-55℃~+125℃

Refer to the following table

16.0pF, 18.0pF

7.0pF Max.

100μW

500MΩMin.

±5ppm Max.

4.4±0.2

3.6±0.1

12.4±0.1

9.4±0.1(1.5) (1.5)

0.8

#1 #2#1 #2

#4 #3#4 #3

0.8 (1.0)

1.8 1.87.6

1.8

1.8

1.7

Internal connection

■ DIMENSION [mm]

CM309S

■ SOLDER PAD LAYOUT [mm]

∗ Do not connect to external with #2 and #3

Life-size

AT-CUT CRYSTAL UNIT (SMD • Plastic Package)

■MOTIONAL (SERIES) RESISTANCE (R1)

■ STANDARD SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Toleranceover OperatingTemperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

Frequency Range

Mode

R1

1000pcs/reel

AG
EOL
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16

3.5MHz≦f0<4.0MHz 4.0MHz≦f0<6.0MHz 6.0MHz≦f0<10MHz 10MHz≦f0<14MHz 14MHz≦f0<30MHz 30MHz≦f0<36MHz 36MHz≦f0≦50MHz

Fundamental

200ΩMax.

Fundamental

150ΩMax.

Fundamental

100ΩMax.

Fundamental

80ΩMax.

Fundamental

50ΩMax.

3rd Overtone

140ΩMax.

3rd Overtone

100ΩMax.

HCM49

■ DIMENSION [mm]

1000pcs/reel

■ SOLDER PAD LAYOUT [mm]

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

HCM49

3.5MHz~30.0MHz(Fundamental) Need to contact us for the available frequency30.0MHz~50.0MHz(3rd Overtone)

at 25˚C

-10℃~+60℃

See figure 3 in P4

at 25˚C

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

below 6.0MHz:±50ppm

above 6.0MHz:±30ppm

-40℃~+85℃

-55℃~+125℃

Refer to the following table

16.0pF, 18.0pF

7.0pF Max.

100μW

500MΩMin.

±5ppm Max.

3.81

Max

.

4.3

Max

.

3.6

Max

.

(0.64)

+0.1

-0.2

0.8

+0.15

-0.05

10.5 Max.12.4±0.4

(4.32)

4.7±0.2

11.4±0.2

3 5.55.51.

5

Life-size

■ FEATURES

7Surface mount type of metal-can HC-49/U-S. High performance with the resistance weld sealing.

7Automatic mounting and reflowable type.

7Suitable for various applications such as communication devices, AV devices, automotive devices and measuring instruments.

AT-CUT CRYSTAL UNIT (SMD • Metal-can Type)

■ STANDARD SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Toleranceover OperatingTemperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

Frequency Range

Mode

R1

■MOTIONAL (SERIES) RESISTANCE (R1)

Internal connection

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17

Frequency Range

Mode

R1

ø3.

0±0.

2

1.1±

0.2

8.8±0.2 10.0±0.5

ø0.

32 -

0.03

+0.

07

CSA-309

■ FEATURES

7High performance miniature crystal units with Citizen's ultra-precise processing technology.

7High-stability assured with tight vacuum sealing.

7Suitable for various applications.

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

CSA-310 CSA-309

3.5MHz~4.0MHz4.001MHz~34.0MHz(Fundamental)

3.5MHz≦f0<4.0MHz

Fundamental Fundamental Fundamental Fundamental Fundamental 3rd Overtone 3rd Overtone

4.0MHz≦f0<6.0MHz 6.0MHz≦f0<10MHz 10MHz≦f0<27MHz 27MHz≦f0<36MHz 36MHz≦f0≦70MHz

Need to contact us for the available frequency27.0MHz~70.0MHz(3rd Overtone)

50ΩMax. 100ΩMax. 80ΩMax.50ΩMax.100ΩMax.150ΩMax.200ΩMax.

at 25˚C

-10℃~+60℃

See figure 3 in P4

at 25˚C

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

below 6.0MHz:±50ppm

above 6.0MHz:±30ppm

-20℃~+70℃

-40℃~+85℃

Refer to the following table

16.0pF, 18.0pF

5.0pF Max.

100μW

500MΩMin.

±5ppm Max.

Life-size

CSA-310 . CSA-309

ø3.

0±0.

2

1.1±

0.2

10.3±0.2 10.0±0.5

ø0.

32 -

0.03

+0.

07

CSA-310

AT-CUT CRYSTAL UNITS (Cylinder Type)

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

■MOTIONAL (SERIES) RESISTANCE (R1)

■ STANDARD SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Toleranceover OperatingTemperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

AG
Discontinued
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18

Taping dimension : 2000pcs/Ammo pack [mm]

f0

△ f/f0

△ f/f0

TOPR

TSTR

R1

CL

C0

DL

IR

△ f/f0

HC-49/U-S

3.5MHz~30.0MHz(Fundamental)

3.5MHz≦f0<4.0MHz 4.0MHz≦f0<6.0MHz 6.0MHz≦f0<10MHz 10MHz≦f0<14MHz 14MHz≦f0<30MHz 30MHz≦f0<36MHz 36MHz≦f0≦50MHz

Fundamental

Need to contact us for the available frequency30.0MHz~50.0MHz(3rd Overtone)

200ΩMax.

Fundamental

150ΩMax.

Fundamental

100ΩMax.

Fundamental

80ΩMax.

Fundamental

50ΩMax.

3rd Overtone

140ΩMax.

3rd Overtone

100ΩMax.

at 25˚C

-10℃~+60℃

See figure 3 in P4

at 25˚C

Need to specify your requirement

DC100V±15V

25℃±3℃

±30ppm

below 6.0MHz:±50ppm

above 6.0MHz:±30ppm

-20℃~+70℃

-40℃~+85℃

Refer to the following table

16.0pF, 18.0pF

7.0pF Max.

100μW

500MΩMin.

±5ppm Max.

4.88

11.5 Max.

20±13.5 Max.4.66 Max.

φ0.43±0.05

6.35±1.3

3.85±0.7

12.7±0.3

5.0±0.8

φ4±0.2

11.5 Max. 3.5 Max.

3.0 Max.

13.0

20.5±0.5

9.0±0.5

18.0+1.0

-0.5

12.7±1.0 2.0 Max.2.0 Max.

4.65 Max.

1.5 Max.

0.375

■ DIMENSION [mm]

HC-49/U-S

Life-size

■ FEATURES

7High performance miniature crystal units with Citizen's ultra-precise processing technology.

7Available in Tape and reel form.

7Suitable for various applications such as communication , AV , automotive and measurement devices.

AT-CUT CRYSTAL UNIT (Metal-can Type)

■ STANDARD SPECIFICATIONS

Nominal Frequency

Frequency Tolerance

Frequency Toleranceover OperatingTemperature Range

Operating Temperature Range

Storage Temperature Range

Motional (series) resistance

Load capacitance

Shunt capacitance

Level of drive

Insulation Resistance

Aging (first year)

Item Model Conditions

Frequency Range

Mode

R1

■MOTIONAL (SERIES) RESISTANCE (R1)

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■ FEATURES7Available to supply voltage 5.0V or 3.3V.

7Low current consumption with output enable function (OE) or stand by function (STAND-BY).

7Suitable for various applications such as communication devices, AV devices and measuring instruments.

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

5.0±

0.15

1.45.08

2.6

#2#1

#4 #3

7.0±0.15

1.6 Max.

Pin No.#1#2#3#4

ConnectionOE or Stand By

GNDOUTVdd

Pin Assignment

#1 inputH

OpenL

#3 Output conditionOscillation outOscillation outOscillation stop

Function

4.2

0

5.08

2.0

0

1.80

CSX-750F SERIES

TTL level(1.4V)

CMOS level(1/2 Vdd)

VOH

VOL

VIH

VIL

TTL

CMOS

(*)

STAND-BY

OE

8 nsec Max. 6 nsec Max. 8 nsec Max. 6 nsec Max.

4 msec Max. 10 msec Max. 4 msec Max. 10 msec Max.

2.0V Min.

0.8 V Max.

20mA Max.10mA Max.

0.7Vdd Min.

0.3Vdd Max.

5mA Max.

0.4V Max.

10μA Max.

10TTL Max.

0.9Vdd Min.

0.4V Max. 0.1Vdd Max.

30pF Max. 30pF Max.50pF Max.

45~55%

B : ±50ppm, C : ±100ppm, E : ±50ppm(- 40℃~+ 85℃), F : ±100ppm(- 40℃~+ 85℃)

-20℃~+70℃(-40℃~+85℃)

-55℃~+125℃

40~60% -

Vdd : 3.3V±0.3V

25mA Max. 45mA Max. 15mA Max. 25mA Max.

Vdd : 5.0V±0.5V

CSX-750 FJ(*)

CSX-750 FB(*)CSX-750 FC(*)

40.000MHz~80.000MHz1.8432MHz~39.999MHz40.000MHz~75.000MHz1.8432MHz~39.999MHz

Life-size

■ STANDARD SPECIFICATIONS

Item

Model

*Model is determined by the selection for the output enable or stand-by function, the frequency stability and the supply voltage.

CRYSTAL CLOCK OSCILLATORS (SMD • Ceramic Package)

2000pcs/reel

Frequency Range

Supply Voltage

Frequency Stability

Operating Temperature Range

Storage Temperature Range

Current consumption

Duty

Output Voltage

Output Load

Rise and Fall Time

Start-up time

Input Voltage

Disable current

Stand-by current

RoHS compliant

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■ FEATURES7Available to supply voltage 1.8V to 2.8V.

7Low current consumption type.

7Suitable for various applications such as communication devices, AV devices and measuring instruments.

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

5.0±

0.15

1.45.08

2.6

#2#1

#4 #3

7.0±0.15

1.6 Max.

Pin No.#1#2#3#4

ConnectionOE or Stand By

GNDOUTVdd

Pin Assignment

#1 inputH

OpenL

#3 Output conditionOscillation outOscillation outOscillation stop

Function

4.2

0

5.08

2.0

0

1.80

CSX-750F (Low Voltage Ver.)

STAND-BY

OE

CSX-750 FN(*)CSX-750 FH(*)CSX-750 FM(*)

Life-size

■ STANDARD SPECIFICATIONS

Item

Model

CRYSTAL CLOCK OSCILLATORS (SMD • Ceramic Package)

2000pcs/reelRoHS compliant

TTL level(1.4V)

CMOS level(1/2 Vdd)

VOH

VOL

VIH

VIL

TTL

CMOS

8 nsec Max.

4 msec Max.

0.8Vdd Min.

0.2Vdd Max.

10μA Max.

0.9Vdd Min.

0.1Vdd Max.

15pF Max.

45~55%

B : ±50ppm, C : ±100ppm, E : ±50ppm(-40℃~+85℃), F : ±100ppm(-40℃~+85℃)

-20℃~+70℃(-40℃~+85℃)

-55℃~+125℃

Vdd : 2.5V±0.2V Vdd : 2.8V±0.2V

2.5mA Max. 3.0mA Max. 3.2mA Max.

Vdd : 1.8V±0.2V

1.8432MHz~39.999MHzFrequency Range

Supply Voltage

Frequency Stability

Operating Temperature Range

Storage Temperature Range

Current consumption

Duty

Output Voltage

Output Load

Rise and Fall Time

Start-up time

Input Voltage

Disable current

Stand-by current

(*)

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■ FEATURES•Wide range of output frequency by PLL technology.•Quick sample delivery and short lead time in mass production.•Low current consumption with output enable function (OE) or stand by function (STAND-BY).•Suitable for various applications such as communication devices, AV devices and measuring instruments.

4.20

5.08

2.00

1.80

5.0±

0.20

1.45.08

2.6

#2#1

#4 #3

7.0±0.20

1.6

Max

.

Pin No.#1#2#3#4

ConnectionOE or Stand By

GNDOUTVdd

Pin Assignment

#1 inputH

OpenL

#3 Output conditionOscillation outOscillation outOscillation stop

Function

4.20

5.08

2.00

1.805.0±0.15

1.45.08

2.6

#2#1

#4 #3

7.0±0.15

1.6 Max.

Pin No.#1#2#3#4

ConnectionOE or Stand By

GNDOUTVdd

Pin Assignment

#1 inputHOpenL

#3 Output conditionOscillation outOscillation outOscillation stop

Function

Life-size

■ DIMENSION [mm]

■ SOLDER PAD LAYOUT [mm]

SSX-750P SERIES

Frequency Range

Supply Voltage

Frequency Stability

Operating Temperature Range

Storage Temperature Range

Current consumption

Duty

Output Voltage

Output Load

Rise and Fall Time

Start-up time

Input Voltage

Disable current

Stand-by current

TTL level(1.4V)

CMOS level(1/2 Vdd)

VOH

VOL

VIH

VIL

TTLCMOS

(*)

SSX-750 PB(*)STAND-BY

OE

4 nsec Max.10 msec Max.

2.0V Min. 0.8V Max.

30mA Max.50μA Max.

0.7Vdd Min.0.2Vdd Max.16mA Max.

5TTL Max.

Vdd−4.0V Min.0.4V Max.

−15pF Max.25pF Max.−

40〜60%

B : ±50ppm, C : ±100ppm, E : ±50ppm(− 40℃〜+ 85℃), F : ±100ppm(− 40℃〜+ 85℃)−20℃〜+70℃(−40℃〜+85℃)

−55℃〜+125℃

40〜60%−

Vdd : 3.3V±0.3V

28mA Max.45mA Max.

Vdd : 5.0V±0.5V

SSX-750 PJ(*)SSX-750 PC(*)SSX-750 PD(*)

SSX-750 PT(*)SSX-750 PK(*)

1.000MHz 〜 125.000MHz

■ STANDARD SPECIFICATIONS

Item

Model

* Model is determined by the selection for the output enable or stand-by function, the frequency stability and the supply voltage.

PROGRAMMABLE OSCILLATORS (SMD • Ceramic Package)

2000pcs/reelRoHS compliant / Pb free

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21

2.000MHz ~ 40.000MHz

Vdd : 5.0V±0.5V Vdd : 3.3V±0.3V

B : ±50ppm, C : ±100ppm, E : ±50ppm(-40℃~+85℃), F : ±100ppm(-40℃~+85℃)

-20℃~+70℃(-40℃~+85℃)

-55℃~+125℃

M : ±100ppm Min. / Vc=2.5±2.0V L : ±90ppm Min. / Vc=1.65±1.65V

2.5±2.0V(at 25℃) 1.65±1.65V(at 25℃)

15mA Max. 10mA Max.

10mA Max. 6mA Max.

10% Max.

45~55%

Vdd-0.4V Min.

0.4V Max.

CMOS 30pF Max.

6 nsec Max.

4 msec Max.

15kHz Min.(Gain-3dB)

-120dBc/Hz Max.(Offset 1kHz)

Pin No. #1 #2 #3 #4 #5 #6

Connection VC NC GND OUT OE Vdd

Pin Assignment

#5 input H Open L

#4 Output condition Oscillation out Oscillation out Oscillation stop

Function

5.0±0.15

1.45.08

2.6

1.1

#3#1

#6

#2

#5 #4

7.0±0.15

1.6 Max.

4.2

2.54 2.54

2.0

1.8

CSX-750V SERIES

■ STANDARD SPECIFICATIONS

Frequency Range

Supply Voltag

Frequency Stability

Operating Temperature Range

Storage Temperature Range

Pulling range

Frequency control voltage

Current consumption

Disable current

Linearity

Duty

Output Voltage

Output Load

Rise and Fall Time

Start-up time

Modulation band width

Phase Noise

CMOS level(1/2 Vdd)

VOH

VOL

(tr,tf)

(*)

Item Model CSX-750 VK(*)LCSX-750 VJ(*)M

Life-size

*Model is determined by the supply voltage and the frequency stability.

■ FEATURES

7Available to supply voltage 5.0V or 3.3V.

7Automatic mounting and reflowable type.

7Most appropriate for communication devices and other equipment.

7Output enable function (OE) can be used for low power consumption.

■ DIMENSION [mm] ■ SOLDER PAD LAYOUT [mm]

VOLTAGE CONTROLLED CRYSTAL OSCILLATORS (SMD • Ceramic Package)

2000pcs/reel

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22

CSX-750F/P SERIES

TEST CIRCUIT

VDD

VDD OUT CL=15pF

TEST POINT

GND

GND

0.01~

4

1 2

3

390Ω

0.1μFOE

VDD

CL=50 pF

TEST POINT

GND

4

1 2

3

0.01~ 0.1μF

VDD OUT

GNDOE

VDD

GND

0.01~ 0.1μF

4

1 2

3

VDD OUT

GNDOE

A

OUTPUT WAVE-FORM(CSX-750 SERIES・CSX-325 SERIES)

TTL load CMOS load Current Consumption

0.1μF6

1 2 3

5 4

Vdd/2

CL=30pF

GND

VDDTEST POINT

VDD OE OUT

Vc GND

A

VDD0.1μF

Vdd/2

OE OUT

Vc GND

GND

VDD

1 2 3

6 5 4

CMOS load Current Consumption

CMOS load TTL load

DUTY=Th/T×100(%)

tr

Th

T

tf

VOL

80%VDD

50%VDD

20%VDD

VOH

DUTY=Th/T×100(%)

tr

Th

T

tf

VOL

VOH

2.4V

1.4V

0.4V

*1

*2

*1 : 390Ω : CSX-750 (FC)820Ω : CSX-750 (PT, PK)

*2 : 50pF : CSX-750 FC

*1 : 30pF : CSX-750 (FB, FJ)*1 : 25pF : CSX-750 (PC, PD)*1 : 15pF : CSX-750 (PB, PJ)

CSX-750V SERIES

■Measurement conditions:1. Oscilloscope

Impedance: No less than 1MΩCapacitance: No more than 15pFBand width: No less than 500MHz

2. The CL includes the probe capacitance.3. Grounding should be single-point grounding.4. Supply impedance should be as low as possible.

0V→0.9Vdd rise time is No less than 150µs5. use an ammeter with small internal impedance.

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23

TAPE & REEL SPECIFICATION①Taping & reel form is conforming to JIS C 0806 and EIAJ RC-1009B and a unit in quantity per reel shall be

1,000pcs, 2000pcs or 3,000pcs.

②A "Label" on which necessary information is clearly written is on the surface of the packing box and the reel.

③Goods will be ship out after packing some taping reels into the shipping box.

Taping dimensions(Conforming to JIS C 0806 TB1208NEIAJ and RC-1009B TE1208N)

→ Tape lead-out direction

Reel dimensions(Conforming to JIS C 0806 R12R and EIAJ RC-1009B R15)

φ13.0

2.0

l

n m

R1.0

φ21.0(±0.8)

2.0

kj

C d

2.0(±0.1)

4.0(±0.1)

gh

e

ab

f

φ1.5(  ) +0.10

1.75(±

0.1)

Unit : mmUnit : mm

Unit:mm

Quantity(pcs/reel) a b c d e f g h j k l m n

Model

CM200C

CM250C

CM519

CM415

CM315

HCM49

CM309S

CS325

CMR200T

CMJ206

CSX-750F

CSX-750P

CSX-750V

3,000

3,000

3,000

3,000

3,000

1,000

1,000

2,000

2,000

3,000

3,000

2,000

3,000

2,000

2,000

2,000

16.0(±0.3)

16.0(±0.3)

12.0(±0.3)

12.0(±0.3)

12.0(±0.3)

24.0(±0.3)

24.0(±0.3)

12.0(±0.3)

24.0(±0.3)

8.0(±0.2)

8.0(±0.2)

16.0(±0.3)

16.0(±0.3)

16.0(±0.3)

16.0(±0.3)

16.0(±0.3)

7.5(±0.1)

7.5(±0.1)

5.5(±0.05)

5.5(±0.05)

5.5(±0.05)

11.5(±0.1)

11.5(±0.1)

5.5(±0.1)

11.5(±0.1)

3.5(±0.05)

3.5(±0.05)

7.5(±0.1)

9.2(±0.1)

7.5(±0.1)

7.5(±0.1)

7.5(±0.1)

8.0(±0.1)

8.0(±0.1)

4.0(±0.1)

4.0(±0.1)

4.0(±0.1)

12.0(±0.1)

12.0(±0.1)

8.0(±0.1)

12.0(±0.1)

4.0(±0.1)

4.0(±0.1)

8.0(±0.1)

8.0(±0.1)

8.0(±0.1)

8.0(±0.1)

8.0(±0.1)

φ1.6(+0.1,-0)

φ1.6(+0.1,-0)

φ1.0(+0.2,-0)

φ1.0(±0.1)

φ1.0(±0.1)

φ2.0(±0.1)

φ2.2(±0.1)

φ1.6(±0.1)

φ2.2(±0.1)

φ1.1(+0.1,-0)

φ1.1(+0.1,-0)

φ1.5(+0.1,-0)

φ1.5(+0.1,-0)

φ1.5(+0.1,-0)

8.3(±0.1)

8.3(±0.1)

5.3(±0.1)

4.5(±0.1)

3.6(±0.1)

16.1(±0.1)

12.8(±0.1)

6.4(±0.1)

12.0(±0.1)

3.5(±0.1)

3.5(±0.1)

9.7(±0.1)

9.5(±0.1)

7.4(±0.1)

7.4(±0.1)

7.4(±0.1)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

0.4(±0.05)

0.4(±0.05)

0.3(±0.05)

0.4(±0.05)

0.25(±0.05)

0.25(±0.05)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

0.3(±0.05)

2.7(±0.1)

2.7(±0.1)

1.1(±0.1)

1.0(±0.1)

1.0(±0.1)

4.3(±0.1)

3.9(±0.1)

1.4(±0.1)

2.4(±0.1)

0.75(±0.1)

0.75(±0.1)

2.15(±0.1)

2.1(±0.1)

1.9(±0.1)

1.9(±0.1)

1.9(±0.1)

4.05(±0.1)

4.05(±0.1)

2.1(±0.1)

1.9(±0.1)

1.9(±0.1)

5.1(±0.1)

4.8(±0.1)

3.9(±0.1)

5.9(±0.1)

2.8(±0.1)

2.8(±0.1)

5.0(±0.2)

3.0(±0.1)

5.4(±0.1)

5.4(±0.1)

5.4(±0.1)

Max. 3゜

Max. 3゜

Max. 5゜

Max. 5゜

Max. 5゜

Max. 5゜

Max. 3゜

Max. 3゜

Max. 3゜

Max. 5゜

Max. 5゜

Max. 3゜

Max. 5゜

Max. 5゜

Max. 5゜

Max. 3゜

Max. 3゜

Max. 5゜

Max. 5゜

Max. 5゜

Max. 3゜

Max. 3゜

Max. 3゜

Max. 5゜

Max. 5゜

Max. 5゜

Max. 5゜

17.5

17.5

13.0

13.0

13.0

25.5

25.5

14.0

25.5

11.4

11.4

17.5

17.5

17.5

17.5

17.5

φ330

φ330

φ180

φ180

φ180

φ330

φ330

φ330

φ330

φ180

φ180

φ330

φ330

φ254

φ254

φ254

φ100

φ100

φ60

φ60

φ60

φ100

φ100

φ100

φ100

φ60

φ60

φ100

φ100

φ100

φ100

φ100

AG
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Page 29: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

24

The following instructions and information are providedfor the purpose of having the user understand the properway to handle the Citizen crystal products to preventproblems prior to use and enhance the reliability ofequipment to which they are applied.

I. When dropped by mistake:< All products >

The crystal products are designed and manufactured toresist physical shocks.However, in the event the crystal is subjected to excessiveimpact such as being dropped onto the floor or givingshocks during mounting. Need to make sure itssatisfactory performance before using it.

II. Soldering:< Lead Type products >

(1) Lead wires should be soldered within 3 seconds withthe iron heated to a temperature no higher than 380°C.

(2) In solder-dip mounting, it should be within 10 secondswith a temperature no higher than 260°C. And bewarenot to heat the whole crystal unit in the dip mountingprocess.Mounting in upright bearing is recommendable (preventheat conduction directly to the body of a crystal unit).

(3) Heating the whole crystal unit, for example, in a reflowoven may deterioration of the performance.Because the holder is quite small and it is sealed bysolder material with press sealing so that such reflowprocess not allowed to be proceeded.

< SMD Type products >

(1) Eutectic solder

HANDLING INSTRUCTIONS(2) Pb free solder

III. Bending Lead:< Cylinder Type products >

(1) When the lead of cylinder type crystal units need to bebent, leave more than 1.5mm (3.0mm is recommendable)of lead from the case in order to prevent from occurrenceof any cracks of the hermetic seal glass at the root of thelead and use a jig for bending if possible.

(2) When bending the lead of cylinder type crystal units, donot scrape off the solder plating from the lead surface.

IV. Mounting:< Cylinder Type products >

(1) Soldering on the body of the cylinder type crystal unitmust be strictly avoided due to deteriorate thecharacteristics or damage the products. Rubberadhesive is recommended.

(2) When the lead needs to be bent by hand, follow thenext instructions.① Hold the body of the Cylinder type crystal unit in

fingers.② Pick at the part with tweezers, which you intend to

bend. There should be more than 1.5mm (3.0mm isrecommendable) from the body case.

③ Bend the lead 90° by tweezers without pulling thelead strongly. If pulling the lead strongly may causeany cracks of the hermetic seal glass at the root ofthe lead and may cause the airtightness and thecharacteristics to deteriorate.

1.5mm Min.

Rubber adhesive

Cylinder type crystal unitTemperature (℃)

Time (sec.)

200

240℃ Max.

160℃

120

30Max.

230Max.

100

10Max.

Temperature (℃)

Time (sec.)

230

260℃ Max.

180℃±10℃

90±30 10Max.

55Max.

360Max.

120

By teezers

Lead

Page 30: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

25

< SMD Type products >

When using an automatic loading machine, test andconfirm to cause no damage to the crystal products beforemounting. Bending the circuit board in the process of cleaving boardsafter mounting and soldering crystal products may causepeeling off the soldering or package cracks by mechanicalstress.Please be sure that the layout of crystal products positionis on the less stressed and the cleaving process is underless stressed for the crystal products.

< Crystal Oscillators >

Please be sure to confirm that the pin location is properwith electric wiring on the circuit board prior to mountingthe crystal oscillators. Mounting to the wrong pin positionwill cause malfunction and damage to the crystal oscillatorand the circuit board.

V. Cleaning:< All products >

(1) Crystal products may be affected and destroyed atworst by ultrasonic cleaning. Please be sure to check ifyour cleaning process affects any damage to crystalproducts prior to use.

(2) Some kind of cleaning fluid may cause any damage tocrystal products. Please be sure to check suitability ofthe cleaning fluid in advance.

VI. Thermal shock:< Crystal Oscillators >

Repetitive rapid changes with a great amplitude intemperature may cause deteriorate the crystal unit andbreak the wires inside the package. The condition must beavoided.

VII. Static electricity:< Crystal Oscillators >

Excessive levels of electricity may cause damage of ICinside of a Crystal oscillator even if an anti static electricityprotection circuit is provided in the circuit board. Please besure to use conductive packing materials and transportcontainers, and use the soldering gun and the measuringcircuit free from high-voltage leakage and providegrounding connection while using crystal oscillators.

VIII. Noise:< Crystal Oscillators >

Applying excessive levels of extraneous noise to powersupply or input pin may cause latch-up or spuriousphenomenon, which results in malfunction and breakdown.Do not permit any objects, which emit a high level of noisein a location near the Crystal Oscillator.

IX. Power supply lines:< Crystal Oscillators >Line impedance of a power supply should be as low aspossible. To maintain stable operation, power supplies tothe Crystal Oscillator should have by-pass capacitor(0.01µF ~ 0.1µF). Place the capacitor as close as possible to the CrystalOscillator supply pins (VDD and GND).Supply lines (VDD, GND) should be as wide as possible.

X. Output line:< Crystal Oscillators >To reduce the line impedance of the Output line andreduce the electromagnetic radiation, output load shouldbe installed as close as possible to the Crystal Oscillator.

XI. Input line:< Crystal Oscillators >Input pin (OE) is pulled up with an internal resister, but if itis not used, connect it to VDD.

XII. Storage:< All products >Storage of Crystal products under higher temperature orhigh humidity for a long term may affect frequency stabilityor solderability. Please store the Crystal products underthe normal temperature and humidity without exposing todirect sunlight and dew condensation, and avoid thestorage of Crystal products for more than 6 months, andmount them as soon as possible after unpacking.

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26

PRECAUTIONS IN OSCILLATION CIRCUIT DESIGNTo utilize Crystal units characteristics fully, is necessary todesign a oscillation circuit with optimal conditions.Based on Citizen's experience accumulated over the year,Citizen offers such service as checking the oscillation circuitdesigned by a customer with regard to items mentioningfollowing to ensure optimal matching between the crystal unitsand the oscillation circuit.The results of investigation with regard to items will be reportedto the customer as Citizen's "Circuit Investigation Report".

1. MOS Fundamental Crystal Oscillation CircuitCL : Load capacitance-R : Negative resistanceLe : Effective InductanceRe : Effective resistance

2. Load capacitance (CL)The Load capacitance (CL) refers to an effective external seriescapacitance in an assuming oscillation circuit that is viewedfrom the crystal unit side. Resonance frequency will be determined with the Loadcapacitance and the crystal unit.For this reason, differences in the load capacitance of theoscillation circuit may cause the frequency deviations (result ina different resonance frequency from the required one).

3. Negative resistance (-R)The Negative resistance reflects the allowance and margin foroscillation motility.An insufficient negative resistance may cause unexpectedtrouble such as No-Oscillation or slow start-up time.

4. Drive Current (i)The drive current refers to the current flows through a crystalunit. An excessive drive current that is applying a crystal unitmay cause the following trouble and phenomenon.

① Increase in the electromagnetic wave noise.②Crystal element of T/F breaking off③Get worse the characteristics of the crystal unit such as

frequency Tolerance, Frequency Tolerance over OperatingTemperature Range, Motional resistance (Series resistance)

5. Frequency-Voltage coefficientRepresents the rate of frequency change against variations inthe supply voltage.The cause of frequency changing by the power supply variationattributes to factors on the oscillation circuit side (especially IC)than the Crystal unit.It is normally desirable to keep within ±5ppm in the rate offrequency change against ±10% variation in the supply voltage.

6. Frequency tolerance over operating temperature rangeRepresents the rate of frequency change against various inoperating temperature.There may be a large difference between the oscillation circuitand the crystal unit in Frequency tolerance over operatingtemperature range.

7. How to Check a margin for oscillation motility① To know a margin for oscillation motility should check the

negative resistance (-R) of a oscillation circuit.② Connect a variable resistor (VR) to the oscillation circuit in

series with the crystal unit.③ To turn down the value resistor of VR from the NO-

OSCILLATION in abeyance to the oscillation START-UP.The value shall be the negative resistance (-R) at theoscillation starts up.

④ Adjust value of C1, C2 and Rd as the negative resistance tobe 5 times larger than the effective resistance in order to getenough margins for oscillation motility. And to get 10 times of -R to the effective resistance isrecommended for equipment that is required the high qualityand reliability such as auto-motive etc.

CL = + CIC + △CC1 + C2

C1   C2

External capacitance

Internal capacitance of IC

Stray capacitance of PCB

Equation of Load capacitance in Oscillation Circuit

Rd

Xtal

VR

Rf

C2C1

Oscillation circuit for checking -R

25 60

10

f/f(ppm)

TEMP.(℃)

Crystal unit

Oscillation circuit with the Crystal unit

(Example) Frequency tolerance over operating temperature range

Rd

Rf

Xtal

C2

Le CL

Re RC1

If required

Crystal unit

MOS Fundamental Crystal Oscillation Circuit

Correlation crystal unit and Oscillation Circuit

OscillationCircuit

Page 32: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

(Example Part Number)

CM315D 32 768 D Z F T

Model

CFS-206CFS-145CFV-206CMR200TCMJ206CM200CCM250CCM519CM415CM315DCM315DL CM2012

TAPE & REEL SPECIFICATION

TB

Tape & ReelBulk

ABCDEF

Series6.0pF9.0pF (STD)9.5pF12.0pF12.5pF (STD)

GQSVYZ

13.0pF10.0pF11.0pF8.0pF7.0pFOthers

Frequency Tolerance over Operating Temperature Range

Z

ABCDEFGHZ∗ Standard shall differ subject to frequency.

+/-30ppm+/-50ppm+/-100ppm+/-20ppm+/-10ppm+/-15ppm+/-25ppm+/-5ppmOthers

(STD)

(STD) 32.768kHz

Frequency

Frequency Tolerance (at 25℃)

Load capacitance (CL)

Please mention numeral of the frequency in Hz unit.

Standard Spec.

PART NUMBERING SYSTEMTuning Fork Crystal Units

When ordering or inquiring, please specify Part Number according to the following.

Page 33: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

Model

HC-49/U-SHCM49CM309S/ECS325S

TAPE & REEL SPECIFICATION

TB

Tape & ReelBulk

ABCDEFGH

Series6.0pF9.0pF9.5pF12.0pF12.5pF13.0pF15.0pF

IJKLMNOP

16.0pF18.0pF20.0pF22.0pF25.0pF30.0pF32.0pF33.0pF

QRSTUVYZ

10.0pF50.0pF11.0pF14.0pF17.0pF8.0pF7.0pFOthers

Frequency Tolerance over Operating Temperature Range

ABCDEFGHIJKL

+/-30ppm+/-50ppm+/-100ppm+/-20ppm+/-10ppm+/-30ppm+/-50ppm+/-100ppm+/-20ppm+/-10ppm+/-150ppm+/-200ppm

(-10 to +60˚C) (STD) (-10 to +60˚C) (STD)(-10 to +60˚C) (-10 to +60˚C) (-10 to +60˚C) (-40 to +85˚C) (-40 to +85˚C) (-40 to +85˚C) (-40 to +85˚C) (-40 to +85˚C) (-40 to +85˚C) (-40 to +85˚C)

(-40 to +85˚C) (-40 to +85˚C) (-20 to +70˚C) (-20 to +70˚C) (-20 to +70˚C) (-20 to +70˚C) (-20 to +70˚C) (-20 to +70˚C) (-40 to +100˚C)(-40 to +100˚C)(-40 to +100˚C)(-40 to +100˚C)

MNOPQRSTUVWXZ

+/-60ppm+/-80ppm+/-30ppm+/-40ppm+/-50ppm+/-60ppm+/-70ppm+/-80ppm+/-80ppm+/-100ppm+/-150ppm+/-200ppmOthers

∗ Shall not be available subject to the frequency.

ABCDEFGHZ

∗ Standard shall differ subject to frequency.

+/-30ppm+/-50ppm+/-100ppm+/-20ppm+/-10ppm+/-15ppm+/-25ppm+/-5ppmOthers

(STD)(STD)

Frequency

Frequency Tolerance (at 25℃)

Load capacitance (CL)

Please mention numeral of the frequency in Hz unit.

PART NUMBERING SYSTEMAT-Cut Crystal Units

When ordering or inquiring, please specify Part Number according to the following.

(Example Part Number)

CS325S 20 000 000 A A J T

Page 34: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

(Example Part Number)

CSX-750 FC C 20 000 000 T

Series

SSX-750PCSX-750F

TAPE & REEL SPECIFICATION

TB

Tape & ReelBulk

Frequency Stability

B

C

EFZ

+/-50ppm+/-50ppm+/-100ppm+/-100ppm+/-50ppm+/-100ppmOthers

(-10 to +70˚C) (-20 to +70˚C) (CSX-750)(-10 to +70˚C) (-20 to +70˚C) (CSX-750) (STD) (-40 to +85˚C) (-40 to +85˚C)

∗ Shall not be available subject to the frequency.

Frequency

Please mention numeral of the frequency in Hz unit.

Model

Please chose specific model by referring each detail specifications.

PART NUMBERING SYSTEMQuartz Oscillators (Clock Oscillators, Programmable Oscillators)

When ordering or inquiring, please specify Part Number according to the following.

Page 35: Quartz Crystal Devices - endrich · Quartz Crystal Devices. As a global leader in miniaturization and precision technology, we are poised to carve out new product possibilities to

34

Series

CSX-750V

TAPE & REEL SPECIFICATION

TB

Tape & ReelBulk

Frequency Stability

BCEFZ

+/-50ppm+/-100ppm+/-50ppm+/-100ppmOthers

(-20 to +70˚C) (STD)(-20 to +70˚C) (-40 to +85˚C)(-40 to +85˚C)

∗ Shall not be available subject to the frequency.

Frequency

Please mention numeral of the frequency inHz unit.

Model

Please chose specific model by referring each detail specifications.

PART NUMBERING SYSTEMVoltage Controlled Crystal Oscillator

When ordering or inquiring, please specify Part Number according to the following.

(Example Part Number)

CSX-750 VJ B 20 000 000 T