qualcomm’s second generation 5g mmwave chipset, from modem ... · from modem to antenna a study...

©2020 by System Plus Consulting | SP20517 – Qualcomm’s Second Generation 5G mmWave Chipset, from Modem to Antenna | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qualcomm’s Second Generation 5G mmWave Chipset, from modem to antennaA study of the complete second generation of the 5G millimeter-wave chipset for handset applications, including the baseband modem SDX55M, the transceiver SMR526 and Antenna-on-Package QTM525.

SP20517 – RF report by Stéphane ELISABETHLaboratory Analysis by Youssef EL GMILI and Nicolas RADUFFE

May 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of ContentsOverview / Introduction 4

o Executive Summaryo Reverse Costing Methodology

Company Profile 8o Qualcommo 5G Technologies Roadmapo 5G mmWave Handset Challengeso 5G mmWave Antenna, module and system configurationo Samsung Galaxy S20 Ultra 5G Teardown

Market Analysis 29o RF Front-End Module Supply Chaino Connectivity Market Forecasto RFFE Market Forecasto 5G Commercial Rollout Summary

Physical Analysis 34

o Synthesis of the Physical Analysis

o Module Package 38 Package Views: Dimensions, marking, Block Diagram, Integration

Physical Analysis of the Baseband Module 44

o Baseband SiP 45 Package Views: Dimensions, marking

Package Opening: Views, Bill of Materials

Package Cross-Section : Dimensions, PCB Substrate

Summary of Physical Data

o Baseband SiP active dies 53 Die View, Dimensions, Delayering & main Blocs IDs Die Process & Cross-Section Die Process Characteristic

Physical Analysis of the Modulator 69

o Package 70 Package Views: Dimensions, marking, Opening

Package Cross-Section : Dimensions, PCB Substrate


o Modulator Die 75 Die View, Dimensions, Delayering & main Blocs IDs Die Process & Cross-Section Die Process Characteristic

Physical Analysis of the Antenna Module 86

o Antenna SiP 87 V1/V2 Package Views: Dimensions, marking, Opening, Bill of Materials V1/V2 Package Overview & 3D X-Ray deprocessing : Patch Antenna, Dipole

Antenna, Shielding, Routing, Cross-Section V1/V2 Package Cross-Section: PCB Substrate, Patch Antenna, Dipole Antenna


o Antenna SiP active dies 118 Die View & Dimensions Die Delayering & main Blocs Die Process: On Board Isolation, Transceiver

Die Cross-Section Die Process Characteristic

Physical Comparison 152 First vs. Second Generation of mmWave Chipset:Integration, Chipset, Baseband Die, AoP, Transceiver

Manufacturing Process 160o Synthesis of the main partso Baseband Processor, Modulator, Transceiver, PMIC Die Front-End Process &

Fabrication Unito SiP, FCBGA, AoP process & Fabrication Unit

Cost Analysis 177o Synthesis of the cost analysiso Yields Explanation & Hypotheses 180

o Baseband Processor Module 182 Dies Front-End Cost Dies Wafer and Die Cost

Baseband SiP Packaging and Component Cost

o Modulator 189 Dies Front-End Cost Dies Wafer and Die Cost

Packaging and Component Cost

o AoP SiP Packaging 195 Dies Front-End Cost Dies Wafer and Die Cost

AoP SiP Packaging and Component Cost

Estimated Selling Price 204

Feedbacks 209

Company services 211




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm SDX55M, SMR526 and QTM525.

Like the previous generation, the complete solution has been especially design for smartphone applications starting with Samsung and expected to spread to others designs. The module in the Samsung Galaxy S20 Ultra 5G, comes with five systems spread throughout the smartphone. The first System-in-Package (SiP) is the baseband processor, which uses standard Ball Grid Array (BGA) SiP Packaging. The second is the 5G mmWave Rx/Tx which uses standard Flip-Chip BGA (FCBGA) packaging. The other systems are the antenna module, which are spread around the corner of the smartphone in order to provide spherical coverage without any hand-blocking constraints.

Two version of the antenna modules are integrated in the flagship. The first version comes with a dipole antenna coupled with a patch antenna system. The patch antenna system is designed to provide a wide-band polarized radiation. Among the innovation in the antenna design, Qualcomm seems to integrate two type of antenna patch in the same form factor: Coupled Feed antenna with Dual-Polarized and Dual Band Patch Antenna. Moreover, the design in the routing, in the filtering and in the transceiver has led to a better stability of the power emission.

This report includes a full investigation of the system, featuring a detailed study of the SiPs, including die analyses, processes and board cross-sections. It contains a complete cost analysis and a selling price estimation of the system. Finally, it features a technical and cost comparison with the structure of the first generation of 5G mmWave Chipset from Qualcomm.




Overview / Introduction

Company Profile & Supply Chain o Qualcommo 5G technologyo 5G mmWave challengeso 5G mmWave configurationo Samsung Galaxy S20 Ultra 5G

Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Samsung Galaxy S20 Ultra 5G Teardown

Samsung Galaxy S20 Ultra 5G USA Opening©2020 by System Plus Consulting

Samsung Galaxy S20 Ultra 5G – X-Ray View©2020 by System Plus Consulting

Antenna Module – X-Ray View©2020 by System Plus Consulting

5G Antenna Module






Market Analysis

Physical Analysis o Module Synthesiso Baseband SiP

Package SiP Cross-Section SiP Active Dies

o Modulator Package Cross-Section Die

o Antenna SiP Overview X-Ray Overview Package Antenna SiP Cross-Section Transceiver and PMIC Dies

Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Modules Views and Dimensions

Baseband Processor SiP• Package: XX-Ball SiP BGA

• Dimensions: XX x XX x XX mm

• Pin Pitch: XX mm

XX mmX

X m

mX

X m

m

5G Modulator• Package: XX-Ball FCBGA


• Pin Pitch: XX mm

XX mm

XX

mm

XX

mm

Qualcomm SMR526 – 5G mmWave Rx/Tx – Top, Bottom and Side view©2020 by System Plus Consulting

Qualcomm SDX55M – Baseband Processor – Top, Bottom and Side view©2020 by System Plus Consulting






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Modules Views and Dimensions

Antenna Module v1• Package: Antenna-on-Package


Antenna Module v2• Package: Antenna-on-Package


XX mm

XX

mm

XX

mm

Qualcomm QTM525 v1 – Top, Bottom and Side view©2020 by System Plus Consulting

Qualcomm QTM525 v2 – Top, Bottom and Side view©2020 by System Plus Consulting

XX mm

XX

mm

XX

mm






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Baseband Processor Module – Package Opening

Package Top/Bottom View©2020 by System Plus Consulting






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Baseband Processor Module – Modem Die Cross-Section – CMOS Transistor






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Modulator – Die View & Dimensions






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Antenna Module – X-ray View






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Antenna Module – X-Ray View – Version 1 – Dipole






Market Analysis





Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Antenna Module – Antenna Structure – Version 1/2

Layer #5

Layer #7






Market Analysis

Physical Analysis

Physical Comparisono 1st Vs. 2nd Gen.


Cost Analysis


Feedbacks

Related Reports

About System Plus

Qualcomm’s First vs. Second Generation mmWave Chipset

Samsung Galaxy 5G USA Plus Opening©2020 by System Plus Consulting

Samsung Galaxy S20 Ultra 5G Opening©2020 by System Plus Consulting






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Baseband FE Cost & Wafer/Die

Costo BB SiP Packaging Costo BB SiP Component Costo Modulator FE Cost & Wafer/Die

Costo Packaging Costo Component Costo Transceiver/PMIC FE Cost &

Wafer/Die Costo AoP SiP Packaging Costo AoP SiP Component Cost


Feedbacks

Related Reports

About System Plus

Baseband Processor Module – Modem Front-End Cost






Market Analysis

Physical Analysis

Physical Comparison








Feedbacks

Related Reports

About System Plus

Modulator Front-End Cost






Market Analysis

Physical Analysis

Physical Comparison








Feedbacks

Related Reports

About System Plus

Antenna Module – Packaging Cost






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

Feedbacks

Related Reports

About System Plus

Estimated Manufacturer Price






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• 5G’s Impact on RF Front-End Module and Connectivity for Cell

phones 2019• Advanced RF System-in-Package for Cellphones 2019• System-in-Package Technology and Market Trends 2020

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF & PACKAGING• Qualcomm’s First 5G mmWave Chipset: SDX50M and

QTM052• Mediatek Autus R10 (MT2706) 77/79 GHz eWLB/AiP

Radar Chipset• Infineon’s Radar Technology and Knowles’ Machine

Learning drive Google Pixel 4XL Gesture Recognition• RF Front-End Module Comparison 2020 – Volume 2



https://www.i-micronews.com/products/advanced-rf-sip-for-cellphones-2019/


https://www.systemplus.fr/reverse-costing-reports/infineons-radar-technology-and-knowles-machine-learning-drive-google-pixel-4xl-gesture-recognition/


https://www.systemplus.fr/reverse-costing-reports/mediatek-autus-r10-mt2706-77-79-ghz-ewlbaip-radar-chipset/


https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/




https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/

https://www.systemplus.fr/reverse-costing-reports/qualcomms-first-5g-mmwave-chipset-sdx50m-and-qtm052/



https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2020-volume-2/




SystemPlusConsultingS E RVI CES




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

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About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

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About System Pluso Company serviceso Contact

Contact

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qualcomm’s second generation 5g mmwave chipset, from modem ... · from modem to antenna a study...

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