comprising passivating the surface with an aqueous solution to inhibit the formation of whiskers, wherein the solution comprises l-50 g/L sodium dichromate, and 140% phosphoric acid, applying an aqueous rinse solution having a pH greater than 8 after passivation, and thereafter electroplating in a methane sulfonate solder bath to form a coating of solder, which is substantially whisker free.

Device for Removing Paint U.S. Patent 5327,869. June 21, 1994 R. Kaempf, assignor to Ceufsche Luffhansa AG, Germany

A device for removing paint from painted surfaces by utilizing high-energy jets.

Internal Abrading Tool U.S. Parent 5321,919. June 21, 1994 A.F. Scheider and R.B. Warner, assignors fo Jason Inc., C/eve/and

An internal abrading tool comprising an axial stem, said stem being in the form of a slender shaft, abrasive containing plastic filaments projecting radially of the shaft,

and bent through an arc having an angular component axially of the shaft,wherebi the filaments extend in a direction generally axially of the shaft.

Automatic Brush Plating Machine U.S. Patent 5,324,406. June 28, 1994 EM. Anderson et al., ass&nots fo Tosoh SMD Inc., Grove Cify, Ohio

An electrodeposition apparatus for de- positing one or more of a plurality of working solutions on a substrate.

Electrodeposition of a Dense, Reflective Tin or Tin-Lead Alloy U.S. Pafenf 5,326,453. July 5, 1994 D. Irz! Endicoff et al, assignors to Moforola Inc., Schaumburg, 111. and Technic Inc., Cranson, RI.

A solution for electrodepositing a tin or tin-lead alloy on a cathode, comprising an alkane or alkanol sulfonic acid and a tin alkane or alkanol sulfonate or a mixture of a tin and lead alkane or alkanol sulfonate; a modified additive comprised of at least one nonionic surfactant, wherein an additive is electrolyzed prior to electrodepositing a tin

or tin-lead alloy on a cathode to form the modified additive; and an aliphatic dialde- hyde.

Antireflective Surface Coating U.S. Pafenf 5,326,454. Jufy 5, 1994 DE. Engefhaupf, assignor fo Martin Marietta Corp., Bethesda, Md.

A method for application of a high specific area, antireflective surface to a substrate, comprising electrodepositing by a bipolar pulse plating method, which encompasses alternate plating and etching, a surface layer of metal exhibiting a dendritic crystal structure, and contacting with an oxidizing solution to form an oxide layer to form the antireflective surface.

Purge System for Automotive Powder Coating U.S. Patent 5,326,599. July 5, 1994 J. I?. Shufik, assignor to No&on Corp., W&fake, Ohio

A ‘method of powder spraying a work- piece having an exterior, a priir of side openings one on each side of the exterior, an additional opening on the exterior, and a

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hollow interior cavity connected to the openings, which comprises the steps of spraying powder on the exterior of the workpiece; positioning a pair of inlet hood assemblies respectively at the side open- ings on each side of the workpiece; con- necting the pair of inlet hood assemblies to a vacuum source; and purging the cavity of excess powder by extracting through the inlet hood assemblies.

Plural-Component Spray Painting System U.S. Patent 5,328,093. July 12, 1994 A. Feife/, assignor to Grace Inc., Go/den Va//ey, Minn.

A water-based plural-component sys- tem, comprising an electrostatic spray gun having an efectrically-charged tip for dis- pensing a homogeneous mixture of an electrically more-conductive component and an electrically less-conductive compo- nent.

Shot Peening Machine U.S. Patenf 5327,755. July 12, 1994 R.A. Thompson, assignor to Genera/ Electric Co., Schenectady, N. Y

A constant flow control device for a pressure-pot shot-peening system, com-

prised of an air supply; an air mass flow controller operatively connected to the air supply wherein the air mass flow controller is further comprised of a choked-nozzle flow control; a pressure pot operatively connected to the air mass flow controller; and a nozzle operatively connected to the pressure pot.

Microetchant for Copper Surfaces U.S. Patent 5,328,561. July 12, 1994 R.A. Letize et al, assignors fo MacDermid Inc., Waterbury, Conn.

A process for microetching a copper surface to remove copper therefrom and produce a remaining copper surface, which is microroughened, comprising contacting with an aqueous solution of cupric ion, ammonium hydroxide, and/or a source of ammonium ion, and a chelator for cupric ion other than ammonia selected from the group consisting of monoethanolamine, ethylenediamine tetraacetic acid, salts of ethylenediamine tetraacetic acid, and mix- tures thereof, said contacting being at a composition temperature of 85- 13O’F.

Dry-In-Place Conversion Coating U.S. Patent 5,328,525. July 12, 1994 EM. M&go et al, assignors to Betz Laboratories Inc., Trevose, Pa.

An aqueous acidic solution effective in forming a dried-in-place nonchromate con- version coating on a surface of Galvalume aluminum or alloys thereof consisting es- sentially of l&60% by weight of a polymer selected from the group consisting of polyacrylic acid and copolymers and ho- mopolymers thereof; 0.2-20% by weight molybdate, and 10-60% by weight dihy- drohexafluo acid.

Acid Copper Electroplating Baths U.S. Patent 5,328,589. July 12, 1994 S. Martin, assignor to EnthowOMl Inc., Warren, MiCh.

An improved high-acid low-copper elec- troplating bath comprising 13-45 g/L cop- per ions; 45-262 g/L of an acid with effective amounts of a bath-soluble multi- functional polymer, said polymer compris- ing at least three distinct ether groups, wherein one of the ether linkages is derived from an alcohol, a bisphenol A or an epoxy

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METAL FINISHING . APRIL 1995 95