provides a means to align a pattern on a chip to the pattern on a mask; and then to expose this...
Post on 21-Dec-2015
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TRANSCRIPT
bullProvides a means to align a pattern on a chip to the pattern on a mask and then to expose this pattern
UV-light
Mask quartz + Cr pattern
Photoresist
substrate
MASK ALIGNER INTRODUCTION
Pump service corridor
Lamp power supply
The aligner
Lamp house
microscope
Microscope Translation-control Mask holderAlignment stage
Manometer boxMirror house Sample
holder
Mercury lampbull g - line 436 nm bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer
1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Pump service corridor
Lamp power supply
The aligner
Lamp house
microscope
Microscope Translation-control Mask holderAlignment stage
Manometer boxMirror house Sample
holder
Mercury lampbull g - line 436 nm bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer
1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Lamp house
microscope
Microscope Translation-control Mask holderAlignment stage
Manometer boxMirror house Sample
holder
Mercury lampbull g - line 436 nm bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer
1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Mercury lampbull g - line 436 nm bull h-line 405 nm
bull i - line 365 nm
S-1800 series are g-line photoresit
Mercury lamp
bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer
1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Mercury lamp
bull Life time 600 hbullNitrogen cooling is very importantbullLamp must be cool before restarting hellip or you risk damaging the lamp Therefore wait ~30 minutes after previous use But it is better to leave the lamp on for several hours than turn off and on and off and on hellipbullThe first exposure after turning on the lamp should be done with no wafer
1048766If the bulb explodes it will fill the lithography area with toxic mercury vapor This can cause severe neurological damage EVACUATE THE LAB FOR AT LEAST 30 MIN The mask aligner will also be seriously damaged1048766
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Mercury lamp power supply
bull It can be operated at constant power or constant Intensity
bull Constant intensity better reproducibilitybull CI1 refers to 365 nmbull CI2 refers to 405 nm
In constant intensity mode the controller monitors the lamp intensity measure on the feedback sensor and
varies the power supplied to the lamp to keep the intensity selected
bullWe work with CI2 because is the power meter we have
I= 25mWcm2
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
1 Lamp
2 Elipsoidal mirror
3 Cold mirror
4 Flyrsquos eyes lens
5 Condenser lens (32mm)
6 Frame for filters
7 Diffraction reducing lens plates (69 mm)
8 Turning mirror
9 Front lens
UV-400 optics
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
WHATrsquoS NEWBefore NOW
Turn onoff the whole machine and Nitrogen in service corridor
ONLY H2 and air switches on the aligner controller unit
No vacuum no possibility of different exposures modes
Vacuum is available Possibility to choose
Height adjustment in contact NEVER height adjustment in contact
The Lever separation was not used
The lever separation must be used
Exposures in constant power mode
Exposures in constant intensity mode
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Air pressure and nitrogen switches
ONOFF
ON all the time
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
ONLY MOVE THE THIN ENDS
Travel limits
X 3mm
Y 3mm
3
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
CONTACT ARM
CONTACT-SEPARATION LEVER
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
Exposure modes Mode How does it work Resolution comments
Vacuum Contact (HP)
vacuum is drawn between the mask and the wafer prior exposure
~08 microm pitch RISK OF BREAKING THE MASK
Standard (ST)
Hard contact mode
During exposure the vacuum holding the substrate to the chuck is switched off and positive nitrogen pressure is used to press the substrate against the mask
~15 microm pitch RISK OF BREAKING THE MASK
Soft Contact mode The substrate is held to the mask just by mechanical pressure of chuck throughout the exposure The vacuum holding the substrate to the chuck remains on
~2 microm pitch SAFE
Proximity contact Exposures are made with a small gap between the mask and substrate The gap is determined by the height adjustment
Depends on separation
SAFE It has to be adjusted manually
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
-
1 Fiber optic light pipe
2 Single field splitfield shutter
3 Rotation for focus
4 Objective separation for splitfield operation
5 Iris diaphram
6 Objectives
SPLITFIELD= left shutter fully clockwise right shutter fully anticlockwise
Left objective=left shutter half way right shutter fully anticlockwise
Right objective=left shutter fully clockwise right shutter half way
MICROSCOPE
- Slide 1
- Slide 2
- Slide 3
- Mercury lamp
- Slide 5
- Mercury lamp power supply
- Slide 7
- WHATrsquoS NEW
- Slide 9
- Slide 10
- Slide 11
- Exposure modes
- Slide 13
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