project / subject name: industrial realization of cmos- integrated nanosensors contact person and...
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Project / subject name: Industrial Realization of CMOS-integrated Nanosensors
Contact person and organization: Anton Köck, AIT Austrian Institute of Technology GmbhE-mail address: [email protected] number(s): +43-50550-4302, +43-664-8251101
Grand challenge addressed (from AWP 2013): 7.3.2 “Competitiveness through Semiconductor Process Differentiation”
Acronym proposal: RealNano
Motivation
• Problem to be solved:Reliable fabrication and implementation of nano-components (nanowires, nanoparticles,…) on CMOS devices
• Research Domain:Heterogeneous Integration, 3D-integration, Nanotechnology; More than Moore
• Market innovation and impact:Employing nano-components for the realization of new devices, such as smart sensor systems (e.g. gas sensors in consumer electronic products, safety- and health-applications in smart phone)
WS on 3D SiP, ESREF 2012 Cagliari, Italy, October 1st, 2012
COCOA: Chip-On-Chip technology to Open new ApplicationsSTMicroelectronics + 19 partners (ams AG,…)
Device development
ESiP: Efficient Silicon Multi-Chip System-in-Package Integration –Reliability, Failure Analysis and TestInfineon AG + 41 partners (ams AG,…)
Reliability issues
Gas Sensors
WS on 3D SiP, ESREF 2012 Cagliari, Italy, October 1st, 2012
SnO2, CuO & ZnO-Nanowires + Nanoparticles
Reproducibility ! Each device is
unique ! How to implement
on CMOS-chip ?
SnO2
CuO SnO2CuO
WS on 3D SiP, ESREF 2012 Cagliari, Italy, October 1st, 2012
SnO2, CuO & ZnO-Nanowires + Nanoparticles
SnO2
CuO
CuO
ZnO
Objectives
• Brief description of a project/subject idea:Development of an industrial process chain enabling the implementation of nano-components on CMOS-chips
• Final objective:Demonstration of “nano-based” devices capable for mass production (e.g. gas sensor arrays,…)
• Main activities:Process development, nanowire synthesis (on wafer-scale), nanoparticle implementation, transfer processes, device development, device fabrication, reliability issues
Organizational
• Consortium statusPreliminary: AIT, ams AG, EVG, IMTEK(?), CAN
• Available key partners and capabilitiesAIT, ams AG, EVG, CANNW synthesis, 3D integration, wafer handling, NP production
• Missing capabilities and/or partners:Other partners employing nano-components, identifying additional “nano-enabled” devices (e.g. super-caps), definition of viable process chains
• Indicative size (person.years and Euro’s): t.b.d.• Program addressed (ENIAC/CATRENE): ENIAC