PRODUCT / PROCESS CHANGE INFORMATION

1. PCI basic data

1.1 Company STMicroelectronics International N.V

1.2 PCI No. AMS/19/11719

1.3 Title of PCI BURN IN time reduction for the selected MEMS Accellerometers.

1.4 Product Category See Products List

1.5 Issue date 2019-08-13

2. PCI Team

2.1 Contact supplier

2.1.1 Name ROBERTSON HEATHER

2.1.2 Phone +1 8475853058

2.1.3 Email heather.robertson@st.com

2.2 Change responsibility

2.2.1 Product Manager Andrea Mario ONETTI

2.1.2 Marketing Manager Simone FERRI

2.1.3 Quality Manager Michele CALDERONI

3. Change

3.1 Category 3.2 Type of change 3.3 Manufacturing Location

General (Test Program) Testing flow/coverage/strategy change KIRKOP (MALTA)

4. Description of change

Old New

4.1 Description BURN IN duration= 12 hours BURN IN duration= 6 hours

4.2 Anticipated Impact on form,fit,function, quality, reliability orprocessability?

No Impact

5. Reason / motivation for change

5.1 Motivation The implementation of the change assures the increase of the capacity without compromisingthe quality of the impacetd products.

5.2 Customer Benefit CAPACITY INCREASE

6. Marking of parts / traceability of change

6.1 Description Shipment Date

7. Timing / schedule

7.1 Date of qualification results 2019-08-09

7.2 Intended start of delivery 2019-09-09

7.3 Qualification sample available? Upon Request

8. Qualification / Validation

8.1 Description

8.2 Qualification report andqualification results

In progress IssueDate

9. Attachments (additional documentations)

11719 Public product.pdf11719 ASG5 (AIS1120-AIS2120) - BI Reject Analysis.pdf

10. Affected parts

10. 1 Current 10.2 New (if applicable)

10.1.1 Customer Part No 10.1.2 Supplier Part No 10.1.2 Supplier Part No

AIS1120SXTR

AIS2120SXTR

IMPORTANT NOTICE – PLEASE READ CAREFULLY

Subject to any contractual arrangement in force with you or to any industry standard implemented by us, STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2018 STMicroelectronics – All rights reserved

ASG5 BI Rejects Analysis

AMS operations

Outline

• With the aim to reduce ASG5 burn-in time, it has been necessary to

demonstrate that current burn-in does not contribute in screening devices

affected by early life reliability problem

• To address the above, an activity of analysis of burn-in reject has been

conducted

• The analysis has involved the rejects related to 191K of production

• It has been necessary to confirm the real failure condition of the burn-in rejects due to

known “false reject” induced by harsh burn-in environment like vibrations and socket contact.

• On every burn-in reject confirmed fail at ATE retest, a correlation analysis with burn-in stdf

file has been conducted in order to track the behavior of the device all along the burn-in time.

2

ASG5 test flow 3

FT1 amb

BI THS FT3 amb

FT5 cold

FT6 hot

BI system generates map indicating the parts to reject and the good ones (BIN 1).

BI reject preliminary analysis4

BI fallout has been analyzed in detail.

Preliminary data shows following results (hard bin)

0.43

0.57

BI Rejects

SPI Fail Accelerometer

• SPI fail: pieces in which SPI

check fails (Who am I check)

• Accelerometer: parts in which SPI

check was positive, but self test or

offset were out of spec.

A deeper analysis of the fails showed that SPI check and accelerometer

offset measured are highly impacted by vibrations generated by the fans of

the thermal chamber; vibrations induce mechanical noise capable in some

case to moves the parts inside the socket.

5BI acquisition

During burn-in, data are acquired on test session1(amb), test session2 and 3

(hot) and test session 4 (amb after cooling).

Analysis Results

• On 191K of ASG5 production, no reliability rejects were highlighted

• 4 parts are confirmed fails:

• 3 of them failed only at hot temperature. This result is acceptable in consideration of the fact that when parts are submitted to burn-in, they are not yet screened at hot by ATE.

• 1 part failed since burn-in T0 reading (then no burn-in stress was yet received)

• Thanks to the burn-in data analysis, it has been possible to demonstrate

that the failure at hot was not induced by burn-in stress (all the parts were

failed at BI since the first reading at hot temperature or first reading at

ambient)

• In the next slides detail of the failing parts with results at BI

6

Device #1

• Device fails for SELFTEST immediately at the beginning of BI curve as

soon as it gets to HOT and before returning to AMB. The device behaves

correctly at AMB.

• SELFTEST failure is confirmed at HOT test

=> Device failure @HOT, not induced by BI <=

7

Burn-In results Serial

X_STNEG DUT TEMPERATURE Test Session 762965

-1520 30 1

-800 125 2

-800 125 3

-1584 30 4

Device #3• Part works correctly at BI AMB step but shows catastrophic behavior on

SELFTEST / OFFSET at the beginning of BI curve as soon as it gets to HOT and

before returning to AMB.

• X OFFSET failure is confirmed at HOT test.

=> Device failure @HOT, not induced by BI <=

8

Burn-In results Serial

X offset X_STPOS X_STNEGDUTTEMPER

ATURETest Session 498315

2 1608 -1608 30 1

8191 -7328 -7328 125 2

8191 -7328 -7328 125 3

3 1592 -1616 36 4

Device #4

• Part works correctly at BI AMB step but shows catastrophic behavior on OFFSET

at the beginning of BI curve as soon as it gets to HOT and before returning to

AMB.

• Fail very stable at HOT at time 0

=> Device failure @HOT, not induced by BI <=

9

Burn-In results Serial

X offset DUT TEMPERATURETest

Session500331

3 33 1

8191 125 2

8191 125 3

5 37 4

10Device #2

• Device fails for EEPROM since T0 at ambient Test session1 (AMB)

• On ATE FDMA check is present at FT5

• The device fails on ATE retest for FDMA:Test #5240, FDMA Window Checked - FDMA_POSTBAKE_FT

Nominal: CPASS - In Limits

Die 3 : SDO CFAIL Fail (Pin 3, Ch 200)

Fail

=> Device failure for EEPROM, not induced by BI <=

Burn-In results

EEProm

ErrorDUT TEMPERATURE

Test

Session

1 29 1

1 125 2

1 125 3

1 18 4

Public Products List

Publict Products are off the shelf products. They are not dedicated to specific customers, they are available through ST Sales team,

or Distributors, and visible on ST.com

PCI Title : BURN IN time reduction for the selected MEMS Accellerometers.

PCI Reference : AMS/19/11719

Subject : Public Products List

Dear Customer,

Please find below the Standard Public Products List impacted by the change.

AIS2120SXTR AIS1120SXTR

Public Products List

IMPORTANT NOTICE – PLEASE READ CAREFULLY

Subject to any contractual arrangement in force with you or to any industry standard implemented by us, STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2018 STMicroelectronics – All rights reserved