product leaflet technical specs application note fileproduct leaflet technical specs application...
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Imaging for smart decisions
ApplicationsThe S-MIZE EM is particularly suited for all applications where a rug-ged, shockproof and light sensitive yet compact camera is essential:
• Airborne applications
• Range and ballistic tests
• On-Board MIL vehicle tests
Harsh industrial and research environments where cameras are ex-posed to vibration, impacts, dust, moisture and other challenging conditions
Why the S-MIZE EM• Robust design – designed for many years of industrial handling
and harsh environments (milled aluminum housing with heavy duty connectors)
• Ultra-compact, fitting into tight spaces like camera pods on aircrafts
•
S-MIZE EM – the ruggedized, ultra compact high speed camera for applications in the most demanding environmental conditions. More light sensitive, more compact than ever.
PRODUCT LEAFLET TECHNICAL SPECS APPLICATION NOTE
S-MIZE EM High Speed Camera
Unique features• Simple and easy to integrate – due to its built-in PowerPC,
the S-MIZE EM can duplicate the control- and status lines of a film camera. This plus the range of available connectors make the integration into a given environment, i.e. by replacing an older film-based camera, a cinch. Modifications on the air-craft as well as on the test routine are kept to a minimum.
• High Sensitivity – the S-MIZE EM offers a high light sensitiv-ity, allowing to use high lens apperture numbers for an ex-tended depth of field resp. using short shutter times to mini-mize motion blur of fast moving objects.
• In compliance with MIL standards – the S-MIZE EM is de-signed and built to withstand extreme ambient conditions; it complies with the relevant MIL standards (temperatures, shocks, vibrations, altitudes etc.)
• Autonomous operation – the built-in battery allows you to use the camera without external power cables and power- supplies. No risk that the camera interferes with the aircrafts power system.
AOS Technologies AG, Taefernstrasse 20, CH-5405 Baden-Daettwil Tel. +41 (56) 483 3488, Fax + 41 (56) 483 3489 [email protected] www.aostechnologies.com
S-MIZE EM positioned inside pod
Airborne housing for S-MIZE EM
Your local AOS partner:
Specifications are subject to change without prior notice – v07.2012
S-MIZE EM 90 with data- and I/O-connectors mounted sidewise (90 deg. off the standard model with connectors on the back plate)
Technical key specifications
Image Sensor Progressive CMOS, 1280 x 1024 pixels, mono or color
Sensor size (@ full resolution) 17.82 x 14.33 mm, 14 µm pixel size
Light sensitivity ISO 3200 (monochrome), ISO 1600 (color)
Dynamic range 5-, 8- or 10 bit, adjustable by user
Gain control User selectable, High Dynamic Range (HDR) mode
Frame rate at full resolution 500 fps @ 1280 x 1024 pixels
Typical fps/resolution settings 1280 x 1024 @ up to 500fps 900 x 700 @ up to 1’000fps 800 x 600 @ up to 1’250fps
Max. frame rate 100’000 fps
Shutter type Global electronic shutter
Shutter exposure times 4 µsec to 1/frame rate
Image memory Built-in DRAM, circular buffer
Sequence length 2 sec @ 1280 x 1024 / 500fps (1.3 GB memory)4 sec @ 1280 x 1024 / 500fps (2.6 GB memory)8.1 sec @ 1280 x 1024 / 500fps (5.2 GB memory)16.2 sec @ 1280 x 1024 / 500fps (10.4 GB memory)
Data Interface Gigabit Ethernet (1’000 Mb/s) RJ45, other connectors on request
Frame synchronisation Multi-camera operation
Sync in, Sync out (TTL) Yes
Memory Interface Built-in CF interface (optional),accepting CF cards for non-volatile data storage
Power supply Voltage range (24 – 36 V DC)
Power consumption 14 W (w/o data link), 18 W (with data link)
Battery Built-in, rechargeable NiMH battery allowing 15 minutes camera operation. Optional ‘extended battery pack’ available
Extended battery pack (optional) 2.5 hours battery capacity
Video Interface (optional) SDI (digital) or PAL/NTSC (analog)
IRIG B Interface IRIG B time stamping (requires external IRIG-B122, amplitude modulated signal)
Ext. temp range, storageExt. temp range, operation
-51…+70 ºC (-60…158 ºF)-51…+49 ºC (-60…120 ºF)
Shock resistance 100G for 15msec, 3 axis , up to 200G during short peaks
Size, weight (standard model) 74 x 71 x 80 mm, 700 gr92 x 71 x 67mm, 700gr (model ‘90’)
I/O Connector 1 GND (-) 2 V In (In) 3 Remote On (In) 4 Sync In (In) 5 Sync Out (Out) 6 Set-to-Rec (In) 7 Trigger (In) 8 Strobe (Out) 9 Armed (Out) 10 Triggered (Out) 11 Status 1 (In/Out) 12 GND 13 GND 14 IRIG-B (In)
LEMO Type: FGG.2B.314.CLAD82ZODU Type: S22LOC-P14MFGO-8200
10 12
3
456
7
8 14 1213
119
different pinout configuration and connectors on request
CEMIL
In compliance with relevant standardsIn compliance with MIL-STD-810 and MIL-STD-461