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Probe Card System for DHP Chip Testing

VXD Workshop, Wetzlar, February 4-6, 2013

H. Krüger, Bonn University

Motivation

• PXD modules are sensitive to single-point-of-failure of the DHP

• Up to know very little statistics of the DHP yield (+ flip chip mounting to wirebond adapters with low yield only)

• Need to qualify ICs before flip-chip mounting

VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn 2

DHP

To/from DCD (86 CMOS/HSTL)

To/from DHH (9x LVDS)

To Switcher (4x LVDS)

4 x LVDS

Gb

it T

X

4x

LVD

S

4x

JTA

G

18

x C

MO

S

64

x H

STL

4x

JTA

G

DHP Chip Probing Prerequisites

• What is needed:

– Needle card for solder bump probing

– Test bench for DHP environment

• IO signals from test system (DHH like)

• DCD input/output emulation

– Test procedure to provide full coverage

– Definition of cut parameters for chip classification

• Design is based on DHP 0.2

• DHPT 1.x will be pin compatible to DHP 0.2


Probe Station

DHP Chip Probe Test System

VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn

DHP test system

(XUPV5 FPGA Board)

Needle Card PCB

Probe Needles

FPGA

DCD emulation

Sequencer r/b

Power Supply

DHP

DA

C

Infiniband

Eth

GPIB or USB

JTAG

4

• 159 bumps need to be connected

• Material: lead free, LTS

• Pitch: 200µm (y), 180µm (x)

• ~110µm diameter

• Connections: – JTAG (4x LVDS)

– Timing (4x LVDS)

– Data Link (1x CML)

– Aux clock (2x LVDS)

– SWITCHER (4x LVDS)

– DCD out (8x 8 HSTL)

– DCD in (8x 2 CMOS)

– DCD timing (2x CMOS)

– DCD JTAG

– DCD_ref (analog)

– Power (8x VSS, 4x VDD, 2x VDD_CML)

– PLLxx2Fast

– FrameSync

– ResetB (CMOS)

– Analog IO test signals

20

0µ

m

180µm

36

85

µm

3685µm

bumps to connect: 159 out of 296

VXD Workshop, Wetzlar, Feb. 2013, H. Krüger, Uni Bonn -4

-3

-2

-1

0

0 1 2 3

Tho

usa

nd

s

Thousands

5

DHP test system

FPGA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

1 A no bump 180

0

540 0

900

0

1260 0

1620

0

1980 0

2340

0

2700 0

2 B 0

100

360 100

720 100

1080 100

1440 100

1800 100

2160 100

2520 100

3 C 180 200

540 200

900 200

1260 200

1620 200

1980 200

2340 200

2700 200

4 D 0

300

360 300

720 300

1080 300

1440 300

1800 300

2160 300

2520 300

5 E 180 400

540 400

900 400

1260 400

1620 400

1980 400

2340 400

2700 400

6 F 0

500

360 500

720 500

1080 500

1440 500

1800 500

2160 500

2520 500

7 G 180 600

540 600

900 600

1260 600

1620 600

1980 600

2340 600

2700 600

8 H 0

700

360 700

720 700

1080 700

1440 700

1800 700

2160 700

2520 700

9 J 180 800

540 800

900 800

1260 800

1620 800

1980 800

2340 800

2700 800

10 K 0

900

360 900

720 900

1080 900

1440 900

1800 900

2160 900

2520 900

11 L 180

1000

540 1000

900

1000

1260 1000

1620 1000

1980 1000

2340 1000

2700 1000

12 M 0

1100

360 1100

720

1100

1080 1100

1440 1100

1800 1100

2160 1100

2520 1100

13 N 180

1200

540 1200

900

1200

1260 1200

1620 1200

1980 1200

2340 1200

2700 1200

14 O 0

1300

360 1300

720

1300

1080 1300

1440 1300

1800 1300

2160 1300

2520 1300

15 P 180

1400

540 1400

900

1400

1260 1400

1620 1400

1980 1400

2340 1400

2700 1400

16 Q 0

1500

360 1500

720

1500

1080 1500

1440 1500

1800 1500

2160 1500

2520 1500

17 R 180

1600

540 1600

900

1600

1260 1600

1620 1600

1980 1600

2340 1600

2700 1600

18 S 0

1700

360 1700

720

1700

1080 1700

1440 1700

1800 1700

2160 1700

2520 1700

19 T 180

1800

540 1800

900

1800

1260 1800

1620 1800

1980 1800

2340 1800

2700 1800

20 U 0

1900

360 1900

720

1900

1080 1900

1440 1900

1800 1900

2160 1900

2520 1900

21 V 180

2000

540 2000

900

2000

1260 2000

1620 2000

1980 2000

2340 2000

2700 2000

22 W 0

2100

360 2100

720

2100

1080 2100

1440 2100

1800 2100

2160 2100

2520 2100

23 X 180

2200

540 2200

900

2200

1260 2200

1620 2200

1980 2200

2340 2200

2700 2200

24 Y 0

2300

360 2300

720

2300

1080 2300

1440 2300

1800 2300

2160 2300

2520 2300

25 Z 180

2400

540 2400

900

2400

1260 2400

1620 2400

1980 2400

2340 2400

2700 2400

26 AA 0

2500

360 2500

720

2500

1080 2500

1440 2500

1800 2500

2160 2500

2520 2500

27 AB 180

2600

540 2600

900

2600

1260 2600

1620 2600

1980 2600

2340 2600

2700 2600

28 AC 0

2700

360 2700

720

2700

1080 2700

1440 2700

1800 2700

2160 2700

2520 2700

29 AD 180

2800

540 2800

900

2800

1260 2800

1620 2800

1980 2800

2340 2800

2700 2800

30 AE 0

2900

360 2900

720

2900

1080 2900

1440 2900

1800 2900

2160 2900

2520 2900

31 AF 180

3000

540 3000

900

3000

1260 3000

1620 3000

1980 3000

2340 3000

2700 3000

32 AG 0

3100

360 3100

720

3100

1080 3100

1440 3100

1800 3100

2160 3100

2520 3100

33 AH 180

3200

540 3200

900

3200

1260 3200

1620 3200

1980 3200

2340 3200

2700 3200

34 AJ 0

3300

360 3300

720

3300

1080 3300

1440 3300

1800 3300

2160 3300

2520 3300

35 AK 180

3400

540 3400

900

3400

1260 3400

1620 3400

1980 3400

2340 3400

2700 3400

36 AL 0

3500

360 3500

720

3500

1080 3500

1440 3500

1800 3500

2160 3500

2520 3500

37 AM 180

3600

540 3600

900

3600

1260 3600

1620 3600

1980 3600

2340 3600

2700 3600

• Bump coordinates in µm

• Origin in upper left corner

• No bump at location (0,0)

• Bumps with no needle connection shown in gray



DHP 0.2 Layout Examples from vendor

8

Debug Probe Card

• PCB with active components, will need some debugging

• Very sensitive with needles attached

Dedicated debug “Probe” Card

• (almost) same netlist as needle card PCB

• replace needle footprint with DHP 0.2 wire bond adapter

Debug PCB is ready and tested

• DHP communication

• FPGA programming (DCD emulation, Switcher sequencer read-back)


Debug Probe Card

9

Needle Card PCB

Specs

• 6 layer PCB

• 3mm thick mechanical stiffness

Status

– PCB Design & Production

– Component mounting

– Testing

– Needle mounting

• needs ~4 weeks (@ HTT)


Needle Probe Card (w/o needles)

10

Probe Station Setup

• Needle card fixture

• We have diced chips only

– put single chips on chuck (Ok for now)

– “chess board” fixture with array of cavities for production testing tbd

• External components:

– Power supply

– DHP test system (FPGA board via Infiniband cables)

– extra JTAG for on board FPGA programming/readback , optional: can use JTAG from Infiniband connection


Probe Card System Status

• Hardware components of the needle card test system

– Debug probe card for HW verification and debugging

– Needle probe card: components mounted and tested, shipped for needle mounting end of January (takes ~4 weeks)

– Mechanical fixture for probe station

• Software

– based on DHP test system from Mikhail ()

– needs further extensions (for basic testing ok)

• (more) systematic sequencer and DHP DAC output read-back

• automation of test sequences

• coverage…

• definition of cut parameters

• …

• Planning

– Start commissioning of the needle card system by end of Feb

– First (rudimentary) tested DHP chips supposed to be available in March


DHP Chip Availability

• Only small number of DHP 0.2 chips left (~15)

• Next chip version (DHPT 1.0) available by mid 2013

• Need certain number of tested chips for E-MCM and PXD6 large matrix assemblies

Possible scenarios:

a) DHP has high yield, enough Ok tested die for E-MCM + PXD6 (very optimistic)

no action needed

b) DHP yield not sufficient, need more chips (more likely)

i) Buy remaining MPW chips from MOSIS (rather expensive)

ii) Wait for DHPT 1.0 to become available (maybe too late)

iii) Recover unsuccessful DHP 0.2 flip chip assemblies (quite a few)

Recovery procedure

• De-solder and clean DHP chips (Valencia ?)

• Place new bumps (Heidelberg ?)


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