presenter: wolfgang heinz-fischer (heifi) · contact data: wolfgang heinz-fischer (heifi) head of...

Embedded Module Market

Make vs Buy

© TQ-Group l www.tq-group.com FTF Shenzhen 2014 - TQ Rev.100 Folie 1

Presenter:

Wolfgang Heinz-Fischer (HeiFi) Head of Marketing & PR / TQ-Group

Embedded Module Market Agenda


The market demand and situation

Make vs Buy

The market players

How to select the right supplier

Embedded Module Market Design Concerns / Design Goal


Time

Save

Technology

Manage

Risk

Min

imiz

e

Cost

Cut dow

n

Embedded Module Market Market Trend


How you solve this contradiction?

Modular Design!

Technology

is getting

more complex

Longer

development

time

Higher

design

risk

Shorter

Time-to

-Market

Less

HW Design

resources

Shorter

product

lifecycle

Embedded Module Market Modular Design (SOM/COM) Principle


Customer Applicationboard

20% to 40% flexible Design for perfect fit.

Resources and design focus on Application Know

How and Core Competence.

SOM/COM

Module

60% to 80%

done in COM

Module

Processor,

Memory and

general

Interface

Technology

delivered by

COTS

Modular Design Benefits


Faster Development Time

Processor core board (COTS) already ready and tested

Majority of the hardware design is available prior to the project start

Carrier / application board more simple and can be developed faster

Reference designs available and tested on development board /

starterkit

Software development can start from beginning on target platform

Performance test can be done before final prototype is ready

Customer Benefit = Time-to-Market

Customer Benefit = lower Product Cost



Cost Saving

Development cost only for carrier / application board

Carrier / application board less layer (COTS = 10 to 12, Carrier = 6 to 10)

Using additional feature elements that have already been tested

Lower risk for respin need, product ready after first shot

Lower risk for redesign during life cycle

Lower investment for development means lower interest cost

Reuse same COTS and design knowlege in other products (higher qty.)

Customer Benefit = Confidence / lower Cost



Reduce Complexity

Be able to design and manage the technology

Be able to manufacture the product

Design more simple carrier / application board

Benefit from design knowledge of COM vendor

COM vendor has the expertise to deal with high speed design

and multiprocessor



Customer Benefit = Confidence

Lower design risk by more simple carrier / application board design

By using tried and tested elements, get the design right first time

Lower risk for redesign during life cycle, due to more simple carrier

board design (redesign risk mainly on COM board)

Better chance to meet the planned market entry date

Lower investment risk by lower investment cost

Minimize Risk



In most cases the processor is not

the core competency of the customer

Modular Design enables you

to put the focus on your own core competency:

The Application!!!

Read article …

Modular Design Calculator


Webinar Thursday, Oct. 30, 17:00

Embedded Module Market The Market Offers


Embedded Module Market The Market Offers


< 100 Vendors

< 1.000 Boards

< 10.000 Arguments

Embedded Module Market The Module World


Embedded Module Market The Intel Module World


Embedded Module Market The Intel Module World


= Standard

PC/104

COMs ETX

XTX

Qseven

COM Express

SBC EBX

3.5“

PicoITX

Mainboard MiniITX

Embedded Module Market The Power Architecture Module World


Embedded Module Market The Power Architecture Module World


= Vendor specific

= few offers only

Embedded Module Market The ARM Module World


Embedded Module Market ARM Processors


Standard?

Embedded Module Market ARM Module Standards???


EDM Standard

SOM

TX Standard

Vendor specific

Embedded Module Market Standards


Pins defined in

Standard and

supported by Processor

Pins delivered by

Processor but not

connected

Pins defined in

Standard and not

supported

Pins defined in Standard and

supported by extra Chip

Embedded Module Market Standards


Standard = interchangeable, scaleable ???

Embedded Module Market Standard Offering


Embedded Module Market TQ Offering


Maximum Design Freedom

Embedded Module Market Guideline to select your module


How to select the right COM (Differenciation)

Application

Processor (Consumer / Industrial = Longevity)

Dimension

Memory System (Consumer / Industrial)

Connector System

No. of Pins (all Signals available?)

Pitch

Robust System (Schock / Vibration)

Current / Transfer Speed

other Specification

Longevity

Software Support

Vendor behind

Embedded Module Market Guideline to select vendor


How to select the right COM vendor (Differenciation)

How much experience has the vendor with the processor

How many people involved

Support

No. of support people

SW support (BSP, ???)

Design support

Application support

Own production

Test methods

Obsolescence management

Proven records Read article …

Embedded Module Market Guideline to select vendor


TQ-Modules offers … Complete, independent system

All necessary functions on board (DC/DC, sequencing, clocking)

Maximum memory size

Maximum safety (temperature & power control)

Single DC supply

All processor functions available on connector

Maximum robustness (connector system, industrial design)

Minimum board size

Built-in boot mechanism

Long time availability (> 10 years, life cycle management)

Starterkit available

BSPs available

SW & design support

Mainboard schematics review

Customized mainboard design and own production

„Made in Germany“ *xxx = TQ USPs

TQ-Group Produkt Portfolio



TQ-Group ARM Module Portfolio

ARM Cortex-A8

TQMa53

2.2 x 1.7 inch

(55 x 44 mm)

240 pin, 0.8 mm ARM9 / i.MX28

TQMa28

1.6 x 1 inch

(40 x 26 mm)

160 pin, 0.8 mm

ARM11 / i.MX35

TQMa35

2.1 x 1.7 inch

(54 x 44 mm)

320 pin, 0.8 mm

ARM Cortex-A9

TQMa6

2.8 x 1.8 inch

70 x 46 mm

360 pin, 0.8 mm

ARM9 / i.MX28

TQMa28L

1.18 x 1.18 inch

(30 x 30 mm)

161 pin LGA


TQ-Group Power Architecture Module Portfolio

PowerQUICC I / MPC8xx

TQM8xx

54 mm x 44 mm

280 Pin, 0.8 mm

PowerQUICC II Pro / MPC83xx

TQM8315M (MPC8315)

70 mm x 50 mm (MPC8315)

320 Pin, 0.8 mm (MPC8315)

TQM8360L (MPC8360)

77 mm x 75 mm (MPC8360)

500 Pin, 0.8 mm (MPC8360)

PowerQUICC III / MPC85xx

TQM8548

100 mm x 75 mm

600 Pin, 0.8 mm

QorIQ / P1 / P2

TQMP1xxx

TQMP2xxx

74 mm x 54 mm

360 Pin, 0.8 mm

MPC5200B

TQM5200 / TQM5200S

80 mm x 60 mm (TQM5200 with Graphic)

320 Pin, 0.8 mm

56 mm x 60 mm (TQM5200S no Graphic)

240 Pin, 0.8 mm

TQ-Group The Company


TQ-Group The Company


TQ = Technology in Quality

Founded 1994

1.275 Employees, 150 Design Engineers, >200 Mio € Revenue (As of May 2014)

Leading European CEM / E²MS Provider

OEM / ODM Provider (Embedded, Embedded Drives, Building Automation)

8 Manufacturing Locations, 5 Design Locations

ISO 9001, ISO 14001, ISO 13485 (Medical), EN 9100 (Aviation), ISO 16949 (Automotive) certified

Leading Freescale Partner since 1998

Managing Directors (Owner): Detlef Schneider (left) and Rüdiger Stahl

Head office: Seefeld / Delling (West of Munich) Germany

SMD Production Line: Durach Germany

Embedded Product: i.MX28 / ARM9 Module 1.6 inch * 1 inch


ARM9 / i.MX28 Module

40 mm x 26 mm

P2020 Module

75 mm x 54 mm www.tq-group.com

Contact Data: Wolfgang Heinz-Fischer (HeiFi)

Head of Marketing / Alliance Manager

[email protected]

mailto:[email protected]



presenter: wolfgang heinz-fischer (heifi) · contact data: wolfgang heinz-fischer (heifi) head of...

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