powerpoint presentation evolving to flexible, ... transparent carrier dynamic release layer...
TRANSCRIPT
July 2016© 2016 Uniqarta, Inc.
© 2016 Uniqarta, Inc.
Electronics Evolving to Flexible, Shaped Formats
2
© 2016 Uniqarta, Inc.
Today’s ICs not Suitable forTomorrow’s Flexible Devices
Standard ICs are too thick to bend
3
Thinned ICs are flexible
© 2016 Uniqarta, Inc.
Today’s Assembly Technology Can’t Handle Thin ICs
4
Challenges
• Thinning/Handling
• Dicing
• Pick-up
• Cracking
• Accuracy
• Throughput
• Interconnections
© 2016 Uniqarta, Inc.
FlexChip™ Process Designed for Ultra-Thin ICs
5
• Standard wafers
• Conventional tooling
• High throughput
• Extendable toultra-small ICs
patents pending
© 2016 Uniqarta, Inc.
On-Chip Handles Facilitate FlexChip Assembly
patents pending6
Thinned, Diced Wafer Handle Removal(pick-and-place or laser)
Die Placement
handle IC
ultra-thin IC
© 2016 Uniqarta, Inc.
Market Engagement and Support
7
SBIR grants
Multiple funded projects
Commercial Collaborations
Co. #1 Flexible displays
Co. #2 Molded electronics
Co. #3 Wide-area sensors
Co. #4 Embedded materials