PLASMA ASHING SYSTEMS

About ESI

ESI has been in business since 1986 with a focus on serving the Semiconductor, MEMS, Biomedical, Nanotechnology & LED industries worldwide. From consulting factories on yield improvements to refurbishing Gasonics, AMAT and LAM tools for customers. We have broad experience with Plasma etch and ash tools. Offering new tools, upgrades, spare parts, FE services and technical support. We have become the industry leader in remanufactured Gasonics L3510 Asher equipment. ESI’s experienced engineer team is the best guarantee for high quality service and support.

Support Highlights

Full process testing of tools in our class 100 cleanroom

All of our equipment goes through a series of rigorous tests which are

documented, standardized, and certified by performance and

reliability standards to ensure the highest quality.

Supplying solutions for customers who are faced with obsolete

machines or parts that are no longer OEM supported.

With our S3 Alliance Distributer, Local support is available

throughout Europe

Features

PC / Controller Configuration

Product Specification

e3511 SINGLE WAFER ASHING SYSTEM

e3511 SINGLE WAFER ASHING SYSTEM

True downstream mw plasma process uses a heated platen with temp up to 300° for extreme low damage Photoresist removal or light etch

Features

e3511 SINGLE WAFER ASHING SYSTEM

True downstream mw plasma process uses a heated platen with temp up to 300° for extreme low damage Photoresist removal or light etch

Process assisted with 1KW heat lamp for better uniformity/ash rate. Solid State lamp controller eliminates calibration requirement

Features

e3511 SINGLE WAFER ASHING SYSTEM

IDX Flexware

Versatile, Flexible & Configurable

Improve Performance and Yield

Easy User Interface in Windows 7 platform

SECS/GEM Compliant

Field Proven Performance

Easy-to-Use, Configurable Display

Features: PC/HMI

e3511 SINGLE WAFER ASHING SYSTEM Features: PC/HMI

Embedded Intel® Atom PC with Slice type I/O modules attached to the PC

Optional quad core Intel® Atom PC

Flash drive data storage & USB Backup for recipes/data

Easy to see 17” touchscreen

Built-in watchdog timer for safe operation

LED status of power and Digital I/O

e3511 SINGLE WAFER ASHING SYSTEM

Embedded PC Technical Data

Features: PC/HMI

e3511 SINGLE WAFER ASHING SYSTEM

Power supply system with DC-DC power supplies for cleaner power

Wafer cooling station with touch wafer sensor, works with substrates, glass etc.

Advanced Hine Hatm-5 pick and place robot

Muegge Gerling 1.2kw microwave generator

Wafer is over 24” from plasma source

6 pole Microwave applicator

Automatic photoemission end-point detection

Features: Sub-systems

PLASMA AND WAFER CHAMBER

ROBOT AND CHAMBER

COMPUTER AND I/O

e3511 SINGLE WAFER ASHING SYSTEM

Three Gases With Fourth Gas Option:

Gas1 4L O2

Gas2 500 sccm N2 or N2O

Gas3 2L N2 or N2/4%H2

MFC Configuration

e3511 SINGLE WAFER ASHING SYSTEM Product Specification

Gas Flows Pressure Platen Temperature μ-wave Power

Lamp Utilization Throughput Uniformity

Ash Rate System Matching Mobile Ion Concentration CV Shift Particle

Process

O2=1000 – 4000 sccm. N2/H2 = 100-1000 sccm; N2 – 100 –500 scc 0.5-> 5.0 torr 100° – 300° C

0-1200 watt at 2.45 GHz 0-100% (1000 watts) 1.2 μm blanket softbaked resist ashed to end point except for descums ≤ 300Å Descum/S.T. 45 - 60 WPH Baked Photoresist 45 - 60 WPH Implanted & Damaged Photoresist 25 - 55 WPH

Sigma, ashed to 50% of ≥ 1.2 μm With in Wafer 2% - 5% Wafer to Wafer 2% - 4% < 200Å - ≥4. μm./min. 2% - 5% (I sigma)

IEI0/cm2 – IEII/cm2 ≤0.1 volt <0.02/cm2, size of 0.2 μm

e3511 SINGLE WAFER ASHING SYSTEM Product Specification

Reliability MTBF MTBA

MTTR MTTA UPTIME (SEMI EI0-92 STD)

≥ 350 hr. ≥ 100 hr. ≤ 2 hr. for 80% of all downs <5 min. 90 – 98%

General Information

Substrate size Footprint Electrical Typical Process Gases

3 – 8 inch 75-200 mm 30” 762 mm) W x 38” (965mm) D x 58” (1473mm) H

200-240 VAC. 2 Phase, 50/60 Hz, WYE configuration, 30A Breaker O2, N2/H2, N2 – regulated 18 – 23 PSIG

Note – Due to the complexity of customer’s process variations and requirements, the above process performance can deviate or be improved. Therefore, customers should submit demo samples to the Application’s Lab via their sales person to establish the optimum applicable specifications and conditions. Actual numbers on reliability will depend upon specific support available through contracts, knowledge of people performing PM and sufficient consumables and spare parts on site.

e3510 upgrade Available as an UPGRADE TO ANY GASONICS L3500 SERIES TOOL

e3511 SINGLE WAFER ASHING SYSTEM

www.Esi-semi.com