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HUAWEI TECHNOLOGIES CO., LTD.
PIC Technologies for Intra- and Inter-
Distributed DC and Cloud-Access Ultra-
High Capacity Flex OTN
Presented @ 4th Symposium on Optical Interconnect for Data Centers
© Huawei Technologies – All Rights reserved 2016
Le Binh, European Research Institute, GRC
Huawei Technologies
PIC = Photonic Integraed Circuit
= Photonic InterConnection
HUAWEI TECHNOLOGIES CO., LTD.
Evolutionary Networks: Flattening Telcom Cloud Nets and DC Centric
Nets
Ultra-fast
Giga fiber/copper/co-ax/Wifi
E2E IP + Optical 400G/2T
Metro Core (coherent)
Backbone core
(Coherent)
Data Centers
(distributed/concentric)
Simplified
•No Congestion, Lower
Concentration Ratio
•Legacy Consolidation ,
Flattened Hierarchy
Agile
•SDN / NFV Enabled
•Telco OS
Cloud CO Cloud Edge
APP/Service
Core DC
Edge DC CO DC
Access
(DD/Coherent)
MIMO antenna
5G
Where and What PIC Technologies ????
APP
APP
Page 3
Transmission capacity/fiber and demands
10/11/2016
1980 1990 2000 2010 2020 2030 2040
106
109
1012
1015
1018
SSMF
WDM
WDM: EDFASSMF+DCFED
FA +Noises OA noises
Non-DCF Co-ORx DSP
SE –M-QAM
Flex Co-ORx DSP
Ext C- L-band Data Center Nets
Clouds – CRAN
Intra-Interconnection
4K Video
5G
IoT
Data Center Nets Flattened Telcom Nets
Inter DC-Telcom Net Inter-connections
100G-400G DWDM Deployment
Flex OTN (100G – 2-3Tbps) DC Networking
Nets-Interconnections
Multiple-fibers
Page 4
25-30Gbps Electrical 56Gbps Electrical? 50-56Gbps
Backplane Rate
SerDes Approach NRZ + FEC (Optional) SE-HoM? + FEC
Analog Tx / Digital Rx
10-13 pJ/bit (16nm)
Analog Tx / Analog Rx
7-10 pJ/bit (16nm)
Digital Tx / Digital Rx
>15 pJ/bit (16nm)
56-112Gbps Optical
PAM + FEC Optical Solution
28nm/16nm 7nm Photonics/simple photonics
CEI 56G-USR: ~2 pJ/bit
Optical I/O: ~5 pJ/bit
Optical I/O vs. Electrical I/O
Save Energy, Longer Reach
Optical
CEI 56G-LR: 10-13 pJ/bit (16nm)
Optical I/O About 7 pJ/bit
Electrical I/O About 10-13 pJ/bit (16nm)
Page 5
Optical switching using PIC micro-rings
Massive capacity Optical Interconnect Flex Rates/BW Channels
Page 6
Basic micro-ring net for 4-way switching (4W-MRSw)
Modulated channels
Multi-lamdas
vSW1 vSW2
Port 2 (out)
Port 3 (out)
Port 4 (out)
vSW1 & vSW2: voltage controlled
Switch signals
R1,R2, R3: micro-ring resonators
(driven by dual electrodes in push pull
Mode wideband filtering/passband
CSw = coupling switch
Switching principles
To switch lamda1 to port 2 (out) : Use R3
to resonate the required wavelength
Channel to R# and then switching out by
using the CSw3 coupler.
Similar for switching to Port 3 and 4 –
use rings R!, R2 or R3
Flex R1
Flex R3
Flex R2
CSw3
CSw2
CSw1
vSW2
Modulated channels
Multi-lamdas
Page 7
Hybrid PIC : Multi-Tbps super-channel optical transmitter
Page 7
Wideband Comb Gen
Narrow linewidth
Bank of
Cascade
Micro-ring pn Mod
Data-channels
Modulated channel
To be launched to SSMF
Page 8
Large-size small form-factor Switching matrix using 4-way micro-ring switches: applications Photonic switching in photonic kernal Data Centers
Multi-lamda selective
switched output port 3
Multi-lamda selective
switched output ports 4 Multi-lamda selective
switched output port 2
Modulated channels
Multi-lamdas
Modulated channels
Multi-lamdas
Modulated channels
Multi-lamdas
Micro-ring 4-way switch
(4W-MRSw previous slide)
Multi-bank elect.
switching signals
Micro-rings
SOI waveguides
Page 9
Large-size small form-factor Switching matrix using 4-way micro-ring switches: Apps Photonic switching/ distribution of ref. channels in photonic kernel (core) Data Centers
Multi-lamda selective
switched output port 3
Multi-lamda selective
switched output ports 4
Multi-lamda selective
switched output port 2
QD Comb Laser 1
Micro-ring 4-way switch
(4W-MRSw previous slide)
Multi-bank elect.
Switching/modulation signals
QD Comb Laser ith
QD Comb Laser N
Modulated channels
Multi-lamdas
Modulated channels
Multi-lamdas
Modulated channels
Multi-lamdas
Page 10
Flex Optical Filters by Cascade & Parallel Ring and MZDI
GND
ck
IN
OUT
dk dk
PS 1
(b) All-pole stage
(Resonant)
(tuning – piezo-elect)
PS 2
TC
m-Ring delay T
V1+
V2 +
OUT 1
OUT 2
(b) All-zero stage
(Interferometric)
Tuning piezo-electric
PassBands: 50, 75, 275, 375 GHz
V+
GND
GND
V+
1 2
1 1 2
ˆ ˆ ˆ ˆ( ) ( ) ( ) ( )ˆ ˆˆ ( ) .......ˆ ˆ ˆ ˆ( ) ( ) ( ) ( )
Mk M
k k M
z z z z z z z zH z A A
z p z p z p z p
- - - -
- - - -
OPTICAL FILTER BANDPASS FILTER Z-DOMAIN TRANSFER FUNCTION
Cascade - Sampling time = optical delay line (propagation)
Formed by Common Standard z-transfer form
1540 1542 1544 1546 1548 1550 1552 1554 1556 1558 15600
0.2
0.4
0.6
0.8
1
1.2
Magnitude Response of Butterworth Bandpass Optical Filter
Wave Length (nm)
Mag
nitu
de
Filter Order = 8
Passband Ripple = 0.5 dB
Stopband Ripple = -20 dB
1540 1542 1544 1546 1548 1550 1552 1554 1556 1558 15600
0.2
0.4
0.6
0.8
1
1.2
Magnitude Response of Chebyshev Bandpass Optical Filter
Wave Length (nm)
Magnitude
Filter Order = 6
Passband Ripple =0.5 dB
Stopband Ripple = -20 dB
1540 1545 1550 1555 15600
0.2
0.4
0.6
0.8
1
1.2
Magnitude Response
Wave Length (nm)
Mag
nitu
de
Photonic Switching Kernel + Er:OWA + High Res. OSA+ MCU
Page 11
Si-integrated Tunable
OXC Matrices
Er:
O
WA
Er:
OW
A
Planar Er: OWA
Er: OWA
optical fibers transporting
flex channels (North/South/East/West
Cloud DC
High Res. AWG/ PD Bank
PD Bank
High Res. AWG/ PD Bank
PD Bank
High Res. AWG/ PD Bank
PD Bank
High Res. AWG/ PD Bank
PD Bank
CONTROL
DSP
CONTROL
DSP
CONTROL
DSP
CONTROL
DSP
PD Bank
Fiber flex
channels
Fiber flex
channels
Fiber flex
channels
Fiber flex channels
CLOUD
F/RAN
CLOUD
Fiber/RAN
CLOUD
F/RAN
CLOUD RAN
Planar integrated Er:Al2O3 : gain and absorption
Page 12 Gain /cm factor versus % Er:conc. pumped by 80mW 980nm
Waveguide section EDWA Spiral structure section
Photonic Section
EDWA
980nm PL
Integrated Photonic Components
› Optical channels of Flex BW/Rates be
detected to feed MCU to control switching
at variable BW
› Setting routing path and path BW via ring
&MZ filtering net
› Si PIC play the major part in the
convergence of wireless and optical
technologies for economic.
› Planar Optical Amps to compensate losses
Page 13
HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 14
84 Channels Edge Coupling Prototype: Loopback Testing
3.5mm
84 Channel
Ceramic substrate
SiPh chip 12 x MCF
input
output
Each 7-core MCF could fanout to 7 SMFs
Fan-out 1 x 7-core MCF
7 x SMF
HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 15
84 Channels Surface Coupling Prototype
› 84-ch are coupled in area of 6mm x 2mm, density is 7-ch/mm2
› One-pass loss of 84-ch range from 4.1dB to 6.9dB
SiPh
Loopback
Circuit with
GCs3D
Interposer
10mm
9mm
6mm2mm
MCF Array
3D Interposer
900um
1270um
Channel Number
On
e-p
as
s In
se
rtio
n L
oss
HUAWEI TECHNOLOGIES CO., LTD. HUAWEI Confidential Page 16
Acknowledgement
› The author thanks to Dr. Song Xiaolu of Huawei HQ Shenzhen for the use of the two
slides on out coupling and multi-core or few-mode fibers to further increase the
routing capacity.
Page 16