photonic integrated circuit platforms for multi project ...€¦ · •hybrid combinations between...
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Photonic Integrated Circuit platforms for Multi Project Wafer access
Technologies: InP, Si, TriPleX
TriPleX: Low loss, spot size converters
InP: Active components
Fraunhofer HHI
• Rx: 40GHz Photodiodes
• Tx: 25Gb/s Directly-Modulated Lasers
• Polarization Multiplexing: Pol.- Splitter and Converter
• Fiber-Chip Coupling with cleaved SSMF (Loss<2.0dB;
large 1dB-alignment-tolerance fiber-array coupling)
• Specific MPW offering
– Quick Turn-Around Time
(one MPW run every 3 months)
– Die size: 6 x 4 mm2
InP photonics: Tx-Rx Fraunhofer HHI
▪ 40G Rx - 25G Tx; SI substrate ▪ Polarization splitter and converter ▪ C-band wavelength range ▪ 2” MPW Wafers (soon 3”)
Passives MMIs, AWGs
3 etch depths
propagation loss = 0.5 - 2 dB/cm
PIN detectors (40GHz; Idark<10nA)
DFB lasers (25Gb DML)
DBR Lasers
SOAs EAMs Tunable DBR Gratings (4nm)
TO Phase Shifters (soon high-speed EO PMs)
SI substrate Pol.- Converter and Splitter (PER>15dB)
SSCs (MFD=10µm; 1.5-2dB Loss-to-SMF)
2” wafers (soon 3”)
Metal Interconnects (DC and RF)
InP photonics: Tx-Rx Fraunhofer HHI
▪ 40G Rx - 25G Tx; SI substrate ▪ Polarization splitter and converter ▪ C-band wavelength range
5Gb/s All-Optical Flip-Flop
Multi-Channel Transmitter
Short-Puls Generator
Optical Transmitter
InP photonics: Tx-Rx SMART Photonics
▪ Independent Pure Play III-V Foundry ▪ C-band wavelength range ▪ Sources, detectors and modulators
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▪ Extensive Building block library ▪ >150 designs fabricated ▪ MPW start every 3 months
▪ Passives, photodetectors, amplifiers,
lasers, high speed modulators ▪ Performance comparable to off-the-
shelf components!
InP photonics: Tx-Rx SMART Photonics
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Optical Gas Sensing: Mode Locked Laser
Widely tunable laser
Wavelength meter
▪ Independent Pure Play III-V Foundry ▪ C-band wavelength range ▪ Sources, detectors and modulators
TriPleX: a versatile dielectric photonic platform, Adv. Opt. Techn. 2015; 4(2): 189–207
TriPleX
• Adjustable polarization properties (sensors telecom)
• Low optical attenuation
• Small bend radii (small footprint!)
• Design by geometry
• Silicon and glass compatible
• Spot size converters for low loss fiber chip coupling
TriPleX photonics: MPW offering
✓ High Quality Passives (AWG, MZ, ring, ..) ✓ Low-loss waveguides ≤ 0.5 dB/cm ✓ Bend radii 125 µm allow real VLSI ✓ Spotsize converters for low coupling loss ✓ Thermo Optic Phase modulators
Visible light to IR transparency (405 to 2350 nm)
● Photonic ASIC prototypes in TriPleX MPW fab (typically a run every 4 months)
● Dies sized 16 x 16 mm2; 8 x 32 mm2
● Low-loss dielectric waveguides :
– silicon nitride
– silicon oxide
The PIX4LIFE project, a project funded by the EU under the H2020 programme (contract number: 688519)
Multi platform developments
• Hybrid combinations between different platforms
– Combinations between HHI-InP, SMART InP and TriPleX made.
TriPleX combines well with InP
• Hybrid Integration : combine the best of 2 worlds
TriPleX chip
InP Chip
Active devices Lasers, SOAs, fast modulators + PDs
Low-loss waveguides & spot-size converters Visible & NIR ranges
Tunable laser source
• Hybrid combination of InP gain section and TriPleX reflector chip to realize a tunable external cavity laser source with excellent specifications.