© 2014

Permanent Wafer

BondingApplication trends & Technology

Brewer Science

© 2014• 2

Table of content• Table of contents……………………………...2

• Objectives of the Study………………………4

• Definition, limitations & Methodology……..6

• 2011 vs. 2014 Analysis Comparison……….7

• Companies Cited in the Report…………..…9

• Glossary…………………………………….…..10

• Executive summary…………………………..12

– Methodology and Key Trends

– Bonding technologies vs Applications

2013-2019 Number of wafers bonded (wspy

– Permanent Bonding Market Forecasts(in wafer eq., $M)

• by Technology

• by Application

– Permanent Bonder Market Forecasts

(in Unit of Production)

– Breakdown by End Applications

– in 8 eq wspy

• in 8 eq wspy

• in $M

– Permanent Bonding Equipment suppliers’ Market

Share ………….………………………………..36

• Introduction, Definitions & Scope of the Report ..59

– Overview of the permanent bonding

technologies……………………………….64

•

• Main Players involved Permanent Bonding

Equipment ………………………………………..……67

• 2013-2019 Detailed Permanent Bonding

Market Forecast by Wafer bonding process……..71

– Permanent Bonding Market Forecasts by

technology (in $M)

– Permanent Bonding Market Forecasts by

technology (in wafer eq.)

– Fusion bonding…………..............................84

– Anodic bonding……………………………….109

– Glass frit bonding……………………………129

– Adhesive bonding……………………………139

– Eutectic Bonding……………………………..153

– Transit Liquid Phase bonding………………164

– Cu-Cu @ Room Temp bonding……………..175

– Thermo-compression bonding………………185

• 2013-2019 Detailed Permanent Bonding Forecast by

Applications…………………….……195

– MEMS devices…………………….208

– Advanced Packaging……..……..227

• CMOS Image Sensors

• 3D Stack TSV

– LED devices……………………….264

– SOI substrate………………………285

• Conclusions & Perspectives……………….300

• Company Presentation………………….…..305

© 2014• 3

Objectives of the study• This is the second research update on this market after our first report published in 2011 on

Permanent bonding technologies

• We described the main applications that require permanent bonding processes and as well as the

types of permanent bonding technologies

• Market Research Scope: the objectives of the report are:

– Give the detailed information regarding permanent bonding processes

– Describe the main applications using permanent bonding processes

– To provide an overview of the technological trends and applications that use permanent bonding processes

– To provide a forecast for the next five years, and predict future trends for permanent bonding

• Overview of the permanent bonding used in MEMS, Advanced Packaging, LED and SOI substrate applications

• Evaluate market developments in terms of market size

• in wafers, number of chambers, value in $M by application, by permanent bonding technology and wafer size

• We have focused on the following permanent bonding applications– MEMS

– Advanced Packaging

– LED

– SOI substrate

• We have not included:

– PV applications

– C2W approach

– Advanced Substrate such as SSOI, SGOI, GOI

© 2014• 4

Wafer bonding technologies

Without intermediate layer

Fusion bonding/ direct or molecular bonding

200°C<T<1100°C

Anodic bonding

350°C<T<450°C

With intermediate layer/ indirect

Insulating interlayer

Glass frit bonding

350°C<T<450°C

Adhesive bonding

T<150°C

Metal bonding

Cu-Cu/oxide hybrid bonding at RT

Solder bonding

Eutectic bonding

300°C<T<450°C

Transit Liquid Phase

180°C<T<300°C

Thermo-compression

• Permanent Bonding technologies– Throughout this report, we will address and cover the following permanent bonding

technologies

– Depending on the permanent bonding technology, the bonding step can be performed at

various temperatures

Wafer bonding technologyOverview

© 2014• 5

Scope of the Report

• Market scope:– Permanent wafer bonding is used in a wide range of devices in the semiconductor industry.

– Advanced Substrate will not be covered in this report

Applications of permanent bonding technologies covered

MEMS

LED

packaging

(for HB-LED)

WLCapping

Advanced Packaging LED

CMOS Image

SensorLED carrier:

Bonding to

the carrier

Back-Side

Illumination

Capping Wafer

Level Packaging

3D Stack

TSV

SOI Substrate

© 2014• 6

MEMS

Advanced Packaging LED

SOICIS

TSV

stacksCarrier HB-LED

BSICapping

WLP

Permane

nt

Bonding

Direct

bonding

Fusion

bonding

Anodic

Bonding

Indirect

bonding

Glass Frit

Bonding

Adhesive

bonding

Cu-Cu/ oxide

hybrid

bonding @RT

Solder

bonding:

Eutectic

Bonding

Solder

Bonding: TLP

Thermo-

compression

Bonding technologies vs Applications

Production

On development

© 2014• 7

WPSY MEMS

Advanced Packaging LED

SOICISTSV

stacksCarrier HB-LED

BSICapping

WLP

Permane

nt

Bonding

Direct

bonding

Fusion

bonding1.1M

8’’ eq

Anodic

Bonding

Indirect

bonding

Glass Frit

Bonding

Adhesive

bonding199 k

8’’ eq

Cu-Cu/ oxide

hybrid

bonding @RT

0 k

8’’ eq

Solder

bonding:

Eutectic

Bonding

Solder

Bonding: TLP

Thermo-

compression

Bonding technologies vs Applications

2013 Number of wafers bonded (wspy) 8 inch eq

© 2014• 8

0

2 000

4 000

6 000

8 000

10 000

12 000

14 000

16 000

18 000

2013 2014 2015 2016 2017 2018 2019

Nu

mb

er o

f w

afer

s (8

inch

eq

)

Wafer Forecast by Application (in 8 inch eq)(Report includes detailed breakdown for the following applications: 3D TSV stack, CIS BSI, CIS capping WLP, LED

carrier, LED packaging, MEMS, SOI)

Yole Developpement © April 2014

Wafer Forecast by Permanent Bonding

Technology (in 8 inch eq)

© 2014• 9

2013 Overall Market Share for Permanent Bonding

• The Permanent Bonding business is fragmented into EVG, SUSS MicroTec and TEL

• EVG, SUSS, TEL today concentrate almost 80% of the permanent bonding equipment

market by focusing on MEMS devices, Advanced Packaging (CIS BSI, WLP, 3D

Stacks), applications

Market share extracted from the preivous

report Permanent bonding in 2011Market share assessed in 2013

2013 market share breakdown by permanent bonding

equipment supplier (in M$)

(Report includes detailed breakdown for each supplier)

© 2014• 10

More slides extracts

© 2014• 11

Who Should Be Interested in This Report?

• Equipment & Materials suppliers – Identify new business opportunities and prospects

– Understand the differentiated value of your products and technologies in this market

– Identify technology trends, challenges and precise requirements related to permanent

bonding

– Evaluate market potential of your permanent bonding technologies

– Position your company in the market

– Monitor and benchmark your competitors

• IDMs, CMOS foundries & OSAT players – Understand technology trends related to permanent bonding applied in the MEMS, LED, CIS

and Advanced Packaging applications

– Spot new opportunities and define diversification strategies

• R&D organizations & Investors– Monitor the global activity and consolidation currently happening in the semiconductor

equipment & material business in order to identify new partners, targets and make the right

decisions before committing to one particular supplier

© 2014• 12

About the author of this report

Amandine Pizzagalli– Amandine is in charge of equipment & material fields for the Advanced

Packaging & Manufacturing team at Yole Développement after graduating as an

engineer in Electronics, with a specialization in Semiconductors and Nano

Electronics Technologies. She worked in the past for Air Liquide with an

emphasis on CVD and ALD processes for semiconductor applications.

Contact: pizzagalli@yole.fr

© 2014• 13

Companies Cited in this Report

AMD, AML, Applied Materials, Avago, Bosch, Discera, EVG, Infineon,

Invensense, Lemoptix, Luxtera, Mitsubishi Heavy Industries, Murata /

VTI, Nemotek, OSRAM, PlanOptik, Samsung, Sensonor, SOITEC, ST

Micro, SUSS MicroTec, Sony, Teledyne/Dalsa, Tokyo Electron, Ziptronix,

IMEC, Leti, Texas Instruments, Tezzaron, WiSpry, Ziptronix, and more…

© 2014• 14

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