part 3_manufacture flow.pdf

Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (1)

Manufacturing Manufacturing processprocess

Module Card


From the Chip to theFrom the Chip to the MicromoduleMicromodule

n To make a Smart Card, you need:Ø A chipØ A special filmØ A plastic card body

n A chip mounted on the film is called aMicromodule

n The micromodule is the interface with the outside worldØ The micromodule ensures electrical connection

with a smart card reader

The micromodule is the fruit of smart card makers’ know how

GEMPLUS


MicromoduleMicromodule Assembly Consists Assembly Consists of...of...

Contacts

Silicon wafer

A Chip

Active faceMicromodule

Connection Wires


A Film Holds ManyA Film Holds Many MicromodulesMicromodules

n The film design is different for each smart card maker

n The position of the contacts is determined by the smart card product standard: ISO 7816

n The micromodule is embedded in the card cavity

Roll of Film

Micromodule


Position of Contacts and Film Design

Micromodule

Vcc

RST

CLK

GND

NC

I/O

NC NC

ElectricalContacts

Example of Film Design

Examples


Module designModule design

Module Position & pads defined by ISO7816-2

Vcc

CLK I/O

RST Vpp

GND


Manufacturing ProcessManufacturing Process

Silicon Wafer

ChipMicromodule

Plastic granules ABSOr

PVC Core

Card body

Chip behind the module


MicromoduleMicromodule AssemblyAssembly

Chip

Micromodule

Silicon wafer

Chip

Pad connection

Resin

Sawing

Die bonding

Wire bonding

Potting

Visual inspection

Electrical testing

Embedding


Manufacturing FlowManufacturing Flow

Plastic granules

ChipMicromodule

Silicon wafer

Plastic bodyInjection

Offset Printing

Embedding Coding Final quality control

Packing

Micromodule

assembly

Clean room

Logo approval

Presence of quality control points at each manufacturing phase

Personalization

LaminatedprocessPVC Core


Module Module ManufacturingManufacturing

Understanding how micromodules are made


Assembly ProcessAssembly ProcessWhat isWhat is a module ?a module ?

n Module :Ø Result of a production process using

üChips provided by suppliers : Thomson, Siemens, Motorola..

üModule film

Ø Modules put on a cardbody during production process


Assembly ProcessAssembly ProcessDifferentDifferent module module shapesshapes

TGP B TGP M

8 Contact Small Heart & Big Heart

6 Contacts 8 Contacts Small Big Heart


Assembly ProcessAssembly ProcessManufacturing FlowManufacturing Flow

1. SAWING1. SAWING2. DIE BONDING2. DIE BONDING

3. WIRE BONDING3. WIRE BONDING4. POTTING4. POTTING

5. GRINDING5. GRINDING

6. ELECTRICAL 6. ELECTRICAL TESTINGTESTING6. VISUAL 6. VISUAL

INSPECTIONINSPECTION6.MANUFACTURING 6.MANUFACTURING

FILMFILM


Wafer sawingWafer sawing

Cutting silicon wafer into individual chips. Defective chips are marked with an ink drop.


Die BondingDie Bonding

Gluing the chip into the cavity located on the film, ensuring proper physical and electrical connection.


Die BondingDie Bonding


Wire BondingWire Bonding

Electrically connecting the chip's bonding pads and the contacts on the micromodule using gold wires.

This phase allows the chip electrical behaviour


Wire BondingWire Bonding


PottingPotting

Protecting the chip and wires with a drop of epoxy resin, ensuring the physical durability of the micromodule.


GrindingGrinding

Grinding the micromodule to the proper thickness prior to embedding.


Electrical TestingElectrical Testing

Sample testing of the micromodule prior to embedding.


Electrical TestingElectrical Testing


Visual InspectionVisual Inspection

ü Visual control of film roll to extract micromodules not compliant with Gemplus specifications.

ü Manual inspection to avoid presence of glue, dust etc.

ü Clean side necessary to ensure electrical contacts.


Gemplus Film ManufacturingGemplus Film Manufacturing

Laminated Lead Frame (Gemplus patent). This film is used to hold the micromodules prior to embedding.


Smart Cards Smart Cards ManufacturingManufacturing

Understanding how smart cards are made


Manufacturing FlowManufacturing Flow

FROM PLASTIC FROM PLASTIC GRANULESGRANULES

1. GRANULE HEATING1. GRANULE HEATING

5. OFFSET PRINTING5. OFFSET PRINTING

2. INJECTION2. INJECTION

4. QUALITY CONTROL4. QUALITY CONTROL

ABS

3. CARD MOLDING3. CARD MOLDING


MoldingMolding

n The manufacturing process is called molding:

Ø Plastic granules heated to 270°C

Ø dried and transformed in card bodies with cavity.

n Production in press machines.

n Injected card bodies are white cards.


Offset PrintingOffset Printing

Printing of an image on a card


Smart Smart cardscardsManufacturing FlowManufacturing Flow

1. VARNISHES1. VARNISHES

INJECTED CARDSINJECTED CARDS2. GRINDING2. GRINDING

LAMINATED CARDSLAMINATED CARDS3. EMBEDDING & TEST3. EMBEDDING & TEST

6. WRAPPING / 6. WRAPPING / PACKAGINGPACKAGING

6. FINAL 6. FINAL TESTTEST

5. PERSONALIZATION5. PERSONALIZATION

4. UNIVERSAL SIM4. UNIVERSAL SIM

FROM PRINTING FROM PRINTING CARDS...CARDS...


Options : Visual AdditivesOptions : Visual Additivesn Visual additives AFTER Artwork printing :

Ø Glossy Varnishü Shiny finish & Greater artwork protection

Ø Printable varnishü Allowed Graphical

personalization with Thermal

Transfer Technology

Ø …


Cavity GrindingCavity Grinding: : Laminated cards Laminated cards bodybody

n Grinding a cavity on the card body to place themodule.


Embedding & TestEmbedding & TestEmbedding: the module is inserted and glued

in the cavity.Test coding: an electrical test is carried out

and the embedded module is encoded.


Embedding & TestEmbedding & Test


PlugPlug--InIn

Cutting to plug-in format for mobile phones.


Final Quality Control Final Quality Control -- 11

Guarantee that the finished product complies with customer specifications.

ØAfter each Production step, statistical quality controls are performed on all batches

ØAfter Printing: Random sampling in each boxes to check quality of colors and printing artwork


Final Quality Control Final Quality Control -- 22

Ø After Coding/Initializationü Electrical test (memory content)

ü Physical test (flexion, torsion)

Ø After personalizationü Electrical test (data

loaded into the chips)

ü Graphical test (quality & coherence of printed data)


PersonalizationPersonalization

Graphic and electric personalization according to customer specifications, printing of mailers for cardholders.


PersonalizationPersonalization


WrappingWrapping & Packaging& Packaging

1.1. WrappingWrapping : : -- in blister in blister -- IndividuallyIndividually

-- in batchin batch

22. . OverwrappingOverwrapping 3.3. PackagingPackaging


PackingPacking


MailersMailersn The mailer is used to send the PIN/PUK code to the

final cardholder, separately from the card.n A mailer is made up of 3 or 4 layers and some

carbon zones.n Mailers can be pre-printed with customer logo.

Sheet 1 Sheet 2

Sheet 3

Address Address

Address

PIN

For end-user only.

Used for checkingprinting, thendestroyed.

Hol

dH

ere

Pu

llF

irmly


PackagingPlusPackagingPlus

n The packaging basic offer consists on :Ø handling documents to

be delivered with cards such as a card carrier, introducing letter, booklets...

Ø sticking the personalized card on the card carrier

Ø stuffing the card carrier together with docs intoan envelope

Ø sending the envelopes to premisces

n A card carrier :Pre printed card carrier

with logo and/or text

Customer Logo

CardText Area

Text Area

Text & AdressArea

Pre printed or Variable Text


GSM GSM PrepaidPrepaid KitKitn This is a complete package dedicated to the GSM prepaid

market.

n The standard kit contains :Ø a Sim card, a GemScratch card, a user guide, cover sheets

with marketing messages.Ø all these elements are packed in a wrapped CD box, belt

pack, pocket box, envelope packs, photo box, or card wallet


Smart Card Smart Card PersonalizationPersonalization

Artwork Electrical


The PlayersThe Players

Chip Manufacturer

Card Manufacturer

Card Issuer

Card Holder

Electronic Circuit

InitializationPersonalization

Cards Distribution( Personalization )

Manufacturing Process – Nicolas SMAYRABull & Innovatron PatentsAugust 2001 – (46) 5

Bull & Innovatron Patents

Personalization FlowPersonalization FlowDear Mr X :

Your card serial number:123456

Address

456 9987 8888

Mr John SMITH

Customer File

Blank papers Personalized card

Paper personalization and packaging

PERSONALIzATION

(DC 9000, Leroux)

Graphic

Electric

Magnetic

Document

Blank card


Gemplus KnowGemplus Know--HowHow

n InitializationØ Card associated with issuerØ Security conditions

n PersonalizationØ Application profile into every

card.The cards belong to one given application.

Ø Cardholder profile into the card: name, identification number...

Initialization

Personalization


Card personalization Card personalization n Electrical Personalization (downloading of data:

application & cardholder)Ø Private/personal dataØ Template / file structureØ Diversified keys

n Mechanical or Graphical Personalization (printing text or artwork on the card body)Ø Photos, holograms, magstripe encoding...Ø EmbossingØ Text printing

n Input file / output filen Packaging & shippingØ Mailer with PIN

My name My name

Making each card unique !Making each card unique !


ElectricalElectrical DataData

n Electrical personalization permits to put datas intothe chip

n From where data are taken from Ø From Input files sent by the customer in case of Full

Personalization (Electrical & Graphical Personalization)

Ø Directly generated by Gemplus in case of Pre-Personalization (Electrical personalization only)


GraphicalGraphical DataDatan Graphical personalization allows to print on the card

body serial numbers, bar code, photos on themodule or on the reverse side of the card.

n Different technologies are used for graphical personalization :Ø EmbossingØ Indent PrintingØ Colour PrintingØ Thermal transfer printingØ Laser EngravingØ Ink Jet


GEMPLUS GEMPLUS PersonalisationPersonalisation SitesSites

HavantZaventem

Herne

Filderstadt

Gemenos

Singapore

MontgomeryvilleTianjin

Sarcelles

Joint Ventures in Y2000Sites opening in 2001

Cuernavaca

Sao Paulo

Melbourne

Madrid

JohannesburgGemplus sites in Y2000

Zhuhaï

Tokyo

Gdansk


DATA EXCHANGE DATA EXCHANGE WITH GemplusWITH Gemplus


Data Exchange FlowData Exchange FlowNetworkOperator Gemplus

Artwork / Mailer definition

BAT sample cards "BAT": "Bon A Tirer"

BATApproval

?

Yes

No

Personalization specification

BAP sample cards"BAP": "Bon A Personnaliser

Gemplus

Post-Perso

BAPApproval

?

Yes

No

PersonalizationInput files / IMSI,Ki

Output files / personalized cards


Printing and MailingPrinting and Mailing

NetworkOperator Gemplus

Primary logo material

BATApproval

?

Yes

No

Printing guidelines

Cromalin orBAT sample cards

Mailer definition

BAT Mailer

Production

Guide


Personalization SpecificationsPersonalization SpecificationsNetworkOperator Gemplus

Approval?

Yes

No

BAP 10 sample cards / Input files

Personalization

Excel sheet

PersonalizationSpecification

Electrical personalization

Input/ Output files format

Graphic personalization

Mailer personalization

Input files format

BAPApproval

?Yes

No


Programming Option

Gemplus Software Tools

Memoryinitialization

Personalization post-perso

Silicon wafer

ser. N° ser. N°

Mr Smith


Card Life PhasesCard Life Phases


Card Life PhasesCard Life Phases

Manufacturing phase

Personalization phase

Card in the application phase ( End user )

TransportCode


Card Life CycleCard Life Cycle

IC Manufacturer Card Manufacturer

From From Manufacturing to Manufacturing to Application phaseApplication phase

Software Manufacturer

SystemIntegrator

Card AcceptingDevices

Card Issuer

End User

Gemplus is more than a Smart Card Manufacturer ...Gemplus is more than a Smart Card Manufacturer ...


ThankThankyouyou

Bull CP8 Patents

Q & AQ & A

part 3_manufacture flow.pdf

Documents