p-channel 30 v, 24 mΩ typ., 6 a stripfet h6 power mosfet · vdd = 16 v, tj = 150 °c - 15 ns qrr...

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AM01475v4 D(5, 6, 7, 8) G(4) S(1, 2, 3) Features Order code V DS R DS(on) max. I D P TOT STL6P3LLH6 30 V 30 mΩ 6 A 2.9 W Very low on-resistance Very low gate charge High avalanche ruggedness Low gate drive power loss Applications Switching applications Description This device is a P-channel Power MOSFET developed using the STripFET H6 technology with a new trench gate structure. The resulting Power MOSFET exhibits very low R DS(on) in all packages. Product status link STL6P3LLH6 Product summary Order code STL6P3LLH6 Marking 6P3L Package PowerFLAT 3.3 x 3.3 Packing Tape and reel Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed. P-channel 30 V, 24 mΩ typ., 6 A STripFET H6 Power MOSFET in a PowerFLAT 3.3 x 3.3 package STL6P3LLH6 Datasheet DS9257 - Rev 4 - March 2020 For further information contact your local STMicroelectronics sales office. www.st.com

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  • AM01475v4

    D(5, 6, 7, 8)

    G(4)

    S(1, 2, 3)

    FeaturesOrder code VDS RDS(on) max. ID PTOT

    STL6P3LLH6 30 V 30 mΩ 6 A 2.9 W

    • Very low on-resistance• Very low gate charge• High avalanche ruggedness• Low gate drive power loss

    Applications• Switching applications

    DescriptionThis device is a P-channel Power MOSFET developed using the STripFET H6technology with a new trench gate structure. The resulting Power MOSFET exhibitsvery low RDS(on) in all packages.

    Product status link

    STL6P3LLH6

    Product summary

    Order code STL6P3LLH6

    Marking 6P3L

    Package PowerFLAT3.3 x 3.3

    Packing Tape and reel

    Note: For the P-channel PowerMOSFETs the actual polarity of thevoltages and the current must be

    reversed.

    P-channel 30 V, 24 mΩ typ., 6 A STripFET H6 Power MOSFET in a PowerFLAT 3.3 x 3.3 package

    STL6P3LLH6

    Datasheet

    DS9257 - Rev 4 - March 2020For further information contact your local STMicroelectronics sales office.

    www.st.com

    https://www.st.com/en/product/STL6P3LLH6?ecmp=tt9470_gl_link_feb2019&rt=ds&id=DS9257

  • 1 Electrical ratings

    Table 1. Absolute maximum ratings

    Symbol Parameter Value Unit

    VDS Drain-source voltage 30 V

    VGS Gate-source voltage ±20 V

    ID(1)Drain current (continuous) at TC = 25 °C 6 A

    Drain current (continuous) at TC = 100 °C 3.8 A

    IDM(1)(2) Drain current (pulsed) 24 A

    PTOT Total power dissipation at TC = 25 °C 2.9 W

    Tstg Storage temperature - 55 to 150 °C

    TJ Max. operating junction temperature 150 °C

    1. The value is rated according Rthj-pcb.

    2. Pulse width limited by safe operating area.

    Table 2. Thermal data

    Symbol Parameter Value Unit

    Rthj-case Thermal resistance junction-case max 2.50 °C/W

    Rthj-pcb(1) Thermal resistance junction-pcb, single operation 42.8 °C/W

    1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec.

    Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed.

    STL6P3LLH6Electrical ratings

    DS9257 - Rev 4 page 2/12

  • 2 Electrical characteristics

    (TC = 25 °C unless otherwise specified)

    Table 3. On /off states

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    V(BR)DSS Drain-source breakdown voltage VGS = 0 V, ID = 250 µA 30 V

    IDSS Zero gate voltage drain currentVGS = 0 V, VDS = 30 V 1 µA

    VGS = 0 V, VDS = 30 V, TC = 125 °C 10 µA

    IGSS Gate-body leakage current VDS = 0 V, VGS = ±20 V ±100 nA

    VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 1 V

    RDS(on) Static drain-source on-resistanceVGS = 10 V, ID = 3 A 24 30 mΩ

    VGS = 4.5 V, ID = 3 A 38 50 mΩ

    Table 4. Dynamic

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    Ciss Input capacitance

    VDS = 25 V, f = 1 MHz, VGS = 0 V

    - 1450 - pF

    Coss Output capacitance - 178 - pF

    Crss Reverse transfer capacitance - 120 - pF

    Qg Total gate charge VDD = 24 V, ID = 6 A, VGS = 4.5 V

    (see Figure 12. Switching times testcircuit for resistive load)

    - 12 - nC

    Qgs Gate-source charge - 4.4 - nC

    Qgd Gate-drain charge - 5 - nC

    Table 5. Switching times

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    td(on) Turn-on delay time

    VDD = 24 V, ID = 3 A,

    RG = 4.7 Ω, VGS = 10 V

    - 15 - ns

    tr Rise time - 15 - ns

    td(off) Turn-off delay time - 24 - ns

    tf Fall time - 21 - ns

    Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed.

    STL6P3LLH6Electrical characteristics

    DS9257 - Rev 4 page 3/12

  • Table 6. Source drain diode

    Symbol Parameter Test conditions Min. Typ. Max. Unit

    VSD Forward on voltage ISD = 6 A, VGS = 0 V - 1.1 V

    trr Reverse recovery timeISD = 6 A, di/dt = 100 A/µs

    VDD = 16 V, TJ = 150 °C

    - 15 ns

    Qrr Reverse recovery charge - 6.5 nC

    IRRM Reverse recovery current - 0.9 A

    Note: For the P-channel Power MOSFETs the actual polarity of the voltages and the current must be reversed.

    STL6P3LLH6Electrical characteristics

    DS9257 - Rev 4 page 4/12

  • 2.1 Electrical characteristics (curves)

    Figure 1. Safe operating area

    ID

    10

    1

    0.1

    0.1 1 VDS(V)10

    (A)

    Opera

    tion i

    n this

    area

    is

    Limite

    d by m

    ax RD

    S(on)

    10ms

    1s100ms

    0.01

    Tj=150°CTc=25°CSingle pulse

    GIPG171120141448MT

    Figure 2. Thermal impedance

    Single pulse

    d=0.5

    0.05

    0.02

    0.01

    0.1

    0.2

    K

    10 tp(s)-4 10 -3

    10 -2

    10 -1

    10 -510 -3

    10 -2 10 -1 10 0

    case

    10 1

    GIPG171120141449MT

    Figure 3. Output characteristics

    ID

    25

    15

    5

    00 1 VDS(V)2

    (A)

    32V

    3V

    VGS=6, 7, 8, 9, 10V

    10

    20

    30 4V

    5V35

    40

    GIPG171120141450MT

    Figure 4. Transfer characteristics

    ID

    30

    20

    10

    00 4 VGS(V)7

    (A)

    2 6

    5

    15

    25

    35

    VDS=2V

    1 3 5

    GIPG171120141451MT

    Figure 5. Gate charge vs gate-source voltage

    VGS

    6

    4

    2

    00 8 Qg(nC)

    (V)

    24

    8

    12 16

    10

    28

    12

    4 20

    ID=6A

    GIPG171120141452MT

    Figure 6. Static drain-source on-resistance

    RDS(on)

    24.0

    23.5

    23.00 2 ID(A)

    (mΩ)

    1 3

    24.5

    VGS=10V

    4 5 6

    GIPG171120141453MT

    STL6P3LLH6Electrical characteristics (curves)

    DS9257 - Rev 4 page 5/12

  • Figure 7. Capacitance variations

    C

    600

    400

    200

    00 10 VDS(V)

    (pF)

    5 15

    Ciss

    CossCrss

    20 25

    800

    1000

    1200

    1400

    1600

    GIPG171120141452MT

    Figure 8. Normalized gate threshold voltage vstemperature

    VGS(th)

    1.0

    0.8

    0.6

    0.4-50 0 TJ(°C)

    (norm)

    -25

    1.2

    7525 50 100

    ID=250µA

    -75 125 150

    GIPG171120141455MT

    Figure 9. Normalized on-resistance vs temperature

    1.2

    RDS(on)

    TJ(°C)

    (norm)

    -50 0-25 7525 50 100-75 125 150

    1.0

    0.8

    0.6

    0.4

    1.6

    1.4

    GIPG171120141456MT

    ID=3A

    Figure 10. Normalized VDS vs temperature

    VDS

    TJ(°C)

    (norm)

    0.94

    0.96

    0.98

    1.00

    1.02

    1.04

    1.06

    ID=1mA1.08

    -50 0-25 7525 50 100-75 125 150

    GIPG171120141457MT

    Figure 11. Source-drain diode forward characteristics

    VSD

    0 4 ISD(A)

    (V)

    2 60.4

    0.5

    0.6

    0.7

    TJ=-55°C

    TJ=175°C

    TJ=25°C

    0.8

    0.9

    1.0

    GIPG171120141458MT

    STL6P3LLH6Electrical characteristics (curves)

    DS9257 - Rev 4 page 6/12

  • 3 Test circuits

    Figure 12. Switching times test circuit for resistive load Figure 13. Gate charge test circuit

    Figure 14. Test circuit for inductive load switching and diode recovery times

    STL6P3LLH6Test circuits

    DS9257 - Rev 4 page 7/12

  • 4 Package information

    In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,depending on their level of environmental compliance. ECOPACK specifications, grade definitions and productstatus are available at: www.st.com. ECOPACK is an ST trademark.

    4.1 PowerFLAT 3.3 x 3.3 type F mechanical data

    Figure 15. PowerFLAT 3.3 x 3.3 type F drawing

    BOTTOM VIEW

    SIDE VIEW

    TOP VIEW

    8465286_Rev2

    STL6P3LLH6Package information

    DS9257 - Rev 4 page 8/12

    https://www.st.com/ecopackhttp://www.st.com

  • Table 7. PowerFLAT 3.3 x 3.3 type F mechanical data

    Dim.mm

    Min. Typ. Max.

    A 0.70 0.80 0.90

    b 0.25 0.30 0.39

    c 0.14 0.15 0.20

    D 3.10 3.30 3.50

    D1 3.05 3.15 3.25

    D2 2.15 2.25 2.35

    e 0.55 0.65 0.75

    E 3.10 3.30 3.50

    E1 2.90 3.00 3.10

    E2 1.60 1.70 1.80

    H 0.25 0.40 0.55

    K 0.65 0.75 0.85

    L 0.30 0.45 0.60

    L1 0.05 0.15 0.25

    L2 0.15

    J 8° 10° 12°

    Figure 16. PowerFLAT 3.3 x 3.3 type F recommended footprint

    8465286_Rev2_footprint

    STL6P3LLH6PowerFLAT 3.3 x 3.3 type F mechanical data

    DS9257 - Rev 4 page 9/12

  • Revision history

    Table 8. Document revision history

    Date Revision Changes

    04-Mar-2013 1 First release.

    28-Nov-2013 2

    • Modified: PTOT value, silhouette and not found in cover page• Modified: VGS and PTOT values in not found

    • Modified: Rthj-pcb value and note (1) in Table 3: "Thermal data"• Modified: IGSS test conditions value• Modified: Qg in Table 5: "Dynamic"• Added: Table 9: "PowerFLAT™ 3.3 x 3.3 type F mechanical data", Figure 18:

    "PowerFLAT™ 3.3 x 3.3 type F drawing" and Figure 19: "PowerFLAT™ 3.3 x 3.3 type Frecommended footprint".

    • Minor text changes

    26-Nov-2014 3

    Updated Figure 1: "Internal schematic diagram".

    Added Section 4.1: "PowerFLAT™ 3.3 x 3.3 type C package information" and Section 4.2:"PowerFLAT™ 3.3 x 3.3 type F package information".

    Minor text changes.

    09-Mar-2020 4Updated Section 4 Package information.

    Minor text changes.

    STL6P3LLH6

    DS9257 - Rev 4 page 10/12

  • Contents

    1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

    2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

    2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

    3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

    4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

    4.1 PowerFLAT 3.3 x 3.3 type F mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

    Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

    STL6P3LLH6Contents

    DS9257 - Rev 4 page 11/12

  • IMPORTANT NOTICE – PLEASE READ CAREFULLY

    STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

    Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.

    No license, express or implied, to any intellectual property right is granted by ST herein.

    Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

    ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.

    Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

    © 2020 STMicroelectronics – All rights reserved

    STL6P3LLH6

    DS9257 - Rev 4 page 12/12

    http://www.st.com/trademarks

    1 Electrical ratings2 Electrical characteristics2.1 Electrical characteristics (curves)

    3 Test circuits4 Package information4.1 PowerFLAT 3.3 x 3.3 type F mechanical data

    Revision history