outline - tum lvivseptember2014.pdf · 1. introduction: the recent search for new superhard...
TRANSCRIPT
NAP , Lviv, September 22
The Recent Search for New Superhard Materials: Go Nano!
S. Veprek
Department of Chemistry, Technical University Munich, Garching, Germany
Outline 1. Introduction: The Recent Search for New Superhard Materials: Go Nano !
2. The role of interfaces for achieving high strength and hardness
3. The nc-TiN/SiNx system – brief summary
4. Other TmN/XY systems, TmN = TiN, ZrN, …; XY = SiC, BN, AlN
DFT & QMD Calculations & Thermodynamic Consideration
5. Summary and Outlook
Acknowledgment Dr. V.I. Ivashchenko Academy of Sci. Kiev,
Prof. R.F. Zhang, Beihang University, Beijing
Dr. M.G.J. Veprek-Heijman, Technical University Munich
Prof. A.S. Argon, MIT, Cambridge, USA
Dr. S.H. Sheng, TUM, now: Beihang University, Beijing
and many more
“superhard” ≥ 40 GPa “ultrahard” ≥ 70 GPa
c-BN ≈ 48 GPa Diamond ≈ 70 – 90 GPa
Hardness is only one of many properties: “hot hardness”; thermal stability; oxidation
& corrosion resistance; coefficient of friction; fabrication & price
H = average pressure beneath the indenter under conditions of fully developed plasticity H must be load invariant
sufficiently high load and thick coating
H = L/AC AC = contact area of remnant plastic deformation
ε – strain
Size Indentation Effect at low applied load
The meaning of Indentation Hardness
E. Meyer, Zt. D. Vereines Deutscher Ingenieure 52 Nr.17(1908)645 ; D. Tabor, The Hardness of Metals Clarendon Press, Oxford 1951
Load-invariant hardness
In the superhard nanocomposites the plastic flow take place by shear within the
grain boundaries (“G.B. sliding”),
therefore the load-invariant hardness is achieved already at relatively low load
S. Veprek, J. Vac. Sci. Technol. A 31 (2013) 050822
13.8 µm thick coating deposited by plasma
CVD with low biaxial stress of ≤ 0.4 GPa
30.6 µm thick coating deposited by reactive
sputtering with biaxial stress of ≈ 2 GPa
Note the role of the choice of the hardness of Si used for the calibration of the instrument
Many possible mistakes when using the automated load-depth sensing techniques
1 N
In the superhard nanocomposites the plastic flow take place by shear within the
grain boundaries (“G.B. sliding”),
therefore the load-invariant hardness is achieved already at relatively low load
S. Veprek, J. Vac. Sci. Technol. A 31 (2013) 050822
13.8 µm thick coating deposited by plasma
CVD with low biaxial stress of ≤ 0.4 GPa
30.6 µm thick coating deposited by reactive
sputtering with biaxial stress of ≈ 2 GPa
Note the role of the choice of the hardness of Si used for the calibration of the instrument
Many possible mistakes when using the automated load-depth sensing techniques
1 N
Whereas in many intrinsically superhard materials the load-invariant hardness
is reached only at large load
Example: ReB2:
Chung et al. Science 316(2007)436
ReB2 is not superhard !
Load-invariant
H < 30 GPa
Intrinsically Superhard Materials
attain their high hardness from
- strong covalent bonds,
- three-dimentional lattice network and
- electronic stability upon finite shear where plastic deformation occurs
Extrinsically Superhard Materials
attain their high hardness from
their nanostructure which impedes plastic flow
Diamonds are beautiful
Diamond is the hardest material
and sexy
Diamonds are beautiful
Diamond is the hardest material Can a material be harder than Diamond ?
and sexy
Strength of engineering materials << The ideal strength of flaw-free crystal
Ideal strength = The upper limit
1. Ideal Shear Strength:
relevant to plastic deformation
C 0.1G-Shear modulus
2. Ideal Decohesion strength: relevant
for brittle fraction & crack growth
2/1
0
a
Ec
YSurf
C
0.1EY
compres-
sive
tensile
0
Inte
rnal E
nerg
y
Strain
Decohesion Strength
max
0
d E
/dx
Ten
sile R
esis
tan
ce
Strain Large modulus hard material ?
What Determines the Strength & Hardness ?
No !
Elastic moduli describe reversible elastic deformation under infinitesimal strain whereas irreversible plastic deformation occurs at large strain where electronic
instabilities and structural transformation to softer phases may occur
Electronic instability at strain 0.24 Non-binding electron pairs on N interact with C-orbitals
Transformation of c-C3N4 to graphitic-like phase
The story of C3N4
Strain ε 0.1 0.2 0.3
M. Cohen et al., 1985: first principle calculation High B0 High H c-BN < C3N4 ≈ Diamond
Y. Zhang et al. 2006: B0 380 < 423 < 451 GPa
But: measured H(a-C3N4) ≈ 26-28 GPa
Veprek et al., J. Vac. Sci. Technol. A 13 (1995) 2914
c-C3N4 graphitic phase
Y. Zhang et al., Phys. Rev. B 73(2006) 064109
c-BN
Diamond
"Since B0 is related to the strength of a bond, it is
ultimately related to hardness."
“Bond Strength Based Models of Hardness”
M. Cohen et al., 1985, …
B(GPa)= 0.25NC(1971-220λ)/d(Ǻ)3 λ=“ionicity“ 1 for III-V; 2 for II-VI
H of an ideal single crystal ?
“Bond Strength Based Models of Hardness”
M. Cohen et al., 1985, …
B(GPa)= 0.25NC(1971-220λ)/d(Ǻ)3 λ=“ionicity“ 1 for III-V; 2 for II-VI
H of an ideal single crystal ?
“Hardness of an ideal crystal” ??
Hardness is the average pressure beneath the indenter under conditions of fully
developed plasticity no any “ideal crystal”
these “theories” confuse plastic hardness with elastic stiffness
5d transition metals high elastic moduli: Os: B0 ≈ 395-462 GPa
(Diamond 443 GPa) but low H≈ 3-4 GPa due to metallic bonds
Suggestion: “5d metals diborides should be superhard”
HOWEVER:
H(OsB2) ≤ 20 GPa Because of easy shear between Os-Os planes J. Yang, H. Sun, C.G. Chen, J. Am. Chem. Soc. 130(2008)720
H(ReB2) < 30 GPa due to electronic instabilities at finite strain
Zhang, Legut, Niewa, Argon and Veprek Phys. Rev. B 82 (2010) 104104
Veprek, Argon and Zhang, Phil. Mag. 90 (2010) 4101
Shear-induced structural transformations and low shear resistance upon finite strain in ultra-incompressible ReB2 limit its hardness
S. Veprek, A.S. Argon, R.F. Zhang, Phil.Mag. 90 (2010) 4101.
R.F. Zhang, D. Legut, R. Niewa, A. S. Argon and S. Veprek, Phys. Rev. B 82 (2010) 104104
γ
Valence Charge Density
in equilibrium
The boron rings intercalated between the Re planes are holding the structure together; Re-B bonds are weak
Re
B
Bond
breaking
Bond
recovers
γ
Re
B dσ/dγ < 0 inherent instability stress
decreases with increasing strain
0.0 0.5 1.0 1.5 2.0 2.5 3.00.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.11
0.12
0.13
VC
DBond distance
B1-B2
=0.0000
=1.1436
=1.5871
=1.9717
B B
Full recovery if stable
The Boron network which has been holding the system
collapsed due to 5d crystal field splitting instabilities
Boron network still strong
Shear-induced structural transformations and low shear resistance upon finite strain in ultra-incompressible ReB2 limit its hardness
S. Veprek, A.S. Argon, R.F. Zhang, Phil.Mag. 90 (2010) 4101.
R.F. Zhang, D. Legut, R. Niewa, A. S. Argon and S. Veprek, Phys. Rev. B 82 (2010) 104104
γ
Re
B dσ/dγ < 0 inherent instability stress
decreases with increasing strain
0.0 0.5 1.0 1.5 2.0 2.5 3.00.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.11
0.12
0.13
VC
DBond distance
B1-B2
=0.0000
=1.1436
=1.5871
=1.9717
B B
Full recovery if stable
The Boron network which has been holding the system
collapsed due to 5d crystal field splitting instabilities
Boron nettwork still strong
Shear-induced structural transformations and low shear resistance upon finite strain in ultra-incompressible ReB2 limit its hardness
S. Veprek, A.S. Argon, R.F. Zhang, Phil.Mag. 90 (2010) 4101.
R.F. Zhang, D. Legut, R. Niewa, A. S. Argon and S. Veprek, Phys. Rev. B 82 (2010) 104104 Complex changes of the interaction of B-atoms with
the d-orbitals of Re result in large changes of
electronic DOS at Fermi level
The complex transformations to phases with lower plastic resistance are
responsible for the sluggish approach to load-invariant hardness
In the nanocomposites the grain boundaries are
the carrier of plastic flow and, therefore, the
load-invariant hardness is achieved already at
low load of 50 – 100 mN
see above
ReB2
OsB2 & IrB2 Me-double layer yet different deformations paths R.F. Zhang et al. Phys. Rev. B (2014) in press
In equilibrium (strain ε = o) similar
structures with Me double layers only
slightly different inter- and intra-plane
Me-Me distances
IrB2 OsB2
Shear within the weakest slip system
(001)[100]
before and after instability
IrB2
OsB2
Similar structure but different deformation paths
Electronic structure:
Os: [Xe] 4f 14 5d6 6s2
Ir: [Xe] 4f 14 5d7 6s2
Diamond also transforms to Graphite upon (111)[11-2] shear (left) but because of its “simple” electronic structure
this transformation needs very high strain & stress (right)
Note: Diamond is metastable to Graphite, but Eact ≈ 700 kJ/mol
S. Veprek et al. Philos. Mag. 90 (2010) 4101
Diamond
Diamond
ReB2
ReB2
What about BC5 with H = 71 GPa – load invariant ! No such electronic instabilities expected in this material
V. L. Solozhenko, et al., Phys. Rev. Lett. 102(2009)015506
c- BC5 with H = 71 GPa – load invariant ! Synthesis at 24 GPa & 2000 K
V. L. Solozhenko et al., Phys. Rev. Lett. 102 (2009) 015506
Low ideal strength of 37 – 54 GPa < c-BN 58-62, Diamond ≥ 87 GPa
R.F. Zhang, S. Veprek and A.S. Argon, Phys. Rev. B 80 233401 (2009)
Explanation:
The Nanosize Effect
due to 10–15 nm small nanocrystals
The Strongest Size A.S. Argon & S. Yip, Phil. Mag. Lett. 86 (2006) 713
It cannot be
intrinsically superhard
The “Strongest Size” A.S. Argon & S. Yip, Philos. Mag. Lett. 86(2006)713
J. Schiotz & K.W. Jacobsen, Science 301(2003)1357; etc.
10-1
100
101
102
103
104
105
0
5
10
15
20
Grain
Boundary
Shear
Hall - Petch Hardening
H(d) = H0+ k/d0.5
Ha
rdn
es
s (
r.u
.)
Crystallite Size d (nm)
10-1
100
101
102
103
104
105
0,0
0,2
0,4
0,6
0,8
1,0
VG.B./Vtotal ~ 1/d
Vo
lum
e F
rac
tio
n o
f G
rain
Bo
un
da
rie
s (
r.u
.)
Crystallite Size d (nm)
Hall-Petch Strengthening:
Decrease of dislocation activity with decreasing crystallite size E.O. Hall, Proc. Phys. Soc. B 64 (1951) 747; N.J. Petch, Iron Steel Inst. 174 (1953) 25.
and other mechanisms of plasticity: slip, twinning, shear …
Below about 10-15 nm strong increase of the material
fraction in Grain Boundaries
Softening due to G. B. Shear
“the Strongest Size”
Generic Mechanism
working almost in any system e.g. TiAlN:
- Pure system d = 110 nm H = 22 GPa
- O-contaminated d = 20 nm H = 30 GPa
But: Fracture Toughness ?
See:
H. Riedl et al., ICMCTF San Diego, 28. April – 2. May 2014
How to Achieve Super- > 40 GPa & Ultrahardnes ≥ 80 GPa?
10-1
100
101
102
103
104
105
0
5
10
15
20
Grain
Boundary
Shear
Hall - Petch Hardening
H(d) = H0+ k/d0.5
Ha
rdn
es
s (
r.u
.)
Crystallite Size d (nm)
10-1
100
101
102
103
104
105
0,0
0,2
0,4
0,6
0,8
1,0
VG.B./Vtotal ~ 1/d
Vo
lum
e F
rac
tio
n o
f G
rain
Bo
un
da
rie
s (
r.u
.)
Crystallite Size d (nm)
Hall-Petch Strengthening:
Decrease of dislocation activity with decreasing crystallite size E.O. Hall, Proc. Phys. Soc. B 64 (1951) 747; N.J. Petch, Iron Steel Inst. 174 (1953) 25.
and other mechanisms of plasticity: twinning, shear …
Below about 10-15 nm strong increase of the material
fraction in Grain Boundaries
Softening due to Grain Boundary Shear
“the Strongest Size“
“the Strongest Size” Argon & Yip, Phil. Mag. Lett. 86(2006)713
We can reduce the G. B. Shear by
Low-Energy G. B. ?
Examples:
- Stacking Faults in Mg-Alloy prepared by SPD W.W. Jian et al., Mater. Res. Lett. 1(2013)61
- Nanotwinned c-BN H ≈ 108 GPa
Y. Tian et al., Nature 493(2013)385
- Nanotwinned Diamond H ≈ 200 GPa
Q. Huang et al., Nature 510 (2014) 250
Twins and stacking faults = coherent interfaces
10-1
100
101
102
103
104
105
0
5
10
15
20
Grain
Boundary
Shear
Hall - Petch Hardening
H(d) = H0+ k/d0.5
Ha
rdn
es
s (
r.u
.)
Crystallite Size d (nm)
-Nanotwinned c-BN
Y. Tian et al., Nature 493(2013)385
Energy of twinned G.B. ≈ 0.1 large-angle G.B.
TB – twin boundaries
STs – stacking faults
▲ - dislocations
It works but many open
questions: H enhancement still limited
to about a factor of 2
The role of other defects ?
▲ twinned c-BN
■ nc c-BN
How to Achieve Super- > 40 GPa & Ultrahardnes ≥ 80 GPa?
“the Strongest Size” Argon & Yip, Phil. Mag. Lett. 86(2006)713
108 GPa
Martensitic transition
Nanotwinned Diamond Q. Huang et al. Nature 510 (2014) 250
How to Achieve Super- > 40 GPa & Ultrahardnes ≥ 80 GPa?
nt- Diamond
natural Diamond
{110} face
{111}
The nt-Diamond shows also high fracture
toughness and oxidation resistance
“One cannot measure hardness larger than the
H of the Diamond indenter” ! e.g. press release of Saxonian Inst. Surf. Mechanics
elementary knowledge missing ∙/∙
ISE
Martensitic transition
Slip-Line Fields theory
R. Hill, The Mathematical Theory of Plasticity, Clarendon Press, Oxford 1950
F.A. McClintock and A.S. Argon, Mechanical Behavior of Materials, Addison-Wesley Publ., Reading 1966
A.Y. Ishlinsky, J. Appl. Math. Mech. (USSR) 8(1944)201
Strength of diamond in compression about 8-times higher than in shear
How can you measure hardness larger than
the H of the Diamond indenter ?
Indenter loaded in
compression
Material being indented
loaded in shear
“Ti-Si-N Films Prepared by Plasma-Enhanced Chemical Vapor Deposition”
Li Shizhi, et al., Plasma Chem. Plasma Process. 12 (1992) 278
H ≤ 70 GPa measured with load ≈ 490 mN on coatings ≈ 5 µm thin
Combined H of the film & soft steel substrate
These values underestimate the correct H(Film)
6.1 µm thick nc-TiN/a-Si3N4/TiSi2, load 1 N
Indent. depth ≈ 2 µm >15% elastic in the coating
S. Veprek & A.S. Argon, J.V.S.T. B 20 (2002) 650
Evaporate Pt strip & focused Ga ion beam etching S. Veprek in C.C. Koch et al. Structural Nanocrystalline
Materials, Cambridge University Press, 2007, Fig. 4.42
Deformation of the Film is Predominantly Elastic
The Hardness of the Films is much Higher
Measure with lower load on thicker coatings
Quasi-ternary nc-TiN/Si3N4/TiSi2 Nanocomposites Prepared by Plasma CVD
6.1 µm thick nc-TiN/a-Si3N4/TiSi2, load 1 N
Indent. depth ≈ 2 µm >15% elastic in the coating
S. Veprek & A.S. Argon, J.V.S.T. B 20 (2002) 650
Evaporate Pt strip & focused Ga ion beam etching S. Veprek in C.C. Koch et al. Structural Nanocrystalline
Materials, Cambridge University Press, 2007, Fig. 4.42
Li Shizhi et al.
1992
Tech. Univ. Munich MRS Symp Proc. 581 (2000) 321
Surf.Coat.Technol. 133-134 (2000) 152
Thin Solid Films 522 (2012) 274
nc-TiN/Si3N4/TiSi2
7.3 µm thick
Quasi-ternary nc-TiN/Si3N4/TiSi2 Nanocomposites Prepared by Plasma CVD
6.1 µm thick nc-TiN/a-Si3N4/TiSi2, load 1 N
Indent. depth ≈ 2 µm >15% elastic in the coating
S. Veprek & A.S. Argon, J.V.S.T. B 20 (2002) 650
Evaporate Pt strip & focused Ga ion beam etching S. Veprek in C.C. Koch et al. Structural Nanocrystalline
Materials, Cambridge University Press, 2007, Fig. 4.42
Tech. Univ. Munich MRS Symp Proc. 581 (2000) 321
Surf.Coat.Technol. 133-134 (2000) 152
Thin Solid Films 522 (2012) 274
0 50 100 150 200 250 300 350 400 450 500 550
0
20
40
60
80
100
120
FEM Calculations
Ha
rdn
es
s
(G
Pa
)
Load (mN)
Measurements
nc-TiN/Si3N4/TiSi2
7.3 µm thick
┼ measured
○ non-linear Finite Element Modeling M.G.J. Veprek-Heijman & S. Veprek, 2014 Submitted
Quasi-ternary nc-TiN/Si3N4/TiSi2 Nanocomposites Prepared by Plasma CVD
6.1 µm thick nc-TiN/a-Si3N4/TiSi2, load 1 N
Indent. depth ≈ 2 µm >15% elastic in the coating
S. Veprek & A.S. Argon, J.V.S.T. B 20 (2002) 650
Evaporate Pt strip & focused Ga ion beam etching S. Veprek in C.C. Koch et al. Structural Nanocrystalline
Materials, Cambridge University Press, 2007, Fig. 4.42
Tech. Univ. Munich MRS Symp Proc. 581 (2000) 321
Surf.Coat.Technol. 133-134 (2000) 152
Thin Solid Films 522 (2012) 274
0 50 100 150 200 250 300 350 400 450 500 550
0
20
40
60
80
100
120
FEM Calculations
Ha
rdn
es
s
(G
Pa
)
Load (mN)
Measurements
nc-TiN/Si3N4/TiSi2
7.3 µm thick
┼ measured
○ non-linear Finite Element Modeling M.G.J. Veprek-Heijman & S. Veprek, 2014 Submitted
Correct harndess of coatings by
Li Shizhi et al. 1992
calculated by non-linear FEM
● Li
3. The quasi-binary are more sensitive to oxygen impurities, but H ≈ 65-70 GPa has
been reported when [O] ≈ 100 ppm.
SEM Micrograph of an indentation into
about 8 µm thick nc-TiN/Si3N4 coatings with
a load of 110 mN
Thin Solid Films 522(2012)274
1. The quasi-ternary nc-TiN/a-Si3N4 /TiSi2 are unstable in long-terms because of the
metastable TiSi2
2. The quasi-binary nc-TiN/Si3N4 are stable for years (measured up to 5 Y)
Why such High sensitivity ?
(a)
High Sensitivity of Interfaces to Impurities 100 ppm Bi in Cu Embrittlement known since > 100 Years
(b)
double-layer at high Bi activity (also in Ni)
J. Luo et al., Science 333(2011)1730
J. Kang et al., Phys. Rev. Lett. 111(2013)055502
A. Kundu et al. Scripta Mater. 68(2013)146J.
a) Theoretically Predicted Structure (V. Vítek et
al., in: Interfaces: Structures and Properties, ed. S.
Ranganathan, Trans. Tech. Publ., New Dehli 1999, p. 3;
Min Yan et al., Phys. Rev. B 47 (1993) 5571)
b) HR TEM image (M. Rühle et al., in: Inst. Phys.
Conf. Series No. 161: Section 1, 1999 IOP Publ. Ltd, ed.
C. J. Kiely, p. 1)
3. The quasi-binary are more sensitive to oxygen impurities, but H ≈ 65-70 GPa has
been reported when [O] ≈ 100 ppm.
SEM Micrograph of an indentation into
about 8 µm thick nc-TiN/Si3N4 coatings with
a load of 110 mN
Thin Solid Films 522(2012)274
1. The quasi-ternary nc-TiN/a-Si3N4 /TiSi2 are unstable in long-terms because of the
metastable TiSi2
2. The quasi-binary nc-TiN/Si3N4 are stable for years (measured up to 5 Y)
Questions:
Why no other researchers reproduced these results
for nc-TiN/Si3N4 and other nc-TmN/XY ?
The usual answers:
“Veprek measured incorrectly the hardness”
See: stan.veprek.net
What can be wrong with these measurements ? nothing !!
Questions:
Could there be another explanation of this
“lack of reproducibility of high Hardness of
nc-TiN/Si3N4 and other nc-TmN/XY”?
The answers will come in this lecture
Outline 1. Introduction
2. The role of interfaces for achieving high strength and hardness
3. The nc-TiN/SiNx system – brief summary hardening mechanism?
4. Other TmN/XY systems, TmN = TiN, ZrN, …; XY = SiC, BN, AlN
DFT & QMD Calculations & Thermodynamic Consideration
5. Summary and Outlook
10-1
100
101
102
103
104
105
0
5
10
15
20
Grain
Boundary
Shear
Hall - Petch Hardening
H(d) = H0+ k/d0.5
Ha
rdn
es
s (
r.u
.)
Crystallite Size d (nm)
10-1
100
101
102
103
104
105
0,0
0,2
0,4
0,6
0,8
1,0
VG.B./Vtotal ~ 1/d
Vo
lum
e F
rac
tio
n o
f G
rain
Bo
un
da
rie
s (
r.u
.)
Crystallite Size d (nm)
Hard & Superhard nc-TiN/Si3N4 Nanocomposites:
Strong Interface
The G.B. Shear is reduced down to crystalite size of 3-4 nm
by the formation of strong interface
Thin Solid Films 522 (2012) 274; J. Vac. Sci. Technol. A 31 (2913) 050822
“the Strongest Size” Argon & Yip, Phil. Mag. Lett. 86(2006)713
How to Achieve Super- > 40 GPa & Ultrahardnes ≥ 80 GPa?
nc-TmN/Si3N4
HMax. at 1 ML Si3N4
which is strengthened by valence charge transfer from TiN
at 2 ML the H-enhancement lost due to too much weakening of TiN
1 ML 2 ML
a(TiN) = 4.23 Ǻ
a(VN) = 4.14 Ǻ
a(W2N)= 4.13 Ǻ
Absence of dislocation activity in 3-4 nm size polycrystals
the 1 ML (monolayer) thick interfacial Si3N4 strengthened by valence charge transfer
but weakening of Ti-N bonds adjacent to the Si3N4- like interfacial layer
lost of hardness enhancement at 2 ML Si3N4 because of the weakening of Ti-N bonds adjacent to the SiNx
S. Hao et al. Phys.Rev.Lett. (2006); Phys. Rev. B (2006) – Si3 N4 – like interfaces
R.F. Zhang et al. Phys. Rev. Lett. (2009); Phys. Rev. B (2009); (2010) – pseudomorphic SiN interfaces
Valence Charge Density Difference calculated by DFT
Hard & Superhard nc-TiN/Si3N4 Nanocomposites:
Strong Interface
De-cohesion strength > ideal strength of single crystal
Absence of dislocation activity in 3-4 nm size polycrystals
the 1 ML (monolayer) thick interfacial Si3N4 strengthened by valence charge transfer
but weakening of Ti-N bonds adjacent to the Si3N4- like interfacial layer
lost of hardness enhancement at 2 ML Si3N4 due to too much weakening of Ti-N bonds
S. Hao et al. Phys.Rev.Lett. (2006); Phys. Rev. B (2006) – Si3 N4 – like interfaces
R.F. Zhang et al. Phys. Rev. Lett. (2009); Phys. Rev. B (2009); (2010) – pseudomorphic SiN interfaces
Surf. Coat. Technol. 201(2007)6064 (111) before and after decohesion
a(TiN) = 4.23 Ǻ
a(VN) = 4.14 Ǻ
a(W2N)= 4.13 Ǻ
Hard & Superhard nc-TiN/Si3N4 Nanocomposites:
Strong Interface
1 ML
Absence of dislocation activity in 3-4 nm size polycrystals
the 1 ML (monolayer) thick interfacial Si3N4 strengthened by valence charge transfer
but weakening of Ti-N bonds adjacent to the Si3N4- like interfacial layer
lost of hardness enhancement at 2 ML Si3N4 due to too much weakening of Ti-N bonds
S. Hao et al. Phys.Rev.Lett. (2006); Phys. Rev. B (2006) – Si3 N4 – like interfaces
R.F. Zhang et al. Phys. Rev. Lett. (2009); Phys. Rev. B (2009); (2010) – pseudomorphic SiN interfaces
Surf. Coat. Technol. 201(2007)6064 (111) before and after decohesion
a(TiN) = 4.23 Ǻ
a(VN) = 4.14 Ǻ
a(W2N)= 4.13 Ǻ
Hard & Superhard nc-TiN/Si3N4 Nanocomposites:
Strong Interface
0.00 0.05 0.10 0.15 0.20 0.25-10
0
10
20
30
40
50
60
70
80
90
Str
ess
(G
Pa
)
Strain
Tensile [111] 1ML 2ML
Shear (111)[110] 1ML 2ML
Shear (111)[112] 1ML 2ML
Decohesion of [111] - 2 ML SiN
The 2 ML Interface weaker than 1 ML
R.F. Zhang, A.S. Argon, S. Veprek,
Phys. Rev. B 81 (2010) 245418
The yellow contours show valence charge density of
0.015 electrons/Bohr3 close to bond breaking
1 ML
2 ML
0.00 0.05 0.10 0.15 0.20 0.25-10
0
10
20
30
40
50
60
70
80
90
Str
ess
(G
Pa
)
Strain
Tensile [111] 1ML 2ML
Shear (111)[110] 1ML 2ML
Shear (111)[112] 1ML 2ML
Decohesion ! Decohesion of [111] - 2 ML SiN
The 2 ML Interface weaker than 1 ML
R.F. Zhang, A.S. Argon, S. Veprek,
Phys. Rev. B 81 (2010) 245418
The yellow contours show valence charge density of
0.015 electrons/Bohr3 close to bond breaking
Ti-N bonds
still O.K.
0.00 0.05 0.10 0.15 0.20 0.25-10
0
10
20
30
40
50
60
70
80
90
Str
ess
(G
Pa
)
Strain
Tensile [111] 1ML 2ML
Shear (111)[110] 1ML 2ML
Shear (111)[112] 1ML 2ML
Decohesion ! Decohesion of [111] - 2 ML SiN
The 2 ML Interface weaker than 1 ML
R.F. Zhang, A.S. Argon, S. Veprek,
Phys. Rev. B 81 (2010) 245418
The yellow contours show valence charge density of
0.015 electrons/Bohr3 close to bond breaking
because of larger weakening of neighbor TiN
Ti-N bonds
still O.K.
0.00 0.05 0.10 0.15 0.20 0.25-10
0
10
20
30
40
50
60
70
80
90
Str
ess
(G
Pa
)
Strain
Tensile [111] 1ML 2ML
Shear (111)[110] 1ML 2ML
Shear (111)[112] 1ML 2ML
Decohesion ! Decohesion of [111] - 2 ML SiN
The 2 ML Interface weaker than 1 ML
R.F. Zhang, A.S. Argon, S. Veprek,
Phys. Rev. B 81 (2010) 245418
The yellow contours show valence charge density of
0.015 electrons/Bohr3 close to bond breaking
because of larger weakening of neighbor TiN
Ti-N bonds
still ±O.K.
0.00 0.05 0.10 0.15 0.20 0.25-10
0
10
20
30
40
50
60
70
80
90
Str
ess
(G
Pa
)
Strain
Tensile [111] 1ML 2ML
Shear (111)[110] 1ML 2ML
Shear (111)[112] 1ML 2ML
Decohesion ! Decohesion ! Decohesion of [111] - 2 ML SiN
The 2 ML Interface weaker than 1 ML
R.F. Zhang, A.S. Argon, S. Veprek,
Phys. Rev. B 81 (2010) 245418
The yellow contours show valence charge density of
0.015 electrons/Bohr3 close to bond breaking
because of larger weakening of neighbor TiN
How Can We Understand Such High Hardness ?
see at the end
Limits to the Preparation of Superhard nc-TiN/Si3N4 Nanocomposites
Thin Solid Films 522 (2012) 274
Limits to the preparation of ultrahard nanocomposites:
2a) the nc-TiN/Si3N4 system
- Deposition conditions
The formation of the nanostructure with sharp interface is thermodynamically
driven by high activity of nitrogen and kinetically controlled by the diffusion.
Therefore it requires
Sufficiently high activity of nitrogen (partial pressure) > 0.002 mbar and
sufficiently high temperature of ≥ 550 °C
This has been discussed many times: Veprek & Reiprich, Thin Solid Films 268 (1995) 64
S. Veprek et al., Surf. Coat. Technol. 200(2006)3876
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A 424(2006)128; 448 (2007) 111–119
Reviews: Thin Solid Films 476(2005)1; J. Vac. Sci. Technol. A 31(2013)050822
Very high de-mixing Gibbs free energy of the Ti1-xSixN solid solution at T = 873 K and
different nitrogen pressure as indicated
sharp 1 ML interfacial SiNx layer R.F. Zhang & S. Veprek, Mater. Sci. Eng. A 424(2006)128
Limits to the preparation of ultrahard nanocomposites:
2a) the nc-TiN/Si3N4 system
- Impurities: J. Vac. Sci. Technol. B 23(2005)L17
at 0.5 at.% 20 O-related defects per TiN nanocrystal H determined by defects
0.01 at.% 1 O-related defect per 2-3 TiN nanocrystal approaching defect-free system
Published papers of other groups: [O] 0.5 – ≥ 2 at.%
Maximum achievable hardness vs. O-impurities
5 P - CVD & PVD apparatusses from 3 countries
SHM
company
Oxygen impurities are limiting the diffusion and formation of the nanostructure
Si-O bond is the strongest one in the Ti-Si-N system
Thin Solid Films 522(2012)274
Temperature needed to complete the
formation of stable nanostructure
O Si
Si is lost above ≈ 1000 °C due to sublimation of SiO
Impossible to form nc-TiN/Si3N4 nanocomposite
Si
Limits to the preparation of ultrahard nanocomposites:
see Thin Solid Films 522(2012)274 and references therein
2 ML 1 ML
when H-enhancement maximum at 1 ML but the lost at 2 ML
the Si3N4 –like interfacial layer must be sharp
2b) Other nc-TmN/XY systems:
- absence of spinodal decomposition mechanism
Nucleation & Growth: morphology of
98%B2O3 + 2%PbO glass
J. Zarzycki, Glasses and the Vitreous State,
Cambridge Univ. Press, Cambridge 1991
Spinodally Decomposed Co2TiO4 – CoAl2O4
System
N. Burkert, et al., Ber. Bunsenges. Phys. Chem.
96(1992)1603
100 nm
Sharp interface superhardness possible if
the system is spinodal and
the interfacial layer is strengthened
Hardness enhancement only ≤ 2
See Thin Solid Films 522(2012)274 and references therein
0.0 0.2 0.4 0.6 0.8 1.0-200
-100
0
100
200
300
400
500nc-TiN/a-Si
3N
4
G
ibb
s F
ree
En
erg
y (
kJ
/mo
l)
N2 presure = 0.01 atm
0.001
0.0001
0.00001
0.000002 (0.002 mbar)
mol.% of Si3N
4TiN Si3N
4
600 °C
Spinodal: d2G/dx2 < 0
Gibbs Free Energy of the mixed Ti1-xSixN1+4x/3
interface strain energy ≤ 5 kJ/mol is balanced by the stabilization of the interface
due to negative charge transfer, it cannot hinder the spinodal decomposition
Gde-mixing ≥ 300 kJ/Mol
Strong de-mixing driving force
Different from metallic alloys:
Gde-mixing ≈ 1 – 20 kJ/mol
ABBABBAACBBCAACBA LyayyyyyaRTGyGyGcacaca
)lnln(00
),(
Where to get the T-dependent interaction parameter LAB ?
ab initio DFT calculations
R.F. Zhang & Veprek, Mater.Sci.Eng.A 424(2006)128; Phys.Rev.B 76(2007)174105; Thin Solid Films 516(2008)2264
The Formation of the nanostructure with strong interface?
the TiN/Si3N4 system
Outline 1. Introduction
2. The role of interfaces for achieving high strength and hardness
3. The nc-TiN/SiNx system – brief summary
4. Other TmN/XY systems, TmN = TiN, ZrN, …; XY = SiC, BN, AlN
DFT & QMD Calculations & Thermodynamic Consideration
5. Summary and Outlook
Combined DFT & Thermodynamic Calculations
Details if interests
Ti-Si-N Spinodal: R.F. Zhang & Veprek, Mater.Sci.Eng.A 424(2006)128; Phys.Rev.B 76(2007) 174105;
Thin Solid Films 516(2008)2264
Ti-Al-N Partially Spinodal: R.F. Zhang & Veprek, Mater.Sci.Eng.A 448(2007)111; see also Mayrhofer et al.
Zr-Al-N Nucleation & Growth no interfacial AlN layer:
S.H. Sheng, R.F. Zhang & Veprek, Acta Mater. 56(2008)968
Cr-Al-N Chem. Spinodal, but ΔGDemixing small Nucleation and Growth
more likely: R.F. Zhang & Veprek, Acta Mater. 55(2007)4615
Ti-B-N Nitrogen-rich Ti1-xBxN spinodal, but incoherent TiN/BN interface
Nitrogen-poor TiBxN1-x nucleation & growth R.F. Zhang, S.H. Sheng & Veprek, Acta Mater. 56(2008)4440
Zr-Si-N Nucleation & Growth sharp SiNx interfacial layer unlikely S.H. Sheng, R.F. Zhang, & Veprek, Acta Mater. 59(2011)297
Zr-Al-O Spinodal S.H. Sheng, R.F. Zhang, & Veprek, Acta Mater. 59 (2011) 3498
Al-Si-N Coherency Spinodal unlikely nucleation & growth
S.H. Sheng, R.F. Zhang, & Veprek, Acta Mater. 61(2013)4226
In the majority of the systems the reported H-enhancement is due to smaller crystallite size
not “strong interface” like in nc-TiN/Si3N4
Outline 1. Introduction
2. The role of interfaces for achieving high strength and hardness
3. The nc-TiN/SiNx system – brief summary
4. Other TmN/XY systems, TmN = TiN, ZrN, …; XY = SiC, BN, AlN
DFT & QMD Calculations & Thermodynamic Consideration
5. Summary and Outlook
Stability of the 1 ML interfacial XY layer
How to determine the stability of the interfacial layer?
1. “Static” DFT at 0 K manual distortion of the structure what happens with the total energy?
2. First-principles quantum molecular dynamic calculations at elevated temperature temperature-induced structural transformations ?
3. Dynamic (phonon) instability: when instable “negative” frequencies
4. “Soft Modes” as function of the TmN – XY lattice misfit detailed understanding
5. Electronic density of states pseudogap at EF when electronically stable .
“Static” DFT at 0 K: R.F. Zhang et al., Phys. Rev. Lett. 102(2009)015503; Phys. Rev. B 79 (2009) 245426; 81(2010)245418
First-principles QMD & Phonon instability at elevated T: V.I. Ivashchenko et al., Phys. Rev. B 86(2012)014110; Thin Solid Films 545(2013)391; 564 (2014) 284
How to determine the stability of the interfacial layer?
1. “Static” DFT at 0 K manual distortion of the structure what happens with the total energy?
2. First-principles quantum molecular dynamic calculations at elevated temperature temperature-induced structural transformations ?
3. Dynamic (phonon) instability: when instable “negative” frequencies
4. “Soft Modes” as function of the TmN – XY lattice misfit detailed understanding
5. Electronic density of states pseudogap at EF when electronically stable .
“Static” DFT at 0 K: R.F. Zhang et al., Phys. Rev. Lett. 102(2009)015503; Phys. Rev. B 79 (2009) 245426; 81(2010)245418
First-principles QMD & Phonon instability at elevated T: V.I. Ivashchenko et al., Phys. Rev. B 86(2012)014110; Thin Solid Films 545(2013)391; 564 (2014) 284
0,0
0,1
0,20,00 0,05 0,10 0,15 0,20
-150,28
-150,24
-150,20
-150,16
-150,12
-150,08
-150,04
-150,00
To
tal
en
erg
y (
eV
)
[110] x or y direction
[100] xy direction
Distortion of Si atoms along x direction (%)
Dependence of the total energy (eV/supercell) on the displacement of Si-atoms within the (001) interface as
indicated in the inset
The distortion lowers the symmetry and
total energy stabilization well known
Jahn-Teller Effect, Ferroelectric transition, …
DFT calculation at 0 K (001) TiN/1ML SiN/TiN Interface is unstable in its high symmetry octahedral configuration
(a) After full relaxation with Si atoms in symmetric octahedral positions
(b) After displacement of the Si atoms into position with minimum of total energy: Si-four fold coordinated
Confirmed by the Dynamic Phonon Calculations: Alling et al., Phys. Rev. B 78 (2008) 132103
Marten et al., Phys. Rev. B 85 (2012) 104106
R.F. Zhang et al., Phys. Rev. B 79 (2009) 245426
How to determine the stability of the interfacial layer?
1. “Static” DFT at 0 K manual distortion of the structure what happens with the total energy?
2. First-principles quantum molecular dynamic calculations at elevated temperature temperature-induced structural transformations ?
3. Dynamic (phonon) instability: when instable “negative” frequencies
4. “Soft Modes” as function of the TmN – XY lattice misfit detailed understanding
5. Electronic density of states pseudogap at EF when electronically stable .
“Static” DFT at 0 K: R.F. Zhang et al., Phys. Rev. Lett. 102(2009)015503; Phys. Rev. B 79 (2009) 245426; 81(2010)245418
First-principles QMD & Phonon instability at elevated T: V.I. Ivashchenko et al., Phys. Rev. B 86(2012)014110; Thin Solid Films 545(2013)391; 564 (2014) 284
Quantum Molecular Dynamics (QMD) Studies at high T
the TiN/SiNx System
Confirmed the DFT results but the distortion of the (001) interface is random reducing elastic strain energy
V.I. Ivashchenko et al. Phys. Rev. B 85, 195403 (2012)
300 K 1400 300 K
Si 3N4 - like stable to 1100 °C
Experiment: Thin Solid Films 2005; DFT calculations: Hao et al. 2006
Pseudomorphic SiN – DFT Calculations (0 K):
- (111) & (110) stable, - (001) unstable but can be stabilized by 12% distortion of Si in [110] direction
Superhard Nanocomposite with Strengthened Interface
Stability of the SiNx Interfaces - Thermodynamic
Si3N4 stable
Pseudomorphic SiN unstable: 4SiN Si3N4 + Si
however nitriding during deposition at sufficiently high nitrogen activity 3SiN + N Si3N4
1 ML fcc(111) TiN/SiN/TiN is stable at high T
Why? Probably kinetic limitations or
dynamic stabilization (see later)
300 K 1400 300 K
QMD Study:
Surprising stability of the pseudomorphly stabilized (111) SiN
Even heating to 3000 K (melting point 3223 K) did not change the (111) SiN !!
V.I. Ivashchenko et al. Phys. Rev. B 85, 195403 (2012)
Si3N4 – like interfaces QMD
V.I. Ivashchenko et al. 2014 submitted
nc-TiN/BN
a) Stoichiometric TiN & BN is chemically spinodal [R.F. Zhang et al., Acta Mater. 56(2008)4440]
b) H-enhancement at 1 ML BN [P. Karvankova et al., Surf. Coat. Technol. 200(2006)2978]
c) But incoherent interface to TiN [P. Karvankova et al.,ibid.]
First-principles QMD calculations: the interfacial BN layer unstable already at 0 K
V.I. Ivashchenko & S. Veprek, Thin Solid Films 545(2013)391
The BN interfacial layer
unstable alerady at 0 K
annealing to 1400 K and
relaxation at 300 K (right)
a)
b)
c)
Hardening Mechanism the
“Strongest Size” Not “strong interfacial SiNx
layer” like in nc-TiN/Si3N4
TiN/AlN
h(Wurtzite)-AlN - stable; c-AlN (B1-AlN) – high pressure polymorph
≤ 2 nm c-AlN stabilized between TiN slabs [A. Madan et al., Appl. Phys. Lett. 78(1997)1743;
J.W. Kim et al., Appl. Phys. Lett. 78(2001)892] and forms during spinodal decomposition of
Ti1-xAlxN solid solution [P.H. Mayrhofer et al., Appl. Phys. Lett. 83(2003)2049]
1 ML AlN TiN/AlN/ heterostructures stable
at high T(1400 K) V.I. Ivashchenko & S. Veprek, Thin Solid Films 545(2013)391
Can one prepare nc-TiN/AlN nanocomposites? Ti0.9 Al0.1N low de-mixing energy !
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A 448(2007)111
TiN/AlN
h(Wurtzite)-AlN - stable; c-AlN – high pressure polymorph
≤ 2 nm c-AlN stabilized between TiN slabs [A. Madan et al., Appl. Phys. Lett. 78(1997)1743;
J.W. Kim et al., Appl. Phys. Lett. 78(2001)892] and forms during spinodal decomposition of
Ti1-xAlxN solid solution [P.H. Mayrhofer et al., Appl. Phys. Lett. 83(2003)2049]
Can one prepare nc-TiN/AlN nanocomposites? Ti0.9 Al0.1N low de-mixing energy !
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A 448(2007)111 as compared with Ti-Si-N
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A
424(2006)128
TiAlN TiSiN
1 ML AlN TiN/AlN/ heterostructures stable
at high T(1400 K) V.I. Ivashchenko & S. Veprek, Thin Solid Films 545(2013)391
TiN/AlN
h(Wurtzite)-AlN - stable; c-AlN – high pressure polymorph
≤ 2 nm c-AlN stabilized between TiN slabs [A. Madan et al., Appl. Phys. Lett. 78(1997)1743;
J.W. Kim et al., Appl. Phys. Lett. 78(2001)892] and forms during spinodal decomposition of
Ti1-xAlxN solid solution [P.H. Mayrhofer et al., Appl. Phys. Lett. 83(2003)2049]
Can one prepare nc-TiN/AlN nanocomposites? Ti0.9 Al0.1N low de-mixing energy !
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A 448(2007)111 as compared with Ti-Si-N
R.F. Zhang & S. Veprek, Mater. Sci. Eng. A
424(2006)128
TiAlN TiSiN
1 ML AlN TiN/AlN/ heterostructures stable
at high T(1400 K) V.I. Ivashchenko & S. Veprek, Thin Solid Films 545(2013)391
nc-TiN/(1 ML AlN) nanocomposites a Challenge
Worth trying ! But it will probably not work because of the small de-mixing energy of the TiAlN
What about other nc-TmN/AlN systems ?
ZrN/AlN
First-principles QMD
The B1-AlN in ZrN/AlN/ZrN heterostructures is unstable already at temperature ≥ 10 K
V.A. Ivashchenko et al., Thin Solid Films 564 (2014) 284
Broken & distorted bonds
Total energy (ET) as a function of simulation time for
the ZrN-based heterostructures
Unstable AlN interfacial layer already at 10 K
WHY ?
How to determine the stability of the interfacial layer?
1. “Static” DFT at 0 K manual distortion of the structure what happens with the total energy?
2. First-principles quantum molecular dynamic calculations at elevated temperature temperature-induced structural transformations ?
3. Dynamic (phonon) instability: when instable “negative” frequencies
4. “Soft Modes” as function of the TmN – XY lattice misfit detailed understanding
5. Electronic density of states pseudogap at EF when electronically stable .
“Static” DFT at 0 K: R.F. Zhang et al., Phys. Rev. Lett. 102(2009)015503; Phys. Rev. B 79 (2009) 245426; 81(2010)245418
First-principles QMD & Phonon instability at elevated T: V.I. Ivashchenko et al., Phys. Rev. B 86(2012)014110; Thin Solid Films 545(2013)391; 564 (2014) 284
Driving Force for Transformations of the Interfacial Layers?
Soft “Condensed“ Phonon Modes
Central position Stable Unstable imaginary wave vector (‘negative” frequencies)
Phonon “Soft” Mode
driving the transition
Example: Ferroelectric transition in BaTiO3
Ti oscillates around
the centre but in up or down minima
at T>TC = 393 K at T < TC Frequency
Temperature TC 0
-
+ T > TC
T < TC
Instability & Phase Transition in XY interfacial
layer in the TmN/XY heterostructures
Due to Acoustic Soft Modes as function of the lattice parameter of TmN
TmN/AlN nanocomposites ?
Λ3 [2π/a(1/8,1/8,1/8)]
Δ5 [2π/a(1/4,0,0)]
V. A. Ivashchenko et al., Thin Solid Films 564 (2014) 284
aZrN=4.593 Å
B1-AlN is Stable for a < 4.4 Å (TiN, VN, NbN) unstable for a > 4.4 Å (ZrN etc.)
Search for Tm-Al-N system with a < 4.3 Ǻ and High De-Mixing Energy
Can we prepare nc-TmN/AlN nanocomposites with Tm=Ti, V, Nb ?
Probably not because of the low de-mixing energy not spinodal ?
a > 4.4 Ǻ
Unstable
a < 4.4 Ǻ
Stable Ti, V, Nb Zr, …
Driving Force for Transformations of the Interfacial Layers?
Phonon frequencies vs. Lattice Parameter a
B1-BN & SiN unstable, AlN & SiC stable, softening for aTiN
Λ3 [2π/a(1/8,1/8,1/8)]
Δ5 [2π/a(1/4,0,0)]
aAlN aTiN aTiN
aTiN
aBN
aSiC
Instability of B3-BN because it is high-pressure polymorph,;
Instability of B1-SiN because of high electronic DOS above EF;
Destabilization of AlN & SiC for large a
V. A. Ivashchenko et al., Thin Solid Films 545 (2013) 391
●
Instability of B1-BN
interfacial layer at 0 K
because it is the high-P
phase
What about SiC ?
TiN/SiC
Experiment :
a) TiN/SiC/TiN heterostructures, deposited at R.T., no annealing
b) H-enhancement (measurement on only 2 µm thin coatings) M. Kong et al., Appl. Surf. Sci. 253(2007)4734
tTiN = 4.3 nm tSiC = 0.6 nm
TiN/SiC
First-principles QMD calculations & thermodynamics
Transformation at ≥ 600 K poor thermal stability V.I. Ivashchenko et al., Phys. Rev. B 86(2012)014110; Thin Solid Films 545(2013)391
300 K 1400 K 300 K 1400 K
(001) (111)
nc-TiN/SiC nanocomposites?
No because of formation of stable TiN1-xCx Solid solution
nc-TiN/SiC nanocomposites?
No because of formation of stable TiN1-xCx Solid solution S. Veprek et al., Surf. Coat. Technol. 86-87(1996)394
Experiments done in Li Shizi’s laboratury
TiN/SiC
The Hardness follows the Rule-of-Mixtures
Other TmN/XY systems ? Continue ∞
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter
σ(p) = σ0 + · p ≈ 27.8 GPa
p - upon the onset of plasticity
pmax = 2.58∙σ0 Hertzian Theory
β = 0.11 – 0.3 E.F.Oleinik, Polymer Sci. Ser. C 45 (2003) 17
we take β = 0.15
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter σ(p) = σ0 + · p ≈ 27.8 GPa
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter
6. For randomly oriented polycrystal Sachs average (1928) yields tensile yield strength Y ≈ 2.24·σ(p) ≈ 62 GPa
σ(p) = σ0 + · p ≈ 27.8 GPa
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
The tensile Yield strength Y of randomly oriented polycrystalline aggregate with plastic slip
resistance of slip planes is increased because all slip systems (even the stronge) have to be active
G. Sachs, Zt. Vereines deutscher Ingenieure 72 (1928) 734
Y = 2.24·σ
A randomly oriented polycrystal is stronger than a single crystal
because all slip systems (also the strongest ones) have to be active
-
Arrows - easy slip system in
randomly oriented crystals
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter
6. For randomly oriented polycrystal Sachs average (1928) yields tensile yield strength Y ≈ 2.24·σ(p) ≈ 62 GPa
7. H ≈ C·Y, C – constraint factor
σ(p) = σ0 + · p ≈ 27.8 GPa
Constraint Factor:
A.Y. Ishlinsky, J. Appl. Math. Mech. (USSR) 8(1944)201;
R. Hill, The Mathematical Theory of Plasticity, Clarendon, Oxford 1950
M. G. J. Veprek-Heijman et al., Surf. Coat. Technol. 203 (2009) 3385 (non-linear FEM)
For a summary see: S. Veprek, Appendix B in J. Vac. Sci. Technol. A 31 (2013) 050822
C ≈ 2.8
H ≈ 2.8·Y ≈ 173 GPa
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter
6. For randomly oriented polycrystal Sachs average (1928) yields tensile yield strength Y ≈ 2.24·σ(p) ≈ 62 GPa
7. H ≈ C·Y ≈ 173 GPa
σ(p) = σ0 + · p ≈ 27.8 GPa
8. Why is the experimentally achieved hardness of about 110-115 GPa for quasi-ternary nc-TiN/Si3N4/TiSi2 and 70 GPa for long-term stable quasi-binary nc-TiN/Si3N4 much smaller?
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4 S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
Understanding of Hardness 70 - >100 GPa in nc-TiN/Si3N4
We know from experimental results: 1. The TiN nanocrystals are randomly oriented (XRD, El. Diffraction, HR TEM) 2. The 3-4 nm TiN nanocrystal deform only elastically and 3. The interfaces are the carrier of the plastic flow (high-pressure XRD) 4. We take as an average plastic resistance the shear resistence of the stable
TiN/SiNx heterostructures calculated by QMD (15-32 GPa) at elevated T to be about 20 GPa (see above)
5. Accounting for its pressure enhancement during the pressure developed under the indenter
6. For randomly oriented polycrystal Sachs average (1928) yields tensile yield strength Y ≈ 2.24·σ(p) ≈ 62 GPa
7. H ≈ C·Y ≈ 173 GPa
σ(p) = σ0 + · p ≈ 27.8 GPa
8. Why is the experimentally achieved hardness of about 110-115 GPa for quasi-ternary nc-TiN/Si3N4/TiSi2 and 70 GPa for long-term stable quasi-binary nc-TiN/Si3N4 much smaller?
Impurities
S. Veprek et al., Philos. Mag. Lett. 87 (2007) 955; V. Ivashchenko et al., Thin Solid Films (2014) submitted
Improvement of deposition conditions in industrial coating unit π80
higher Tdep & lower O-impurities life time improvement by > 100 %
S. Veprek, M. Veprek-Heijman (Tech. University Munich), X. Zeng (SIMTech, Singapore), M. Píška (Tech. University
Brno, CZ), A. Bergmaier (Univ. Bundeswehr Munich), Q.F. Fang (Chinese Acad. Sci., Hefei)
Steel DIN C45
C Mn Si P S Cr Ni Fe
0.42-0.5 0.5-0.8 0.17-0.37 0.004 0.004 0.25 0.3 balance
Steel DIN C45
VC = 130 m/min - cutting speed
f= 0.18 mm/revolution
aF = 1.5 mm (depth of cut)
0
10
20
30
40
50
Improved
deposition 2
4 Inserts
Improved
deposition 1
4 Inserts
Standard
To
o L
ife
Tim
e
(min
)
2.2 x
lower O-impurities !
0.2-0-3 at.% Oxygen ≤0.1 at.% Oxygen
Si
Ti Al N
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,00
30
40
50
60
70
80
90
100
110
120
+
[XXX] nc-TiN/a-Si3N
4 P CVD: Cl < 0.5 at.%
Cl = 0.5 - 0.8 at.%
Cl = 1.0 - 3.5 at.%
nc-TiN/a-Si3N
4/a- & nc-TiSi
2 P CVD: Cl < 0.5 at.%
Cl > 0.5 at.%
nc-TiN/a-Si3N
4/a-TiSi
2Li Shizhi 2004, Cl 0.7 - 1.0 at.%
nc-TiN/a-Si3N
4 RMSputt - Centr. Cathode
nc-TiN/a-Si3N
4 RMSputt - Planar Cathode + SiH
4+ H
2
nc-TiN/a-Si3N
4 RMSputt of Ti & Si in N
2 - Planar Cathode & Outgas
nc-TiN/a-Si3N
4 RMSputt of Ti & Si in N
2 - Planar Cathode
+ "Ti-Si-N" Vaz et al. RMSputt
Pla
sti
c H
ard
ne
ss
[G
Pa
]
Oxygen Content [at%]
0
2
4
4 O-defects/Nanocrystal
> 20 O-defects/Nanocrystal
1/C
ov
era
ge
[N
an
oc
rys
tal/
Ox
yg
en
Ato
ms
]
[O] = 100 ppm about 1 O-defects/2.5 Nanocrystals
Detrimental Effect of Oxygen Impurities
S. Veprek, P. Karvankova and M. G. J. Veprek-Heijman, J. Vac. Sci. Technol. B 23 (2005) L17
H determined by strength of
the O-defects
SHM & TUM
Industrial Coating System
“ORM”
Good News
0.07 at.% = 700 ppm
Surface
contamination
Bulk
The great challenge:
Presently ≤ 1000 ppm impurities in every day deposition in “ORM”of SHM and in
Pi80 & Pi300 of PLATIT
We need an improvement only by a factor of 3-4 to reach ≤ 250 ppm in the
industrial coating units!
Selected Examples of Industrial Applications of
Hard and Superhard Nanocomposite Coatings on Tools
Selected Exmples
What are the advantages of the superhard nanocomposites
Advantages of Superhard Nanocomposites:
- Higher Hardness
- Higher oxidation & corrosion resistance
- Lower thermal conductivity lower heat flow into
the cutting edge
- Higher cutting speed & feed Higher Productivity
- Longer Life Time of Expensive Tools
- Dry Cutting – economy, ecology
- Flexibility in the design of “triple Coatings”
Presently Available Superhard Nanocomposite Coatings for
Industrial Applications:
nc-(Ti1-xAlx)N/a-Si3N4 - (“TiAlSiN” or ”AlTiSiN”)
nc-(Cr1-xAlx)N/a-Si3N4 (“CrAlSiN”)
TiCrN/Ni not superhard (H ≈ 15 – 20 GPa) but ductile forming
Hard Dry Milling T. Cselle, PLATIT A.G. (CH)
0 500 1000 1500 2000 2500
0
50
100
150
200
250
Cle
ara
nc
e W
ea
r [µ
m]
Tool Life-Time [m]
nACo-MLH-N nACo-MLH
AlTiN 1 AlTiN 2
nACo-MLH ii nACo-MLH i
T. Cselle & M. Morstein, PLATIT AG
Hard Milling of 57 HRC Steel
Ball nose, cemented carbide end mills, d=10 mm, External Minimum Jet Lubrication
18 500 RPM, fz=0.18 mm, ap=0.25 mm, ae=0.6 mm,
ap-axial -, ae- radial depth of cut
(TiAl)N/Si3N4
1st Generation
Fatigue of "WC/Co" Substrate
2nd Generation:
Improved Design
of Coatings +
higher Si-content
TiSiN-Hitachi
Nanocomposites TiAlN
Coatings
0 500 1000 1500 2000 2500
0
50
100
150
200
250
Cle
ara
nc
e W
ea
r [µ
m]
Tool Life-Time [m]
nACo-MLH-N nACo-MLH
AlTiN 1 AlTiN 2
nACo-MLH ii nACo-MLH i
T. Cselle & M. Morstein, PLATIT AG
Hard Milling of 57 HRC Steel
Ball nose, cemented carbide end mills, d=10 mm, External Minimum Jet Lubrication
18 500 RPM, fz=0.18 mm, ap=0.25 mm, ae=0.6 mm,
(TiAl)N/Si3N4
1st Generation
Fatigue of "WC/Co" Substrate
2nd Generation:
Improved Design
of Coatings +
higher Si-content
TiSiN-Hitachi
Nanocomposites TiAlN
Coatings
ap-axial -, ae- radial depth of cut
Maintenance of Railroads for Fast Trains ≤ 320 km/hr
Shinkansen Japan since 1964
TGV France since 1981
ICE Germany since 1993
Required surface roughness of the rails for given speed
≤ 160 km/h - 0.5 mm
160 – 280 km/h – 0.3 mm
> 280 km/h – 0.2 mm
PRAMET TOOLS & SHM Šumperk Czech Republic 2014
Required surface roughness of the rails for given speed
≤ 160 km/h - 0.5 mm
160 – 280 km/h – 0.3 mm
> 280 km/h – 0.2 mm
Milling tool
D = 600 mm, z = 22 teeths, vC = 220-280 m/min,
n = 120-150 rev./min, f = 700 m/h, aP = 1.5 mm
Steel R350 HT
H = 0.9-1.2 GPa 1.5 GPa (cold work hardening)
(27 – 46 HRC)
Solution: TripleCoatings AlTiSiN Nanocomposite
AlTiN-TiN Multilayers
TiN Adhesion layer
Large-scale tests in large European countries
Life Time increase by 30 % as compared with
the competitor
“life-time” > 2 km !
Advantages of Superhard Nanocomposites:
- Higher Hardness
- Higher oxidation & corrosion resistance
- Lower thermal conductivity lower heat flow into
the cutting edge
- Higher cutting speed & feed Higher Productivity
- Longer Life Time of Expensive Tools
- Dry Cutting – economy, ecology
- Flexibility in the design of “triple Coatings”
Presently Available Superhard Nanocomposite Coatings for
Industrial Applications:
nc-(Ti1-xAlx)N/a-Si3N4 - (“TiAlSiN” or ”AlTiSiN”)
nc-(Cr1-xAlx)N/a-Si3N4 (“CrAlSiN”)
TiCrN/Ni not superhard (H ≈ 15 – 20 GPa) but ductile forming
Tools: ø7.1-12mm SC step drills - Cooling: 70 bar internal 5% emulsion
Test material: GGG40 - Vc: 140-200 m/min - Vf: 1475 - 2304 mm/min
Source: Sauer Danfoss Steerings, DK
Drill test in cast iron GGG40 UNIMERCO DK
Vc, Surface speed
0
50
100
150
200
250
TiAlN AlTiSiN
Vf, Feed rate
0
500
1.000
1.500
2.000
2.500
TiAlN AlTiSiN
Tool life time
0
5.000
10.000
15.000
20.000
25.000
30.000
35.000
40.000
TiAlN AlTiSiN
Performance improvement at Higher Speed & Feed Rate
Increase in Productivity with AlTiSiN-Nanocomposites 56 % !
Advantages of Superhard Nanocomposites:
- Higher Hardness
- Higher oxidation & corrosion resistance
- Lower thermal conductivity lower heat flow into
the cutting edge
- Higher cutting speed & feed Higher Productivity
- Longer Life Time of Expensive Tools
- Dry Cutting – economy, ecology
- Flexibility in the design of “triple Coatings”
Presently Available Superhard Nanocomposite Coatings for
Industrial Applications:
nc-(Ti1-xAlx)N/a-Si3N4 - (“TiAlSiN” or ”AlTiSiN”)
nc-(Cr1-xAlx)N/a-Si3N4 (“CrAlSiN”)
TiCrN/Ni not superhard (H ≈ 15 – 20 GPa) but ductile forming
Tool Lifetime: number of sawed parts with tolerance of ± 0.2 mm
Solid Carbide saw blades Diam. 125 mm, Thick. 3.6 mm, z = 100, sintered workpiece material Co1
N = 300 RPM, vf = 800 mm/min, ap = 35 mm, colant: emulsion 7%
Source: Prétat, Selzach & PLATIT AG, CH
Lifetime of Solid Carbide Saw Coated with different Coatings (Precision Metal Cutting)
25x
6.5x
T.Cselle PLATIT AG (CH)
Injection Moulding of Aluminum Alloys for Automotive Industry
after the fabrication of 15 000 parts with different surface treatment. The length and diameter
of several similar tools which were tested was 180-200 mm and 15-25 mm, respectively.
conventional nitriding 2 to 3 µm thick CrAlSiN
nanocomposite coatings Conventionally treated
Many further applications
The superhard nanocomposite coatings
are not the “future nanotechnology”,
they are present reality
Conclusions
1. Low-energy and strengthened interafaces enable one to design strong and
superhard materials
2. The very high hardness of the nc-TiN/Si3N4 nanocomposites fully understood:
it is achieved due to strengthened SiNx interfacial layer
3. Similar H-enhancement possible in other nc-TmN/Si3N4 systems with
a(TmN) < 0.42 nm
4. Impurities hinder this strengthening & formation of the nanostructure and
thus to achieve the high hardness
5. So far no other nc-TmN/XY system was found as candidate because - although many TmN/AlN systems with a(TmN) < 0.44 nm are chemically spinodal
their de-mixing energy is too low
- BN as interfacial layer forms strongly incoherent interfaces to TmN
- SiC as interfacial layer is instable above 600 °C and forms stable TiN1-xCx solution
6. The hardness enhancement reported in many TmN/XY nanocomposites is due
to the “Strongest Size” and not to a strong interfacial XY layer
Thank you for your attention
The pdf of this lecture will be available at stan.veprek.net