OSECompany Presentation

Orient Semiconductor Electronics, Ltd.

OSEBusiness Overview

• Established in 1971 and listed on the Taiwan Stock Exchange in 1994

• Positions as an electronics manufacturing service provider

• Provides a wide range of IC packaging and testing as well as contract manufacturing services

• Offers customer-focused production and logistics solutions to achieve time-to-market and time-to-volume

OSESemiconductor Group – Products & Services

IC Package DesignProcess DevelopmentMaterial ManagementWafer ProbingWafer GrindingIC Packaging Services PDIP/PLCC/SO/SSOP/TSOP/ TSSOP/QFP/LQFP/TQFP/MLP PBGA/EBGA/TEBGA/LFBGA FTFBGA/MCM/FC IC Test Program DevelopmentIC Testing Services Logic/Memory RF/Mixed SignalDistribution Support

IC Packaging

&TestingServices

OSEFinished Products Group – Products &

ServicesCircuit LayoutDFM/DFT ReviewPrototypeIC Packaging DesignPart SelectionMaterial ProcurementMaterial ManagementPCB AssemblyBack-plane AssemblyFinal Systems BuildIn-Circuit TestFunctional TestReliability TestDistribution SupportRepair & Upgrade

ElectronicsManufacturing

Services

OSEGlobal Manufacturing Facilities

Facility Space Equipment

OSEKaohsiung, Taiwan

1,280K sq. ft.

W/B * 1,560SMT * 28

OSE PhilippinesLaguna, Calamba

554K sq. ft.

W/B * 200

OSE USA *San Jose, CA

83K sq. ft.

W/B * 120

Sparqtron Corp.Fremont, CA

35K sq. ft.

SMT * 4

*OSE USA formerly called IPAC

OSESemiconductor Group site strategy

Orient Semiconductor Electronics, Ltd.Semiconductor Group

OSE USA OSE PhilippinesOSE Taiwan

•Sales & marketing

•Packaging technology development for quick build requirement

•Quick turn and Low volume service

•Marketing contact from qual lot at OSEU and mass production at OSET/OSEP

•Focus on high volume; low pin count and low cost packaging

•Packaging technology research & development center

•Focus on high pin count ; value added packaging and mass production

•Transfer low pin count packaging to OSEP

OSEGlobal Sales & Support Offices

Region Location

Taiwan TaipeiHsinchuKaohsiung

Asia Tokyo, JapanManila, PhilippinesSingapore

North America San Jose, CALos Angeles, CAPhoenix, AZBoston, MA

Europe London, UK

OSEStatistics on Human Resources (Worldwide)

IC Packaging & Testing Operations

3,786

1,565

266

DirectIndirectR & D

Contract Electronics Manufacturing Operations

1,369

38727

DirectIndirectR & D

5617/1783//7400/4353/1114

OSEPercentage of Sales By Region

38.28%

49.62%

10.92% 1.18%

Taiwan N. America Europe Others

Remark : Data shown based on FY 2000 both IC & FP

OSEPercentage of Sales By Market Segment

IC Packaging & Testing Operations

5%15%

20%

10%15%

7%

13%

5%10% DSP

System Controller

Telecommunication

Memory

Graphics

Audio

Other PC Related

Consumer

Mixed Signal

Contract Electronics Manufacturing Operations

40%

37%

16%2% 5%

Computer System

Communication

Computer Peripheral

Industrial Electronics

Others

OSE

6,2127,072

8,9148,316

9,694

14,342

0

2,000

4,000

6,000

8,000

10,000

12,000

14,000

16,000

1995 1996 1997 1998 1999 2000

Reve

nue (

in m

illio

n N

T$)

1995 – 2000 Sales Revenue

Remark : Data shown OSET IC packaging & Finished product sales revenue; OSEP & OSEU not included.

OSEResearch & Development Capabilities

• Custom package & module design• Substrate layout design for SCM,

MCM, LFBGA, and FCBGA• Material and process development• Thermal and electrical analysis• Mechanical simulation• Mold flow simulation• Quick mold chase and T/F tooling

for prototype• Package technology development