organizational chart - semi · 2016-03-16 · legend: tcc — the locale has a tc chapter of the...

Organizational Chart China

Europe

Japan

Korea

North America

Taiwan

Last updated: March 15, 2016

Global Technical Committee and

TC Chapters

Legend:TCC — the Locale has a TC Chapter of the global technical committee. CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.

Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).

Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).

Locale

Global

technical committee

China Europe Japan KoreaNorth

AmericaTaiwan

EH&S TCC WG TCC TCC

Facilities TCC TCC TCC

Gases TCC TCC TCC

Liquid Chemicals TCC TCC TCC

FPD Materials & Components TCC TCC TCC TCC

FPD Metrology TCC TCC TCC TCC

MEMS / NEMS TCC

CFG

CFG

CFG

Locale

Global

technical committee


AmericaTaiwan

Traceability TCC TCC

Information & Control TCC TCC TCC TCC TCC

Metrics TCC TCC TCC

Physical Interfaces & Carriers TCC TCC TCC

Automation Technology TCC TCC

Photovoltaic TCC TCC TCC TCC TCC

PV Materials TCC TCC TCC

Legend:TCC — the Locale has a TC Chapter of the global technical committee.CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.

Note 1: An underlined Locale has ab RSC and may also be referred as a Region (e.g., Europe Region ).

Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).

Locale

Global

technical committee


AmericaTaiwan

Micropatterning

(Microlithography*)TCC TCC

Silicon Wafer TCC TCC TCC

Compound Semiconductor

MaterialsTCC TCC TCC

HB-LED WG TCC

3DS-IC TCC TCC

Assembly & Packaging

(Packaging**)TCC

Automated Test Equipment

(Test***)TCC TCC

Legend:TCC — the Locale has a TC Chapter of the global technical committee.

CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).

Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles). * In NA, Micropatterning is traditionally called Microlithography.** In Japan, Assembly & Packaging is traditionally called Packaging.*** In Japan, Automated Test Equipment is traditionally called Test.

CFGTCC

TCC

Regional Standards Committee (RSC)

Organizations

Co-chairs: Bert Planting - ASML, Werner Bergholz – International Standards Consulting

Vice-chair: Frank Petzold - Trustsec

SEMI Europe RSC Organization

Europe Chapter of Metrics Global Technical

CommitteeC: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB

Europe Chapter of PV Materials Global

Technical CommitteeC: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley

Europe Chapter of Physical Interfaces &

Carriers Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec

Europe Chapter of Gases Global

Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier – Gordon F Consulting

Europe Chapter of Compound Semiconductor

Materials Global Technical CommitteeC: Arnd Weber - SiCrystal

Europe Chapter of Silicon Wafer Global

Technical CommitteeC: Werner Bergholz – International Standards ConsultingC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic

Europe Chapter of Liquid Chemicals

Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier – Gordon F Consulting

Europe Chapter of Information & Control

Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec

Europe Chapter of Automation

Technology Global Technical Committee C: Christian Hoffmann - PEER Group

SEMI Japan RSC OrganizationCo-Chair: Kenji Yamagata - Daifuku, Naoyuki Kawai - The University of Tokyo

Vice Chair: Supika Mashiro - TEL

Special Groups

Reporting to the JRSC

Japan Chapter of Gases & Facilities

Technical CommitteeC: Hiromichi Enami - Hitachi High-TechnologiesC: Isao Suzuki - MKS Japan

Japan Chapter of Environmental Health

& Safety Global Technical CommitteeC: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho

FPD Coordination Group

L: Yoshitada Nogami - SK ElectronicsL: Makoto Yamamoto - Muratec

Standardization Process

Improvement (SPI)L: Supika Mahiro -TEL

Japan Chapter of Micropatterning

Global Technical CommitteeC: Morihisa Hoga - Dainippon Printing

Japan Chapter of Compound Semiconductor

Materials Global Technical CommitteeC: Masayoshi Obara - Shin-Etsu Handotai

Japan Chapter of Physical Interfaces &

Carriers Global Technical CommitteeC: Tsuyoshi Nagashima - MiraialC: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKU

Japan Chapter of Automation

Technology Global Technical CommitteeC: Terry Asakawa -TELC: Naoki Ito - Mitsubishi ElectricC: Makoto Ishikawa - Nisshinbo Mechatronics

Japan Chapter of PV Materials

Global Technical CommitteeC: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima – Kashima EngineeringC: Tetsuo Fukuda - AIST

Japan Chapter of FPD Materials &

Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - FUJIFILM

Japan Chapter of Assembly &

Packaging Global Technical CommitteeC: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI

Japan Chapter of FPD Metrology Global

Technical CommitteeC: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics

Japan Chapter of PV Global

Technical CommitteeC: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima – Kashima EngineeringC: Masaaki Yamamichi - AIST

Japan Chapter of Metrics

Global Technical CommitteeC: Toshio Murakami – Murakami Corporation

Japan Chapter of Traceability

Global Technical CommitteeC: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence

Japan Chapter of Silicon Wafer

Global Technical CommitteeC: Naoyuki Kawai - The University of Tokyo C: Tetsuya Nakai - SUMCO

Japan Chapter of Information & Control

Global Technical CommitteeC: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai Electric

Japan Chapter of Liquid Chemicals

Global Technical CommitteeC: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions

Japan Chapter of 3DS-IC Global

Technical CommitteeC: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST

NA Chapter of Physical Interfaces &

Carriers Global Technical CommitteeC: Matt Fuller - EntegrisC: Stefan Radloff - Intel

NA Chapter of Metrics Global

Technical CommitteeC: David Bouldin - Fab ConsultingC: Mark Frankfurth - Cymer

NA Chapter of Silicon Wafer

Global Technical CommitteeC: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein

NA Chapter of Traceability

Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST

NA RSC Technical Architect

BoardC: James Moyne - University of MichiganC: Yaw Obeng - NIST

NA Chapter of Information & Control

Global Technical CommitteeC: Jack Ghiselli - Ghiselli ConsultingC: Brian Rubow - CimetrixC: Lance Rist - RistTex

NA Chapter of Flat Panel Display

Global Technical CommitteeC: Bill Colbran - Engenuity Systems

NA Chapter of Automated Test

Equipment Global Technical CommitteeC: Ajay Khoche - Khoche Consulting

NA Chapter of 3DS-IC Global

Technical CommitteeC: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor

NA Chapter of Facilities Global

Technical CommitteeC: Steve Lewis - LPCiminelli

NA Chapter of Liquid Chemicals

Global Technical CommitteeC: Frank Flowers - PeroxyChem

NA Chapter of HB-LED Global

Technical CommitteeC: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco

NA Chapter of Gases

Global Technical CommitteeC: Mohamed Saleem - Fujikin

NA Chapter of PV Materials

Global Technical CommitteeC: Lori NyeC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide

NA Chapter of Photovoltaic

Global Technical CommitteeC: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan

NA Chapter of MEMS/NEMS

Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan

NA Chapter of Compound Semiconductor

Materials Global Technical CommitteeC: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman

NA Chapter of Environmental Health &

Safety Global Technical CommitteeC: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML

NA Chapter of Microlithography

Global Technical CommitteeC: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST

SEMI North America (NA) RSC Organization - NA LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering

Vice-Chairs: Brian Rubow – Cimetrix

China Chapter of HB-LED

Global Technical CommitteeC: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San an Optoelectronic

China Chapter of PV Global

Technical CommitteeC: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute

SEMI North America RSC Organization – China LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering


Co-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering


SEMI North America RSC Organization – Korea Locale

Korea HB-LED CFG

L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI

Korea Chapter of FPD Materials &

Components Technical Committee C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution

Korea Chapter of Information &

Control Global Technical Committee C: Hyungsu Kim - Doople C: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research

Korea Chapter of Global Facilities

Technical CommitteeC: Kwang Sun Kim - KUT

Korea Chapter of FPD Metrology

Global Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution

SEMI North America RSC Organization – Taiwan LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering


ISC Taiwan Advisor

Tzeng-Yow Lin - CMS/ITRI

Taiwan Chapter of Photovoltaic

Global Technical CommitteeC : B. N. Chuang - CMS/ITRI

C : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan

Taiwan Chapter of EHS Global

Technical CommitteeC:Shuh-Woei Yu - SAHTECHC: Fang-Ming Hsu - TSMC

Taiwan Chapter of 3DS-IC

Global Technical CommitteeC: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE

Taiwan Chapter of Information and

Control Global Technical CommitteeC:Robert Chien - TSMC

Taiwan Chapter of Flat Panel Display

Global Technical CommitteeC: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA

Organization of Each TC Chapter

Taiwan TC Chapter of 3DS-IC

Global Technical CommitteeC: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE

Test TF

L: Tzong-Tsong Miau - ITRIL: Roger Hwang - ASEL: Ming-Chin Tsai - KYEC

Middle End Process TF

L: Arthur Chen - NTUSTL: Erh Hao Chen - ITRIL: Jerry Yang - SEMATECH

NA TC Chapter of 3DS-IC

Global Technical CommitteeC: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor

3DS-IC Bonded Wafer

Stack TFL: Richard Allen - NIST

3DS-IC Inspection and

Metrology TFL: Victor Vartanian -SEMATECH L: David Read - NIST

JA TC Chapter of 3DS-IC

Global Technical CommitteeC: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST

Steering Group

L: Yoshihiro Tomita - IntelL: Masahiro Tsuriya – iNEMIL: Eiji Yoshino – Hitachi High Technologies

3DS-IC Global Technical Committee

Electromagnetic

Characterization SGL: Mikio Kiyono - AET

JA 450 mm ATDP TF

L: Akihito Kawai - DiscoL: Sumio Masuchi - Disco L: Kiyofumi Tanaka – Shin-Etsu PolymerL: Kenichi Watanabe - Lintec

3D-IC SG

L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST

Thin Chip Handling TF

L: Hideki Suzuki - Shin-Etsu PolymerL: Haruo Shimamoto - AIST

5 Year Review TF

L: Masahiro Tsuriya - iNEMIL: Kazunori Kato - AiT

Japan TC Chapter of Assembly &

Packaging Technical CommitteeC: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI

Fiducial Mark

Interoperability TFL: Sumio Masuchi - Disco

Assembly & Packaging Global Technical Committee

Global Equipment Interface

Specification (EIS) TFL: Makoto Ishikawa - Nisshinbo Mechatronics

Europe TC Chapter of Automation

Technology Global Technical CommitteeC: Christian Hoffman - PEER Group

Japan TC Chapter of Automation

Technology Global Technical CommitteeC: Makoto Ishikawa - Nisshinbo MechatronicsC: Naoki Ito - Mitsubishi ElectricC: Terry Asakawa - TEL

Global Equipment Interface

Specification (EIS) TFL: Carsten Born - VITRONIC GmbH

PV Wafer Traceability TF

L: TBD

Automation Technology Global Technical Committee

= Global Task Force

Automated Test Equipment Global Technical Committee

NA TC Chapter of Automated Test

Equipment Technical CommitteeC: Ajay Khoche - Khoche Consulting

Standard Test Data

Format (STDF) TFL: Ajay Khoche - Khoche Consulting

Test Cell Communcations

TFL: Len Van Eck - LTX- CredenceL: Mark Roos - Roos Instruments

Compound Semiconductor Materials (CSM)

Global Technical Committee

Europe TC Chapter of CSM

Global Technical Committee C: Arnd Weber - SiCrystal

Contactless Resistivity

and Mobility Mapping TFL: Wolfgang Jantz - Semimap

SiC TF

L: Arnd Weber - SiCrystal

Japan TC Chapter of CSM

Global Technical CommitteeC: Masayoshi Obara - Shin-Etsu HandotaiC: open

5 Year Review TF

L: TBD

Global 200 mm GaAs

Wafer Specification TFL: TBD

Sapphire Substrate TF

L: Toshiro Kotaki - Namiki Precision Jewel

International SiC TF

L: Taizo Hoshino - Nippon Steel & Sumikin Materials

NA TC Chapter of CSM Global

Technical CommitteeC: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman

Electrical Properties TF

L: Austin Blew - LEI

SEMI M55 5-Yr Review TF

L: Judy Kronwasser - NOVASiC

Silicon Carbide TF

L: Open

GaN TF

L: Judy Kronwasser - NOVASiC

= Global Task Force

Japan TC Chapter of EHS

Global Technical CommitteeC: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho

Global S23 Revision TF

L: George Hoshi - TEL

Environmental, Health & Safety (EHS)

Global Technical Committee

GHG Emission

Characterization TFL: George Hoshi - TEL

Seismic Protection

TFL: Naokatsu Nishiguchi - SCREEN Semiconductor Solutions

FPD System Safety TF

L: Naokatsu Nishiguchi- SCREEN Business Support Solutions

Taiwan TC Chapter of EHS

Global Technical CommitteeC: S. W. Yu - SAHTECHC: F. M. Hsu - TSMC

IC Equipment Safety TF

L: Colin Shen - MXICL: C. C. Huang - SAHTECH

Gas and Chemical Safety

TFL: Benny Chen - AUOL: Heng-Li Sue - SAHTECHL: Moony Lee - UMC

Seismic TF

L: K. C. Tsai - NCREEL: J. S. Hwang - NCREEL: D. W. Sun - TSMC

FPD Safety Subcommittee

L: C. C. Huang - SAHTECH

Equipment Safety TF

L: Benny Chen - AUOL: Juo Cho - AUOL: Alice Lin - CMO

Environmental

Sustainability TFL: Tony C. H. Lu - ITRIL: C Y Huang - TSMC

PV Safety

TFL: Eddie Wu - Nexpower

LED Safety

TFL: Eric Lin - Epistar

EHS TC Chapter

AdvisorRoger Wu - UMC

STEP Planning WG

L: Kenji Sugihara - Panasonic

SDRCM (S Documents REG-PG-SM

Conformance Maintenance) TFL: Supika Mashiro - TEL

= Global Task Force

Environmental, Health & Safety Global Technical Committee

S2 Interlock Reliability TF

L: Bert Planting - ASMLL: Tom Pilz - Pilz GmbH

Ergonomics TF

L: Ron Macklin - Macklin & AssociatesL: Paul Schwab - Texas Instruments

NA TC Chapter of EHS Global

Technical CommitteeC: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML

S2 Ladders & Steps TF

L: Ron Macklin - Macklin & Associates L: Carl Wong - AKTL: Lindy Austin - Salus Engineering

Fire Protection TF

L: Eric Sklar - Safety GuruL: Matt Wyman - Koetter Fire

Lifting Equipment TF

L: Ron Macklin - Macklin & Associates

S2 Chemical Exposure TF

L: John Visty - Salus Engineering

S22 Revision TF

L: Chris Evanston - Salus EngineeringL: Sean Larsen - Lam Research

S6 Revision TF

L: John Visty - Salus EngineeringL: Glenn Holbrook - TUV SUD

S2 Non-Ionizing Radiation

TFL: Sean Larsen - Lam Research L: John Visty - Salus Engineering

S10 Revision TF

L: Eric Sklar - Safety GuruL: Mark Fessler - Tokyo Electron

Manufacturing Equipment Safety

SubcommitteeC: Cliff Greenberg - Nikon PrecisionC: Andrew Giles - ESTECC: Lauren Crane - KLA-Tencor

Seismic Liaison TF

L: Lauren Crane - KLA-Tencor

S27 Revision TF

L: Chris Evanston - Salus Engineering

Energetic Materials EHS

TFL: Steve Trammell - EORML: Andy McIntyre - EORM

Control of Hazardous

Energy (CoHE) Task ForceL: Andrew Giles - ESTEC L: Sean Larsen - Lam Research L: Mark Fessler - Tokyo Electron

Global S23 TF

L: Lauren Crane - KLA-Tencor

Device Removal Shipment

TFL: Eric Sklar - Safety Guru

Flow Limitation TF

L: Eric Sklar - Safety Guru

= Global Task Force

Facilities Global Technical Committee

Japan TC Chapter of Facilities

Global Technical CommitteeC: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan

F1 Revision TF

L: Shuji Moriya - TEL YamanashiL: Yoshifumi Machii - Fujikin

Korea TC Chapter of Facilities

Global Technical CommitteeC: Kwang Sun Kim - KUT

Equipment Cleanness TF

L: TBD

NA TC Chapter of Facilities

Global Technical CommitteeC: Steve Lewis - LPCiminelli

F51 Revision TF

L: Dalia Vernikovsky - Applied Seals North America

Building Information Modeling (BIM) for

Semiconductor Capital Equipment TFL: Ben Bruce - Applied Materials

D31 Revision TF

L: Keizo Ochi - Konica Minolta

FPD Metrology Global Technical Committee

Transparent Display TF

L:JongSeo Lee - Samsung Display

Perceptual Image Quality

TFL: Jongho Chong - Samsung Display

Perceptual Viewing Angle

TFL: Myongyoung Lee - LG Electronics

Flexible Display TF

L: WangWen - Tung - ITRI

LCD Subcommittee

L: Kerson Wang - AUO

E-Paper Display TF

L: Fang Hui - MeiL: Bor-Jiunn Wen - CMS/ITRI

Touch Screen Panel TF

L: Yen-Wen Fang - AUOL: S.Y. Chou - CMS/ITRI

Korea TC Chapter of FPD Metrology

Global Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution

Japan TC Chapter of FPD Metrology

Global Technical CommitteeC: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics

Taiwan TC Chapter of FPD Metrology

Global Technical CommitteeC: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA

FPD Materials & Components Global Technical Committee

Polarizing Film TF

L: Toshihito Otsuka - SanritzL: Yoshihiko Shibahara - Fujifilm

L: Shigeo Kobayashi - Nitto

Denko

Flexible Display TF

L: Haruhiko Itoh - Teijin L: Tadahiro Furukawa - Yamagata University

FPD Color Filter TF

L: Tadahiro Furukawa -Yamagata University

FPD Mask TF

L: Kazuya Shiojiri - SK ElectronicsL: Hirofumi Ihara - HOYA

NA TC Chapter of FPD

Technical CommitteeC:Bill Colbran - Engenuity Systems

Japan TC Chapter of FPD Materials &

Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - Fujifilm

Korea TC Chapter of FPD Materials

& Component Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution

NA TC Chapter of Gases

Global Technical CommitteeC: Mohamed Saleem - Fujikin

Mass Flow TF

L: Mohamed Saleem - Fujikin

Pressure Measurement TF

L: Joyce Chen - UCTL: Jeff Christian - WIKA

Filters & Purifiers TF

L: Mohamed Saleem - Fujikin

Materials of Construction

Gas Delivery Systems TFL: Bill Kiikvee - AP TECH

Gases Global Technical Committee

Heater Jacket TF

L: David Colquhoun - BriskHeat

Gas Specifications TF

L: Mark Ripkowski - CONSCI

Surface Mount Sandwich

Component Dimensions TFL: Matt Milburn - UCT

Europe TC Chapter of Gases

Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Gordon F Consulting

Korea Gas & Liquid Chemicals

CFGL: TBD

Japan TC Chapter of Gases

Global Technical CommitteeC: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan

Gas Panel Test Method TF

L: Yoshifumi Machii - Fujikin L: Shuji Moriya - TEL Yamanashi

Live Gas Flow Rate TF

L: Moriya Shuji - TEL YamanashiL: Shimizu Tetsuo - Horiba STECL: Ishihara Seiji - Flow Techno Service

5 Year Review TF

L: Yoshifumi Machii - Fujikin

China TC Chapter of HB-LED

Global Technical CommitteeC: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San an Optoelectronic

HB-LED Global Technical Committee

NA TC Chapter of HB-LED

Global Technical CommitteeC: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco

HB-LED Equipment

Automation Interfaces TFL: Daniel Babbs - Brooks AutomationL: Jeff Felipe - Entegris

HB-LED Assembly TF

L: Paul Reid - Kulicke & Soffa

HB-LED Wafer TF

L: Win Bayles - BayTech-Resor

HB-LED Impurities and Defects

in Sapphire Wafers TFL: Luke Glinski - GT Advanced Technologies

HB-LED Equipment

Communication Interfaces TFL: Brian Rubow - Cimetrix

Patterned Sapphire

Substrate (PSS) TFL: Win Bayles - BayTech-Resor

Korea HB-LED CFG

L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI

Test Methods TF

L: Peter Wagner - Self

Single Crystal Sapphire TF

L: Yong Ji - Guizhou Haotian Optoelectronics Technology

L: Xinhong Yang - AURORA

GaN based LED Epitaxial Wafer

TFL: Fa Dong - THTF

L: Xinhong Yang - AURORA

Sapphire Single Crystal Ingot

TFL: Hongo Zuo – AURORA

L: Songbin Zhao - DDXDF

Sapphire Single Crystal

Orientation Task ForceL: Songbin Zhao - DDXDF

HB-LED Source Materials

TFL: Paul Ahn – VeecoL: H.B. Joo -Aixtron L: Sungjin Jun - LG InnotekL: Deok-gil - Samsung

Electronics

Process Control Systems

TFL: Martin Schellenberger - FhG IISB

Information & Control Global Technical Committee

TA

Hiroshi Kondo - Murata MachineryTadashi Mochizuki - TEL

GEM300 TF

L: Yoshihisa Takasaki - SCREEN Semiconductor SolutionsL: Yuko Toyoshima - Hitachi High-Technologies

Equipment Information

System Security TFL: Mitch Sakamoto - Freelance

Japan I&CC Maintenance

TFL: Mitsuhiro Matsuda - Hitachi Kokusai Electric

GEM300 TF

L: Jong Sub Shim - ASM L: Chang Yul Cho - SEMESL: Byoung Min Im - TEL Korea

DDA TF

L: Hyungsu Kim - Doople

Europe TC Chapter of Information &

Control Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec

Japan TC Chapter of Information &

Control Global Technical CommitteeC: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai ElectricAdviser: Mitch Sakamoto - Freelance

Korea TC Chapter of Information &

Control Global Technical CommitteeC: Hyungsu Kim - DoopleC: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research

Fiducial Mark

Interoperability TFL: Mitsuhiro Matsuda - Hitachi Kokusai Electric

Information & Control Global Technical Committee

GEM300 TF

L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant

Diagnostic Data

Acquisition (DDA) TFL: Brian Rubow - CimetrixL: Gino Crispieri - Consultant

Process Control System

Architecture (PCS) TFL: James Moyne - University of MichiganL: Chris Maloney - Intel

Energy Saving Equipment

Communication TFL: Gino Crispieri - ConsultantL: Mike Czerniak - Edwards Vacuum

Equipment Information

TFL : Liao Robin - TSMC

GEM 300 TF

L : Liao Robin - TSMC

NA TC Chapter of Information &

Control Global Technical CommitteeC: Brian Rubow - CimetrixC: Jack Ghiselli - Ghiselli ConsultingC: Lance Rist - RistTex

Taiwan TC Chapter of Information &

Control Global Technical CommitteeC: Robert Chien - TSMC

Sensor Bus TF

C: James Moyne - University of Michigan

Backend Factory Integration

TFL :Ivan Chen - TSMCL: C.Y. Chiu - TSMC

Precursor Specifications

TFL: Paul Williams - SAFC Hitech

Liquid Chemicals Global Technical Committee

Solvents in Advanced

Processes TFL: TBD

Analytical Methods TF

L: Frank Flowers - PeroxyChem

SEMI F57 Rewrite TF

L: James Henry - Arkema GroupL: Ian Francisco - Lam Research

Determining Roughness

of Polymer Surfaces TFL: Gunter Moeller - Arkema Group

SEMI IX Resin TF

L: Slava Libman - Air Liquide

UPW Filter Performance

TFL: Slava Libman - Air Liquide

SEMI F63 Rewrite TF

L: Slava Libman - Air Liquide

SEMI F31, F39 & F41

Rewrite TFL: David Kandiyeli - Mega Fluid SystemsL: Koh Murai - Mega Fluid Systems

SEMI F40 Rewrite TF

L: Don Hadder Jr. - Intel

Liquid Chemicals

SubcommitteeC: Frank Flowers - PeroxyChem

Liquid Chemical Distribution

SubcommitteeC: open

Diaphragm Valve TF

L: Shigeru Ohsugi - CKDL: Kimihito Sasao - Advance Electric

Welding Fitting TF

L: Kimihito Sasao - Advance ElectricL: Takashi Hasegawa - KITZ SCT

Liquid Filter TF

L: Takuya Nagafuchi - Nihon EntegrisL: Takehito Mizuno - Nihon Pall

Liquid-Borne Particle

Counter TFL: Kaoru Kondo - RIONL: Kazutoshi Kato - PMS

Europe TC Chapter of Liquid Chemicals

Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics

Japan TC Chapter of Liquid Chemicals

Global Technical CommitteeC: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions

NA TC Chapter of Liquid Chemicals

Global Technical CommitteeC: Frank Flowers - PeroxyChem

Permeation Tubes for Trace

Moisture Calibration TFL: Jean-Marie Collard - Solvay ChemicalsL: Jim Mc Kinley - KIN-TEK

Ultrapure Liquid

Evaluation Study GroupL: Kaoru Kondo - Rion L: Hiroshi Sugawara - Organo

Korea Gas & Liquids

Chemicals CFGL: TBD

MEMS/NEMS Global Technical Committee

Packaging TF

L: Steve Martell - Sonoscan

Wafer Bond TF

L: Win Baylies - BayTech-ResorL: Richard Allen - NIST

Material Characterization

TFL: Richard Allen - NIST

International MEMS

Terminology TFL: Steven Martell - Sonoscan

Reliability TF

L: Open

Microfluidics TF

L: Mark Tondra - Diagnostic Biosensors

NA TC Chapter of MEMS/NEMS

Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan

= Global Task Force

Europe TC Chapter of Metrics

Global Technical CommitteeC: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB

Metrics Global Technical Committee

Japan TC Chapter of Metrics

Global Technical CommitteeC: Toshio Murakami - Murakami Corporation

Int'l Environmental

Contamination Control TFL: Mikio Furukawa - Shin-Etsu Polymer

ESD/ESC TF

L: Toshio Murakami - Murakumi Corporation

EMC Study Group

L: Koji Ochi - Noise Laboratory

Cycle Time Metrics TF

L: Kenichiro Mukai - Applied Materials JapanL: Supika Mashiro - TEL

Metrics Education & Adoption

(MEA) Subc (inactive)C: TBD

EMC TF

L: Vladimir Kraz - BestESD Technical ServicesL: Mark Frankfurth - Cymer

ESD/ESC TF (inactive)

L: Arnold Steinman - Electronics WorkshopL: open

Factory Level Productivity

Metrics TF (inactive)L: Ron Billings - Georgia Tech/ FABQL: Jim Irwin - I/C Irwin Consulting

Equipment Training &

Documentation TFL: Mark Cohran - IntelL: Malthi Venkat - Nikon Precision

Wait Time Waste Metrics

and Methods TFL: Lance Rist - RistTex

Equipment RAMP Metrics

TFL: David Busing - ConsultantL: Steven Meyer - Intel

Equipment Cost of

Ownership TF (inactive)L: Daren Dance - WWKL: David Bouldin - Fab Consulting

NA TC Chapter of Metrics

Global Technical CommitteeC: David Bouldin - Fab ConsultingC: Mark Frankfurth - CymerTE: Carolyn Busing - Self TE: Chona Shumate - CymerTA: Greg Francis - Cymer

= Global Task Force

Micropatterning Global Technical Committee

5 Year Review TF

L: Morihisa Hoga - Dainippon Printing

Mask Data Format for

Mask Tools TF L: Toshio Suzuki - Dainippon Printing

Extreme Ultraviolet (EUV)

Mask TFL: David Chan - SEMATECH

Data Path TF

L: Thomas Grebinski - OASIS ToolingL: Kurt Wampler - ASML

NA TC Chapter of Microlithography

Global Technical CommitteeC: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST

Japan TC Chapter of Micropatterning

Global Technical CommitteeC: Morihisa Hoga - Dainippon Printing

Extreme Ultraviolet (EUV)

Fiducial Mark TFL: Long He - SEMATECH

Photovoltaic Global Technical Committee

China TC Chapter of PV

Global Technical CommitteeC: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute

PV Silicon Wafer TF

L: Yuepeng Wan - LDKL: Liangping Deng - LONGi

L: Jingang Lu - Suntech

Thin Film PV TF

L: Yaohua Mai - Baoding Tianwei SolarfilmsL: Xinwei Niu - Chint SolarL: Jian Ding - Hanergy

PV Silicon Raw Materials

TF

L: Xiaoxia Liu - GCL

L: Dongxu Chu - SINOSICO

L: He Li - CPVT

Taiwan TC Chapter of PV

Global Technical CommitteeC : B. N. Chuang - CMS/ITRI

C : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan

Organic & Dye Sensitized

Solar Cell TFL : Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRI

PV Wafer Measurement

Method TFL : Samunine Chen - Chunson

PV Package Performance

TFL: C.C.Lin - PV GuiderL: Bor -Tsuen Wang - National Pingtung UnviersityL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King Design

Building Integrated

Photovoltaic (BIPV) TFL: C.C.Lin - PV GuiderL: Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King DesignL: K. Han Ke - Gran System

NA TC Chapter of Global PV

Technical CommitteeC: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan

Japan TC Chapter of Global PV

Technical CommitteeC: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - Kashima ConsultantC: Masaaki Yamamichi - AIST

Multi-Wire Saws TF

L: Jingying Jia - National Engineering Research Center for Photovoltaic EquipmentL: Xianwu Cai - CETC 48th InstituteL: Zhixin Li – LCTL: Honglin Sui - CETC-48

Crystalline Silicon Solar Cell TF

L: Dengyuan Song - YingLi EnergyL: Ruling Chen - Suntech

L: Xianwu Cai - 48th Institute

PV Diffusion Furnace Test

Methods TFL: Liangyu Liu - CETC-48thL: Xianwu Cai - CETC-48th

L: Jianyu Zheng - SevenStar

PV Module TF

L: Wei Zhou - Trina Solar

L: Liang Luo - Hunan Red SolarL: Zhen Zhang - Hohai UniversityL: Jingbing Zhu - Suntech

PV Reliability Test Method

TFL: H.S. Wu – CMS/ITRI

EU TC Chapter of PV Materials

Global Technical Committee C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley

PV Silicon Materials TF

L: Peter Wagner - Consultant

PV Materials Global Technical Committee

NA TC Chapter of PV Materials

Global Technical Committee C: Lori NyeC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide Electronics US

JA TC Chapter of PV Materials

Global Technical Committee C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima – Kashima EngineeringC: Tetsuo Fukuda - AIST

Japan PV Materials TF

L: Tetsuo Fukuda - AISTL: Takashi Ishihara - Mitsubishi Electronic

Int l PV Analytical Test Methods,

Metrology, and Inspection TFL: Hugh Gotts - Air Liquide Electronics USL: Ron Sinton - Sinton InstrumentsL: Chris Moore - BayTech-Resor

Int l PV Analytical Test Methods,

Metrology, and Inspection TFL: Peter Wagner - Consultant

= Global Task Force

International Reticle SMIF Pod

& Loadport Interoperability TFL: Jan Rothe - GLOBALFOUNDRIES

Physical Interfaces & Carriers Global Technical Committee

Global PIC Maintenance

TFL: Shoji Komatsu - Acteon

International 450 mm PIC

TFL: Shoji Komatsu - Acteon

Fiducial Mark Interoperability

TFL: Supika Mashiro - TEL

Glboal PIC Maintenance

TFL: Larry Hartsough - UA Associates

EUV Reticle Handling TF

L: Long He - SEMATECHL: David Chan - SEMATECHL: John Zimmerman - ASMLL: Kazuya Ota - Nikon

International 450 mm PIC

TFL: Melvin Jung - IntelL: Shoji Komatsu - Acteon

NA 450mm Shipping Box

TFL: Tom Quinn - Intel

International 450 mm

Shipping Box TFL: Tom Quinn - Intel

450mm ATDP TF

L: Stefan Radloff - Intel

International Reticle SMIF Pod

& Loadport Interoperability TFL: Jan Rothe - GLOBALFOUNDRIES

International Process Module

Physical Interface (IPPI) TFL: Richard Oechsner - Fraunhofer

NA TC Chapter of Physical Interfaces & Carriers

Global Technical CommitteeC: Matt Fuller - EntegrisC: Stefan Radloff - Intel

Japan TC Chapter of Physical Interfaces &

Carriers Global Technical CommitteeC: Tsuyoshi Nagashima - Miraial C: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKUTA: Shoji Komatsu - Acteon

Europe TC Chapter of Physical Interfaces &

Carriers Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec

= Global Task Force

Europe TC Chapter of Si Wafer

Global Technical CommitteeC: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic

International Terminology

TFL: Peter Wagner - Consultant

International Advanced

Wafer Geometry TFL: Fritz Passek - SiltronicL: Frank Riedel - Siltronic

International Test

Methods TFL: Peter Wagner - Consultant


Surface Inspection TF L: Frank Riedel - Siltronic

International Polished

Wafers TFL: Frank Riedel - Siltronic

Silicon Wafer Global Technical Committee

International Annealed

Wafers TFL: Dinesh Gupta - STA

International Epitaxial

Wafers TFL: Dinesh Gupta - STA


Wafers TFL: John Valley - SunEdison SemiconductorL: Mike Goldstein

International SOI Wafers

TFL: Bich-Yen Nguyen - SOITEC


Wafer Geometry TFL: Noel Poduje - SMSL: Jaydeep Sinha


TFL: TBD

NA TC Chapter of Si Wafer

Global Technical CommitteeC: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein TE: Murray Bullis - Materials & Metrology

International Test

Methods TFL: Dinesh Gupta - STA

International Automated

Advance Surface Inspection TFL: Kurt Haller - KLA Tencor

= Global Task Force

Japan TC Chapter of Si Wafer

Global Technical CommitteeC: Naoyuki Kawai - The University of TokyoC: Tetsuya Nakai - SUMCO

International Annealed

Wafers TFL: Koji Araki - GlobalWafers Japan

Silicon Wafer Global Technical Committee


TFL: Tetsuya Nakai - SUMCO


Wafer Geometry TFL: Satoshi Akiyama - Raytex

Japan JWG TF

L: Masanori Yoshise - FreelanceL: Satoshi Akiyama - Raytex

International Test Method

TFL: Ryuji Takeda - GlobalWafers Japan

International SOI Wafers

TFL: Atsushi Ogura - Meiji University


Surface Inspection TFL: Masami Ikota - Hitachi High Technologies

JA Shipping Box TF

L: Shoji Komatsu - ActeonL: Tsuyoshi Nagashima - Mirial

International 450 mm

Shipping Box TFL: Shoji Komatsu - Acteon

GOI WG

L: Tsuyoshi Otsuki - Shin-Etsu Handotai

Surface Organic

Contaminant Analysis WGL: Mikako Omata - Sumika Chemical Analysis Service

Surface Metal Chemical

Analysis WGL: Ryuji Takeda - GlobalWafers JapanL: Ryo Machida - Sumika Chemical Analysis Service

BMD DZ WG

L: Satoshi Akiyama - RaytexL: Kazuo Moriya - Raytex

Bulk Heavy Metal Analysis by

Electrical Measurement WGL: Shingo Sumie - KOBELCOL: Masaru Akamatsu - KOBELCO

International Epitaxial

Wafers TFL: Naohisa Toda - Shin-Etsu Handotai

Japan Test Method TF

L: Ryuji Takeda - GlobalWafers JapanL: Tsuyoshi Otsuki Shin-Etsu HandotaiL: Mikako Omata - SCAS


Wafers TFL: Yasutoshi Takamoti - GlobalWafers Japan

Fiducial Mark

Interoperability TFL: Tetsuya Nakai - SUMCO

= Global Task Force

Traceability Global Technical Committee

5 Year Review

TFL: Hirokazu Tsunobuchi - Keyence

NA TC Chapter of Traceability

Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST

5 Year Review TF

L: Win Baylies - BayTech-Resor

Japan TC Chapter of Traceability

Global Technical CommitteeC: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence

Fiducial Mark

Interoperability TFL: Hirokazu Tsunobuchi - Keyence