optical integration key to the next generation networks focus... · optical integration – key to...

NTT Electronics Corp. ©2011 – proprietary & confidential

NEL America

Optical Integration – Key to the

Next Generation Networks

Atul Srivastava

CTO, NTT Electronics-A


Agenda

Introduction

Trends in Optical Networks

100G and higher channel rate

CDC ROADM networking

Integrated Optical Components

100G and higher rate components

Integrated receivers

Hybrid LN modulators

Narrow Line width lasers

CDC ROADM Components

Split and Select Switches

1xN OCMs

2


Transmission System Evolution

3

EDFAs

Novel Fibers

Dispersion Control

Non-linearity Control

Novel Mod. Format

Coherent Receiver

High Speed ADC/DSP

WSS/ROADMs for

Efficient BW usage

Capacity demand

Requires 100x

Revolution

Coherent OFDM

Stronger FEC

Hybrid Raman/EDFA

Multi-Core Fiber

Multi-Mode Transmission


Commercial Transmission Systems

Current Systems 100Gb/s: Transmission, Cross-connect and IP Router interface rates

have coalesced

8Tb/s Capacity 80 Ch @ 100Gb/s 50Hz

PM-QPSK, 28Gbaud, 4bits/symbol

Coherent Detection with ADC/DSP

Future Systems 2015 - 400Gb/s?

2020 - 1Tb/s?

4

Year 1990s past

2000 past

2010 present

2020 future

System Capacity 20-160 Gb/s 1 Tb/s 8 Tb/s 100Tb/s

Channel Rate 2.5-10 Gb/s 10 Gb/s 40-100 Gb/s 1 Tb/s!

No. of WDM Channels 8, 16, 40 100 100-160 100

Spectral Efficiency .025-.05 0.2 2 20!


Exponential growth in 100G deployment

5

Courtesy: Andrew Schmitt, Infonetics, FOE 2012

0

50

100

150

200

CY07 CY08 CY09 CY10 CY11 CY12 CY13 CY14 CY15 CY16

Un

its (

K)

$0

$10

$20

$30

$40

$50

$60

AS

P (

$K

)

NEM 40G units Non-NEM 40G units

NEM 100G units Non-NEM 100G units

40G component ASP 100G component ASP

• 100G pricing to reach

2x 40G in 2013,

resulting in rapid shift

to 100G

• The majority of

carriers move to 100G

from 40G at this price

Projected >100K LH interfaces

in 2016


Current OIF LH 100G MSA module:

6

• Size: 5 in. x 7 in.

• Power Dissipation: 80 W


100G DP-QPSK LH transponder components

CONT. 100G

OTN

LSI

TLA

DRV

MUX

DRV

90°

hybrid

90°

hybrid PBS

TLA(LO)

ADC+

DSP

LSI

Transmitter

Receiver

x

y

X2

ADC

TIA

DSP-LSI Clients (CFP)

PBC

100G-DP-QPSK

modulator

100G-DP-QPSK

receiver

ADC

ADC ADC

118 x 13.5 x 7 mm

50 x 27 x 7 mm

Integration is key to reducing size and power dissipation


100G Module MSA Progress: Enabling higher card density

5x7 MSA

100W

Size (Smaller)

CurrentOIF MSA 1.1

Future MSA (CFP ??)

2013 OIF MSA 2.0

Smaller Size Low Power

Power Consumption

8

Smaller Size Low Power


Example of Module Layout

in the 100G Transmission Line Card a) Transponder

Framer

CFP

100G

LH MSA

(4”x5”,<40W)

b) Muxponder

XFP

×10

c) Regenerator Framer

100G

LH MSA

(4”x5”,<40W)

100G

LH MSA

(4”x5”,<40W)

DC/DC

Conv. Area

DC/DC

Conv. Area

DC/DC

Conv. Area

a) Transponder b) Muxponder c) Regenerator

5”x7”(Gen.1)

4”x5”(Gen.2)

100G

LH MSA

(4”x5”,<40W)

Module size required for the line card

The module with the size of 4”x5” can be installed in three kinds of the

line card.

9

Courtesy: Onaka, Fujitsu


Evolution of modules

Considering SFF transponder, SFF modulator will be needed.

5” x 7” 4” x 5” ?


Smaller Integrated Components for smaller size

pluggable (CFP) modules

11

ASIC

iTx

Coherent 100G CFP modules within 2-5 years


SFF DP-QPSK modulator

Smaller size and same side fiber in/output package.

Suitable for limited mount area like 4” x 5”.

The target package size is 105.0 x 13.5 x 7.0 mm.

5”

4”

Features

modulator

LD LD

Receiver DSP

12


Optical Integration: Drivers and role of PLC

Optical Components and modules

Increasing complexity

Reduction in Size

Lower cost

Lower power consumption

Integrated optics on a silica PLC platform.

High density integration

Monolithic

Hybrid with LN and InP

Large wafers

Very low power consumption

High yields

13


PLC technologies

Optical fiber

Optical fiber array

Bonding w/ UV-curable adhesive

Size: 4 x 2 x 2.5 mm

PLC

Stable and reliable based on silica glass

Precisely controlled waveguide cores, mass-producible

Well-established and reliable fiber attachment

Low propagation loss of 0.3 dB/m

Various functions (Y-branch, coupler, optical switch, variable optical attenuation,

MUX/DEMUX (AWG etc.)

Efficient heatsink of Si substrate

Core Size: 8

x 8 mm


100G DP-QPSK Modulator

Data ports (RF electrodes) are separated from DC bias ports.

DC bias is controlled by differential electrodes.

@32GBaud

PD (X) RF XI, XQ DC bias

XPp , XPn

INPUT OUTPUT PBC

Polarization

Converter

PD (Y) RF YI, YQ

DC bias YIp , YIn , YQp , YQn

DC bias YPp , YPn

DC bias

XIp , XIn , XQp , XQn

PD (X) RF XI, XQ DC bias

XPp , XPn

INPUT OUTPUT PBC

Polarization

Converter

PD (Y) RF YI, YQ

DC bias YIp , YIn , YQp , YQn

DC bias YPp , YPn

DC bias

XIp , XIn , XQp , XQn

15


Silica PLC

Silica PLC

LN waveguide

Straight-line phase modulators

Passives

- Large EO coefficient - Large bandwidth

- Flexible circuit design: PBS, couplers, splitters, U-turn, etc… - Low propagation loss - Mass producible

100G Modulator – Hybrid Integration

Highly integrated modulator

Scalable to advanced formats

Compact and low insertion loss

16


Modulator – R&D direction: Increasing Integration

2010 2015

[PLC-LN] RZ-integrated QPSK

ILF

[PLC-LN] Two subcarrier

OFDM-QPSK

[PLC-LN] PDM-QPSK

[PLC-LN] 64 QAM

4:3 2:1

4:3 2:1

[PLC-LN] Modulation-level selectable

Higher

Spectral

Efficiency

Compact and

Flexible

100G

200G

400G

2020

40G

1T

[InP-MZM] Ultra-compact PDM-QPSK

[InP-MZM] 16 QAM with DAC

17


In-phase [a.u.]

Quadra

ture

[a

.u.]

194.06 194.08 194.1 194.12

Frequency [THz]O

ptic

al i

nte

nsity

[1

0 d

B/g

rid

] .

20 GHz

64 QAM modulators for higher SE

18

4:3

VOA (for fine tuning) QPSK1

QPSK2

QPSK3 2:1

4:3

2:1

PLC-R 14.0 mm PLC-L

34.0 mm LN

63.7 mm

IL: 5.5 dB

Package: 146.0 x 18.7 x 11.0 mm

64 QAM generation with optical

DAC configuration.

H. Yamazaki et al., ECOC'09

NTT Electronics Corp. ©2010 – proprietary & confidential 19

TILF2

TILF3

TILF1 PBC VC

FSR=100GHz

FSR=200GHz

FSR=200GHz

Half-wave plate as Pol. Rot.

PLC-I chip PLC-O chip LN chip

In Out

Signal electrode TO phase shifter Stress-release groove

X

Y

X1

Y1

X2

Y2

X3

Y3

X4

Y4

for 50-GHz grid carriers

Flexible format modulator with multi-carrier

T. Goh et al., OFC‘11


-70

-60

-50

-40

-30

-20

-10

193.15 193.20 193.25 193.30 193.35 193.40 193.45 193.50

Frequency [THz]

Inte

ncsity [

dB

m]

Y

X

-70

-60

-50

-40

-30

-20

-10

193.15 193.20 193.25 193.30 193.35 193.40 193.45 193.50

Frequency [THz]In

ten

csity [

dB

m]

Y

X

-70

-60

-50

-40

-30

-20

-10

193.15 193.20 193.25 193.30 193.35 193.40 193.45 193.50

Frequency [THz]

Inte

ncsity [

dB

m]

Y

X

Operation of Flexible format modulator 4-carrier BPSK mode 2-carrier QPSK mode 1-carrier 16QAM mode

ch1 ch2 ch1

50GHz

ch1 ch2 ch3 ch4

50GHz-grid

1bit/sym. x 4carrier

x 25Gbaud x 2pol.

= 200Gbps


x 25Gbaud x 2pol.

= 200Gbps


x 25Gbaud x 2pol.

= 200Gbps

T. Goh et al., OFC‘11


Receivers: hybrid integration

21

XI

XQ

TIA

YI

YQ

TIA

TIA

TIA

90O

hybrid

(Y-pol.)

BS

PBS

Pol. rotator

90O

hybrid

(X pol.) SIG

LO

One-chip PLC Chip-scale packaged O/E

Lenses 2 TIAs/chip

4 PDs/chip

Key devices developed in-house are assembled with hybrid integration technology

Silica-based PLC

InP/InGaAs PIN-PD

InP HBT IC PKG size 50 x 27 x 7 mm (40 x 27 x 6 mm version is under development)


Device concept & configuration

Features

● Long-term wavelength stability

without mode-hopping

● Reliable operation without moving parts

● Automatic power control via the SOA

(therefore no wavelength change)

● C-band & L-band

12ch. DFB array + 12X1 MMI Coupler + SOA + Wavelength Locker

DFB LD array Coupler SOA

Wavelength Locker

isolator

lens lens

fiber

Tunable Laser Array (TLA)


Module Features

12.7-mm x 30-mm (footprint) standard-

size 26-pin butterfly package

Internal Wavelength Locker

Specifications

Tuning range: >35 nm

C-band : 1529-1568 nm

L-band : 1567-1607 nm

Module output: 13 dBm(C/L-band)

Side-mode suppression: > 40 dB

Linewidth : 10MHz (Current ver.)

Wide Tuning Characteristics

Tunable Laser Array (TLA)

Total Tuning

Range:35 nm

1530.0

1540.0

1550.0

1560.0

1570.0

0 10 20 30 40 50 60

Wave

lengt

h (nm

)Temperature (deg.)

C-band full cover

Total Tuning

Range:35 nm

1530.0

1540.0

1550.0

1560.0

1570.0

0 10 20 30 40 50 60

Wave

lengt

h (nm

)Temperature (deg.)

C-band full cover


0

200

400

600

800

1000

191000 192000 193000 194000 195000 196000 197000

Frequency (G H z)

Linewidth (kHz)

Typical Linewidth Characteristics

@16dBm

ITLA TLA Module (Butterfly)

Integrated Tunable Laser Array (iTLA)


Tunable Transmitter Module

25


40G/100G Integrated Devices Roadmap 2011 2012 2013 2014 2015

System

TRx

DSP

IRM

Modulator

T-LD

Low power ver.

ULH/LH 40G 100G

Metro 40G 100G

300pin

(5” x 7”)

27 x 48 x 7 mm

1.2 W (typ.) 15 x 30 x 5 mm

> 1 W

ITLA

30.5 x 74 x 10.5 mm

6.5 W

118 x 13 x 7 mm

1 slot/40G

2 slots/100G

2nd ver.

InP MZM

小型pkg

1 slot/100G

2 slots/400G

▲

2nd gen.

Pluggable

(CFP-like)

15×6 ×6 mm

> 2.5 W

? mm

> 20 W

DP-QPSK Module

25 x 15 x 7 mm

21×13×8 mm

145 x 82 x 13.6 mm

> 32W

37.5 x 37.5 mm

> 45 W

Low power

Compact


Agenda

Introduction

Trends in Optical Networks

100G and higher channel rate

CDC ROADM networking

Integrated Optical Components

100G and higher rate components

Integrated receivers

Hybrid LN modulators

Narrow Linewidth lasers

CDC ROADM Components

Split and Select Switches

1xN OCMs

27


Multicast

switch

Aggregation

switch

Route 1

Next-Gen C-D-C ROADM

Multicast/aggregation switch can connect any wavelength channel to any direction without wavelength contention.

TRx

WSS

Route 2 WSS

Route N WSS

OSP or

WSS

OSP or

WSS

OSP or

WSS


Nx1

SW

Realization of Multicast Switch

1xM

WSS

Rx

TFs

Solutions NxM WSS

N x M WSS is still challenging to realize.

Array of WSS could be possible but might cause very high cost.

PLC-based Split and Select (SS) SW + TFs could be a reasonable solution. This will enable C-D-C ROADMs at a reasonable cost.

Proposed SS SW + Tunable Filters

Rx

Directions

NxM WSS

Rx

Directions Directions

or

1xM

WSS

1xM

WSS Splitters

PLC

Integration Nx1

SW

Nx1

SW

Nx1

SW

Nx1

SW

Nx1

SW


PLC-based SS Switch (Technologies)

Thermo-optic switch with MZ configuration has high reliability and durability because it has no moving part. NEL has been shipped a lot of PLC-ROADM products in which the switch is applied.

Splitter designed by Wave-front Matching Method (WFM) is compact, low-loss, and wavelength-independent

1xM Spl. [1]

Nx1 SW [1]

N x M SS Switch

1xM Spl. [2]

1xM Spl. [N]

Nx1 SW [2]

Nx1 SW [M]

PLC Thermo-Optic Switch

Splitter with WFM method

200 mm


PLC-based SS Switch (Advantage)

103 mm

Our original configuration enables ‘one-chip’ dense integration of all elements, which can reduce device size and cost.

This design also realizes very good insertion loss uniformity.

PLC chip

8x8 SS switch configuration

8x12 SS switch configuration

MZ switch element

1x2 splitter

15 m

m

116 mm

PLC chip

23

.5 m

m

Integration


8x12 SS Switch Design (‘2 units in one’ configuration)

Need air flow: 1.0 m/sec

↓

210x210x14 mm Control board included

12

8

12

8 Control

Board

PLC chip and mount

8x12 SS-SW (B)

PLC chip and mount

8x12 SS-SW (A)

Single slot height with two of

8x12 switch co-package.


Summary

For volume deployment of systems with 100G and higher

data rate industry needs

Reduced size of components and modules

Reduced power dissipation

Reduce cost

Low cost CDC ROADMs are enabled by

MxN Split-and Select Switches

1xN Optical Channel Monitors

Optical integration is key to the next generation system

PLC technology is a key enabler including

Semiconductor integrated devices

33


NEL America

Thank You!

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