olivier vatel
TRANSCRIPT
SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd. 1
Accelerated innovation through strategic collaboration: a view from an equipment supplier
Olivier Vatel SCREEN Semiconductor Solutions Co., Ltd. CTO March 1, 2018
AGENDA
SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd. 2
Company outline and Product Line-up 1
Wet Clean & Litho. Track highlights 3
LETI collaboration A long History 2
Focus on Laser anneal collaboration 4
Conclusion 5
3 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Source: Gartner, April 2015
Company Name: Head Quarter: Kyoto, Japan President: Tadahiro Suhara Product Line-up
Semiconductor Equipment Solutions Wet Clean
Single
Wet Clean Batch
Scrubber Clean
Laser Anneal
Metrology
Flash Anneal
Track Coat/Develop
RE/VM series
LA-3000F
LT-3100
SU-3200
FC-3100
DT-3000
Market Share No.1
Market Share No.1
Market Share No.1
Providing leading-edge technology and solutions
4 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Product Line-up
Ф100mm
Semiconductor Equipment Solutions
Single Wafer Cleaner
Measurement System
Coat/Develop Track
Scrubber
Frontier Project for 200mm
Direct Imaging System Wet Station
SU-3200
SU-3300 SS-3200
Ф300mm
SS-3100
SS-80EX
Ф300mm
Ф300mm
Ф300mm
Ф200mm
FC-821L
FC-3100
WS-820L/WS-620C
Ф200mm
Ф300mm
Ф300mm
Ф300mm
Ф200mm
RE-3100/3300 Series VM-2200/3200 Series
VM-1200/1300 Series
Ф150mm
Ф300mm
Ф100mm
Ф300mm
Ф100mm
Ф300mm Ф200mm
Ф300mm
SU-2000
Ф200mm
CW-1500
Ф200mm
DW-3000
ZI-2000
Ф200mm
LA-3000-F
LA-830
LT-3000/3100
Ф200mm
Ф300mm
Ф300mm Ф300mm
Ф50mm
Ф300mm
VM-1020/1030 Series Ф200mm
DT-3000
Annealing System
600mm
DW-3000 for PLP
RF-310A
5 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Office and Plants Locations
Taga Plant
Global Training Center (Yasu Plant)
WHITE CANVAS RAKUSAI (Rakusai Site) Source:Google, ZENRIN 2014
Fab. FC-1・FC-2 (Hikone Plant)
Process Technology Center (Hikone Plant)
Headquarter
Shiga Pref. Japan
6 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
FLX-1200 E-Beam
LETI Partnerships in Wet, Laser Anneal & Litho Tracks
7 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Single Wafer Cleaner SU-3100
♦ 2012: SCREEN engagement via JDP’s in FDSOI community. (STMicroelectronics, SOITEC, LETI)
♦ 2012: Installation of first WET Single Wafer Cleaner SU-3100 for FEOL applications.
♦ 2014: Installation of second WET Single Wafer Cleaner SU-3100 for BEOL applications.
♦ 2015: SCREEN joined European program WAYTOGOFAST.
Single Wafer Cleaner SU-3100
2015 2012 2014
LETI-SCREEN wet technology engagement
8 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Article in Solid State Technology from Laurent Pain, Raluca Tiron, Ludovic Lattard, Stefan Landis and Cyrille Laviron
KEY PROJECTS:
1. Leti IDEAL JDA to achieve DSA POR and process yield (CH Via)
2. Leti IMAGINE JDA to achieve E-Beam POR enabling new market 3. Improve Defect /CDU /LWR with new technologies
4. New process development with chemical venders
Why Lithography Alternatives Are Essential
9 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
♦ SPIE Advanced Lithography 2013~2018 • The potential of block copolymer’s directed self-assembly for contact hole shrink
and contact multiplication (2013) • 300mm pilot line DSA contact hole process stability (2014) • Handling, clamping and alignment evaluation for Multi-beam technology on
Matrix1.1 platform (2014) • Investigation of coat-develop track system for placement error of contact hole
shrink process (2016) • DSA process window extension via controlled atmospheric conditions through
accurate defectivity and roughness measurements (2017) • A track process for solvent annealing of high-χ BCPs (2017) • DSA Process Window Expansion by Oxygen Concentration (2018)
♦ International Symposium on DSA 2015, 2016, 2017
Conference publication with Leti
TODAY NEAR FUTURE 2018
SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd. 10
track in-line integration
FX-1200 E-Beam Exposure Tool
E-Beam Exposure niche market development for rapid prototype IC
track in-line integration
Immersion ArF Lithography NXT:1970Ci Lithocell @ CEA-LETI
E-Beam
DSA
11 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Laser Systems and Solutions of Europe SAS Development and production of Laser Thermal Anneal Establishment:June, 2014 President:Tadahiro Suhara 14-38 Rue Alexandre, Bldg D F-92230 Gennevilliers, France Tel:+33-1-41-11-2720
LASSE
■ Ultra-Iow Thermal Budget Achieving the highest possible temperature gradient in sub-micro seconds, LT tools are able to anneal fragile
substrates without damaging critical device structures. ■ Full Device Exposure Annealing one die, a group of dies or only the desired region in a single shot, the LT makes it all possible by shaping the beam size to meet process and device requirements without stitching.
■ Dopant Activation Control Obtaining unprecedented high line and parametric yield levels are only possible with the LT annealing process. By melt-annealing, the dopants are superactivated and the low resistance layer is defect free.
Ф300mm
LT-3000/3100
Ф200mm
Main product: Laser Annealer
SCREEN Process Technology Center
LASSE HQ Factory Leti-LASSE Process Development lab
New 2014 SCREEN Group Company: Laser anneal
12 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
LT-3100 UV ns laser annealing
♦ The only production proven Melt Laser Anneal Technology ♦ High Energy UV pulsed (160 ns) laser for shallow anneal ♦ Step & repeat anneal process up to full field size (no stitching) ♦ High productivity and modular platform
13 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Thermal Annealing Technology Portfolio
0
200
400
600
800
1000
1200
1400
1600
1800
1.E-09 1.E-07 1.E-05 1.E-03 1.E-01 1.E+01 1.E+03 1.E+05
Tmax
(°C
) Flash Lamp
spike
Furnace
RTP
Laser
>3000C L. Rebohle et al " Semiconductor
Science and Technology 31.10 (2016): 103001.
14 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
CoolCube® : 3D integration challenges
From leti CoolCube Program
Candidate application for laser annealing
Need for process solution capable of surface localized annealing without affecting buried structure
15 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
LT-3100 for Monolithic 3D integration
P. Batude et al, VLSI 2011
♦ Ultra localized annealing on top layer: – Crystallization – Activation – Stress engineering
S. Kerdilès et al. in proceeding IWJT 2016 A
rsen
ic ju
nctio
n
Incr
easi
ng la
ser e
nerg
y
16 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
CoolCube® Interconnect robustness to LT-3100
C. Fenouillet S3S 2015 (Leti)
Interconnect not degraded at high temperature in nanosecond timescale
17 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
SCREEN Melt laser simulation development
Simulating thermal, phases, diffusion dynamics during laser annealing
Fully-owned Standalone software Native 3D Collaborating and developing
with top academic experts Customer oriented Optimized for LT technology
Laser integration supported by LASSE Innovation Booster
SiO2 SiO2
SiO2 SiO2
Cu CuCu
Cu
Cu Cu
CuCu
ULK
ULK
ULK
ULK
ULK ULK
ULK ULK
50nm SiO2
120nm SiO2
Dense interconnect Relaxed interconnect
a-Si
Area with a slightly higher T°a-Si
T (°
C)
T (°
C)T
(°C)
T (°
C)
1200
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400
200
0
1200
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0
1200
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0
1200
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0
18 SE-77-3018-L1 SCREEN Semiconductor Solutions Co., Ltd.
Conclusion
Accelerated Innovation through Strategic Collaboration
1. This is not a nice to have value proposition
2. Build overtime through deep technology exchange
3. Mutually beneficial Need to offer Win-Win
4. Benefits our customers with innovation acceleration