oem automatic klitsø - electronics forbrugsmaterialer

ELECTRONICSFORBRUGSMATERIALER

2

SwEdEN – OEM Electronics ABP O Box 1025 (Norrabyvägen 6B) SE-573 29 TranåsPhone: +46 75 242 45 00 | Fax: +46 75 242 45 [email protected] | www.oemelectronics.se

FINLANd – OEM Electronics OYFiskarsinkatu 3 FI-20750 TurkuPhone: +358 207 499 300 | Fax: +358 207 499 496 [email protected] | www.oemelectronics.fi

POLANd – OEM Electronics PLul. Postepu 2, PL-02-676 WARSZAWAPhone: +48 22 863 27 22 | Fax: +48 22 863 27 24

[email protected] | www.oemelectronics.pl

MATERIAL

4





The Multicore® line of solder pastes is designed to meet the rigorous demands of a variety of

electronic manufacturing soldering processes. Whether your process requires long abandon

times, wide process windows, or high-speed printing, Henkel offers a paste that suits your

requirements.

PRODUCT DesCRiPTiOn/APPLiCATiOn ALLOY % MeTAL LOAD

TACK (g./MM ²)

PRinT sPeeD MM/seC.

iPC/j-sTD CLAssifiCATiOn

MP218

- Outstanding humidity resistance- Colourless residues- Soft non-stick pin testable residues- Extended open time and tack-life - Suitable for fine pich, high speed printing

SN62/SN6363S4

(Anti-Tombstoning)

89.5 90.5

(Proflow)1.1 25-200 ROL0

Ws200- High performance water washable solder paste.- Residues are readily removed with DI water, without the need for a saponifier- Good open time with excellent print definition and soldering activity

SN62/SN63 90.5 0.8 25-100 OHR1

Leaded Solder Paste

PRODuCT DESCRIPTION/APPLICATION ALLOY POWDER TYPE

%METAL LOAD

TACK (G./MM²)

PRINT SPEED MM/SEC.

IPC/j-STD CLASSIfICATION

Lf318- Outstanding humidity resistance - Colourless residues - Soft non-stick pin testable residues- Extended open time and tack-life

96SC AGS (45-20 µm)

88.5 2.0 25-150 ROL0

Lf700

- No-clean- Low voiding - Excellent humidity resistance - Long abandon time- High printing speed

96SC97SC

DAP (38-20 µm)

1.82.4

1.82.4 20-150 ROL0

Ws300 - Lead-free water washable solder paste96SC97SC

AGS (45-20 µm)

0.9 0.9 25-100 OHR1

Lead Free Solder Paste

Tin Lead Lead free

Solder Paste

No CleanLead free

No CleanTin Lead

Water WashLead free

Water WashTin Lead

Lf318™ MP218™ WS300™ WS200™

Lf700™

SOLdER PASTE

5

NORwAY – OEM Electronics ABP O Box 1025 (Norrabyvägen 6B) SE-573 29 TranåsPhone: +46 75 242 45 00 | Fax: +46 75 242 45 [email protected] | www.oemelectronics.se

dENMARk – OEM AUTOMATIC kLITSØ A/SEngholm Parkvej 4 DK- 3450 AllerødPhone: +45 70 10 64 00 | Fax: +45 70 10 64 [email protected] | www.oemklitso.dk

ThE BALTICS – OEM Eesti OÜKanali tee 1-328, EE-10112 TallinnPhone: +372 6550 871 | Fax: +372 6550 873 [email protected] | www.oem.ee

The line of cored wires features the renowned multiple flux cores technology to ensure even and

consistent distribution of flux throughout the solder wire. This reliability makes Multicore solder wires

the first choice for wire soldering processes.

SOLdER WIRE

No Clean Water Wash

C400™ Hydro-X™

C502™

362™

C511™

Cored Wire

PRODUCT DesCRiPTiOn hALiDe COnTenT iPC CLAss

ALLOY OPTiOns (sn/PB)

ALLOY OPTiOns (PB-fRee)

COnTenT (BYWeighT)

CRYsTAL 400

Halide free, no-clean, clear residue, in creased flux content for improved wetting ZERO ROL0 60/40, SN62 96SC, 99C, 97SC 2.2%

CRYsTAL 502

No-clean, clear residue, minimal activation for increased wetting speed 0.2% ROM1 60/40, SN62 96SC, 99C, 97SC 3%

CRYsTAL 511

No clean, clear residues, heat stable 1.1% ROM1 60/40 96SC, 97SC 2.7%

362 General purpose high activity for fast wetting 0.5% ROL1 60/40, SN62 96SC, 99C, 97SC 3%

hYDRO-X High activity water washable 3% ORH1 60/40, SN62 96SC, 99C, 97SC 2%

96SC = Sn 95,5, AG 3,8%, Cu 0,7% melting point 217 °C99C = Sn 99,3%, Cu 0,7% melting point 227 °C97SC = Sn 96,5% Ag 3,0%, Cu 0,5% melting point 217-218 °C

Bolded text is normal warehouse products.

Use fume absorbers when soldering. More info on page 33-35

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FLUxES

PRODUCT DesCRiPTiOn/APPLiCATiOn % sOLiDs % hALiDs ACiD vALUe iPC CLAss APPLiCATiOn

X32-10

- Clear residue - Wide process window- A general purpose halide-free low solids flux - Suitable for foam and spray flux application systems

2.2 ZERO 15.3 REM0 SPRAY/fOAM

Mf 388- Low residue - Halide free - Ideal for Pb-free wave soldering

3.5 ZERO 20 ROL0 SPRAY

5372- High temperature - Dipping flux- Suitable for all Multicore alloys

75 0.12 38 - DIPPING

Alcohol Based Fluxes

The range of VOC-free (Volatile Organic Compound) fluxes offer reliable, high yield, no clean

wave soldering whilst providing significant environmental and safety benefits due to the non

flammable VOC-free (water based) flux carrier systems.


Mf300- General purpose VOC-free (water based)- No-clean, halide-free and resin-free flux - Compatible with Pb-free processes

4.6 ZERO 37 ORM0 SPRAY/fOAM

VOC-Free Fluxes


hYDRO-X/20

- IPA based- A high activity water washable flux - unique activator package - Residues are readily and completely removed by water wash after soldering - Suitable for lead-free wave soldering

20 1.0 24 ORH1 SPRAY/fOAM

Water Washable Fluxes

Liquid fluxes

5372 Mf300™ Hydro-X20™

Mf388™ ROML

No Clean Voc free Water Wash

SC01™Rework Small Areas

Cleanerspage 19

X32-10i™ REMO

Syntehetic Resin

7




SURFACE MOUNT ADHESIVES

PRODUCT DesCRiPTiOn/APPLiCATiOn COLOR*** CURe PROCess MeThiD sTORAge (PROTeCT fROM heAT)

sheLf Life**

3609 - for high-speed dispensing- Red for best vision pickup on light surfaces

RED90 sec. at 150 °C

or3-4 min at 125 °C

High Speed Dispensing

40,000+ DPH capable.5 °C ± 3 °C 6 months

DOM

3621 - Superior humidity resistance and electrical properties - Can be used in lead free solder applications - Room temperature storage capable



Very High Speed Dispensing

47,000 DPH capable. jettable.

5 °C ± 3 °C or 8 °C -21 °C for 30 days

10 months DOM

3627 - Specially formulated for excellent

high-speed dispensing- Room temperature storage capable

RED 90 sec. at 150 °C 3-4 min at 125 °C High Speed Dispensing 5 °C ± 3 °C 6 months

DOM

3629

- High reliability - Low temperature cure- Lead-free capable- flourescence under uV light

RED PINK

60 sec. at 150 °C110 sec. at 120 °C3 min. at 110 °C

Dispensing Printing 5 °C ± 3 °C 6 months DOM

Syringe Dispense Adhesive

Henkel is the world leader in developing cutting edge technology for high-speed syringe

dispense and stencil print Chipbonders®. Innovative new surface mount adhesives are

developed to meet the challenges of high speed assembly processes and high reliability

end user requirements.

PRODUCT DesCRiPTiOn/APPLiCATiOn COLOR*** CURe PROCess MeThiD sTORAge (PROTeCT fROM heAT)

sheLf Life**

3616 - Specifically formulated for metal stencil print applications - Especially well-suited for large components



Stencil Print(0.5-2"/sec.) 5 °C ± 3 °C 9 months

DOM

3627 - Excellent high-speed printing for finepitch components- Room temperature storage capable

RED 90 sec. at 150 °C 3-4 min at 125 °C

Dispense and Stencil Print 5 °C ± 3 °C 6 months

DOM

3629

- High reliability- Low temperature cure- Lead-free capable- flourescence under uV light

REDPINK

60 sec. at 150 °C110 sec. at 120 °C3 min. at 110 °C

Dispensing Printing 5 °C ± 3 °C 6 months DOM

Stencil Print/Pin Transfer Adhesives

PRODUCT DesCRiPTiOn/APPLiCATiOn sOLvenT TYPe fLAshPOinT CORROsive PROPeRTies

OzOne DePLeTiOn POTenTiAL

7360- Nozzle and dispense machine component cleaner- Excellent for removal of uncured adhesive from the board without causing the adhesive to gel

Aliphatic Ester Blend 100 °C None None

Clean Up Solvent

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PRODUCT DesCRiPTiOn/CURe DesCRiPTiOn/APPLiCATiOn sheLf

Life*

LAPsheAR ADhesiOn (AL/AL)

CURe sCheDULes

Tg °C

CTe PPM/ °C

vOLUMe Resis-TiviTY (OhM-CM)

WORK Life AT ROOM TeMP.

3880 Heat Cure1-component

- Syringe or stencil dispense- Silver conductive adhesive for solder replacement - Long work life

6 months at

0-(-10 °C)

>1,000 psi 6.9

N/mm²

10 min at 125 °C6 min at 150 °C3 min at 175 °C

40 45 <.0.0005 7 days

3888 Room temperature 2-component

Room-temperature cure adhesive for applications requiring a com bination of good mechanical and electrical properties

6 months at

21-25 °C

>1,000 psi 6.9

N/mm²

24 hrs at 23 °C1 hr at 120 °C

30 min at 155 °C50 >50 <.0.0001 90 min.

Electrically Conductive Epoxy Adhesives

Loctite® Electrically Conductive Adhesives provide both a mechanical bond and an electrical

interconnection between a device and a circuit board. Loctite® electrically conductive

adhesives meet the industry’s need for lead-free alternatives to solder.

*Shelf life- 2-component materials have a one year shelf life at room temperature (21 °C-25 °C)

2-Component Packages

Typically used for sample evaluation and rework applications. These packages do not require special storage equipment. They can be stored up to 12 months at room temperature.

1-Component Packages

All 1-component products are packaged in convenient syringes. These packages must be stored fROZEN at -40 °C. (The exception is product 3880 which is stored at 0 °C.)

Isotropical Conductive

Adhesive Clean-up Solvent

3880™ 7360™

3888™

Electrically Conductive Adhesives

Screen Print/Pin Transfers

Dispense Adhesives

Cleaner

3616™ 3609™ 7360™

3627™ 3621™

3629™ 3627™

3629™

Chipbonder ™

CONdUCTIvE ADHESIVES

9




ThERMAL MANAGEMENT MATERIALS

PRODUCT DesCRiPTiOn/APPLiCATiOn

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 80 Psi

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 550 KPAi

TheRMAL COnDUCTiviTY (W/MK)

PhAse ChAnge TeMPeRATURe (ºC)

sUB-sTRATes ThiCKness (MM)

TOTAL ThiCKness (MM)

sUB-sTRATes MATeRiAL

Power-strate®

Xtreme™

unsupported film with very low thermal impedance even at low pressure. fills gaps up to 0.2 mm (0.008") or collapses to form a thin interface. Direct attach to heat sink without heating. Suitable for semiconductor and power electronics applications

0.003 0.022 3.3 45 N/A 0.0080.2 None

Power-strate® 51r™

Low thermal impedance, reworkable grade. Most suited to applications on lidded processors where the heat sink may have to be removed for rework.

0.008 0.052 3 51 0.051 0.074 to 0.083

AL 1145-0

Power-strate®

51,60™

Low thermal impedance, robust grade. Suited to a wide range of applications on bare die processors and other electronics devices.

0.008 0.052 3 51 or 61 0.051 0.064 to 0.16

AL 1145-0

PsX-D Thermal paste for stencil print or manual application 0.008 0.052 3.4 N/A N/A 0.254 All

silver-strate®

Excellent thermal performace, particularly at higher pressures. Typically used on Rf devices and SCRs where electrical conductivity is required, (Silverfilled).

0.003 0.022 3.14 51 0.051 0.102 to 0.127

AL 1145-0

Therm-strate®

TC™

Phase change compound in applicator bar. Ideal for prototyping, rework and small scale production.

0.021 0.137 0.47 60 N/A N/A None

Therm-strate®

2000™

Good thermal performance most suited to applications on power IGBTs, semiconductors, DC-DC converters and other isolated packages.

0.022 0.143 3 600.051

&0.128

0.076 to 0.191

AL 1145-0

Phase Change Thermal Interface Material

The PCTIMs are silicone-free and do not migrate or dry out like thermal greases. These innovative

products are manufactured as a highly thixo-tropic phase change compound coated in a strictly

controlled manner upon the surfaces of special grades of thin AL or CU foils, or to dielectric

substrate films.

PRODuCT DESCRIPTION/APPLICATION

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 80 Psi

TheRMAL iMPeDAnCe (°C-in. ²/W)AT 550 KPAi

TheRMAL COnDUCTiviTY (W/MK)

PhAse ChAnge TeMP. (ºC)

ThiCK-ness sUBsTRA-Tes (MM)

TOTAL ThiCK-ness (MM)

sUB-sTRATes MATeRiAL

DieLeCTRiC RATing vAC/MiL sUBsTRATe

UL YeLLOW CARD

UL fLAM-MABiLTY

isostrate® 2000™

Electrically isolating phase change material for use with a wide range of non-isolated components.

0.12 0.78 0.45 60 0.025 to 0.076

0.051 to

0.153

Polyi-mide >5000 None None

isostrate® j-series™

Electrically isolating phase change material. Ideal for non-isolated devices in high volume applications where high thermal performance is not required.

0.48 3.12 0.155 60 0.0051 0.076 Polyethy-lene >5000

See data sheet

See data sheet

MCM-strate®

Adhesive backed version of Isostrate. Allows pad to be postioned to facilitate assembly.

0.25 1.325 0.4 60 0.025 to 0.076

0.064 to

0.114

Polyi-mide >5000 E1049

35 94V-0

eMi-strate®

unique combination of thermal and EMI management. Excellent choise for radiated EMI control.

0.4 2.6 0.69 60 See data sheet

See data sheet

Polyi-mide N/A N/A N/A

Phase Change Thermal Interface Material - Electrically Isolating Products

10





PRODUCT DesCRiPTiOn/APPLiCATiOn CURe/CheMisTRY

sPeCifiC gRAviTY visCOsiTY sheLf Life CURe

sCheDULes MODULUs Tg °C CTe PPM/ ºC

TheRMAL COnDUCTi-viTY

315Self-shimming for electrical isolation; room-temperature-curing adhesive.

1-component Activator*Acrylic

1.7 Paste 9 months at 5 °C

5 min. at 20 °C4-24 hr. at

20 °C

390,000 psi

2700 N/mm2

50 69 0.80W/mK

384 Repairable, room-temperature-curing adhesive utilized for parts subject to disassembly.

1-component Activator*Acrylic

1.6 Paste 9 months at 5 °C

5 min. at 20 °C4-24 hr. at

20 °C

400,000 psi

2800 N/mm2

50 110 0.76 W/mK

5404 Self-shimming, flexible silicone adhesive for demanding parts such as ceramic boards.

1-component Heat CureSilicone

2.4 280** g/min.

5 months at 4 °C

10 min. at 150 °C

587 psi****

4 N/mm2-40 104 1.0

W/mK

7386

7387 DEPEND is one component of a two part no mix adhesive system. It is solvent based and has a very low viscosity. 1.75 oz bottle

Heptane and Isopropanol 0.8 Very low on part life

2 months N/A N/A N/A N/A N/A

Thermal Adhesives

Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips while

providing an efficient method of thermal transfer between heat generating electronics devices and

their heat sinks.

* use with activator 7386. ** Extrusion measured @ 50 psi/0.125" orifice. *** Made to order. Initial order may require longer lead time. **** Youngs Modulus

Thermal Management Mtl.

Activator

7386™

Shimming

315™

5404™

Non- Shimming

384™

Adhesives Thermal Paste Specialty Mtl.

PSX-D® EMI-Strate®

Thermal Pads

ElectricallyInsulating

Isostrate®

ElectricallyConductive

Silverstrate®

Non-Insulating

Powerstrate® Xtreme™

Powerstrate®

Thermstrate®

ThERMAL MANAGEMENT ADHESIVES

11




SILICONES

PRODUCT feATURes MiX COLOUR DenCiTY g/CM³

visCOsiTYMPA s

POT Life23° C

CURe TiMe°C/iMe fOR 1 CM

hARDness COne MM/10 APPLiCATiOns

semicosil® 926

- Low viscosity- Ready-to-use, one-component- Rapid heat cure- Low content of uncured polymer- Low ion content

1K Transp. 0.96 150 6 H100˚/240 min130˚/40 min150˚/10 min

60Encapsulation of electronic components.

semicosil® 924

- Thixotropic flow- Low ion content- Low content of volatiles- Low content of uncured polymer- forms a soft gel on vulcanization

1K Transp. 0.98 35 000 2 500

3 month15˚C/

6 month

100˚/240 min130˚/40 min150˚/10 min

50

Recommended for local encapsulation of delicate electronic components,e.g.bonded chips on hybrid components which are expo-sed to extreme external influences.

Wacker silgel® 612

- Very low viscosity- Very low hardness (silicone gel)- Crystal clear vulcanizate- Pronounced tackiness- Excellent mechanical damping properites

1:1 Transp. 0.96 1 000 2 H23˚/8 hrs

70˚/15 min120˚/5 min

300

Encapsulation of electronic components and solar cells. Embedding of optical fibres. Production of shock absorbers.Sealing of clean-room filters.

elastosil® RT745s

- Very low viscosity- Low ion content

1K Transp. 0.97 1 000 >4 H80˚/30 min120˚/5 min150˚/2 min

5 37

Shore 00

Encapsulation of electronic components

Potting and Encapsulation Silicone gel addition-curing

Silicones offer highly diverse product properties for virtually unlimited applications. With their great

versatility, silicone products are ideal for intelligent, customized solutions. They offer thermal stability,

weatherability, hydrophobic and hydrophilic surface properties, and excellent release, lubricating

and dielectric characteristics.


visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10

APPLiCATiOns

elastosil® RT 601

- Low viscosity- Medium cured hardness - Excellent tensile strength- Crystal clear vulcanizate

9:1 Transp 1,02 3 500 90 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

45All-round potting compound.Manufacture of moulded articles by casting.

elastosil® RT 602

- Low viscosity- Medium hardness - Excellent heat stability

9:1 Light Grey 1,17 3 500 80 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

30 All-round potting compound.

elastosil® RT 604

- Very low viscosity- Low hardness - Crystal clear vulcanizates

9:1 Transp 1,02 800 90 min

23˚/24 hrs70˚/30 min100˚/8 min 150˚/5 min

25Encapsulation of electrical and electronic components.

elastosil® RT607

- High hardness - Excellent heat stability- flame retardant

9:1 Reddish brown 1,43 10 000 80 min

23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

55 All-round potting compound.

elastosil® RT 622

- Good processing due to low viscosity- Very good mechanical properties- Soft vulcanizates


23˚/24 hrs70˚/20 min100˚/10 min 150˚/5 min

27

All-round potting compound.Technical mouldings.Encapsulation of electrical components.

elastosil® RT 675

- Low viscosity- Low hardness - fast curing at higher temperatures


23˚/24 H70˚/60 min100˚/30 min 150˚/10 min

80Encapsulation of electrical components.

elastosil® RT 743 Lv

- Extreme hardness- Excellent heat stability- Extremely high thermal conductivity

9:1 Grey 1,50 1 100 8 h 100˚/60 min 150˚/15 min 20

Encapsulation of electrical components.

Silicone Rubber Addition-Curing RTV-2

12





Encapsulation and Coating Silicone Rubber


visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10 APPLiCATiOns

elastosil® 935

- Low viscosity- Very long pot life- fast curing at elevated temperatures- Low hardness- High flexibility- Low risk of inhibition by soldering or flux residues

1:1 Transp 0.97 3 500 7 days10˚C/14 d

80˚/30 min 120˚/10 min150˚C/5 min

15

Coating of printed circuit boards.Encapsulation of electronic components.

PRODUCT feATURes MiX COLOR DenCiTY g/CM³

visCOsiTYMPA s

POT Life23° C


hARDness COne MM/10

APPLiCATiOns

elastosil® A 07

- Ready to use, one-component system- Low viscosity- High flexibility - Primerless adhesion to many substrates

1 K Transp. 1.08 10 000-

3-5 min 5 20

Multipurpose sealant and coating material.

elastosil® A 234

- Amine-curing system- flowable- Excellent heat stability- Excellent primerless adhesion to many substrates

1 K White 1.21 35 000 10-20 min 2 36

Gluing and sealing of steam chambers and sole plates of steam iron

elastosil® A 33

- Ready to use, one-component system- Good mechanical properties- Primerless adhesion to many substrates

1 K Ivory 1.16 -2

10-20 min 2 25

Adhesive for the coating and sealing at high temperatures.

elastosil® A 43

- Amine-curing system- flowable- Excellent heat stability- Excellent primerless adhesion to many substrates

1 KTransp. Black

1.09 350 00010-25 min

1-2 30General-purpose adhesive and coating for technical and medical applications

elastosil® n 2010

- Neutral curing system (alkoxy)- Sprayable- flowable- Primerless adhesion to many substrates- Good heat stability

1 K Transp. 1.01 20 000-

10-25 min 2-4 25

General-purpose adhesive and coating for technical applications

elastosil® n 2034

- Neutral curing system (alkoxy)- Short skin forming time- fast curing- flowable- Primerless adhesion to many substrates- Good heat stability

1 K Black 1.14 45 000-

20 min 2-4 36

General-purpose adhesive and for technical applications. CIPG- and fIPG-applications e.g. for headlamps.

elastosil® n 2197

- Neutral curing system- Solvent free- Non-slump- Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1 K Grey 1.24 N/A25 min

2-4 35 General-purpose adhesive and for technical applications.

elastosil® n 2199

- Neutral curing system- Solvent free- Non-slump- Excellent unprimed adhesions to most plastic, metal, glass and ceramic surfaces

1 K Transp. 1.05 N/A25 min

2-4 40 General-purpose adhesive and for technical applications.

elastosil® n 9132

- One-part, ready-to-use- Neutral curing system- Non-slump- Excellent unprimed adhesion to most plastic, metal, glass and ceramic substrates- flame retardant:meets uL 94V-O

1 K

Grey

1.30 N/A 5-20 min 2-4 33

The fully cured rubber can withstand expansion-compression cycles for many years. Especially well suited for joining materials with different coefficients of thermal expansion.

n 9132 s White

elastosil® n 189

- Neutral curing system (oxime)- Non-slump- Good resistance against mineral oil and coolant fluids - Excellent heat stability- Excellent adhesion to many substrates

1 K Black 1.0 -10

10-25 min 1-2 60

General-purpose adhesive fortechnical applications.

fIPG- and CIPG-application

Bonding, Fixing and Sealing/Gasketing Room temperature Curing RTV-1

SILICONES

13




SILICONES


visCOsiTYMPA s

sheAR RATe. g/10s

CURe TiMe 23 °C

hARDness shORe A APPLiCATiOns

elastosil® RT 705

- Ready-to-use, one-component - flowable- Thixotropic- High extrusion rate- fast curing at high temperatures- Good heat stability- Excellent primerless adhesion to many substrates

1K Black 1.23 100 00013 000 26 min 140˚/20 min

200˚/3 min 45

Allround glue for houseware and metal industry.useable for silk screen printing.

semicosil® 986/1K

- Ready-to-use, one-part system- Thixotropic- Translucent, medium hardness- High flexibility

1K Transp. 1.07 300 000 -

100 °/6 h 130 °/30

min 150 °/10min

51General purpose adhesive for the electronics industry.

semicosil® 987/1K

- Ready-to-use, one-component system- Low viscosity during dispensing non- slump after dispensing- Medium hardness- High flexibility - Primerless adhesion to many substrates

1KTransp.

+ Grey.

1.1 300 00030 000 -

100˚/6 h130˚/1 h

150˚/10 min50

General purpose adhesive for the electronic industry. fIPG-and CIPG-applications.

Heat Cure SiliconeAdhesive Silicone Rubber Addition-Curing

PRODUCT feATURes COLOUR DenCiTY g/CM³

OPeRATing TeMP.

hARDness COne MM/10

APPLiCATiOns

silicone Paste P 4

- Good electrical properties- Good adhesion to metal and ceramic materials- Excellent water repellency

Transp. 1.0 -40 - +220 350Lubricants for shut-off valves. Release agents for compression moulding, extruder die rings.

silicone Paste P 12

- Soft, heat sink paste with marked thermal conductivity- Electrically insulating White 2.25 -30 - +200 300

Especially used in semiconductor technology as a heat sink paste.

geniosiln 550

- Silane modified polymere adhesive, free of isocyanates, tin catalysts and silicones - Neutral curing - Temperature range -50° C to 120 °C - Solvent free - Excellent adhesioin

Grey. 1.3 -50 - +120 Shore A55

Sealant/elastic adhesive for technical applications. Can be varnished with suitable paints in cured and uncured state.

Silicone Paste

14





dIE ATTACh ADHESIVES

PRODUCT DesCRiPTiOn/APPLiCATiOn Resin fiLLeR Oven CURe/sKiP CURe

visCOsiTY 5RPM AT 25 °C


Tg (°C)

CTe 1/2

MODULUs AT 25°C

sTORAge TeMP.

QMi 536

Industry Standard Industry standard for die-to-die bonding; dielectric, high adhesive strength material for organic substrates.

BMI PTfE

15 min at 150 ˚C oven10 sec at 150 ˚C SC

9000 CPS 0.3 W/mk -31 93174 0.30 GPa -40 °C

QMi 550si

Low CTE CVersion of QMI 550Silica-filled for low shrinkage and low warpage on laminate and flex substrates.

BMI Silica

15 min at1 50 ˚C oven10 sec at 150 ˚C SC

17000 CPS 0.6 W/mk 33 4391 1.50 GPa -40 °C

QMi 550 eC

Electrically ConductiveSilver-filled version of QMI 550; very high adhesive and cohesive strength.

BMI Silver


17000 CPS 3.8 W/mk 2 46148 2.8 GPa -40 °C

Die Attach Adhesives for Non-Hermetic Packages For organic substrates including laminates, array, BGA and CSP packagers

Based on ultra-hydrophobic chemistry, Hysol® die attach adhesives offer very high adhesive

strength, elongation at break, and cohesive energy at high reflow temperatures. These properties

help electronic packages retain adhesive strength and structural integrity during moisture soak and

absorb stresses during the deformations associated with lead free reflow processing.

PRODUCT DesCRiPTiOn/APPLiCATiOn Resin fiLLeRReCOM-MenDe CURe

visCOsiTY 5RPM AT 25 °C


Tg (°C)

CTe 1/2

MODULUs AT 25°C

sTORAge TeMP.

QMi 518

Electrically Conductive, Large dieSimilar properties to QMI 519, but formulated to have a low modulus to reduce stress on die larger than 500+500 mil./13-13µm.

BMI Silver


8500 CPS 1.4 W/mk -64 69152 0.10 GPa -40 °C

QMi 519

jEDEC L1 260C for SOIC, QfN Industry standard for QfN packages. Good for all preplated leadframes, and bare copper. Higher adhesion, excellent electrical and thermal performance.

BMI Silver

15 min at 185 ˚C oven

10 sec at 200 ˚C SC

9000 CPS 3.8 W/mk 75 40140 5.3 GPa -40 °C

QMi 519hT02l

High Thermal ConductivityVery high electrical and thermal conductivity while maintaining excellent adhesion. Suitable for high heat dissipating devises.

BMI Silver


18800 CPS 7.3 W/mk 49 42104 6.70 GPa -40 °C

For inorganic substrates incl. CU, Pd, Ag & Au plating, ceramic and black oxide

15




ENCAPSULANTS

PRODUCT DesCRiPTiOn/APPLiCATiOn POT Life AT 25 ºC

ReCOMMen-DeD CURe

fLOW PROPeRTies

visCOsiTY AT 25ºC Tg. ºC CTe (1)

(PPM/ºC) % fiLLeR sTORAge TeMP.

fP4451 flow Control Barrier 24 hrs.

30 min. at 125 °C

+ 90 min. at 165 °C

None 860,000 cps 145 24 72 -40 °C

Semiconductor Liquid Encapsulants Flow Control / Dam Materials

Semiconductor Liquid Encapsulants.

Henkel´s co-cure dam and fill encapsulants cure in one easy step, requiring no pre-cure of the

dam material. High purity liquid epoxy encapsulants are designed to work together as dam and

fill materials for bare chip encapsulation, protecting gold wire bonds and silicon die from mecha-

nical damage and corrosion.

Chip on Board Liquid Encapsulants.

These products cure to form void-free globs when exposed to heat, with formulations for low CTE,

minimizing stress on wire bonds during thermal cycling. These encapsulants are easy-to-dispense,

minimize induced stresses, provide improved temperature cycling performance, and offer excel-

lent chemical resistance.


ReCOM-MenDeD CURe

fLOW PROPeRTies



fP4450 ICs, COB, BGA, PGA 3 days

30 min. at 125 °C

+ 90 min. at 165 °C

High 50,000 cps 155 22 73 -40 °C

fP4470 Lead-free Packages 5 days

30 min. at 125 °C

+ 90 min. at 165 °C

High 48,000 cps 148 18 75 -40 °C

Fill Encapsulants


ReCOM-MenDeD CURe

fLOW PROPeRTies



eO1016 COB, Watch ICs 3 months 15 min. at 150 °C Medium 70,000 cps 115 40 40 4 °C

eO1060 Chip on Board 25 days 4-6 hrs. at 125 °C High 15,000 cps 125 40 61 4 °C

fP4401 Chip on Board 24 hrs.

3 hrs. at 170 °C or

6 hrs. at 150 °C

Low 375,000 cps 160 22 75 -40 °C

Clip on Board Liquid Encapsulants

16





CIRCUIT BOARd PROTECTION AND UNDERFILLS

Henkel´s potting and encapsulation compounds protect PCBs and electrical devices by

enhancing mechanical strength, providing electrical insulation, and increasing vibration and

shock resistance.

PRODUCT DesCRiPTiOn TYPe POT Life visCOsiTY CPs CURe CYCLe seCOnDARY CURe

DeLeCTRiC sTRenghT (v/MiL/Kv/CM)

TeMP. RAnge

PC 18

- A one component solvent based Acrylic conformal coating specifically designed as a toluene free alternative.- Application by non-atomized selective spray coating equipment.- Components and joints may be repaired by heating the coating with a soldering iron for easy removal.

urethane 60 min.tack free 350

Heat 2 hrs. at 125 °C

5-7 days at RT 1200/472continuous

up to 110 ºC

PC 28

- Solvent-based, oxygen curing, coating exhibiting superior toughness with abrasion and solvent resistance. - Apply by brush, dip or spray procedures

urethane 60 min.tack free 35

Heat 5-7 days at

25 °C

Air Dry 30-60 min. followed by

2-4 hrs. at 60 °C1500/591

continuous up to

110 ºC

PC 62

- Solvent-based, coating exhibiting superior toughness with abrasion and solvent resistance.- Apply by brush, dip or spray to meet MIL-I-46058C, Type PuR, requirements

Acrylic confor-

mal

5 min. tack free 40-60 24 hours

at 25°C45 minutes

at 75°C N/A –40 -125°C

5293

- uV Silicone for severe temperature cycling environments.- High reliability automotive- No solvents- Low VOC

Silicone N/A 600uV 20-40

sec.75mW/cm2

MoistureTack free:2-6 hrs.full cure: 72 hrs

406/160 -40 -204 °C

Conformal Coatings

PRODUCT DesCRiPTiOn/APPLiCATiOn visCOsiTY AT 25°C POT Life CURe

sCheDULe Tg. °C CTe(1) (PPM/°C)

CAPiLLARY fLOW sTORAge TeMP.

3513 Reworkable CSP 4,000 cps 2 days 30 min at 100 °C 69 70 N/A 2 °C - 8 °C

3593 Snap Cure Rapid flow CSP 4,500 cps 7 days 5 min at 150 °C 110 50 100 sek. 2 °C - 8 °C

Semiconductor Liquid Encapsulants CSP and DCA Underfill Encapsulants

Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements

and are compatible with the high temperature processing required for lead free assembly. Our

green materials are developed to meet demanding end use requirements, including low war-

page/low stress, fine pitch, high reliability, and high adhesion. Loctite CSP/BGA underfills offer

easy reworkability as well as excellent vibration and impact resistance. These underfills offer

many processing advantages such as fast flow, fast cure, and long pot life.

17




CIRCUIT BOARd PROTECTION AND UNDERFILLS

PRODUCT DesCRiPTiOn/APPLiCATiOn PACKing size

sC01 - SC01 is designed for the stencil cleaning and hand cleaning of solder process residues. - A highly effective cleaner that dries rapidly (fast evaporation). 5 L

MCf800 - MCf800 is designed for post soldering cleaning using cleaning process equipment. - Highly effective cleaner, requires rinse using either water or solvent. 8 ML

sPOT OnsOLDeR MAsK

- Temporary solder resists used with circuit boards prior to soldering. - Ideal for prevention of PTH hole filling and for the protection of contact surfaces e.g. edge connections. - Suitable for use with hand, robotic, pneumatic or template screening applications and brush. - Peelable for easy removal.

250 ML5 L

TTC-Lf

- Handy, non-abrasive solder iron tip-tinner. - Easily wets hot solder irons leaving a brightly tinned tip. - Improves hand soldering efficiency and extends tip life. - Adhesive pad allows easy mounting on or near the solder iron holder.

15 G

sTW 001 - Stencil Wipes 100 wipes/can

CLEANERS AND OTHER PRODUCTS

PRODUCT DesCRiPTiOn/APPLiCATiOn TYPe AvAiLABLe WiDThs

nO-CLeAn DesOLDeRing

WiCKs

- fast, easy means of removing solder. - No-clean, High activity flux means minimal cleaning is required. - Comprehensive range available

NC-00 NC-AA NC-AB NC-BB

0.8 MM 1.5 MM 2.2 MM 2.7 MM

PRODUCT DesCRiPTiOn/APPLiCATiOn RAnge AvAiLABLe

Mini fLUXeRs & CLeAneRs

- Controlled release flux and cleaner pen applicators. - Ideal for controlled application of flux when carrying out SMT re-work. - Cleaner pen easily removes residues.

No clean flux x335-07i penCleaner MCf-800 pen

Multicore NC-BB™

SOLDER ACCESSORIES

Mini fluxers (flux Pen) Wicks

Multicore Spot-On™

Solder Masks Mini Cleaners Tip Tinners

Multicore MCf800™

Multicore SC01™

Multicore TTC-Lf™

Multicore NC-00™

Multicore NC-AA™

Multicore NC-AB™

No Clean

Multicore x33S-07i

BY

RÅ

N I

TRA

NÅ

S 2

010

dENMARk

OEM AUTOMATIC kLITSØ A/S

Engholm Parkvej 4

DK- 3450 Allerød

Phone: +45 70 10 64 00

Fax: +45 70 10 64 10

[email protected]

www.oemklitso.dk

SwEdEN

OEM Electronics AB

P O Box 1025 (Norrabyvägen 6B)

SE-573 29 Tranås

Phone: +46 75 242 45 00

Fax: +46 75 242 45 09

[email protected]

www.oemelectronics.se

NORwAY

OEM Electronics AB

P O Box 1025 (Norrabyvägen 6B)

SE-573 29 Tranås Sverige

Phone: +46 75 242 45 00

Fax: +46 75 242 45 09

[email protected]

www.oemelectronics.se

FINLANd

OEM Electronics OY

Fiskarsinkatu 3

FI-20750 Turku

Phone: +358 207 499 300

Fax: +358 207 499 496

[email protected]

www.oemelectronics.fi

POLANd

OEM Electronics PL

ul. Postepu 2

PL-02-676 WARSZAWA

Phone: +48 22 863 27 22

Fax: +48 22 863 27 24

[email protected]

www.oemelectronics.pl

ThE BALTICS

OEM Eesti OÜ

Kanali tee 1-328

EE-10112 Tallinn

Phone: +372 6550 871

Fax +372 6550 873

[email protected]

www.oem.ee

oem automatic klitsø - electronics forbrugsmaterialer

Documents

oem electronics plul

multicore solder

free water washable

baltics oem eesti okanali

di water

saponifier good open

metal loadtack g

mmprint speed mmsec