october 23 -25 2018 suzhou -shenzhen, china archive€¦ · testconx china 2018 advanced contact...
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ArchiveOctober 23 -25 2018
Suzhou - Shenzhen, China
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Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side
SL Wee, Alfred Lim, Takuto YoshidaTest Tooling Solutions Group
Suzhou ▪ October 23, 2018Shenzhen ▪ October 25, 2018
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Contents• Problem Statement• Goal and Objective• Test Parameters• CRES Measurement• Solder Migration Observation• Conclusion
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side2
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Problem Statement• Lead-free solder balls can easily cause solder migration Require frequent cleaning Increase production down time Shorten the EOL of probe pin Reduce the throughput of test operation Increase the cost of testing
• One of the known reasons for heavy solder migration is inconsistent and high contact resistance (CRES) during test
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side3
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Goal and Objective• To investigate the impact of the surface roughness of plunger on
the CRES and thus solder migration onto the probe pin Use different cutting tools and processes on the same device side plunger
(Plunger A) design Assemble the pins using the same parts from the same production lot, apart from
the cut Plunger A The assembled pins are mounted into common cycling jig at the same time to
conduct the experiment Current is passed to accelerate the solder migration Measurement of CRES is taken at every interval Observation of solder migration is taken after cycle test
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side4
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Test Parameters• New pin, 7 pieces each of smooth and rough surface finishing• Current, 2.5 A @ 10 sec• Device Simulator, SAC 105• Total Cycle, 200• Device Simulator movement, every cycle
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side5
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Rough surface
SEM Photo 0 Cycle
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side6
Smooth surface
Cutting line at outer side
Cutting line at inner crown
Smooth surfaceat inner crown
Smooth surface at outer side
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Rough surface
SEM Photo 0 Cycle (Close-up)
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side7
Smooth surface
Cutting line at outer side
Cutting line at inner crown
Smooth surfaceat inner crown
Smooth surface at outer side
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Average CRES
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side8
Spikes indicate open contact
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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CRES Comparison
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side9
Open contact 1x Open contact 8x
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Accumulated Average CRES
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side10
Smooth surface has a lower and more stable CRES than rough surface
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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CRES Distribution
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side11
CRES is measured by FDR machine with gold plated prober
Smooth surface has smaller standard deviation compared to Rough surface
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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SEM Photo 200 Cycles
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side12
Rough surface
Smooth surface
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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SEM Photo 200 Cycles (Tip Melting)
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side13
Rough surfaceSmooth surface
Small tip damage at pin tip Tip melt at pin tip
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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SEM Photo 200 Cycles (Solder Migration)
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side14
Rough surfaceSmooth surface
Thin solder migration at pin tip Heavy solder migration at pin tip
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Conclusion
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side15
Advanced Contact & Socket TechnologyTestConX China 2018Session 4 Presentation 1
October 23 & 25, 2018TestConX China Workshop TestConX.org
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Product Examples
The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side16
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