observation report 20070720
DESCRIPTION
TRANSCRIPT
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Presented by YS Lin 2007-7-20
Observation ReportObservation Report
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Overview
Quality Management system
Shop floor Management
Recommendation
Q & A
Content
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Visual evaluation of a good factoryVisual evaluation of a good factory
1. Is the flow of the assembly-process visible? (Can you find your way?)
2. Non-quality level? - How many . Inspection? . Testing? . Repairs? - Sets and sub-sets waiting beside the lines?
3. Goods flow - Limited material on the lines - No sub-stores
4. Transparency (=supervision) Can one supervise the manufacturing area?
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Visual evaluation of a good factoryVisual evaluation of a good factory
5. Performance-information on the line per line per workplace Information on . Quality (short loop) . Efficiency (output)
6. Number of indirects on the floor? How many people “hanging-around” for . Supervision? (why?) . Q-problems . Material supply
7. Contact pattern? . Management presence on the floor? . Open offices?
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Visual evaluation of a good factoryVisual evaluation of a good factory
8. Is “production” the heart of the business? Are support departments really supporting?
9. Housekeeping Is the place clinically clean?
10. Working atmosphere? Do we smell the “winning spirit” ?
11. Would you like your son or daughter to work here in the “production” ?
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Quality Target/Plan ControlQuality Target/Plan Control
1.Current state
Microsoft Excel ¤u§@ªí
2.Observation
.Improvement plan by PDCA cycle with 5W2H approach .Variance analysis by CAR .Control chart/Flag chart system for management
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I TEM Process No Dep Target Plan J an Feb Mar Apr May J un J ul Aug Sep Oct Nov Dec Dep PS.
Target 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100%
Actual 100.0% 100.0% 100.0% 100.0% 100.0% 100.0%
J udgment ○ ○ ○ ○ ○ ○Target 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 90.0% 90.0% 90.0% 95.0% 95.0% 95.0%
Actual 90.0% 92.0% 98.0% 99.0% 92.0% 89.0%
J udgment ○ ○ ○ ○ ○ ○Target 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0% 80.0%
Actual 98.59% 100.0% 99.32% 98.43% 100.0% 100.0%
J udgment ○ ○ ○ ○ ○ ○
Target 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100% 100%
Actual 100.0% 100.0% 100.0% 100.0% 100.0% 100.0%
J udgment ○ ○ ○ ○ ○ ○
Target 0 0 0 0 0 0 0 0 0 0 0 0
Actual 0 0 0 0 0 0
J udgment ○ ○ ○ ○ ○ ○
The ratio f or Sample pass to
Customer on time
zero calamity in f actory
TEKCORE Quality Target/ Plan Control Year 2007
See Targets f or 2007
泰谷光電科技股份有限公司
Company Target
The ratio f or pricing on timeCOP-01 SD
COP-01 SD
RD
PD/P
MD/
ED
The achievement rate f or the
customers' request
SDThe accurate ratio f or review
the contract
COP-02
COP-03
COP-04
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2
4
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Improvementplan- PDCA
Problem solving
Issueachievement
ShallChallenge
Control Chart
CAR
. 定義 Definition
. 計算式 Calculation formula
. 資料來源 Datasource/system. 擔當 Who. 提供時間When/Deadline
Variance Analysis
KPI/BSCsystem
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Control PlanControl Plan
1. Current state
Microsoft Word ¤å¥ó
2. Observation
. Used for new product
. Sampling plan design/correlation- Outside in
IQC EPI gate FE gate FQC Customer IQC. Identical specification or engineering spec. Process verification between Product and Process characteristics. Responsibility between production and QA Production: operation, parameters check, self-inspection QA: Sampling, gate control, process audit.Visual inspection/control: QA Production, Source management. Control method: application of MSA, SPC, Fool-proof, etc. Control document enhancement. Abnormal: Effectiveness of failure report
Microsoft Excel ¤u§@ªí
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3. Process check sheet design Ex: Prober by QA
4. ISO document review .Junior consultant? .Speak- Write – Doing consistency?
5. Failure report review 異常報告單 .Design concept- open loop, sufficient analysis ability? .Top- 3 QMT teams organized- 側蝕 , 針痕 , 顏色異常
6. Reliability test- 恆溫恆濕 temperature, humidity?
7. Human resource: effective training, technical convention
Microsoft Excel ¤u§@ªí
Microsoft Word ¤å¥ó
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Production ControlProduction Control
M M+123 25
Sales forecast- Stock available=Net requirement
Stagger table
Production plan
Production scheduling
EPI FE BE
PO
Order Book
Combined SO
ShippingInstruction
Bin table
FQC
Transaction
Workorder
Closed
SFM
Run card驗證 Run
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1.Coding: Raw material, parts, WIP, Finished product, Grade, Stock, Run card, Wafer no, Tape no, dept code, machine no, document, A/C, etc
2.Heavy loading to review the stock by bin and SO by range
3.MOQ, Lot size, extra costs for special grade?
4.Production to max capacity- high inventory
5.Capacity review model, bottle-neck management
6.No run card for EPI and BE FIFO, real time tracking?
7.Mixed EPI lot input for FE – Between lot variation
8.Material requisition Issue
9. 驗證 run- Process verification run
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10.Transaction stage: total 25 in FE Main control stage
11.Manual tracking and expediting
12.Backlog issues: EPI, Quality, PM, single skill,
13.With 24 Hours full running: less flexibility to catch-up
14.Review mechanism: Sample run? Pilot run? New product?
15.Push Pull, flow line, JIT, TPM?
16.Delivery performance indicators
ThroughputYieldInventoryShipping quantity
ThroughputYieldInventoryShipping quantity
LoadingOTD: on time deliveryCLIP: cumulative line item performanceCVP: cumulative volume performanceCycle timeInventory turns
LoadingOTD: on time deliveryCLIP: cumulative line item performanceCVP: cumulative volume performanceCycle timeInventory turns
+
σ↓Mean↓
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品質的發展品質的發展品質的歷史面 品質的觀念面 品質的制度面
作業員的品質管制作業員的品質管制
領班的品質管制領班的品質管制
檢驗員的品質管制檢驗員的品質管制
統計的品質管制統計的品質管制
品質保證品質保證
全面品質管制全面品質管制
全面品質保證全面品質保證
品質是“檢查”出來的品質是“檢查”出來的
品質是“製造”出來的品質是“製造”出來的
品質是“設計”出來的品質是“設計”出來的
品質是“管理”出來的品質是“管理”出來的
品質是“習慣”出來的品質是“習慣”出來的
全面品管 (TQC)全面品管 (TQC)
品檢 (QI)品檢 (QI)
品管 (QC)品管 (QC)
品保 (QA)品保 (QA)
全面品保 (TQA)全面品保 (TQA)
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CONTINUOUS IMPROVEMENT-CONCEPT
AA
CC
PP
DD
AA
CC
PP
DD
AA
CC
SS
DD
AA
CC
SS
DD
日常管理實力維持
方針管理實力提昇
. 減少變異
. 提昇水準
願景
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The New Shop Floor Management ModelThe New Shop Floor Management Model
□ Glass wall management□ Scoreboard□ Floor meeting□ Organization of a work station□ Suggestion□ Storyboard□ Mini-company (Mission,Objectives,Business plan,PDCA)□ Improvement group□ Banker's meeting (Progress report,Monthly report ,Annual report)□ Study group□ Company awareness day□ Top management round table□ Sharing of progress (Display,Free lunch,Presentation ,Newsletter,Awards)
□ Policy management□ Cross-functional management□ Management by exception□ Management by objectives□ Managing by wandering around□ Career planning
□ 5S □ SOP□ JIT □ TPM□ Flow lines□ Poka-yoke
Continuous Improvement
□Core values□ Vision□ Roles & responsibilities□ Management process□ Genba□ Exposing problems□ 5 Whys□ Empowerment□ Ownership□ Involvement of everybody□ Teamwork□ Collective wisdom□ Self-management□ Problem-solving tools□ Assessment□ Checklist□ Visual aids□ Benchmarking□ Upgrading skills□ Learning□ Recognition,Reward□ Communication
□ Cross-training□ Job rotation
Customer NeedCustomer-supplier relationship
Thorough practice
Adequate leadership
Innovative culture
Customer orientationProgressive organizationPeople-oriented organizationIncreased capabilitiesWaste eliminationSurvival of the fittestShop floor excellence
CONCEPT/APPROACH
ACTIVITIES
GOALSGOALS
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Management of Mini-CompanyManagement of Mini-Company
1.Name of mini-company 2.Mission 3.Names and pictures of people 4.Customer-supplier relationship chart 5.QCDSM Measurements 6.Customer survey results 7.Plans of action(summary of business plan) 8.Samples of defects(with comments) 9.Skill matrix(cross-training matrix)10.Status of team projects11.Improvements of the month(before-after)12.Attendance chart and vacation plan13.Safety clock(Nr. of days without accident)14.Quality clock(Nr. of days without defects)15.Status of suggestions16.Awards received17.Focus item/slogan of the month18.Documents,reference books Business plan Mini-company annual report Shift book,daily meeting notebook Case example of suggestions Reference books on shop floor management Miscellaneous manuals,etc.
1.Name & description of work station 2.Name & picture of operator 3.Standard operating procedure 4.Andon(trouble light to call for help) 5.Line stop button(to call supervisor) 6.Sample board(to check the quality) 7.Explanation of poka-yoke 8.Machine checklist for self-maintenance 9.Machine downtime log10.Safety checkpoint11.Description of recent improvement12.Layout of the area13.SPC chart14.QC process sheet15.Sample product16.Production control board17.Marking of floor
Organize the meeting area Organize an efficient work station
PracticePractice
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目的 提昇產品品質
Approach 品質管制.流程管理 群體學習.源流管理.持續改進
目標 不良品減少 專業能力.企業體質提昇
□ .組織重整 □ .品質目標展開, Improvement plan
□ .工作盤點 □ .QC教育/種子黑帶培訓□ .Discipline 要求整頓 -體系圖
推 □ .檢驗規範review,限度樣品 -QC 7-tool/ N7
□ .OJT, skill test 檢出力 -QC story 改善歷程□ .Multi-skill training -DOE
動 □ .品質資訊整合(報表.檔案) -QFD
□ .自主檢查規範 -APQP
□ .Process control enhancement -FMEA
事 □ .ISO refinement -Control plan/QC工程圖 條文---> 流程圖 -Control chart
□ .客戶特殊規格專檔 -OCAP
項 □ .Promotion/看板管理 -MSA
□ .共同語言彙整 -Total control methodology(TCM)
□ .異常回饋系統整合 -Design review-Reliability management-QS9000/TS16949-QCC-Fool proof/防呆裝置-Quality improvement status(QIS)
□ .幹部 Self-development,外訓□ .跨部門Quality management team(QMT)
□ .Customer visit /Q-review
□ .品質月□ .管理系統/手冊管制□ .知識庫
KaizenMaintain
提昇管理品質
品保部品保部
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QC STORY 之基本架構
a b c d
真因
1.結果分類
真象
A
A
機械時間 人
方法原料空間
佈置
更換
ecb
a fd
INPUT
INPUT
2.生產要素要因分析
3.數據曾別.收集.查檢
4.原因別解析
5.對策檢討評價.採取
6.對策試行
7.對策實施管理 8.效果確認
9.效果維持(標準化)
10.改善效果之管理-管理工具
11.活動成果比較
12.活動成果報告書之整理
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QC問題解決的步驟及 QC手法
找出問題點 現狀的把握及目標的設定
表示原因及結果的關係
要因的解析
柏拉圖散佈圖 直方圖
A
B
C
1 2 3 4 5
查檢圖
管制圖特性要因圖
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QC 問題解決的步驟及 QC 手法
要因的解析
層別 有相關 有時間的變化
***********
對策的檢討及實施
效果的確認
標準化 ( 制 / 修定 )
效果的維持
A B C D E A B C D E
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主題選定1 選題理由2
要因分析及改善對策4 現況分析及目標設定3
殘留問題8
1.
2.
3.
4.
5.
6.
標準化7
1.
2.
3.
4.
5.
6.
7.
8.
效果確認6 對策執行5
P
DC
A
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QC. STORY SHEET
ASEK Dept.:_______ Leader:_______
Action Group:_______________________
2. Why The Theme Selected
3. Analysis of Present Situation( Data Collection) 4. Cause & Effect Analysis Remark： 8.Remaining Problems / Future Plan 1._________________________________ 2._________________________________ 3._________________________________ 4._________________________________ 5._________________________________ 6._________________________________ 7.Standardization 1.________________________________ 2.________________________________ 3.________________________________ 4.________________________________ 5.________________________________ 6.________________________________ 7.________________________________ 8.________________________________
A
P
6. Results Confirmation C
Remark：
D 5. Action Plan / Implementation Remark：
1. Theme
Schedule Plan Actual
Item
Corrective Action
Action
by
Finish
Evidence
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C
A
D
P
Team name(圈名 )：Dep’t(部門 )： 1.Theme(主題 )：
2.Why select this theme(選定理由 )：
3.Current status(現況分析 )：
4.Target Setting(目標設定 )：
5. Cause-Effect Analysis(要因分析 )：
6.Root Cause Verification(真因尋求 )：
7.Action implementation (對策實施 )：8.Result Confirmation(效果確認 )
9.Standardization(標準化 )：
10.Future chance(改善機會 )：
‧創意來源 (參考文獻 )/ Learning ‧Solution(對策方法 )：
‧Sharing(經驗分享 )：
‧Learning(學習 ) ：
‧Reference ( 參考文獻 ):
One Page QC Story
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Pad dama
ge
Large stress
small stress
Large force
C
A
D
P
One Page QC Story - QIT 53rd Team name:Dep’t: 1.Theme:
2.Why select this theme
3.Current status
4.Target Setting:
5. Cause-Effect Analysis
6.Root Cause Verification
7.Action implementation8.Result Confirmation
9.Standardization
10.Future chance
‧Learning ‧Solution
‧Sharing
DragonWTF Reduce fine pad damage rate
1.More competitive2,High Quality and On Time Delivery3.Capability Improvement4.Utilization improvement 5. Short Through Put Time
0
500
1000
1500
2000
Probe card Prober Man
每週Pad 壓傷平均PPM
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0
200
400
600
800
1000
針位差 大針印 露出氧化層
Pad壓傷每週平均PPM
0%10%20%30%40%50%60%70%80%90%100%
0
100
200
300
400
500
600
700
800
愈測愈偏 換片偏 Prober故障 其它
Pad 壓傷每週平均PPM
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Pad damage from 230ppm to 50ppm
Pad damage
1.Cleaning travel is too long
2.Tip is too large for small pads
3.PCB expansion causes probe mark shift.
Upper limit for tip 25um
50um
Large Tip
Root Cause ： Cleaning travel is too long
1. Needle Mis-alignment Improvement
2. Large probe mark improvement
Tip Reduction Machine:PSK 2000
Root Cause ： Tip is too large for small pads
Action-New needle spec. for small padTip size change slope: 0.1um/um
Action: start Test from wafer center
Root Cause ： PCB expansion causes probe mark shift.
3. Probe Mark Shift improvement
Learning:1. Technology learning – HSM Use N2 gas to prevent AL from forming oxide2. Benchmarking- MOTOROLA / STMicroelectronics Test temperature / Pad size / Needle clean method3. Create idea : Pencil Sharpener
Reference:1. QIT-51, Team : Crystal, Subject : First time pass yield 2. Engineering Report No: EBV-3-10-62/88x EBV-9-1-1/10x3. Process development(TAC Sub-100nm Probing): . Set of < MAT20> TESTCHIPS . Platform Qualification <MAT30>
1.Probe card needles specification change
2.Probe Card Quality Control
3.Product file for wafer test change
EBV-3-10-62/883
EBV-9-1-1/101
EBV-3-10-62/883
Total saving: 1,410,0001,410,000 USDUSD
§ Sharing the experience an best practices with PSC, PST§ Nijmegen and Caen for probing fine pad product.
Action:Reduce needles cleaning path
• Probe card analyzer:1,000,000 USD
• Probe Card Repairing: 62,500 USD
• Utilization Improvement :347,500 USD
Saving
0
50
100
150
200
250
300
425 427 429 431 433 435 437 439 441 443 445 447 449 451
2004 wk
Pad damage rate(ppm)
Probe mark misalignment improvement
Side wall crack improvement
Probe mark shift improvement
Mis-alignment
Needle Clearing• Needle Clearing
Side wall crack Large tip size for pad
Probe mark shift Probe card PCB
thermal expansion
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一、 運作體系
時機 1. START-UP/開機/更換 ‧ ‧ ‧ ‧ ‧
2. 第一條產品 ‧ ‧ ‧ ‧ ‧ ‧
3. 操件中 ‧ ‧ ‧ ‧ ‧ ‧ ‧
4. 批結束 ‧ ‧ ‧ ‧ ‧
5. 停機 ‧ ‧
6. 關機 ‧ ‧ ‧
CHECK 自我 訓練
SHEET 檢查 教材
相關度 ☆ : 強 ○ : 普 △ : 弱
主要系統 = OCAP, QA PROCESS SHEET, SQC 管理圖 FMEA, 自動化, MSE
二、 問題點 1. 水平與垂直整合欠缺 3. FMEA 自動化 , 源流檢查 , MSE , 應用層次仍太低 2. 目的/手段合理 ? 機能分析 ? 4. 從業員之心態 , 意識革新 , 素質配合
管理資料/手段 對象SOP OID
材料
機/設備/模具/零件 ○ ○
生 治具、工具、量具
QA 表 SQC QFD
人 ☆ ☆ ☆
○ ○
產
○
○
○
○ ○
○
○ ○
☆ ○ ○
要
製程條件
☆
○
素
工安
☆
方法
☆
○
☆ ☆產品品質
○
○
☆
○
○
○
☆
○
☆
☆
品質保證措施檢討
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異常報告之運用
異常處理
1. 管理 , 控制基準2. 異常發現 3. 異常處置
4. 執行追蹤
異常報告 彙總
整理
經常發生
根本問題解決
檢討報告書
檢討‧ 分析效果確認標準化日常管理報告書要項
1. 問題點
2. 影響評估
3. CAUSE
4. 改進對策層別
5. 相關單位 / 擔當者
6. 完成日期 (EST,ACT)
應急措施再發防止
點 線 面
( 影響度 x 發生度
x 檢出度 = 重要度 ) 生產影響 , 重要度
● 維持活動
● HORIZONTAL DEPLOYMENT
推廣‧‧運用
擔當者 : 幹部 SUP. SR SUP.
Y