nstda-ewaste-vo2
DESCRIPTION
E-waste programTRANSCRIPT
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"e-waste "
e-waste
e-waste
e-waste
"e-waste ""e-waste ""e-waste ""e-waste ""e-waste ""e-waste ""e-waste ""e-waste ""e-waste "
e-waste
e-waste
e-waste
C
1
2
3
4
5
6
C 1 2 3 4 5 6
-
.
. . . .
.
..2554 ... ..2537
114 . . . . 12120 0 2564 6500 4752, 4755 0 2564 6400 Email: [email protected]
. 111 . . . . 12120 0 2564 7000 0 2564 7015 Email: [email protected]://www.nstda.or.th/cyberbookstore
0 2895 3180-1
e-waste
e-waste / . -- : , 2554. 148 : 1. 2. -- 3. -- I. II. III.
TD 799.85 363.728
C 1 2 3 4 5 6
-
e-waste
.
(MTEC) (.)
"e-waste "
/
e-waste
"e-waste "
C 1 2 3 4 5 6
-
1 ...........................................................................7
1.1 .......................................... 9
1.2 ................................16
1.3 ...............................18
1.4 .............................................. 25
2 .................................................................................................. 31
2.1 ...................................................................................... 32
2.2 ................................. 39
2.2.1 ................. 42
2.3 ............................................................................... 49
3 ....................................................................................................... 53
3.1 ...................................................................................................................... 55
3.1.1 ................. 56
3.1.2 ....................................................... 62
3.2 ...................................................................................................................... 65
4 ................................................................................................................. 67
4.1 ......................................................................................................................... 69
4.2 ................................................................................................................... 70
4.2.1 .................................................................................................................. 70
4.2.2 .......................................................................................................................71
4.2.3 ................................................................................................................. 73
4.2.4 ............................................................................................................. 75
4.3 ......................................................................................................... 76
4.3.1 ............................................................... 76
C 1 2 3 4 5 6
-
4.3.2 ......................................... 78
4.3.3 ................................................ 79
4.3.4 ..............................................81
4.4 .............................81
5 ..................................................................................................... 91
5.1 ............................................................................................................................ 93
5.1.1 ........................................................................ 93
5.1.1.1 : ......................................................... 94
5.1.1.2 : ............................................................. 94
5.1.2 .......................................................................... 95
5.1.3 ........................................................................ 98
5.2 .......................................................................................................................102
5.2.1 ..........................................................................................102
5.2.2 ................................................................................106
6 ................................................................................................109
6.1 ............................................................................................... 114
6.2 ....................................................................................................... 114
6.3 ................................................................................ 116
6.4 ............................................................................................... 117
6.5 ....................................................................................................................................... 118
............................................................................................................121.....................................................................................................................125........................................................................................................... 145
1C 1 2 3 4 5 6
-
8 9E-waste C 1 2 3 4 5 6
1.1
(virgin materials)
/
1.1
( 1.2)
(e-waste)
.. 2551 2.72
20%
.. 2543
11 1
-
10 11E-waste C 1 2 3 4 5 6
1.1
(reuse)
(remanufacturing) (recycling) (incineration)
(landfilling)
(production-batch)
/
(catalyst) (dioxin)
(flame-retardant) (brominated
flame-retardant - BFRs)
36 16
(urban mining)
1.2
1.2
( (GJ/ton)
0 50 100 150 200 250 300 350 400 450
, , 2010
-
12 13E-waste C 1 2 3 4 5 6
.. 2543
.. 2552 2.6
1% .. 2546 500
( 150 ,
5 )
195
10,000-20,000
18 24
(ingot)
Electronic Recyclers International Inc.
170
Advanced E-waste Shredding System
Advanced CRT Crushing
System (cathode ray tube monitor: CRT)
3-5
cradle to cradle
1.1
(non-ferrous)
(clock frequency)
(contact layer)
(gold wafer) 80 1-2.5
300-600
-
14 15E-waste C 1 2 3 4 5 6
(%) (ppm)
Fe
Cu
Al
Pb
Ni
Ag
Au
Pd
28 10 10 1.0 0.3 280 20 10
PC 7 20 5 1.5 1 1000 250 110 5 13 1 0.3 0.1 1380 350 210 23 21 1 0.14 0.03 150 10 4 62 5 2 0.3 0.05 115 15 4
4 3 5 0.1 0.5 260 50 5
PC 4.5 14.3 2.8 2.2 1.1 639 566 124
12 10 7 1.2 0.85 280 110 -
PC 20 7 14 6 0.85 189 16 3
5.3 26.8 1.9 - 0.47 3300 80 -
( .. 2515)
26.2 18.6 - - - 1800 220 30
36 4.1 4.9 0.29 1.0 - - -
(./
)
/(./)
1.
0.26 ABS,PC 0.12 0.01 0.03 0.01 NA 0.05 NA 0.05
-
16 17E-waste C 1 2 3 4 5 6
(printed circuit
board: PCB)
1.2 7
.. 2551
( CPU) 3.3
20,000 3,700
480 ( 100
13-15 ) 100
( 214 )
1.2
()
(2551)
RECUPEL
95
50 100
80
70
Environmental Protection Agency (EPA)
(Waste Electrical and Electronic Equipment : WEEE)
(recovery)
WEEE
(Restriction
of Hazardous Substances: RoHS) Act Governing
the Sale, Return and Environmentally Sound Disposal of Electrical and
Electronic Equipment The ElektroG
23
.. 2548
WEEE RoHS
RoHS
6 .. 2547 1
.. 2549 WEEE
(WEEE Act)
20 .. 2548 Ministry of Environmental Protection
(MEP)
-
18 19E-waste C 1 2 3 4 5 6
1
.. 2550
3R .. 2536
Material and Workmanship Improvement System
.. 2546 Extended Producer Responsibility (EPR) System
17
.. 2549
2 .. 2550 1 .. 2551
3Rs Extended Producer
Responsibility (EPR)
Fundamental Law for Establishing a Sound Material-Cycle Society
1.3
.. 2535
.. 2535 .. 2522
( 3) .. 2551 ( 6) .. 2548
(2551)
. .
(2553)
-
1.4
1.3
20 21E-waste C 1 2 3 4 5 6
/
EEE
EEE / W
EEE
./
W
EEE
/
(3R
)
EEE
EEE
WEEE
/
/
/
(/
)
/
, 2550
EEE : E
lectrical and Electronic equipm
ent
WEEE : W
aste Electrical and E
lectronic equipment
, 2551
Mobile phone
Washing
machine
Copy
machine
Air
Conditioner
Com
puter
Television
Rice cooker
Dism
antling
Dism
antling
Dism
antling
Dism
antling
Dism
antling
Dism
antling
Dism
antling
Batteries
Shredding
Ink waste
Incineration
Bulk reducing
pressC
rusher
Separation
Crusher
Crusher
Heat-exchanger crusher
Cold com
pressor crusher
Separation
Shredding
Sm
ashing
CR
T D
issembling m
achine
Crusher
Separation
Iron
Plastics
Magnetic S
eparator
PC
B
Grain-S
ize sorter
Plastics C
u, Al P
lastics Cu, A
l
Plastics
Cu, A
l
Plastics
Cu, A
l
Iron
Front (panel) glass D
ry Cleaning
Front (panel) glass G
rain-size sorter
Rear (funnel) glass G
rain-size sorterR
ear (funnel) glass Dry cleaning
Funnel glaass
Panel glass
Crusher
Magnetic S
eparatorG
rain-size sorterIron
Iron
Iron
Magnetic S
eparator
Magnetic S
eparator
Magnetic S
eparator
Eddy current separator
Magnetic
separatorC
u
Grain-size sorter
Grain-size sorter
Grain-size sorter
Plastics
Cu, A
l
Iron
Magnetic
Separator Magnetic
Separator
Water
separator
Melting
Electrolysis
Au recovery
Pd recovery
Ag recovery
-
22 23E-waste C 1 2 3 4 5 6
WEEE & HHW
Total Generation
//
//
/ 105/106
(Storage)
2
Waste discard
1.5
/ 2
105/101
/
1
2
, 2550
-
//
.
, 2553
1.6
24 25E-waste C 1 2 3 4 5 6
1.3
(integrated circuit: IC)
1.4
1.5
1)
2) 1
3) 2 1
1.4
(2553)
1.6
1.6
(.)
-
26 27E-waste C 1 2 3 4 5 6
/
/
///
(/ )
1.7 1 1.8 2
Reuse
(2551)
3 1.7-1.9
, 2551
1 ( 1.7)
, 2551
/
(
)
Reuse
-
28 29E-waste C 1 2 3 4 5 6
/
(
)
Reuse
2 ( 1.8)
3 ( 1.9)
4
4
1.
2.
3.
, 2551
1.9 3
-
30 E-waste
24.
5.
6.
7.
8.
C 1 2 3 4 5 6
-
32 33E-waste C 1 2 3 4 5 6
2.1
(printed circuit board: PCB)
2.1
2 1)
(substrate)
2)
metal clad laminate
221
11 2 ( ) (multi-layer)
2.1
-
34 35E-waste C 1 2 3 4 5 6
221-222
1. single-sided boards
2. double-sided boards
plat
through hole (PTH)
3. multi-layer boards
(
) ( 3-50
)
4. flexible circuit (
2.2) laminating copper foil flexible
substrate Kevlar Kapton
printed circuit board assembly
( 2.3)
2.2 flexible circuit 2.3 (printed circuit board assembly)
2.1
70%
16%
0.10%
3 H
() M () L ()
(platinum group metals: PGMs)
-
36 37E-waste C 1 2 3 4 5 6
(power supply units)
(ferrite transformer) (heat sink)
(reliability) pin edge
connector
(optoelectronics) (gold pin board, palladium pin board)
2.1
2.2
%
70
16
4
, () 3
2
0.05
0.03
0.01
( )
-
38 39E-waste C 1 2 3 4 5 6
2.2 2.2
(, )
( 2.4) ( 2.5)
(pyrometallurgical)
(hydrometallurgical)
(%)
Fe Cu Al Pb Ni Ag* Au* Pd*
a (/) 300 7,736 2,475 3,580 31,150 430,000 24,490,000 11,660,000
4 39 13 2 5 6 25 6 37
PC 0 16 1 1 3 4 62 13 79 0 8 0 0 0 5 67 19 91
3 78 1 0 0 3 12 2 17 17 35 4 1 1 4 33 4 42 1 12 6 0 8 6 64 3 73 PC 0 6 0 0 2 2 81 8 91
1 19 4 1 6 3 66 - 69
0 37 1 - 3 25 35 0 60
a (London Metal Exchange - LME)
24 .. 2550
*
J. Cui, L. Zhang / Journal of Hazardous Materials 158 (2008) 228256
2.4
Manual disassembly
PCB
Ni
Plastic, Chip
-
40 41E-waste C 1 2 3 4 5 6
2.6
OEM (original equipment manufacturers)
()
(disposal contractor)
2.5
Hand Picking
OEM
-
/
Shredding
Au
Cu Smelter
Refining
Metal liberation
Air Separation
Precious metal recovery
Precious metal Cu
PCBs
PCBs
PCBs
PCBs
Au, Ag, Pd, Pt
Cyanidation
Size reduction
Mechanical Separation
Metal conentratesCu, Solder, Fe-Ni, Al
Precious metals
Martin Goosey and Rod Kellner, A scoping Study End-of-Life Printed circuit Boardds, Aug 2002
2.6
-
42 43E-waste C 1 2 3 4 5 6
2.2.1
4
1.
-
44 45E-waste C 1 2 3 4 5 6
2.
(Waste
Electrical and Electronic Equipment: WEEE)
(Restriction of Hazardous Substances: RoHS)
WEEE RoHS
2.1
2.2
2.3
the Registration, Evaluation, Authorization, and Restriction of
Chemicals (REACH)
2.4
2.5
-
46 47E-waste C 1 2 3 4 5 6
3.
4.
-
48 49E-waste C 1 2 3 4 5 6
(FTA)
2.3
1.
()
2.
3.
3
2.7
-
50 51E-waste C 1 2 3 4 5 6
, , 2010
2.7
(liberation)
(comminution)
(mixing)
(calcination)
(sintering)
(briqueting)
(agglomeration)
(screening&classification)
1.
(shredder) (hammer
mill) (ball mill)
(magnetic
separator) (centrifuge) (shaking table)
2.
(electrochemistry)
(ion exchange) (reverse osmosis) (electrodialysis)
(bioleaching) (supercritical fluid extraction)
3.
3-6
-
52 E-waste
(thermalprocess)
3C 1 2 3 4 5 6
-
54 55E-waste C 1 2 3 4 5 6
(
)
(pyrometallurgy) (pyrolysis)
11 3(thermalprocess) 3.1(pyrometallurgy) () (heater furnace) (induction furnace) 700-1,200
(decomposition) (NaCO4) (borax)
(KNO3) (NaOH)
(slag)
3 (slag) (matte)
(metal)
()
(high fluidity)
-
56 57E-waste C 1 2 3 4 5 6
(plasma arc furnace)
(blast furnace) (drossing) (sintering)
(gas phase)
3.1.1
3.1
Veldbuizen Sippel Noranda 3.1
100,000 14%
()
(125 ) (supercharged air)
39%
(silica-based slag)
(copper matte) (I)
(converter)
(liquid blister copper)
(anode furnace) 99.1% 0.9%
(electrorefining)
Rnnskr Boliden Ltd. 3.2
(converting) (Kaldo
furnace) 100,000
(skip
hoist) (oxygen lance) -
1,200 post-combustion
( )
( )
H. Veldbuizen, B. Sippel, Ind. Environ., 1994
24%Cu
35%Cu
5%Cu
73%Cu
98%Cu
334kg
99.1%Cu
98%Cu 10%
Cu
3.1 Noranda
-
58 59E-waste C 1 2 3 4 5 6
Umicore
IsaSmelt
(lead slag)
base metals operations (BMO)
(copper-leaching)
(electrowinning)
BMO (lead blast
furnace) (lead refinery)
(special metal plant)
IsaSmelt
( speiss
)
( Harris) (
)
IsaSmelt Umicore (
3.3) hygienic gases
(bag house filters)
(electrofilters) (scrubbers)
(SO2)
(NOx)
SO2
H2SO
4
(silver slime)
NiSO4
Zinc Fuming
Kaldo
3.2 Rnnskr
Umicore
(dross), , speiss (
), (anode slimes), ,
2,500,000
10%
APME, Association of Plastics Manufacturers in Europe Report, 2000
-
60 61E-waste C 1 2 3 4 5 6
300-700 -
/ ()
/ ()
99.9%
80%
1,300 -
40 0.61
(I) (Cu2O)
3.4
3.3 (offgas) IsaSmelt
Isa
Smelt
Hygienicgasses
Radiationchamber
SO
2, NO
x
, ,
H2SO
4, NO
x, CO,
HF, HCl
:
, ,
SO2, NO
x ,
CO,
(quenching)
C. Hageluken, TERI Press, New Delhi, 2007
Zinc Fuming
(Hg)
(hammer mill)
30 50:50
(silo)
(copper collector)
-
Cu2O
Cu
62 63E-waste C 1 2 3 4 5 6
2Cu + H2O = Cu
2O + 2H
3.4
(stream reaction)
Cu2O + 2H = 2Cu + H
2O
2. (halogenated flame retardants - HFR)
3.
4.
5.
/
6. ( )
3.1.2
1.
XCEP, , 2010
3.4 (NaOH)
-
12
3 4 5
6
7
8
9
10
1112
13
64 65E-waste C 1 2 3 4 5 6
3.2(pyrolysis)
()
500-800
3 (
) ( (tar)) ()
3.5
1521% 1520% 60%
H. Kui, G. Jie, X. Zhenming, Journal of Hazardous Materials, 2009
3.5 (1) (2) (3) (4) (5) (6) (7) (8) (9)
(10) (11) (12) (13)
N
oran
da
26
4
(14%
)
R
nns
kr
B
olid
en
265
,266
K
aldo
(
1
00,0
00
/
)
R
nns
kr
267
PC
Zin
c Fum
ing
(
1:1
)
Zin
c Fum
ing
U
mic
ore
268-
270
,
(
PM
O)
IsaS
mel
t
10%
(
2
50,0
00
/
)
Isa
Sm
elt
base
met
als
oper
atio
ns (
BM
O)
PM
O
(lea
d bl
ast fu
rnac
e)
(lea
d re
finer
y)
I
saSm
elt
U
mic
ore
271
WEEE
Is
aSm
elt
W
EEE 6
%
1%
4.
5%
D
unn
272
3
00-7
00
80%
99.9
%
D
ay
273
1400
co
llec
tor
met
al
c
olle
ctor
met
al
80
.3%
94.
2%
A
leks
an-
drov
ich
PG
M
274
PG
M
(c
halc
ogen
ides
)
ba
sem
etal
PG
M
C. J
iran
g, Z
. Lifen
g, J
ourn
al o
f H
azar
dous
Mat
eria
ls, 2
008
3.1
-
66 E-waste
3.6
Gongming Zhou, Zhihua Luo and Xulu Zhai, Proceedings of the international conference on sustainable solid waste management, 2007
3.6
slag
air
Was
te P
CB
Pyrolysis gasslag
slag
slagcopper
discharge
Deoxidization of Cu2OEnrichment of noble metalSeparation of metal
liquid of metaladmixture
noble metalenriched admixture
smokesmoke
slag containing large quantity of Cu2Oslag
(chemicalprocess)
4C 1 2 3 4 5 6
-
68 69E-waste C 1 2 3 4 5 6
11 4(chemicalprocess) 4.1(hydrometallurgy) (discrete component) 200
pin edge connector
(air knives)
(copper substrate)
(electrowinning)
(non selective leachants)
(dilute mineral acid)
2
(selective dissolution-electrolytic recovery)
(discrete metal) (
) (fluoroboric acid)
(precious metal group: PMG)
( )
-
70 71E-waste C 1 2 3 4 5 6
4
(electrolytic membrane cells)
(
)
(electrorefining process)
4.2(leaching)
(leaching)
4.2.1
.. 2326
Carl Wilhelm Scheele
235
4Au + 8CN 4Au(CN)2 + 4e
O2 + 2H
2O + 4e 4OH
Dorin Woods (pH) (
)
10-10.5 (activity) >>>
( 4.1)
4.2.2
( )
() /
Au(I)
Au(II) /
(chlorination)
(aqua regia)
3 1
236
2HNO3 + 6HCl 2NO + 4H
2O + 3Cl
2
2Au + 11HCl + 3HNO3 2HAuCl
4 + 3NOCl + 6H
2O
2
(stainless steel)
-
72 73E-waste C 1 2 3 4 5 6
pH
8-10 +100oC
/ 9-11 Cu/Au
8.5-9.5
Slurry CN-electrolysis 9-11
8-10
7-8
8-9
~9
~9
8-9
/ 6-6.5
6-7
3-10
/
4-5
7-10
,
5-6
DMSO, DMF
7
4.1
4.2.3(thiourea)
(thiourea)
CS(NH2)2
(cationic complex) 99%
212
Au + 2CS(NH2)2 Au(CS(NH
2)2)2
+ + e
(ferric iron)
-
pH
/ 1-3
1-2
1-3
(aqua regia) 1
1 electrolytic Cu slimes
1-2
Haber
1
Bio-D
1
6-7
G. Hilson, A.J. Monhemius, J. Cleaner Prod, 2006
-
74 75E-waste C 1 2 3 4 5 6
4.2
75%
3 (1)
(2)
(3)
CILd
(roasting) - 550oC (kg/ton ) - 50
S/L (g/ml) 1/1.5 1/1.5 S/L (g/ml) 1 /2 1 /2
NaCN (kg/ton ) 6.2 4.6 TUa (kg/ton ) 15.2 15.2
Ca(OH)2 (kg/ton ) 8.2 2.9 FSb (kg/ton ) 140.9 140.9
pH 10.5 10.5 SAc (kg/ton ) 46.2 46.2
pH 1.5 1.5
(h) 48 48 (h) 5 5
(%) 66.7 79.8 (%) 66.8 74.9
a , b , c , d carbon in leach
N. Gonen, E. Korpe, M.E. Yildirim, et al., Miner. Eng., 2007
4.2
4.2.4
(S2O
3
2-)
(ammoniacal thiosulfate) (cupric ion)
Cu(NH3)
4
2+
Cu(NH3)
2
+ Au+
Au(NH3)2
+ Au(S2O
3)2
3- Cu(NH3)2
+
Cu(S2O
3)
2
5- Au(NH3)
2
+ S2O
3
2-
Cu(S2O
3)2
5- Cu(NH3)2
+ Cu(NH3)4
2+
(II)
(Au+) 237
Au + 5S2O
3
2- + Cu(NH3)4
2+ Au(S2O
3)2
3- + 4NH3 + Cu(S
2O
3)3
5-
2Cu(S2O
3)3
5- + 8NH3 + O
2 + H
2O 2Cu(NH
3)4
2+ + 2OH- + 6S2O
3
2-
4.3 (stability constant)
(alkaline)
(9.25 25 )
(II)-
25 9-10
(II)-
50%
-
76 77E-waste C 1 2 3 4 5 6
4.3
(cementation) (solvent extraction) (adsorption
on activated carbon) (ion exchange)
4.3.1(cementation)
1890
Merill-Crowe
(cathodic deposition)
(anodic corrosion)
238
log Ka
Au(CN)2
- 38.3 224
Au(SCN)2
- 16.98 224
Au(SCN)4
- 10 224
AuCl4
- 25.6 225
Au(NH3)2
+ 26, 13b 225, 226
Au(S2O
3)2
3- 26.5, 28 227, 228
a K = [AuLn]/[Auz+][L]n Auz++nL=AuL
n 25oC
b (ionic strength) = 1.0
J. Cui, L. Zhang, Journal of Hazardous Materials, 2008
4.3 2Au(CN)
2
- + 2e 2Au + 4CN-
Zn + 4CN- Zn(CN)4
2- + 2e
(passivating layer)
8-11
-
(reduction-precipitation)
(NaBH4) 12% (NaOH) 40%
4.3.2
(guanidine) -
4.4 (extractant)
(aurocyanide) LIX-79
-
(NaCN)
Cyanex 921
(Li+)
-
78 79E-waste C 1 2 3 4 5 6
239
iNa+ + 2Au+ + jS2O
3
2- + OH- + mTBP(0)
= NaiAu2(S2O32-)
j(OH-)
mTBP
(0)
iNa+ + 2Au+ + jS2O
3
2- + OH- + 2NH3 + mTBP
(0) = NaiAu
2(S
2O
3
2-)j(OH-)(NH
3)2
mTBP
(0)
i (i = 3-5) j (j = 2-3) TBP , m 1.5-2.5
6-9
(extractant)
(diluent)
[Au] (mmol/L)
[pH50]
Primene JMT primary amine 10% (v/v) 0.25 7.65 240
Primene 81R primary amine 10% (v/v) 0.25 7.85 240
Adogen 283 secondary amine 2.2% (v/v) 5 7.05 241
TBP phosphoric ester - 5
-
80 81E-waste C 1 2 3 4 5 6
bio Ci
kio
Qi =Di+
k
b
ijC
j
kijj=l
KCn Qi=
Freundlich 247, 248
K n (0
-
82 83E-waste C 1 2 3 4 5 6
2
(-0.3 mm)
L=Liquid
S=Solid
Ag (NaCl)
Cu
AgCl, CuS
S
(Al)
L
L
L
S
Au, Ag,Pd, Cu
Pd, Ag, Au, Cu
S
L
S
L
L
S
P. Quinet, J. Proost, A. Van Lierde, Miner. Metall.Process, 2005
4.1
27.37% 0.52% 0.06% 0.04%
4
+1.168 , -1.168+0.6 , -0.6+0.3 -0.3
4.1
93% 95% 99%
1 4.5
4.2
(a) (carbonization) (roasting)
(b) (nitric acid)
(c) (d)
(diethyl malonate) (e)
(hexanol), (methyl-iso-butyl ketone),
(di-n-butylketone), , (dibutyl ether),
(ethylene glycol), (n-amylether), (iso-amyl ether),
2,2- (2,2-dichloroethyl ether), (tributylphosphate:
TBP) (natural oil)
(selectivity)
140
-
H2SO
4
H2SO
4 Fe2(SO
4)3
84 85E-waste C 1 2 3 4 5 6
(H2SO
4) (kg) 470
Fe2(SO
4)3 (kg) 12
(O2) (L) 36x104
(H2O
2) (kg) 74
(NaCN) (kg) 19
(HCl) (kg) 165
(Al) (kg) 0.3
(NaCl) (kg) 1.7
(kg) 94
(NaOH) (kg) 53
4.5 1
P. Quinet, J. Proost, A.Van Lierde, Miner. Metall.Process, 2005
(Ag) 40oC
(Au) 40oC
(Au)
Au
HNO3(l+l)
AgNO3
Diethyl malonate
HNO3 0.01 M
H2SO
4 + H
2O
2 + (COOH)
2
A.G. Chmielewski,T.S. Urbanski,W. Migdal, Hydrometallurgy, 1997
4.2
( )
400-500
8-12
(H2SO
4) 90
(HNO3) 1:2
60 (NaClO3)
92%
-
NO3
HNO3
86 87E-waste C 1 2 3 4 5 6
180 (MgCl2) 250 3 80-95
98% 94% 96%
94%
50 200 2.5
80 (redox-potential) 550
50%
96% 98%
(acidic sodium bromide) 30
180 (pulp)
(triisobutylphosphinesulfoxide) 10%
850 60
3 98% 84% 96%
92%
4.3
(stripping solution)
(HNO3) 0.5
(current efficient: CE) 43% (current density) 20
5% HNO3 5
(re-dissolution)
(simulated leaching solution)
(rotating cylinder electrode reactor) (undivided) (batch mode)
(electrodeposition) (II)
(Cu(NO3)2) 0.1 (II) (Pb(NO
3)2) 0.025 0.5
(lead dioxide)
2
(NO3
-)
(multilayer ceramic capacitor: MLCC)
(nitric etching solution)
MLCC
97% 1 90
90 5
4.6
/
4.7
4
-
88 89E-waste C 1 2 3 4 5 6
HNO3 1-6 M
NaOH HCl 1.5 M H
2SnO
3+6HCl H
2SnCl
6+3H
2O
(Sn) Sn(IV)+4e- Sn
HCl H
2SnO
3 HNO
3
A. Mecucci, K. Scott, J. Chem. Technol. Biotechnol., 2002
4.3 Mecucci Scott
H2SnO
3
(Sn) (metastanic acid)
Sn + 4HNO3
H2SnO
3 + 4NO
2+H
2O
: Cu Cu(II)+2e- Cu
: PbO2
Pb(II)+2H2O PbO
2+4H++2e-
..
(Au)
2550 251
(Au) (Ag)
-0.5 (KI) (I
2)
Au Ag 2550 252
(Ni) 1 90oC 90
5
Ni 2550 253
(Au) (98%), (Pd) (96%), (Pt) (92%), (Ag) (84%)
Au PGMs 2549 254
(Cu) (98%)
Cu 2549 255
(Cu), (Ag) (93%), (Pd) (99%), (Au) (93%)
AgCl, Cu, Pd, Au 2548 256
(Au) (Ag) (Pd) 92%
(FeCl2)
gold sponge 2548 257
(Au) , (III) (CuCO
3)
2547 258
(Sn) (Pb)
Ti(IV)
Sn Pb 2546 259
4.6
-
90 E-waste
..
(Cu), (Pb) (Sn)
Cu, Pb Sn 2545 260
(Au)
2540 261
(Au) 80-90oC
2536 262
(Au) (Ni)
()
Ni Au
2535 263
J. Cui, L. Zhang, Journal of Hazardous Materials, 2008
*
++++ ++ -- 0 ++++ ----- -
+++++ +++ ---- ----- - -- ---
+++ ++++ ----- -- 0 - -
++ + ----- 0 -- - ---
4.7
0, - + (base) (negative) (positive)
(*)
J. Cui, L. Zhang, Journal of Hazardous Materials, 2008
5
(biometallurgy)
C 1 2 3 4 5 6
-
92 93E-waste C 1 2 3 4 5 6
20
(Cu), (Ni), (Co),
(Zn), (Au) (Ag)
(structural
function) / (catalytic function)
(prokaryote)
(eukaryote)
(intercellular function) /
(selective)
(non-selective)
11 5(biometallurgy) - (algae) (fungi) / (biological sludge) (effluent) 2
(bioleaching) (biosorption)
(Co), (Mo), (Ni), (Pb) (Zn)
5.1(bioleaching)
5.1.1
2
173
MS + H2SO
4 + 0.5O
2 MSO
4 + So + H
2O
So + 1.5O2 + H
2O H
2SO
4
So = elemental sulfur, oxidation number = 0
-
94 95E-waste C 1 2 3 4 5 6
(Fe2+) (Fe3+)
173
MS + 2Fe3+ M2+ + 2Fe2+ + So
2Fe2+ +0.5O2 +2H+ 2Fe3+ +H
2O
2 (thiosulfate) (polysulfide)
( )
5.1.1.1:(S2O
32-)
(III)
(pyrite: FeS2), (molybdenum disulfide: MoS
2) (tungsten
disulphide: WS2)
176
FeS2 + 6Fe3+ + 3H
2O S
2O
3
2- + 7Fe2+ + 6H+
S2O
3
2- + 8Fe3+ + 5H2O 2SO
4
2- + 8Fe2+ + 10H+
5.1.1.2 :(H2S
n)
(III) /
() 2
176
MS + Fe3+ + H+ M2+ + 0.5H2S
n + Fe2+ (n 2)
0.5H2S
n + Fe3+ 0.125S
8 + Fe2+ + H+
0.125S8 + 1.5O
2 + H
2O SO
4
2- + 2H+
/
(III)
(III)
(II) (meso-
philic) (thermophilic)
5.1.2
heap leaching dump leaching stirred-tank leaching
heap leaching
dump leaching (secondary
minerals) (covellite : CuS) (chalcocite : Cu2S) 40
(heap of ores)
stirred-tank 20
stirred-tank (arsenopyrite:
FeAsS)
(biooxidation)
heap leaching
.. 2523 13
( 5.1)
So = elemental sulfur, oxidation number = 0
-
96 97E-waste C 1 2 3 4 5 6
5.1
178
2Cu2S + 2H
2SO
4 + O
2 2CuS + 2CuSO
4 + 2H
2O
Cu2S + Fe
2(SO
4)3 2CuSO
4 + 2FeSO
4 + S
CuS + Fe2(SO
4)3 CuSO
4 + 2FeSO
4 + S
(refractory gold ores)
(arsenopyrite) (pyrite) (pyrrhotite)
tank leaching
(mineral sulfide matrix)
50% (pretreatment)
95%
stirred-tank leaching .. 2529
(slurry) 15-20%
(primary reactor)
2-2.5
(short-circuiting) 4-6
: / (..)
Lo Aguirree, Chile 16,000 2523-2539
Gunpowders 2534-
Mammoth Mine, (In situ)a
Australia
Mt. Leyshon, Australia 1,370 2535-2540
Cerro Colorado, Chile 16,000 2536-
Girilambone, Australia 2,000 2536-
Ivan-Zar, Chile 1,500 2537-
Quebrada Blanca, Chile 17,300 2537-
Andacollo, Chile 10,000 2539-
Dos Amigos, Chile 3,000 2539-
Cerro Verde, Peru 32,000 2539-
Zaldivar, Chile ~20,000 2541-
S&K Copper, Myanmar 18,000 2541-
Equatorial Tonopah, USA 24,500 2543-2544
5.1
G.J. Olson, J.A. Brierley, Appl. Microbiol. Biotechnol., 2003
a ~1.2
-
98 99E-waste C 1 2 3 4 5 6
Newmont Mining Corporation biooxidation heap
.. 2542 30-39%
49-61%
5.1.3
( 5 10 )
10
(Chromobacterium violaceum)
(dicyanoaurate : [Au(CN)2
-]) 14.9%
( Thiobacillus ferrooxidants) (Thiobacillus
thiooxidants)
2 (biomass)
5.1 5 10
90%
60% 95%
(PbSO4) (tin oxide: SnO)
(Sulfobacillus thermosul-
fidooxidants) 5.2
H. Brandl, R. Bosshard, M. Wegmann, Hydrometallurgy, 2001
100
80
60
40
20
05 10 50 100
AlCuNiZn
(g/L)
(%)
5.1 30 T.ferrooxidantsT.thiooxidants 7
10
(%)
(Al) 0.7 0.05
(Cu) 2.0 0.08
(Fe) 2.0 0.07
(Pb) 20.0 0.08
(Ni) 0.25 0.005
(Sn) 6.9 0.05
(Zn) 0.09 0.006
5.2
S. Ilyas, M.A. Anwar, Hydrometallurgy, 2007
-
100 101E-waste C 1 2 3 4 5 6
(Acidithiobacillus ferrooxidants)
(Fe2(SO
4)3) A. ferrooxidants
Fe2(SO
4)3 + Cu Cu2+ + 2Fe2+ + 3SO
4
2-
(Aspergillus niger)
(Penicillium simplicissimum)
10
100
5.3
(commercial gluconic acid: NaglusolTM 2.5 M) A. niger
5.2
(II) A. ferrooxidants
7
24%
(citric acid)
37%
80%
(g/L)
1 10 50 100 1 10 50 100 (%) (g/L)
(Al) 62 57 42 43 0.15 1.28 4.98 10.2
(Cu) 85 86 70 8 0.07 0.69 2.8 0.6
(Pb) 100 92 99 97 0.02 0.18 0.99 1.9
(Ni) 100 100 100 100 0.02 0.15 0.75 1.5
(Sn) 100 100 100 100 0.02 0.23 1.15 2.3
(Zn) 100 100 100 100 0.02 0.26 1.3 2.6
5.3 NaglusolTM(4)
H. Brandl, R. Bosshard, M. Wegmann, Hydrometallurgy, 2001
00 3 5 7 9
2
4
6
8
10
12
Fe2+(gL-1)
Cu
Cu
Cu
C
u (g
L-1
)
M.-S. Choi, K.-S. Cho, D.-S. Kim, et al., J. Environ. Sci. Health Part A Toxic/Hazard. Subst. Environ.Eng, 2004
5.2
-
102 103E-waste C 1 2 3 4 5 6
5.2(biosorption)
5.2.1
(biosorbent)
5.4
(1)
(chitosan)
(2) 0.003 40
(3) cross-link
(4)
(Au3+), (Pt4+)
(Pd2+)
(chitin) (deacetylated)
(protonated)
(grafting)
(backbone) (functionality)
(packed-bed reactor) (fluidized-bed)
(encapsu-
lation) cross-linking (agar), (cellulose), (alginates),
cross-linked ethyl acrylate ethylene glycol dimethylacrylate, polyacrylamide, (silica gel)
cross-linking reagents toluene diisocyanate and glutaraldehyde
(PVA)
scanning electron microscopy (SEM)
1-13
pHQ
max
a
(mmol/g)
Streptomyces erythraeus Au3+ 4.0 0.03 166
Spirulina platensis Au3+ 4.0 0.026 166
Desulfovibrio desulfuricans Pd2+ 2.0 1.2 158
Desulfovibrio fructosivorans Pd2+ 2.0 1.2 158
Desulfovibrio vulgaris Pd2+ 2.0 1.0 158
Desulfovibrio desulfuricans Pt4+ 2.0 0.32 158
Desulfovibrio fructosivorans Pt4+ 2.0 0.17 158
Desulfovibrio vulgaris Pt4+ 2.0 0.17 158
Penicilium chrysogenum Au(CN)2
- 2.0 0.0072 163
Bacillus subtilis Au(CN)2
- 2.0 0.008 153
5.4
-
104 105E-waste C 1 2 3 4 5 6
pHQ
max
a
(mmol/g)
Saccharomyces cerevisiae Au3+ 5.0 0.026 229
Cladosporium cladosporioides Au3+ 4.0 0.5 166
Cladosporium cladosporioides Au, 4.0 0.18 166
Cladosporium cladosporioides Strain 1 Au3+ 4.0 0.4 230
Cladosporium cladosporioides Strain 2 Au3+ 4.0 0.5 230
Cladosporium cladosporioides Strain 1 Ag+ 4.0 0.4 230
Cladosporium cladosporioides Strain 2 Ag+ 4.0 0.12 230
Aspergillus niger Au3+ 2.5 1.0 231
Rhizopus arrhizus Au3+ 2.5 0.8 231
PVA-immobilized biomass (Fomitopsis carnea) Au3+ 1-13 0.48 187
Aspergillus niger Ag+ 5-7 0.9 232
Neurospora crassa Ag+ 5-7 0.6 232
Fusarium oxysporium Ag+ 5-7 0.5 232
Chlorella vulgaris Ag+ 6.7 0.5 233
Chlorella vulgaris Au3+ 2 0.5 155
Sargassum natans Au3+ 2.5 2.1 231
Ascophyllum nodosum Au3+ 2.5 0.15 231
Sargassum fluitans Au(CN)2
- 2.0 0.0032 163
Alginate cross-linked with CaCl2
Au3+ 2.0 1.47 186
Alginate cross-linked with Ca(OH)2
Au3+ 2.0 0.34 186
Dealginated Seaweed Waste Au3+ 3 0.4 194
pHQ
max
a
(mmol/g)
Hen eggshell membrane (ESM) Au(CN)2
- 3 0.67 195
Hen eggshell membrane (ESM) AuCl4
- 3 3.1c 195
Lysozyme Au3+, Pd2+, Pt4+ - - 193
Bovine serum albumin (BSA) Au3+, Pd2+, Pt4+ - - 193
Ovalbumin Au3+, Pd2+, Pt4+ - - 193
(Alfafa) Au3+ 5.0 0.18d 234
condensed-tannin gel Pd2+ 2.0 1.0e 217
condensed-tannin gel Au3+ 2.0 40e 202
Bayberry tannin immobilized collagen fiber (BTICF)
membranePt4+ 3.0 0.23 188
Bayberry tannin immobilized collagen fiber (BTICF)
membranePd2+ 4.0 0.32 188
Acid-washed Ucides cordatus (waste crab shells) Au(CN)2
- 3.4 0.17 197
Glutaraldehyde crosslinked chitosan (GCC) Au3+ 1.6 2.9 198
Sulfur derivative of chitosan (RADC) Au3+ 3.2 3.2 198
Glutaraldehyde crosslinked chitosan (GCC) Pd2+ 2.0 2.44 199
Thiourea derivative of chitosan (TGC) Pd2+ 2.0 2.54 199
Rubeanic acid derivative of chitosan (RADC) Pd2+ 2.0 3.24 199
Thiourea derivative of chitosan (TGC) Pt4+ 2.0 2.0 200
Glutaraldehyde crosslinked chitosan (GC) Pt4+ 2.0 1.6 200
Chitosan derivatives Pd2+ 2.0 3.5 201
Chitosan derivatives Pt4+ 2.0 3.2 201
a (b) -
c 65
d Au(III), Cd(II), Cu(II), Cr(III), Pb(II), Ni(II) Zn(II) 0.3 mM
e pH 2.0, pCl 2.0 60
J. Cui, L. Zhang, Journal of Hazardous Materials, 2008
-
(a)
5 m 3 m 2 m 3 m 2 m
(b) (c) (d) (e)
106 107E-waste C 1 2 3 4 5 6
5.3 (a) (b) (c) (d) (e)
5.2.2
-
(coordination) (chelation) (ligands)
(siderophores) (transport) (internal compartmentalization)
(microprecipitation)
Cladosporium cladosporioides x-ray photoelectron (XPS) Fourier transform
infra-red spectroscopy (FT-IR)
(AuCl4
-)
extended x-ray absorption fine structure (EXAFS)
x-ray absorption near edge structure (XANES) .. 2523 -
(III) (tetrachloroaurate) Chlorella vulgaris
(III) (I) (0)
(I) /
(III)
(III) (0) environmental scanning electron microscope
(ESEM) 4 5.3 EXAFS
(III) (I) (0) EXAFS
75%
(I)
-
(condensed-tannin gel)
x-ray diffraction (XRD) 5.4
(0) (II)
(0)
M.E. Romero-Gonzalez, C.J. Williams, P.H.E. Gardiner, et al., Environ. Sci. Technol., 2003
-
100
500
1000
1500
2000
2500
3000
3500
4000
20 30 40 50 60 70 80 90 100
20 (drg)
Cou
nts
108 E-waste
5.4 XRD (condensed - tanin gel)
/
Y.H. Kim, Y. Nakano, Water Res., 2005
6C 1 2 3 4 5 6
-
110 111E-waste C 1 2 3 4 5 6
.. 2538
11 6 6.1
6.1
(mg/kg)a
()b
polybrominated diphenyl ethers (PBDEs)
polybrominated biphenyls (PBBs)
tetrabromobisphenol-A (TBBPA)
polychlorinated biphenyls (PCBs) , 14 280
chlorofluorocarbon (CFC),
polycyclic aromatic hydrocarbons (PAHs)
polyhalogenated aromatic hydrocarbons
(PHAHs)
polychlorinated dibenzo-p-dioxins
(PCDDs)
PVC
polychlorinated dibenzofurans (PCDFs)
(Am)
(Sb) , 1,700 34,000
-
112 113E-waste C 1 2 3 4 5 6
(mg/kg)a
()b
(As) (doping material)
(Ba) cathode ray tube
(CRT)
(Be)
(Cd) , , 180 3,600
(Cr) 9,900 198,000
(Cu) 41,000 820,000
(Ga)
(In) LCD
(Pb) , CRT, 2,900 58,000
(Li)
(Hg),
, 0.68 13.6
(Ni) 10,300 206,000
(Se) (rectifiers)
(Ag) ,
a (Morf et al., 2007)
b 20 Brett H. Robinson, Science of the Total Environment, 2009
64
79,520 39,161
(mg/kg)a
()b
(Sn) , LCD 2,400 48,000
(Zn) 5,100 102,000
(rare earth elements) CRT
-
114 115E-waste C 1 2 3 4 5 6
6.1
(polybrominated diphenyl ethers:
PBDEs) 766
16,000
(polychlorinated biphenyls:
PCBs) 16,512 1091
1,2-
(2,4,6-) (1,2-bis(2,4,6-tribromophenoxy) ethane), -
(decabromodiphenyl ethane)
(2,3-) (tetrabromobisphenol A bis (2,3-dibromopropyl)
ether)
0.4
8 (0.05
)
6.2
-p-
(polychlorodibenzo-p-dioxins) 65-2,765
15-16
(WHO)
16,575 300
2%
1.5, 1.3, 91, 13, 89 1.0
(particulate matter: PM)
46.7-51.6%
(organophosphates) -
(triphenyl phosphate: TPP)
(methyl esters of hexadecanoic) (octadecanoic acids)
(levoglucosan) (bisphenol A)
1-5
5%
-
116 117E-waste C 1 2 3 4 5 6
6.3
4,250 -
191- 9,156
() -p- (polychlronated dibenzo-
p-dioxins and dibenzofurans: PCDD/Fs)
100, 330 20,000
25,479
(Pteridium aquilinum L.) (Pteris multifida Poir.)
(Sorghum bicolour L.) Japanese dock (Rumex japonicus Houtt.)
(Erigeron annuus L.) 144, 116, 162, 278 326 (
) (bioaccumulation coefficients)
(
-
118 119E-waste C 1 2 3 4 5 6
( 0.094 )
(chromosomal aberration) 20
(cytogenetic damage)
6.5
/
6.1
E-waste
E-waste
Brett H. Robinson, Science of the Total Environment, 2009
6.1
-
121C 1 2 3 4 5 6
120 E-waste
C 1 2 3 4 5 6
-
122 123E-waste C 1 2 3 4 5 6
cradle to cradle:
clock frequency:
printed circuit board (PCB):
extended producer responsibility (EPR):
platinum group metals (PGMs):
reverse osmosis:
electrodialysis:
magnetic susceptibility: (magnetization)
eddy current:
corona electrostatic separator:
triboelectric:
methanolysis: (transesterification)
drossing:
matte: (slag)
electrowinning: (electrolysis)
electrorefining:
passivation:
heap leaching: (heap of ores)
refractory gold ores:
viscoelasticity:
hydrogenolytic degradation:
heat deflection temperature (HDT):
supercritical fluids:
solvation:
toxicity characteristic leaching procedure (TCLP): US EPA
synthetic precipitation leaching procedure (SPLP): (the mobility of contaminants) US EPA
-
125C 1 2 3 4 5 6
C 1 2 3 4 5 6
-
126 127E-waste C 1 2 3 4 5 6
1. P. Manomaivibool, T. Lindhqvist, N. Tojo,
, Report commissioned by Greenpeace International, 2009.
2. Electrical and Electronics Institute, Thailand (EEI), , http://www.thaieei.com/
eei2009/th/import_home.aspx
3. , , 2010
4. E-waste recycling centers, http://electronicrecyclers.com/about_eri.aspx
5. Articles at Urban Mining, http://urbanmining.org/articles/
6. C. Hageluken, Improving metal returns and eco-efficiency in electronics recycling A holistic
approach for interface optimisation between pre-processing and integrated metals smelting and
refining, IEEE International Symposium on Electronics and the Environment, pp. 218223.
7. J.B. Legarth, L. Alting, G.L. Baldo, Sustainability issues in circuit board recycling, IEEE
International Symposium on Electronics & the Environment, pp. 126131.
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Resour. Recov. 3 (4) (1997) 157167.
9. CPCB, Draft Guidelines for Environmentally Sound Management of Electronic Waste, 2007,
pp. 1025, http://www.cpcb.nic.in/Electronic%20Waste/chapter4.html.
10. J.E. Hoffmann, Recovering precious metals from electronic scrap, Jom-J.Miner. Met. Mater. Soc.
44 (7) (1992) 4348.
11. L.S. Morf, J. Tremp, R. Gloor, et al., Metals, non-metals and PCB in electrical and electronic
waste Actual levels in Switzerland,Waste Manage.27 (10) (2007) 13061316.
12. C. Jirang, Z. Lifeng, Metallurgical recovery of metals from electronic waste: A review, Journal of
Hazardous Materials 158 (2008) 228256.
13. , , 2550.
14. (JETRO) ,
, 2547.
15. ,
, 2551.
16. Martin Goosey and Rod Kellner, A scoping Study End-of-Life Printed circuit Boardds, Aug 2002.
17. H. Kui, G. Jie, X. Zhenming, Recycling of waste printed circuit boards: A review of current
technologies and treatment status in China, Journal of Hazardous Materials 164 (2009) 399408.
18. J. Li, H. Lu, J. Guo, Z. Xu, Y. Zhou, Recycle technology for recovering resources and products from
waste printed circuit boards, Environ. Sci. Technol. 41 (2007) 19952000.
19. G. Schubert, Aufbereitung der NE-metallschrotte und NE-metallhaltigen abfaelleteil 1 (processing
of scrap and refuse containing non-ferrous metalspart 2), Aufbereitungs-Technik 32 (1991) 78.
20. Jirang Cui, Eric Forssberg, Mechanical recycling of waste electric and electronic equipment: a review,
Journal of Hazardous Materials B99 (2003) 243263.
21. T.P.R. de Jong, W.L. Dalmijn, Improving jigging results of non-ferrous car scrap by application of
an intermediate layer, Int. J. Miner. Process. 49 (1997) 5972.
22. The recyclers manual for business, government, and the environmental community unit operations in
resource recovery engineering.
23. P.C. Rem, S. Zhang, E. Forssberg, T.P.R. de Jong, Investigation of separability of particles smaller
than 5 mm by Eddy-current separation technologypart II. Novel design concepts, Magnet. Elect.
Sep. 10 (2000) 85105.
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