nityanand gopalika digital detectors for industrial applications
DESCRIPTION
This is a presentation by Nityanand Gopalika on Digital Radiograpgy. The presentation we given @ Digital Radiography workshop organized by GE at JFWTC, Bangalore.TRANSCRIPT
Digital Radiography:a-Si Array Detectors for Industrial
Applications
Nityanand Gopalika, D. Mishra, V. Manoharan & Greg Mohr*
Industrial Imaging and Modeling LaboratoryJohn F Welch Technology Center
Bangalore
*GE Inspection TechnologiesOne Neumann Way MD K207
Cincinnati, OH 45215
Presentation Outline:
• Technology Development• Benefits of Digital Radiography• Quantifying Image Quality• Image Quality Metric for Digital Systems• Comparison of Imaging Devices: CCD, CMOS
and a-Si• Performance Study of Flat Panels
3 /Industrial Imaging and Modeling Laboratory
Evolution of Direct Digital X-ray Detectors
Technology Development
Film radiography
Image intensifiers
Computed radiography
CCD technology
Direct digital radiography
Productivity Resolution
NDT World
SizeCost
4 /Industrial Imaging and Modeling LaboratoryProductivity and cost benefits
Benefits of Digital RadiographyProductivity• Faster response• Elimination of chemical processing• Automated inspection• Elimination of retakes
Cost• Elimination film and consumables• ROI in two to three years
Quality• Image processing and analysis• Reduces operators fatigue• Consistency
Advanced Application• Volumetric CT for High Throughput
5 /Industrial Imaging and Modeling Laboratory
Measure of Image Quality
Quantifying Image Quality
Decreasing Noise
Incr
easi
ng C
ontr
ast
Contrast-to-Noise Ratio
Perceived Image Quality
What is a good Physical Measure of Image Quality?
6 /Industrial Imaging and Modeling Laboratory
MTF: Same Response to Signal and Noise
Image Quality Metric for Digital Systems
7 /Industrial Imaging and Modeling Laboratory
Higher MTF Does Not Mean Better Imaging System
Contrast Limiting Spatial Resolution (LSR), MTF measured at high contrast
• bar patterns » 100% input contrast MTF indicates fraction of signal that will be seen in image.
Noise MTF measured under noiseless conditions. MTF transfers noise in addition to signal. Image noise can interfere with object detectability.
MTF Limitations
Image Quality Metric for Digital Systems
8 /Industrial Imaging and Modeling Laboratory
High MTF; But Poor Performance
SNR = 1
Higher limiting resolution of smallerpixels may not provide betterdetectability in noisy images.
MTF: High Middle Low
MTFHighMiddleLow
Image Quality Metric for Digital Systems
9 /Industrial Imaging and Modeling Laboratory
MTF is One Metric; But Not Enough
Traditional gauge used for quantifying image quality cannot be used as a stand alone metric.
• Quantum and electronic noise are unavoidable in digital imaging chain.
• SNR can vary widely across systems
• High SNR is key to better inspection power
• To increase SNR often the only way is to increase radiation dose,
unacceptable trade-off
• Achieving high SNR at lower dose: better imaging system
Image Quality Metric for Digital Systems
10 /Industrial Imaging and Modeling Laboratory
DQE = SNR2 at detector outputSNR2 at detector input
SNR = signal-to-noise ratio
DQE: Detective Quantum Efficiency
Measure of SNR transmittance
Image Quality Metric for Digital Systems
11 /Industrial Imaging and Modeling Laboratory
Less Dose and Better Image
Input SNR2 proportional to radiation dose
DQEImage QualityInput Radiation Dose
• Traditional measures such as MTF, LSR are not sufficient to characterize detector performance
• Noise is a limiting factor for detectability, image processing, and advanced applications
Doubling DQE means:
• Same output SNR (“image quality”) at half the dose • 40% improvement in SNR at same dose
Image Quality Metric for Digital Systems
α
12 /Industrial Imaging and Modeling Laboratory
High DQE at Lower Dose
“Object”“Improved”DQE = 0.5
“Standard”DQE = 0.25
SNR = 5 SNR = 3.5 SNR = 2.5
Image Quality Metric for Digital Systems
13 /Industrial Imaging and Modeling Laboratory
High DQE Better Detectability
Film GE Detector
Image Quality Metric for Digital Systems
14 /Industrial Imaging and Modeling Laboratory
Detector Design Keeping DQE in Mind
Image Quality Metric for Digital Systems
15 /Industrial Imaging and Modeling Laboratory
DQE
One Image Quality
Measure
MTFHigh Resolution(for small object
detection)
Measurements and Requirements
Low Noise(for clear visualization)
Noise (NPS)
Efficient X-Ray Conversion (for minimum exposure)
Signal (S)
The Detector Properties
Pixel SizeSampling, Fill
Factor, Aliasing
Scintillator/CouplingCsI, Lanex, Se
lens/Direct
PhotodetectoraSi, CCD,
CMOS
ReadoutElectronic Noise
NPSMTFS
QDQE
221 ⋅=
Detector Design for High DQE
16 /Industrial Imaging and Modeling LaboratoryFlat Panel Technology Variation
Flat Panel Technology
Direct Conversion (Se)
Photons
Selenium
Digital Data
Electrons
Read Out Electronics
Photons
Cesium Iodide (CsI)
Light
Electrons
Read Out Electronics
Amorphous Silicon Panel
Digital Data
Indirect Conversion (CsI)
17 /Industrial Imaging and Modeling Laboratory
CsI vs. SeCesium Iodide
• Very high DQE; potential for high image quality at low dose
• Fluoro capable• Advanced application capable• Mature technology: 25-year history
with Image Intensifiers
Selenium
• Direct conversion of X-Ray into electrical signals
• Currently not capable of fluoro • Low X-Ray absorption• High sensitivity to temperature
Again Keep DQE in Mind!!
18 /Industrial Imaging and Modeling Laboratory
Point Spread Function for Different Detector Types
Electrons
Image Intensifiers CSI Flat panels Se Flat panels
MTF is One Part of the Story, DQE is the Other BIG Part
19 /Industrial Imaging and Modeling Laboratory
Photons
Scintillator
LightFiber Optic Taper
Electrons
CCD
Amorphous Silicon• Potentially high image quality at low
dose (high DQE)• Active Research on New Applications • Designed for X-Ray from the start• Compact packaging• Very high development cost
CCD• CCDs are easily available• Low development costs• “Transition” technology to
flat panel • High CCD cost• Tiling and design complexity
CCD Technology
20 /Industrial Imaging and Modeling Laboratory
All will convert visible energies into an electronic charge
Imager Dimensions• CCDs: 10 – 60-mm on a side• CMOS: 50-mm on a side• a-Si: 200 – 410-mm on a side
Size governed by silicon process• CCDs and CMOS – 6” wafers• Multiple chips/wafer – yield• a-Si – Large area deposition/glass
Pixel Dimensions• CCDs: 9 – 25 microns• CMOS: 40 – 50 microns• a-Si: 100 – 400 microns
• Pixel size governed by architecture
Silicon Imaging Devices, CCD, CMOS & a-Si
21 /Industrial Imaging and Modeling Laboratory
Silicon Device Coupling deviceor Method
Phosphor orPhotoconductor
CCD or CMOS
Fiber optic coupler
Requires 10X more Exposure
Fiber optic scintillator and/or phosphor
ShieldingGlass
LensCooled CCD Camera
Requires 100X more Exposure
Silicon Imaging Devices, CCD, CMOS & a-Si
22 /Industrial Imaging and Modeling Laboratory
3 Types of GE Digital X-Ray Panels All feature high efficiency & fast 14-bit readoutHighest resolution (DXR-500)
• 7” x 9” (19 cm x 23 cm) @ 100 micron
• Over 20% MTF at 5 lp/mmHighest efficiency (DXR-250)
• 16” x 16” (41 cm x 41 cm) @ 200 micron
Fastest Imaging (DXR-250RT)• Up to 30 Hz• 8” x 8” (20 cm x 20 cm) @ 200
micron
GE Digital X-Ray Detectors
Panels Optimized for Different Applications
23 /Industrial Imaging and Modeling Laboratory
Detector Characteristics Suitable for Industrial Applications
Productivity:• High Speed (mR vs. R)• Minimized Rework• High Latitude Coverage
Advantages• Less radiation field• Micro focus (Faster response
enables high definition radiography)
Useful exposure rangeMin and Max exp ratio 2
Comparative study
Typical Exposure ratio requirements
Material LattitudeX-ray tube potential
Subject contrast
Ti 3 to 20 mm 160 kV 12.7Steel 1 to 10 mm 160 kV 7.28
Characteristics DXR-500 Digital Detector Industrial X-ray film ( Medium speed)
Speed In the order of few mR to get signal level of 12000
1.3 R to get Optical density of 2
Dynamic range Useful minimum to maximum exposure ratio 12
Useful minimum to maximum exposure ratio 2
DXR-500 DR system
02000400060008000
100001200014000
0 5 10 15 20 25 30 35
Relative exposure
Sign
al(A
DC)
Performance Study: Radiation Exposure
24 /Industrial Imaging and Modeling Laboratory
Dynamic range
• High latitude coverage• ~ 10 times > image-
intensifier• No blooming or
saturation• Window leveling • No Lead masking
Wide dynamic range enables- high latitude imaging
2& 3 window level adjusted
Ti step wedge image 2 –20 mm
1
2
3
25 /Industrial Imaging and Modeling Laboratory
Artifacts
Image Intensifier- distortionFlat panel- no distortion
> No distortion > No blooming> Uniform sensitivity
over entire area> Brightness uniformity Brightness uniformity
Source:GE Health care Source:GE Health care
Source:GE Health care
Flat panelXII
26 /Industrial Imaging and Modeling Laboratory
Performance study-Spatial resolution
Observation:• System can be designed to match with film MTF.• Digital detector with mini/micro focal tube
outperforms film radiography with large focal spots.• DQE of DXR-500 is comparatively good.
System Design for Meeting Requirements
FS = 1.8mmFS = 0.4 mm
FS = 1.8 mmFS = 0.4 mm
27 /Industrial Imaging and Modeling Laboratory
Detective quantum efficiencySource: GE healthcare
Better defect detectability in useful spatial resolution range
DQE comparison- XII vs. DR
28 /Industrial Imaging and Modeling Laboratory
Performance study-Noise response• Poisson distributed noise
• Noise Quantum limited
• Averaging of frames reduces noise
Effect of no. of X-ray photons
Effect of no. of frames
Quantum Limited Noise Performance
1 mAs
5 mAs
5 frames
10 frames
20 frames
29 /Industrial Imaging and Modeling Laboratory
Performance study-IQI sensitivity
Mat. – TiThick. – 25mmKVp – 120mAs – 1.0FS – 0.4 mm
Mat. – TiThick. – 10mm KVp – 120mAs – 1.0FS – 0.4 mm
2-1T sensitivity over range of thickness
Mat. – SSThick. – 10mm KVp– 140mAs – 1.0FS – 0.4 mm
Mat. – AlThick. – 40 mm KVp – 120mAs – 1.0FS – 0.4 mm
30 /Industrial Imaging and Modeling Laboratory
Performance study-Imaging
KVp – 125
mAs – 1.0
FS – 0.4 mm
Mat. – CSI
Porosity2-2T
Sensitivity
Lack of penetration
KVp – 125
mAs – 1.0
FS – 0.4 mm
Mat. – CS
Range of applications with 2-1T sensitivity
31 /Industrial Imaging and Modeling Laboratory
Object – IC
KVp – 70
mAs – .5
FS – 10 microns
Mag. – 50X
Object – IC
KVp – 70
mAs – .5
FS – 10 microns
Mag. – 50X
Object –ceramics
KVp – 70
mAs – .5
FS – 10 microns
Mag. – 50X
Enable high definition radiography
Performance study-Imaging
32 /Industrial Imaging and Modeling Laboratory
Welding defects-Lack of penetration and spatter
Material: CS
Plate, 12 mm thk
SW SI – Offset
FS-0.4 mm
SDD-700 mm
KVp: 130, 2 mAs
Filter: Cu –0.4 mm
33 /Industrial Imaging and Modeling Laboratory
• System can be designed to meet image quality requirements
• Quantum limited noise performance• Faster response and wide dynamic range • Real time (fluoro)
• Range of applications with 2-1T sensitivity
• Enables high definition radiography • Advanced image processing for image
optimization
Summary