network-on-chip an overview system-on-chip group, cse-imm, dtu

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Network-on-Chip An Overview System-on-Chip Group, CSE- IMM, DTU

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Network-on-Chip

An Overview

System-on-Chip Group, CSE-IMM, DTU

© System-on-Chip Group, CSE-IMM, DTU 2

Introduction – intra chip communication

P

Keypad

Network

DSP

Memory

RF

© System-on-Chip Group, CSE-IMM, DTU 3

Introduction – intra chip communication

P

Keypad DSP

Memory

RF

BUS

© System-on-Chip Group, CSE-IMM, DTU 4

Introduction – intra chip communication

P

Keypad DSP

Memory

RF

Point-to-Point

© System-on-Chip Group, CSE-IMM, DTU 5

Overview

• Important Paradigms• Network Abstraction• Performance Evaluation• Research Opportunities

© System-on-Chip Group, CSE-IMM, DTU 6

Important Paradigms for NoC

• Re-use• Flexibility• GALS• Low Power

Core

Network AdapterRouting Node

Link

© System-on-Chip Group, CSE-IMM, DTU 7

On-Chip vs Off-Chip

• On-Chip Cheap Wires Power Limited Area Limited Unreliable Wire

Models

• Off-Chip Wire/pin Limited High Latency Higher Node

Complexity Viable

© System-on-Chip Group, CSE-IMM, DTU 8

µP Mem.

Typical P2P Write Session (3 comm. events)

DATA

ACK

µP NI

“Networked” Write Session(4 comm. event)

DATA

N-ACK

Mem.NI

DATA

DATA

WRT

Network Usage Example

© System-on-Chip Group, CSE-IMM, DTU 9

Network Abstraction - OSI

Application/Presentation Layers

Session/Transport Layer

Network, Link and Physical Layers

Socket Socket

Sink CoreSource Core

NetworkInterface

CoreInterface

© System-on-Chip Group, CSE-IMM, DTU 10

Network Dataflow View

Socket Socket

Sink CoreSource Core

Packets

Flit

Phif

Messages

© System-on-Chip Group, CSE-IMM, DTU 11

Memory

Application Layer Traffic Characterization

µP, Dedicated Hardware

Communication Msg. Sizesmall large

Fre

q. o

f C

omm

. Eve

nts

high

lowI/O (sensors,

wired/wireless)

DSP, Application Specific Blocks

© System-on-Chip Group, CSE-IMM, DTU 12

Application Based Communication Network Design

The consistent theme in the literature is to design on-chip network for the application the chip is utilized for, but there is a growing integration of various application cores within a single chip. Hence the need for the network to be flexible and robust so that it can support diverse types and volume of traffic generated by different cores.

An example is the Nokia’s future mobile set that can provide real-time application needs as well as “low latency” data needs.

© System-on-Chip Group, CSE-IMM, DTU 13

QoSlow high

Ban

dwid

th

Uti

liza

tion

Traffic Distribution

low

high

‘Normal’ (bulk) traffic

Critical

events

Control, interrupts, requests, et al?

Streaming

© System-on-Chip Group, CSE-IMM, DTU 14

Network Abstraction

•Session / Transport Layer Plug and play interface Traffic encapsulation

•Network / Link Layer Topology Protocol

© System-on-Chip Group, CSE-IMM, DTU 15

Network Abstraction

• Physical Layer Sub-micron technologies pose challenges Circuit design

Low-swing drivers Differential signaling Asynchronous

Link implementations such as virtual circuits

© System-on-Chip Group, CSE-IMM, DTU 16

Networks-on-Chip

Many combinations! How to judge trade-offs?!

© System-on-Chip Group, CSE-IMM, DTU 17

Boil Down of OSI

Presentation

Application

Transport

Network

Session

Data

Physical

OSI NoC Job Description

Application Message Source/Sink

Interface

• Network Configuration• Error Correction• Packet Creation, Message Reconstruction• Addressing

Network• Flow Control• Prioritization (Bandwidth Reservation)

Link Point-to-point Channels (wires)

© System-on-Chip Group, CSE-IMM, DTU 18

Performance Evaluation

• Quantitative terms Latency Bandwidth Power Area

• Qualitative terms QoS Load balancing Reconfigurability Fault tolerance … more features?

© System-on-Chip Group, CSE-IMM, DTU 19

Tools and Testing

NoC is a subset of SoC Tools

Design Simulation

Testing Pre-fabrication Post-fabrication

© System-on-Chip Group, CSE-IMM, DTU 20

Issues

• At Application Layer• Minimizing the end-to-end latency• Making network communication “transparent”• Support for different traffic types

• At Interface Layer• Message-to-packet overhead (and vice versa)

• Breaking up and re-sequencing?• Error Correction cost?• Addressing techniques?

• End-to-end flow control• Message buffer sizing?• Circuit-switching-like properties?• QoS (Network setup cost, BW reservation)?

© System-on-Chip Group, CSE-IMM, DTU 21

Issues, cont…

• At Network Layer• Need specialized technique for “fast and dedicated routing”

• Combination of deterministic and non-deterministic routing?• Topology• Link-to-link Flow Control

• Packet buffer sizing?• Virtual channels (deadlock avoidance)?• Back pressure (Congestion look-ahead)?

• Routing Mechanism • Address resolution• Bandwidth reservation

• At Link Layer• Fast flexible links

• Virtual channels?• Split channels for multi-flit-per-cycle communication?• Dedicated Address / Control lines?

© System-on-Chip Group, CSE-IMM, DTU 22

Overhead Considerations

• Routing Protocol• Congestion control• Error-correction• Network setup/tear-down• Synchronization

© System-on-Chip Group, CSE-IMM, DTU 23

Research Opportunities

• Traffic + Application• Topology + Protocol• Reconfigurability• Area + Power Issues• Interfaces (GALS)• Sub-micron Technology

Exploitation

© System-on-Chip Group, CSE-IMM, DTU 24

References

• BJERREGAARD, T. and MAHADEVAN, S. 2004. “NoC Survey Manuscript”, Submitted.• HO, R.,MAI, K. W., AND HOROWITZ,M. A. 2001. The future of wires. Proceedings of

the IEEE.• ITRS. 2001. International technology roadmap for semiconductors (ITRS) 2001. Tech.

rep., International Technology Roadmap for Semiconductors.• JANTSCH, A. AND TENHUNEN, H. 2003. Networks on Chip. Kluwer Academic

Publishers.• LEE, K. 1998. On-chip interconnects - gigahertz and beyond. Solid State Technology.• OCPIP. The importance of sockets in soc design. White paper downloadable from

http://www.ocpip.org.• BENINI, L. AND MICHELI, G. D. 2002. Networks on chips: A new soc paradigm. IEEE

Computer.• DALLY, W. J. AND TOWLES, B. 2001. Route packets, not wires: On-chip

interconnection networks. In Proceedings of the 38th Design Automation Conference. • DIELISSEN, J., RADULESCU, A., GOOSSENS, K., AND RIJPKEMA, E. 2003. Concepts and

implementation of the phillips network-on-chip. In Proceedings of the IP based SOC IPSOC’03.

• GOOSSENS,K.,MEERBERGEN, J. V., PEETERS, A., AND WIELAGE, P. 2002. Networks on silicon: Combining best-effort and guaranteed services. In Proceedings of the 2002 Design, Automation and Test in Europe Conference (DATE’02). IEEE.