NEMI Optoelectronics Technology Roadmap

Dr. Laura J. Turbini, Centre for Microelectronics Assembly and Packaging

andJohn W. Stafford, JSW Consulting

The Roaring 90’s

Telecommunications – Driving force behind the boom of the late 90’s.Telecom industry grew at twice the rate of the national economy between 1996 and 2000 By 2001 the telecom companies had reached a market value of $3 trillion, and their share of the GDP rose to almost 6%.The Internet, wireless and other telecom services, spurred investment in information technology, which by 1999 accounted for 43% of private, non residential investment.

What Went Wrong in 2000?

The Status in 2002• The Standard and Poors 500 Index reached a

market peak of 1527 on 3/24/00 and on 4/11/03 stands at 868.

• The Telecom Industry has lost an estimated $2 trillion on the stock market since 1999 (i.e. about 2/3 its market value).

• Telecom is purported to have thousands of miles of excess capacity in fiber-optic cable and as much as $500 billion in questionable debt.

• 80% of businesses connected to the Internet use broadband; less than 10% of households with Internet service do so.

• The rate of growth in the Internet is decreasing.

© 2002 KMI Research www .km ico rp .co m 7

The Overall SONET/SDH Market Will Eventually Rebound Thanks to NG

$-

$5,000

$10,000

$15,000

$20,000

1996 1997 1998 1999 2000 2001 2002 2003 2004

Traditional SO NE T/S DH NG

Annual Market Value, $MAnnual Market Value, $M

SONET Equipment Outlook

Traditional SONET Eq. Next Gen. SONET Eq.

Enterprise Module Forecast

Slide 8 8/4/2002

0

1000

2000

3000

4000

5000

6000

7000

2001 2002 2003 2004 2005 2006

Rev

enue

($

Mill

ion)

Optical BackplaneVSR ParallelInfiniBandiSCSIFibre ChannelEthernet

Optoelectronic Communications Component Outlook

*Other includes Modulators, Variable Optical Attenuators and Optical Multiplexers

Note: Percentages refer to CAAGR for 2002 through 2006

010

2030

40

50607080

90M Units

$0

$2,000

$4,000

$6,000

$8,000

$10,000

$12,000$M

You are Here

2001

2001

2002

2002

OPTOELCTRONIC MODULE ANDCOMPONENT VALUE FORECAST

OPTOELCTRONIC MODULE AND COMPONENT UNIT FORECAST

2003

2003

2004

2004

2005

2005

2006

2006Photo Diodes 13%

Photo Diodes 19% CAAGR

Laser Diodes 12%

Laser Diodes20% CAAGR

Transceivers 39%

Transceivers 30%

Couplers/Splitters 21%

Couplers/Splitters 27%

Optical Amplifiers 14%

Optical Amplifiers 29%

Others* 15%

Others* 13%

You are Here

Source:Prismark

M92

.111

mw-all

Optical Components Trends

SONET

DWDM

DWDM200+ Channel

TDM/WDMMixed traffic

DWDM/CWDM~32 Channel

Laser1.5 umDFBExt Mod

Laser1.5/1.3 umFB, DFBDir Mod

Laser1.3/1.5 umDFBVCSEL

Laser850, 980 nmVCSEL

ModInPLiNbO3Polymer

PHY ICGaAsSiGe

PHY ICCMOSGaAsSiGe

PHY ICCMOS

PHY ICBipolarCMOS

Volu

me

Driv

en

10 M

1 M

100 K

10 K

1 K

Ethernet

802.3

“The Last Mile Problem”

DSL/ADSLCableFiber to the Curb (FTTC)Fiber to the Home (FTTH)Wireless-Terrestrial and SatelliteOf the Household That Have Broadband:– 66% have Cable– 31% have DSL– 3% OtherFiber to the home expected to grow from 100K lines in 2003 to nearly 300K lines in 2004

The Copper Optical Trade Off

NEMI Optoelectronic Roadmap Focus

Optical communications, related photonic components and the manufacturing and assembly technologies.Products for long haul, metro-regional, metro- enterprise and home networks.Chapter covers:– Level 0 – uncased devices– Level 1 – single device or multiple devices in a

package– Level 2 – product boards– Level 2 – systems and networking

Level 1Cost Performance Drivers

HermeticityOptical alignment IssuesPartitioning and IntegrationPackaging Material SelectionThermal ManagementAssembly Challenges

Device Technology

Continue development of low cost optical components such as SOAs, VCSELS, and switching products.Develop a system wide view of thermal management. Apply heat sinks and other cooling methods.Develop improved optical materials and designs.Develop photonic crystals and other technologies to reduce the size of OE product.

Elements of Laser Package

TEC

Laser

Lens

Thermistor

WavelengthLocker

Current Level 1 Costs

Sample Optical Module Materials Costs

1% 6%6%

6%

6%

6%

6%

31%

31%

1%TECMisc. HardwareSubstrateSolder PreformsPassivesClipLensesFerrule & AttachHousingFiber

Level 1 Technology Trends

Hybrid and some monolithic integration incorporating O/E in the same package.In addition to hermetically sealed Kovar butterfly packages, there will be an increased use of lead frames, encapsulation, and BGA packages.Increased automation, including automated pigtailing. Active alignment replaced by passive alignment in all but high end devices.Standard test methods for adhesives properties and development of new UV curable, zero shrink materials.

Passive Optoelectronic Substrates

Solder Bumps

Photodetector

VCSEL

Polymer waveguide

High accuracy PNP (< 1.5 um)

Medium accuracy PNP (<10 um)

Opto-Electronic Printed Circuit Board

Production within 3-5 yearsHigh accuracy placement inside optoelectronic packageMedium accuracy placement on boardOptoelectronic printed wiring board

Passive Electronic Substrate

Integrated connector

Standard Printed Circuit Board

Plastic Optical Fiber array

High accuracy PNP (<1.5 um)

High accuracy PNP (< 1.5 um)

Low accuracy PNP (<50 um)

Standard printed wiring board (PWB)Optical connections above the board, between packaged devices.High accuracy placement required for optoelectronic interconnect.Low accuracy placement of components onto the PWB.

Imbedded Active Optoelectronic

System in a packageEmbedded optical wave guideMultiple electrical and optical chipsBuild-up interconnect technology5-10 years out

Waveguide Optional Grating Coupler

Waveguidecladding

λ1

λ2

λ3

Thin film embedded laseror coupled fiber

Rec’r/uP CircuitRec’r/uP CircuitRec’r/uP CircuitRec’r/uP Circuit

Backplane, Board, Module, Substrate

Polymeric Materials: Issues to be Addressed

Repeatability in dispensing small volumesSelective curing with UV or IR without distorting the assembly.Chemistries that cure at low temperature and produce Tg ≥ 95oCLow shrinkage adhesivesMinimum volatiles escaping during cureDevelopment of low CTE, transparent encapsulants.Determine effect of long-term exposure to low or high intensity light sources on the polymer.

Level 2 Roadmap Highlights

Direct optical coupling between component andoptical PCBParallel optical PCB edgeand surface connectors

One step fiber termination “black box”

Integrated automated splice process, for singleor multi-up fibers

OpticalInterconnects:fiber connectorsand splicing

Direct optical coupling between component andoptical PCB, parallel I/O using VCSELs

Standard package types– plugable

Molded plastic packagesPick & place, SMT compatible

Component &Module

20102005Technology

Level 2 Roadmap Highlights

Low temperature conductiveadhesive attach (equivalent to solder electrical & mechanical performance)Passive place, self-

alignment, direct optical coupling to PCB

Bulk reflow, pick & place compatible components Automated data-driven selective solder attach fornon-SMT compatible components

Assembly

Embedded optical waveguides with any-point interconnects (connectorand component)Optical backplanes, pluggable daughter cards

Surface laminated fiber planes, connector terminatedFirst generation optical backplanes (passive optical interconnection)

Substrates

20102005Technology

Level 2 Roadmap Highlights

Modular, reconfigurablemultifunction and paralleltesters On-board, network fault

detection, e.g. OTDR

Low cost testing for high volume technologies –VCSELsAdoption of new protocol standardsFirst generation optical BIST modulesForward error correction –short time BER testing, e.g. Q-factor

Test

20102005Technology

Level 2 Component and Material Challenges

Backplane to daughter board, parallel optical connectors that provide equivalent quality as current connectors (< 0.5dB loss per connection).Development of materials with low dielectric constants and low dissipation factor for printed wiring board laminates.Development of new organic materials for embedded optical waveguides.

Automation

Develop subcomponents and materials that facilitate automation.Develop assembly processes and equipment that enable integration of electronics and optics within a single package.Improve fiber management, or eliminate fiber where possible.

Characteristics of Automation Methodologies

Rare>$400KBest

2-4 minutes

severalInline

5%$250K-$350KBest

3-5 minutes

5-10Full

10%$100K-200KGood

5-10 minutes

2-4Semi

85%$10K-$50K

PoorUp to 1 hour

1Manual

MarketShare

CostYieldTime/Part

Machines/Operator

2002

The Cost of Interconnect

Level 3 Systems and Networks

Systems are broken into 4 network categories:– Enterprise – end connection to people,

computers and LAN– Access – on-ramp to larger network

connectivity for city, national or global connectivity

– Metro – the network managing access connections within a city

– Core – the network providing connectivity nationally and globally

Network Overview

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Metro Edge NodeSTM

SwitchData

Switch

OADM

OADM

SGNS

ADM

MSCRNC

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

ADM

ADM

Metro Access POP Node

ADM & Data

Switch

ADM & Data

Switch

Enterprise Core POP Node

DataSwitch

STM& DataLink

MTU

Enterprise

PC Router

PC

PC

Server

Enterprise

PC Router

PC

PC

Server MTU

GE, PoSOC3/12

GE, OC3/12/48ATM, PoS

GE, ATM, PoS T1/E1/T3, 100 Base-SX/FX/LX, GE, OC3/12/48, PoS

GE, OC48

GE,ATM, PoS

Links in Enterprise Include:FC, ESCON, FICON, FE/GE,

Wireless 802.11a/bCustomer Premise

Equipment Delineation

Customer Premise Equipment Delineation

2.5G/10GDWDM

10G RingMesh

DWDM

GE, PoS, ATMOC3/12/48

Enterprise – Core

Edge/Access

Legend

Metro/Core

Enterprise – CPE

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Edge NodeSTM

SwitchData

Switch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Metro Edge NodeSTM

SwitchData

Switch

OADM

OADM

Metro Edge NodeSTM

SwitchData

Switch

OADM

OADM

SGNS

ADM

MSCRNC

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Backbone Core NodeSTM

SwitchIP CoreSwitch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

Metro Core NodeSTM

SwitchData

Switch

OADM

OADM

ADM

ADM

Metro Access POP Node

ADM & Data

Switch

ADM & Data

Switch

Metro Access POP Node

ADM & Data

Switch

ADM & Data

Switch

Enterprise Core POP Node

DataSwitch

STM& DataLink

MTUMTU

Enterprise

PC Router

PC

PC

Server

Enterprise

PC Router

PC

PC

Server

Enterprise

PC Router

PC

PC

Server

Enterprise

PC Router

PC

PC

Server MTUMTU

GE, PoSOC3/12

GE, OC3/12/48ATM, PoS

GE, ATM, PoS T1/E1/T3, 100 Base-SX/FX/LX, GE, OC3/12/48, PoS

GE, OC48

GE,ATM, PoS

Links in Enterprise Include:FC, ESCON, FICON, FE/GE,

Wireless 802.11a/bCustomer Premise

Equipment Delineation

Customer Premise Equipment Delineation

2.5G/10GDWDM

10G RingMesh

DWDM

GE, PoS, ATMOC3/12/48

Enterprise – Core

Edge/Access

Legend

Metro/Core

Enterprise – CPE

Enterprise – Core

Edge/Access

Legend

Metro/Core

Enterprise – CPE

Level 3 Critical Issues

New Systems Must Address:Ease of use – plug and play, automatic provisioning (multi-rate, multi-protocol)Ease of management – automatic fault isolation, sectionalization, and service level assuranceEnabling varied protocols and end services with a simplified infrastructureMaximizing utilization of installed infrastructureIncremental cost structure – improve the return on investment for each service connection

Integration

Technologies must be developed that support integration of components (OEIC – Optoelectronic Integrated Circuit).Materials and fabrication research needed to support this integration, e.g. optical solders and board-level wave guides.Intelligent network management needed to improve network utilization.

Standards

Packaging represents one of the highest costs of Optoelectronic componentsReliability requirements for telecom standards for backbone network may be different from datacom and premise applicationsNeed “Telcordia light” reliability standardPackaging standards must address changes in reliability, scope and usabilityMSA’s are band-aid, not a solution to having Component Physical Standards

Emerging OE Technologies

Photonic crystals and photonic band gap materials for wave guides.Holey fibers for high NA (numerical aperture) waveguides, higher power transmission.MEMs devices for wavelength switchingHolographs for fast optical switching (ns)

Summary

The NEMI Optoelectronic Roadmap provides an overview of the business and technology trends.There are a number of challenging problems identified, which can be addressed through fruitful research to provide advances in the next 3-5 years.A full list of these challenges can be found in the NEMI roadmap.